Cooling device for air conditioner and air conditioner

Abstract

The air conditioner comprises a to-be-cooled element and a refrigerant circulation loop, the cooling device comprises a shell, a cooling cavity is formed in the shell, the outer side of the bottom wall of the cooling cavity makes contact with the to-be-cooled element, and a plurality of protruding parts arranged at intervals are arranged on the inner side of the bottom wall of the cooling cavity; the protruding part is provided with a plurality of cooling faces allowing liquid refrigerants to flow, the nozzles are arranged on the shell, the nozzles communicate with the refrigerant circulation loop, the nozzles are configured to atomize the high-pressure liquid refrigerants and spray the high-pressure liquid refrigerants to the bottom wall of the cooling cavity, and the flow guide pipes are configured to guide the refrigerants in the cooling cavity to the refrigerant circulation loop. According to the cooling device, the closed cavity is used for refrigerant flash evaporation atomization, and the heat dissipation efficiency and the cooling effect of the to-be-cooled element are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of air conditioners, in particular to a cooling device for air conditioners and the air conditioner. Background Art

[0002] The air conditioner consists of an outdoor unit and an indoor unit. When the computer board in the outdoor unit is working, it generates heat and the temperature rises. If the temperature of the computer board is higher than the threshold and cannot be cooled down in time, it will be difficult to increase the frequency of the compressor and ensure the cooling effect. In addition, under high temperature conditions outdoors, the excessively high temperature of the computer board makes the temperature difference between it and the ambient temperature small, and the heat dissipation effect of the computer board is further limited. In severe cases, the computer board may burn out.

[0003] Existing heat dissipation technology solutions for computer boards include air cooling, heat pipe cooling, liquid cooling, and a combination of air cooling and heat pipe cooling. Air cooling has a poor cooling effect under outdoor high temperature conditions due to the small temperature difference between the computer board and the ambient temperature. Liquid cooling represented by refrigerant circulation has the risk of refrigerant and condensed water leaking and damaging the computer board. The heat dissipation method combining heat pipes and air cooling limits its heat dissipation capacity under high temperature conditions due to the presence of air cooling.

[0004] The above information disclosed in the background technology is only used to increase the understanding of the background technology of the present application, and therefore, it may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0005] In view of the problems pointed out in the background technology, the utility model provides a cooling device for an air conditioner and an air conditioner, which utilizes a closed cavity to perform flash evaporation and atomization of refrigerant to improve the heat dissipation efficiency and the temperature reduction effect of the component to be cooled.

[0006] In order to achieve the above-mentioned utility model purpose, the utility model adopts the following technical solutions:

[0007] The utility model provides a cooling device for an air conditioner, the air conditioner comprising a component to be cooled and a refrigerant circulation loop, the cooling device comprising:

[0008] The housing is provided with a cooling cavity, and the outer side of the bottom wall of the cooling cavity is in contact with the element to be cooled;

[0009] A plurality of spaced-apart raised portions are disposed on the inner side of the bottom wall of the cooling cavity, and the raised portions have a plurality of cooling surfaces for the liquid refrigerant to flow;

[0010] a nozzle, connected to the refrigerant circulation circuit, the nozzle being configured to atomize the high-pressure liquid refrigerant and spray it toward the bottom wall of the cooling chamber;

[0011] The guide pipe is configured to guide the refrigerant in the cooling chamber to the refrigerant circulation loop.

[0012] In some embodiments, the cooling surface is an inclined surface, and the raised portion is a multifaceted pyramidal structure.

[0013] In some embodiments, the top of the protrusion is a tip, and the upper ends of the plurality of cooling surfaces converge to the tip.

[0014] In some embodiments, the protrusion is integrally formed with the bottom wall of the cooling cavity.

[0015] In some embodiments, the bottom wall of the cooling cavity includes a boss and a guide groove, the guide groove is arranged around the boss, a plurality of the protrusions are arranged on the boss, and the guide groove is connected to the guide pipe.

[0016] In some embodiments, the outer side of the bottom wall of the cooling cavity is in contact with the component to be cooled through thermally conductive silica gel.

[0017] In some embodiments, a valve element is further included. The valve element is disposed on a connecting pipeline between the nozzle and the refrigerant circulation circuit, and the valve element is used to control the on and off of the refrigerant.

[0018] In some embodiments, a temperature sensor is further included, which is configured to detect the temperature of the element to be cooled, and the valve body element is opened or closed according to the detection data of the temperature sensor.

[0019] The utility model also provides an air conditioner, characterized in that it comprises:

[0020] The air conditioner body comprises a component to be cooled and the cooling device as described above.

[0021] In some embodiments, the air conditioner includes a refrigerant circulation loop formed by a compressor, a condenser, an evaporator, a four-way valve and a throttling element, and a first throttling element is provided on a connecting pipe between the condenser and the evaporator;

[0022] The nozzle is connected to the refrigerant pipeline between the condenser and the first throttling element through a pipeline, and the guide pipe is connected to the liquid inlet pipeline of the compressor.

[0023] Compared with the prior art, the advantages and positive effects of the utility model are:

[0024] The cooling device disclosed in the present application utilizes a closed cavity to perform flash evaporation and atomization of the refrigerant. When the high-pressure liquid refrigerant after passing through the condenser is sprayed onto the bottom wall of the cooling cavity through a nozzle, the refrigerant flows along multiple cooling surfaces. The multiple cooling surfaces help to increase the effective heat exchange area when the refrigerant flows, thereby further enhancing the heat exchange effect, improving the heat dissipation and cooling effect of the cooling element to be cooled, and improving the refrigeration capacity of the air conditioner.

[0025] The cooling chamber is a closed spray chamber, which solves the problems of refrigerant leakage and condensed water on the components to be cooled in the prior art.

[0026] After reading the specific embodiments of the present invention in conjunction with the accompanying drawings, other features and advantages of the present invention will become more clear. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0028] Figure 1 is a schematic diagram of an air conditioner according to some embodiments;

[0029] Figure 2 is a structural diagram of a cooling device according to some embodiments;

[0030] Figure 3 is a cross-sectional view of a cooling device according to some embodiments;

[0031] Figure 4 A structural diagram of a cooling cavity bottom wall according to some embodiments;

[0032] Reference numerals:

[0033] 10. compressor; 20. condenser; 30. evaporator; 40. four-way valve; 50. first throttling element; 60. cooling device; 70. valve body element; 80. element to be cooled;

[0034] 100, housing; 110, cooling chamber; 120, bottom wall; 121, boss; 122, guide groove; 123, liquid outlet;

[0035] 200, raised portion; 210, cooling surface;

[0036] 300, nozzle; 310, threaded pipe; 320, nut;

[0037] 400. Flow guide pipe. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0039] In the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0040] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0041] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0042] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0043] The disclosure below provides many different embodiments or examples for realizing different structures of the utility model. In order to simplify the disclosure of the utility model, the components and settings of specific examples are described below. Of course, they are merely examples, and the purpose is not to limit the utility model. In addition, the utility model may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the utility model provides various specific examples of processes and materials, but those of ordinary skill in the art may be aware of the application of other processes and / or the use of other materials.

[0044] The present embodiment discloses an air conditioner, which includes a refrigerant circulation loop formed by a compressor 10, a condenser 20, an evaporator 30, a four-way valve 40 and a throttling element. Figure 1 The flow path of the refrigerant under the heating and cooling conditions of the air conditioner is shown.

[0045] The air conditioner comprises an air conditioner body, in which a component to be cooled 80 is arranged. For example, the component to be cooled 80 is a computer board such as an IPM.

[0046] The computer board will generate heat during use, causing its own temperature to rise. If the computer board itself is in a high temperature state for a long time, its service life will be reduced. Therefore, it is necessary to dissipate heat and cool the computer board.

[0047] The air conditioner further includes a cooling device 60, which is configured to dissipate heat and cool the computer board to prevent the computer board from being in a high temperature state. Figure 2 is a structural diagram of the cooling device 60, Figure 3 A cross-sectional view of the cooling device 60 is shown.

[0048] In practical applications, if the air conditioner body includes a plurality of components to be cooled 80 , a plurality of cooling devices 60 may be provided accordingly, and the plurality of components to be cooled 80 may be cooled respectively by the plurality of cooling devices 60 .

[0049] The cooling device 60 includes a housing 100, in which a cooling chamber 110 is disposed. The outer side of a bottom wall 120 of the cooling chamber 110 contacts the component to be cooled 80. A plurality of protrusions 200 arranged at intervals are disposed on the inner side of the bottom wall 120 of the cooling chamber 110. The protrusions 200 have a plurality of cooling surfaces 210 for the liquid refrigerant to flow, such as Figure 4 shown.

[0050] The cooling device 60 further includes a nozzle 300 , which is connected to the refrigerant circulation circuit and configured to atomize the high-pressure liquid refrigerant and spray the atomized liquid refrigerant toward the bottom wall 120 of the cooling chamber 110 .

[0051] Specifically, a first throttling element 50 is provided on the connecting pipeline between the condenser 20 and the evaporator 30 , and the nozzle 300 is connected to the refrigerant pipeline between the condenser 20 and the first throttling element 50 through the pipeline.

[0052] The cooling device 60 further includes a flow guide pipe 400 , which is configured to guide the refrigerant in the cooling chamber 110 to the refrigerant circulation circuit. The flow guide pipe 400 is connected to the liquid inlet pipeline of the compressor 10 .

[0053] When the air conditioner is in cooling mode, when the temperature of the component to be cooled 80 is higher than the temperature threshold, a portion of the high-pressure liquid refrigerant in the refrigerant circulation loop after passing through the condenser 20 is sprayed into the cooling chamber 110 through the nozzle 300. Under the pressure difference before and after the nozzle 300, the high-pressure liquid refrigerant is atomized, flash atomization occurs, and then a multi-type composite heat exchange process occurs to quickly cool the bottom wall 120 of the cooling chamber 110, and then quickly cool the component to be cooled 80, thereby improving the cooling capacity of the air conditioner. The refrigerant in the cooling chamber 110 then flows back to the compressor 10 through the guide pipe 400 to complete the cycle.

[0054] It is understandable that the flash atomization phenomenon is the flash evaporation phenomenon. After the high-pressure saturated liquid enters the container with lower pressure, due to the sudden decrease in pressure, part of the high-pressure saturated liquid will quickly evaporate into steam. In the above phase change process, a large amount of heat will be absorbed, thereby achieving the effect of rapid heat dissipation of the cooling element 80.

[0055] In the cooling device 60 of the present embodiment, the cooling chamber 110 is a closed spray chamber, which solves the problems of refrigerant leakage and condensed water on the component to be cooled 80 in the prior art.

[0056] The cooling device 60 adopts a refrigerant spray cooling method, which includes refrigerant atomization, nucleate boiling heat exchange, forced convection heat exchange, phase change heat exchange and other heat dissipation cooling methods. The cooling device 60 has a stronger heat dissipation capacity.

[0057] When the refrigerant is sprayed onto the bottom wall 120 of the cooling chamber 110 through the nozzle 300, the refrigerant flows along the multiple cooling surfaces 210. The multiple cooling surfaces 210 help increase the effective heat exchange area when the refrigerant flows, thereby further enhancing the heat exchange effect and helping to improve the cooling capacity of the air conditioner.

[0058] In some embodiments, reference Figure 3 and Figure 4 The cooling surface 210 is an inclined surface, and the raised portion 200 is a multi-faceted cone structure. The liquid refrigerant flows down along the inclined surface, which facilitates the refrigerant to accumulate on the bottom wall 120 of the cooling chamber 110.

[0059] In some embodiments, the top of the protrusion 200 is a tip, and the upper ends of the plurality of cooling surfaces 210 converge at the tip. The tip of the protrusion 200 reduces the flow resistance of the coolant, and facilitates the coolant to flow toward each other through the plurality of cooling surfaces 210 at the same time.

[0060] In some embodiments, the protrusion 200 and the bottom wall 120 of the cooling cavity 110 are integrally formed to facilitate processing and manufacturing.

[0061] In some embodiments, the protrusion 200 has four cooling surfaces 210 , and the protrusion 200 is a pyramid-shaped tetrahedron structure.

[0062] In some embodiments, the bottom wall 120 of the cooling cavity 110 includes a boss 121 and a guide groove 122. The boss 121 is higher than the guide groove 122, and the guide groove 122 is arranged around the boss 121. A plurality of protrusions 200 are arranged on the boss 121, and the guide groove 122 is connected to the guide pipe 400.

[0063] After the liquid refrigerant flows down the cooling surface 210, it accumulates in the guide groove 122. The guide groove 122 is provided with a liquid outlet 123, which is connected to the guide pipe 400, and the liquid refrigerant in the guide groove 122 flows out through the liquid outlet 123 and the guide pipe 400.

[0064] In some embodiments, the nozzle 300 is disposed at the top of the cooling chamber 110, and the nozzle 300 is directly opposite to the protrusion 200. In this way, the high-pressure liquid refrigerant can be directly sprayed on the protrusion 200 and flash-evaporated and atomized, so as to further improve the heat dissipation efficiency of the cooling device 60 to the cooling element 80.

[0065] In some embodiments, the nozzle 300 is a threaded tube 310, which is threadedly sealed to the top wall of the housing 100. A refrigerant channel is formed in the threaded tube 310, one end of the threaded tube 310 extends into the cooling cavity 110, and an atomizing nozzle is arranged at the end, and the other opposite end of the threaded tube 310 is connected to the refrigerant circuit through a nut 320.

[0066] In some embodiments, the diameter of the threaded tube 310 is less than or equal to 1 / 2 of the diameter of the pipe of the refrigerant circulation loop.

[0067] Specifically, the diameter of the threaded tube 310 is a first diameter, the diameter of the pipe of the refrigerant circulation loop is a second diameter, and the first diameter is less than or equal to 1 / 2 of the second diameter. For example, the first diameter may be 1 / 2, 1 / 3, 1 / 4, 1 / 5 or 1 / 6 of the second diameter. In this way, it is possible to avoid excessive refrigerant from the refrigerant circulation loop flowing into the cooling chamber 110, so as to avoid affecting the cooling effect of the air conditioner.

[0068] In some embodiments, the outer side of the bottom wall 120 of the cooling cavity 110 is in contact with the component to be cooled 80 through thermally conductive silicone, thereby improving the thermal conductivity and further reducing the heat dissipation effect.

[0069] In some embodiments, reference Figure 1 The cooling device 60 further includes a valve element 70, which is disposed on a connecting pipeline between the nozzle 300 and the refrigerant circulation circuit, and is used to control the on-off of the refrigerant. For example, the valve element 70 is a one-way valve.

[0070] When the air conditioner is in cooling mode, the valve element 70 is opened. At this time, part of the high-pressure liquid refrigerant processed by the condenser 20 is sprayed into the cooling chamber 110 through the nozzle 300.

[0071] When the air conditioner is in the heating mode, the valve element 70 is closed to cut off the refrigerant, thereby preventing the refrigerant flowing from the evaporator 30 from entering the cooling chamber 110 .

[0072] In some embodiments, the cooling device 60 further includes a temperature sensor. The temperature sensor is configured to detect the temperature of the component to be cooled 80, and the valve body element 70 is opened or closed according to the detection data of the temperature sensor.

[0073] Specifically, the temperature sensor is electrically connected to the valve element 70 to control the valve element 70 to close or open according to the temperature of the component to be cooled 80. At the same time, when the valve element 70 is open, the temperature sensor can also control the opening degree of the valve element 70.

[0074] In the initial state, the valve body element 70 is in a closed state.

[0075] When the temperature sensor detects that the temperature of the component to be cooled 80 is higher than the temperature threshold, the valve element 70 can be controlled to open, so that the high-pressure refrigerant in the refrigerant circulation loop is sprayed into the cooling cavity 110 through the nozzle 300. At the same time, the temperature sensor can also control the opening of the valve element 70 according to the temperature of the component to be cooled 80, thereby controlling the amount of refrigerant sprayed into the cooling cavity 110, and further controlling the heat dissipation efficiency of the cooling device 60 on the component to be cooled 80.

[0076] After the temperature sensor detects that the temperature of the component to be cooled 80 is reduced below the temperature threshold, the valve body element 70 may be controlled to close.

[0077] In practical applications, the opening of the valve element 70 is proportional to the temperature of the component to be cooled 80, that is, the higher the temperature of the component to be cooled 80, the larger the opening of the valve element 70. In this way, the amount of refrigerant sprayed into the cooling chamber 110 can be dynamically adjusted according to the temperature of the component to be cooled 80, so as to achieve the effect of saving refrigerant.

[0078] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0079] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited to this. Any changes or substitutions that can be easily thought of by technicians familiar with the technical field within the technical scope disclosed by the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A cooling device for an air conditioner, the air conditioner comprising a component to be cooled and a refrigerant circulation circuit, characterized in that: The cooling device comprises: The housing is provided with a cooling cavity, and the outer side of the bottom wall of the cooling cavity is in contact with the element to be cooled; A plurality of spaced-apart raised portions are disposed on the inner side of the bottom wall of the cooling cavity, and the raised portions have a plurality of cooling surfaces for the liquid refrigerant to flow; A nozzle connected to the shell, the nozzle is in communication with the refrigerant circulation circuit, and the nozzle is configured to atomize the high-pressure liquid refrigerant and spray it toward the bottom wall of the cooling chamber; The guide pipe is configured to guide the refrigerant in the cooling chamber to the refrigerant circulation loop.

2. The cooling device according to claim 1, characterized in that: The cooling surface is an inclined surface, and the raised portion is a multifaceted cone structure.

3. The cooling device according to claim 2, characterized in that: The top of the protrusion is a tip, and the upper ends of the plurality of cooling surfaces are connected to the tip.

4. The cooling device according to claim 1, characterized in that: The protrusion is integrally formed with the bottom wall of the cooling cavity.

5. The cooling device according to claim 1, characterized in that: The bottom wall of the cooling cavity comprises a boss and a guide groove, wherein the guide groove is arranged around the boss, a plurality of protrusions are arranged on the boss, and the guide groove is communicated with the guide pipe.

6. The cooling device according to claim 1, characterized in that: The outer side of the bottom wall of the cooling cavity is in contact with the component to be cooled through heat-conducting silica gel.

7. The cooling device according to any one of claims 1 to 6, characterized in that: It also includes a valve body element, which is arranged on the connecting pipeline between the nozzle and the refrigerant circulation circuit, and is used to control the on and off of the refrigerant.

8. The cooling device according to claim 7, characterized in that: A temperature sensor is also included, which is configured to detect the temperature of the element to be cooled, and the valve body element is opened or closed according to the detection data of the temperature sensor.

9. An air conditioner, characterized in that: include: The air conditioner body includes the element to be cooled; and, A cooling device as claimed in any one of claims 1 to 8.

10. The air conditioner according to claim 9, characterized in that: A refrigerant circulation loop is formed by a compressor, a condenser, an evaporator, a four-way valve and a throttling element, and a first throttling element is arranged on a connecting pipeline between the condenser and the evaporator; The nozzle is connected to the refrigerant pipeline between the condenser and the first throttling element through a pipeline, and the guide pipe is connected to the liquid inlet pipeline of the compressor.

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