Sealing member and semiconductor manufacturing apparatus

Abstract

The utility model relates to a sealing member and a semiconductor manufacturing device, and the sealing member (1) is used for the semiconductor manufacturing device, is annular, and is characterized in that the sealing member is provided with a mark (2) which can be seen from at least any direction of the front surface, the back surface and the side surface of the sealing member. According to the sealing member (1), when the sealing member (1) is mounted on a semiconductor manufacturing device, the sealing member (1) can be mounted on the basis of the mark (2), for example, a part (2) with weak strength generated by the manufacturing method of the sealing member (1) can be arranged so as to avoid a mounting position (11a) where stress is easily applied.

Description

Technical Field

[0001] The utility model relates to a sealing component used for a semiconductor manufacturing device and a semiconductor manufacturing device equipped with the sealing component. Background Art

[0002] In the past, in semiconductor manufacturing equipment, sealing components were used to ensure the airtightness of component connection parts. However, since no mark was marked on the previous sealing components, it was difficult to determine the installation position of the sealing components when installing the sealing components to the semiconductor manufacturing equipment. Utility Model Content

[0003] Technical problems to be solved by the utility model

[0004] Therefore, an object of the present invention is to provide a sealing member capable of determining a mounting position of the sealing member when the sealing member is mounted on a semiconductor manufacturing apparatus, and a semiconductor manufacturing apparatus including the sealing member.

[0005] Technical solutions for solving technical problems

[0006] In order to solve the above technical problems, a first aspect of the present invention is an annular sealing member 1, 61 for a semiconductor manufacturing device, characterized by having a mark 2, 62 visible from at least any one direction of the front, back and side surfaces of the sealing member.

[0007] Moreover, the 2nd aspect of this invention is that in the sealing member 1 of the 1st aspect, the said sealing member has a joining part, and the said mark is formed in this joining part.

[0008] Moreover, the 3rd aspect of this invention is that in the sealing member 1 of the 1st aspect, the both end parts 1a and 1b of one linear member are joined to form a ring shape, and the said mark is formed in the joined part.

[0009] In addition, a fourth aspect of the present invention is that in the sealing member 61 of the first aspect, end portions of a plurality of linear members 61a, 61b, and 61c are joined to form a ring shape, and the mark 62 is formed at the joined portion.

[0010] Moreover, a fifth aspect of the present invention is the sealing member according to the fourth aspect, wherein the number of the joining portions is 2 or more and 10 or less.

[0011] A sixth aspect of the present invention is the sealing member according to any one of the third to fifth aspects, wherein a joining surface of the joining portion has an angle of 5° or more and 70° or less with respect to a cross section of the linear member in a linear diameter direction.

[0012] Moreover, the 7th aspect of this invention is a semiconductor manufacturing apparatus provided with the sealing member of any one of the 3rd aspect to the 5th aspect.

[0013] In addition, an eighth aspect of the present invention is: in the semiconductor manufacturing device of the seventh aspect, the semiconductor manufacturing device has a mounting portion 11 for mounting the sealing member, the mounting portion has a corner 11a, and the mark of the sealing member is arranged at a position that does not abut the corner of the mounting portion.

[0014] In addition, the ninth mode of the present utility model is: in the semiconductor manufacturing device of the eighth mode, the semiconductor manufacturing device is a dry etching device, a plasma etching device, a reactive ion etching device, a reactive ion beam etching device, a sputtering etching device, an ion beam etching device, a wet etching device, an ashing device, a UV / O3 cleaning device, an ion beam cleaning device, a laser beam cleaning device, a plasma cleaning device, a gas etching cleaning device, an extraction cleaning device, a Soxhlet extraction cleaning device, a high temperature and high pressure extraction cleaning device, a microwave extraction cleaning device, a supercritical extraction cleaning device, a stepper, a coater developer, a CMP (chemical mechanical polishing) device, a CVD device, a sputtering device, an oxidation diffusion device or an ion implantation device.

[0015] Effect of utility model

[0016] According to the present invention, when the sealing member is mounted on a semiconductor manufacturing device, the mounting can be performed based on the mark, and for example, a portion with weak strength caused by the manufacturing method of the sealing member can be arranged avoiding a mounting position where stress is easily applied. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a front view of the sealing member according to the first embodiment of the present invention.

[0018] Figure 2 It is a side view of the vicinity of the joint portion of the sealing member.

[0019] Figure 3 This is a plan view of a mold (lower mold) for manufacturing a sealing member according to an embodiment of the present invention.

[0020] Figure 4 It is a front view of the sealing member of the second embodiment of the present invention.

[0021] Figure 5 This is a front view of a state in which a sealing member is mounted on a mounting portion of a semiconductor manufacturing apparatus.

[0022] Description of Reference Numerals

[0023] 1,61 Sealing member

[0024] 1a, 1b Ends on both sides of the linear member

[0025] 2,62 Marks

[0026] A Cross section of a linear component in the direction of its diameter

[0027] B Joint surface of joint part

[0028] α The acute angle between the joint surface B of the joint portion and the cross section A of the linear member in the wire diameter direction

[0029] 3 Lower die

[0030] 4 Preform

[0031] 5 recess

[0032] 61a, 61b, 61c Linear member

[0033] 10 Housing of semiconductor manufacturing equipment

[0034] 11 Installation

[0035] 11a Corner DETAILED DESCRIPTION

[0036] Hereinafter, the sealing member 1 according to the first embodiment of the present invention will be described in detail with reference to the accompanying drawings. Figure 1 As shown, the sealing member 1 is an annular sealing member and has a mark 2 visible from at least one direction of the front, back and side surfaces of the sealing member 1. The sealing member 1 has a joint portion, and the mark 2 is formed in the joint portion. Figure 1 The sealing member 1 shown in the figure is formed into a ring shape by joining the ends 1a and 1b on both sides of a linear member, and a mark 2 is formed at the joined portion. It should be noted that the linear member includes a rope-shaped or rod-shaped member.

[0037] As a material of the sealing member 1, for example, a fluoropolymer disclosed in WO2022 / 114012A1 can be used. Such a sealing member can be suitably used as a sealing member of a semiconductor manufacturing apparatus that particularly requires heat resistance, in particular, a semiconductor manufacturing apparatus that performs high-density plasma irradiation.

[0038] In this embodiment, the material described in 0015 is used as the sealing member 1, so that the bonding portion can be visually seen from the front side, the back side or the side side of the sealing member, and the bonding portion is different in color from other parts, so that the bonding portion can be visually identified as the mark 2. In addition, it is preferred that the bonding surface B of the bonding portion has an angle of 5° or more and 70° or less with respect to the cross section A in the linear direction of the linear member (refer to Figure 2 ). Here, the angle α formed by the joint surface B of the joint portion and the cross section A in the wire diameter direction of the linear member refers to the angle that becomes an acute angle among the angles formed by the joint surface B and the cross section A in the wire diameter direction of the linear member. If the angle α is 5° or more, it is possible to ensure a joint area that can obtain sufficient joint strength. In addition, it is possible to ensure that the width of the joint portion can obtain sufficient visual recognition when the sealing member is observed from the front side, the back side or the side side. In addition, if the joint surface B is close to vertical relative to the user's line of sight when the sealing member is observed from the front side, the back side or the side side (the angle formed by the joint surface B and the cross section A is close to vertical), the visual recognition becomes poor, but by setting the angle α to be less than 70°, it is possible to ensure sufficient visual recognition.

[0039] The sealing member 1 is produced, for example, by the following method: First, the above-mentioned fluoropolymer, fluorinated elastomer, crosslinking agent, etc. are kneaded by an open roll mill to prepare a composition.

[0040] It should be noted that the above-mentioned composition may contain fillers, colorants, pigments, etc. As fillers, organic fillers or inorganic fillers can be used. As organic fillers, imide-based fillers, engineering plastics, and fluorine-based fillers having an imide structure can be used. As imide-based fillers having an imide structure, for example, polyimide, polyamide-imide, polyetherimide, etc. can be used. As engineering plastics, for example, polyarylate, polysulfone, polyethersulfone, polyphenylene sulfide, polyetheretherketone, polyetherketone, polyoxybenzoate, etc. can be used. As fluorine-based fillers, for example, PTFE, PFA, etc. can be mentioned. In addition, as fillers for inorganic fillers, metal oxide fillers such as silicon oxide, aluminum oxide, and yttrium oxide; metal carbides such as silicon carbide and aluminum carbide; metal nitride fillers such as silicon nitride and aluminum nitride can be mentioned, and inorganic fillers such as carbon black, aluminum fluoride, and carbon fluoride can also be mentioned. As pigment, for example, quinacridone system, isoindolinone system, diketopyrrolopyrrole system, anthraquinone system etc. can be used. In addition, above-mentioned inorganic filler, organic filler can be matched alone or in combination of more than 2 kinds. It should be noted that if sealing member 1 is black, it is difficult to visually mark 2 from at least any direction in the front, back and side of sealing member 1, so preferably filler is not black.

[0041] Next, after the above composition is used as a molding material to obtain a preform, the preform is cross-linked to obtain a cross-linked product. The method of using the above composition as a molding material to obtain a preform can be a common method, and can be carried out by a known method such as a method of heating and compressing using a mold, a method of pressing into a heated mold, and a method of extruding using an extruder. For example, Figure 3 As shown, a rod-shaped preform 4 is formed into a ring-shaped state on a lower mold 3 with its two ends slightly overlapping, and is heated while being pressed by an upper mold. As a result, the preform 4 softens, melts, and flows in the recess 5 of the lower mold 3 and the upper mold (not shown) to obtain an O-shaped cross-linked product. At this time, if the composition of the preform is adjusted in such a way that the color of the portion where the two ends of the preform 4 overlap is different from that of other portions, a mark 2 can be formed on the joint portion while obtaining an O-shaped cross-linked product. By adjusting the length of the portion where the two ends of the preform 4 overlap, etc., the angle α of the joint surface of the joint portion can be adjusted. It should be noted that in Figure 3 , an example in which the preform 4 is not placed on the lower left recess 5 is shown. The above-mentioned crosslinking can be performed in the order of primary crosslinking and secondary crosslinking. The primary crosslinking is preferably performed at 150 to 200°C for 5 to 120 minutes, and more preferably at 170 to 190°C for 5 to 60 minutes. As a crosslinking method, a known crosslinking method can be used, for example, press crosslinking can be mentioned. The secondary crosslinking is preferably performed at 180 to 320°C for 2 to 24 hours, and more preferably at 200 to 310°C for 5 to 20 hours. In addition, a temperature change can also be present within this temperature range. As a crosslinking method, a known crosslinking method can be used, for example, oven crosslinking can be mentioned.

[0042] It should be noted that it is preferred to deburr the crosslinked product after the primary crosslinking and / or the secondary crosslinking. When mounted in a semiconductor manufacturing device, burrs may cause a decrease in airtightness or a source of contamination. Deburring can prevent these problems.

[0043] According to the sealing member 1 of this embodiment, when installing the sealing member 1, it is possible to install it based on the mark 2, for example, as described in the third embodiment described later, to avoid the installation position ( Figure 5 A portion (joined portion) with weak strength caused by the manufacturing method of the sealing member 1 is arranged as indicated by reference numeral 11 a .

[0044] Next, the sealing member 61 according to the second embodiment of the present invention will be described. Figure 4 As shown, in the sealing member 61 of the second embodiment, the ends of a plurality of linear members 61a, 61b, and 61c are joined to form a ring shape, and the mark 62 is formed at the joined portion. Figure 4 As shown, in the front view of the sealing member 1, the mark 62 is arranged at a point-symmetrical position. By arranging the marks in a point-symmetrical manner, it is easy to evenly apply load to each joining portion, and the durability of the sealing member 61 can be improved. It should be noted that the joining portions are preferably more than 2 and less than 10. If the joining portions exceed 10, it is disadvantageous in terms of the yield rate during the manufacture of the sealing member 61 and the durability of the sealing member 61. In addition, it is preferred that the joining surface of each joining portion has an angle of more than 5° and less than 70° relative to the cross section in the wire diameter direction of the linear member.

[0045] According to the sealing member 61 of this embodiment, when the sealing member 61 is installed, it can be installed with reference to the mark 62, for example, as described in the third embodiment described later, it is possible to avoid the installation position ( Figure 5 The portion (joined portion) with weak strength caused by the manufacturing method of the sealing member 61 is arranged as shown in the reference numeral 11a. Therefore, the service life of the sealing member 61 can be extended.

[0046] Next, a semiconductor manufacturing apparatus according to a third embodiment of the present invention will be described. The semiconductor manufacturing apparatus according to the present invention includes a sealing member 1. Figure 5 As shown, the semiconductor manufacturing device includes a mounting portion 11 for mounting a sealing member 1, the mounting portion 11 has a corner portion 11a, and the mark 2 of the sealing member 1 is arranged at a position that does not abut against the corner portion 11a of the mounting portion 11. In this embodiment, the mounting portion 11 is formed to protrude from the housing 10 of the semiconductor manufacturing device. Figure 5 In this state, the semiconductor manufacturing apparatus is assembled by installing other components from a direction opposite to the mounting portion 11.

[0047] In addition, the semiconductor manufacturing device described in the utility model is not particularly limited to the device for manufacturing semiconductors, but is widely included in all manufacturing devices used in the semiconductor field that require a high degree of cleanliness, such as devices for manufacturing liquid crystal panels and plasma panels, for example, the following devices can be cited. As etching devices, dry etching devices, plasma etching devices, reactive ion etching devices, reactive ion beam etching devices, sputtering etching devices, ion beam etching devices, wet etching devices, and ashing devices can be cited. In addition, as cleaning devices, UV / O3 cleaning devices, ion beam cleaning devices, laser beam cleaning devices, plasma cleaning devices, gas etching cleaning devices, extraction cleaning devices, Soxhlet extraction cleaning devices, high temperature and high pressure extraction cleaning devices, microwave extraction cleaning devices, and supercritical extraction cleaning devices can be cited. In addition, as exposure devices, stepper photolithography machines and coating and developing machines can be cited. In addition, as grinding devices, CMP devices can be cited. In addition, as film forming devices, CVD devices and sputtering devices can be cited. In addition, as diffusion and ion implantation devices, oxidation diffusion devices and ion implantation devices can be cited. In particular, the sealing member of the present invention can exhibit excellent performance as a sealing material for, for example, a CVD device, a plasma etching device, a reactive ion etching device, an ashing device, or an excimer laser exposure device.

[0048] In addition, this invention is not limited to the said embodiment, It can change suitably within the range which does not deviate from the summary.

Claims

1. A sealing member for use in a semiconductor manufacturing device and having a ring shape, wherein the sealing member is characterized in that: The sealing member includes a mark (2, 62) visible from at least one direction of the front side, the back side, and the side surface of the sealing member, The sealing member has a joint portion, and the mark is formed at the joint portion.

2. The sealing member according to claim 1, characterized in that The sealing member is formed into a ring shape by joining both end portions (1a, 1b) of a linear member, wherein the mark is formed at the joining portion.

3. The sealing member according to claim 1, characterized in that The sealing member is formed into a ring shape by joining the ends of a plurality of linear members (61a, 61b, 61c), and the mark (62) is formed at the joining portion.

4. The sealing member according to claim 3, characterized in that The number of the bonding parts is 2 or more and 10 or less.

5. The sealing member according to any one of claims 2 to 4, characterized in that: A joining surface of the joining portion has an angle of not less than 5° and not more than 70° with respect to a cross section of the linear member in a linear diameter direction.

6. A semiconductor manufacturing device, characterized in that: A sealing member according to any one of claims 1 to 5 is provided.

7. The semiconductor manufacturing device according to claim 6, characterized in that: The semiconductor manufacturing device comprises a mounting portion (11) for mounting the sealing member, the mounting portion has a corner portion (11a), and the mark of the sealing member is arranged at a position that does not abut against the corner portion of the mounting portion.

8. The semiconductor manufacturing device according to claim 6 or 7, characterized in that: The semiconductor manufacturing device is any one of a dry etching device, a plasma etching device, a reactive ion etching device, a reactive ion beam etching device, a sputtering etching device, an ion beam etching device, a wet etching device, an ashing device, a UV / O3 cleaning device, an ion beam cleaning device, a laser beam cleaning device, a plasma cleaning device, a gas etching cleaning device, an extraction cleaning device, a Soxhlet extraction cleaning device, a high temperature and high pressure extraction cleaning device, a microwave extraction cleaning device, a supercritical extraction cleaning device, a stepper photolithography machine, a coating and developing machine, a CMP device, a CVD device, a sputtering device, an oxidation diffusion device or an ion implantation device.

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