Electronic device

Abstract

The utility model provides electronic equipment, and relates to the technical field of electronic equipment. The electronic equipment comprises a first circuit board and a display screen, and a heating device is arranged in a first area of the first circuit board; a first heat conduction piece is arranged between the first circuit board and the display screen, the first heat conduction piece comprises a first part and a second part, the first part covers the first area and is used for absorbing heat generated by the first area and conducting the heat to the second part, and the second part covers the second area of the display screen and is used for absorbing the heat generated by the first area and conducting the heat to the second part. And the area of the second region is larger than that of the first region.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] At present, some display screens have circuit boards placed on the back of the screen. The power consumption temperature of local electronic devices on the circuit board is relatively high, and the heat will be conducted to the local area of ​​the screen corresponding to the heat-generating device, causing overheating of the local area of ​​the screen and causing adverse effects on the screen. Utility Model Content

[0003] The purpose of the embodiments of the present application is to provide an electronic device, which mainly provides the following technical solutions:

[0004] The present application provides an electronic device, the electronic device comprising: a first circuit board and a display screen, wherein a first area of ​​the first circuit board is provided with a heating device;

[0005] A first heat conducting member is disposed between the first circuit board and the display screen, and the first heat conducting member includes a first part and a second part.

[0006] The first part covers the first area, and is used for absorbing heat generated in the first area and conducting the heat to the second part. The second part covers a second area of ​​the display screen, and the area of ​​the second area is larger than that of the first area.

[0007] In some modified implementations of the present application, the second area of ​​the display screen covers the first area of ​​the first circuit board.

[0008] In some modified embodiments of the present application, the first portion of the first heat conductor is located on a first surface of the first heat conductor, the second portion is located on a second surface of the first heat conductor, and the second surface and the first surface are opposite to each other.

[0009] In some modified embodiments of the present application, the first surface of the first heat conducting member has the same area as the second surface of the first heat conducting member.

[0010] In some modified implementations of the present application, an insulating adhesive layer is provided between the first heat-conducting member and the first circuit board and / or between the first heat-conducting member and the display screen; and / or,

[0011] A heat-conducting adhesive layer is also arranged between the first heat-conducting member and the first circuit board.

[0012] In some modified implementations of the present application, the following are also included:

[0013] A first body and a second body, the first circuit board and the display screen are arranged in the first body, and the second circuit board is arranged in the second body;

[0014] The heating device includes: a first component and a second component, the first component is arranged in the first area of ​​the first circuit board, and the first part of the first heat conductor covers the first component, the second component is arranged in the second circuit board, and the second component is electrically connected to the first circuit board.

[0015] In some modified implementations of the present application, the heating device includes: a first part of the device and a second part of the device, the first part of the device is arranged on the side of the first circuit board facing the display screen, and the first part of the first heat conductor covers the first part of the device, and the second part of the device is arranged on the side of the first circuit board away from the display screen.

[0016] In some modified implementations of the present application, the second part of components is a component of the control function of the display screen; and / or,

[0017] The heat generated by the second part of the components is higher than the heat generated by the first part of the components.

[0018] In some modified implementations of the present application, a second heat conducting member is disposed between a side of the first circuit board facing away from the display screen and a shell wall of the first body, and the second heat conducting member is in at least partial contact with the shell wall of the first body.

[0019] In some modified implementations of the present application, a third heat conducting member is disposed between the first part of the components and the second heat conducting member, and the heat absorption performance of the third heat conducting member is better than that of the second heat conducting member, and / or

[0020] A target functional part is arranged on the surface of the first circuit board, the target functional part covers the first part of components, and the target functional part is used to provide electromagnetic shielding function and heat conduction function for the first part of components. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present application will become easy to understand. In the accompanying drawings, several embodiments of the present application are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0022] Figure 1 The internal structure diagram of the electronic device provided in the embodiment of the present application is schematically shown;

[0023] Figure 2 A schematic diagram of a cross-sectional structure of an electronic device provided in an embodiment of the present application is schematically shown;

[0024] Figure 3 A schematic diagram of a bonding structure of a first heat-conducting member, a first circuit board and a display screen of an electronic device provided in an embodiment of the present application is schematically shown;

[0025] Figure 4 A schematic diagram of another bonding structure of a first heat conducting member, a first circuit board and a display screen of an electronic device provided in an embodiment of the present application is schematically shown;

[0026] Figure 5 The structure diagram of the first body and the second body of the electronic device provided by the embodiment of the present application is schematically shown;

[0027] Figure 6 Another cross-sectional structural diagram of an electronic device provided in an embodiment of the present application is schematically shown;

[0028] Description of Figure Numbers:

[0029] First circuit board 1, first area 1a, display screen 2, heating component 3, first partial component 31, second partial component 32, first heat conducting member 4, first part 4a, second part 4b, insulating adhesive layer 5, thermally conductive adhesive layer 6, target functional part 7, first body 81, second body 82, second circuit board 9, flexible circuit board 10, second heat conducting member 11, and third heat conducting member 12. DETAILED DESCRIPTION

[0030] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0031] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by technicians in the field to which this application belongs.

[0032] Reference Figure 1 and attached Figure 2An embodiment of the present application provides an electronic device, which includes: a first circuit board 1 and a display screen 2, wherein a first area 1a of the first circuit board 1 is provided with a heating device 3; a first heat conductor 4 is provided between the first circuit board 1 and the display screen 2, wherein the first heat conductor 4 includes a first part 4a and a second part 4b, wherein the first part 4a covers the first area 1a, and is used for absorbing heat generated by the first area 1a and conducting the heat to the second part 4b, wherein the second part 4b covers a second area of ​​the display screen 2, and an area of ​​the second area is larger than that of the first area 1a.

[0033] The electronic device provided in this embodiment can be, but is not limited to, a device with a display function such as a laptop computer and a tablet computer, and includes a first circuit board 1 and a display screen 2. The first circuit board 1 can be electrically connected to the display screen 2, and the first circuit board 1 can be used to receive and process input signals so as to control the pixel points of the display screen 2 to emit light. A heating device 3 is provided in the first area 1a of the first circuit board 1. In order to prevent the heat of the heating device 3 from being transferred to the display screen 2 during operation, resulting in an increase in the local temperature corresponding to the display screen 2 and the heating device 3, thereby affecting the performance and service life of the display screen 2, in the technical solution adopted in the present application, a first heat conductor 4 is provided between the first circuit board 1 and the display screen 2. The first heat conductor 4 has the performance of absorbing and conducting heat. The first heat conductor 4 includes a first part 4a and a second part 4b. The first part 4a covers the first area 1a of the first circuit board 1, that is, it can absorb the heat generated by the heating device 3 in the first area 1a, and can conduct the absorbed heat to the second part 4b. The second part 4b covers the second area of ​​the display screen 2, and the area of ​​the second area is larger than that of the first area 1a. Since the heating device 3 is provided in the first area 1a of the first circuit board 1, the heating device 3 here can include but is not limited to a timing control chip (T-con IC), a power management integrated circuit (Power Management IC, PM IC) PM IC, backlight drive circuit, protection circuit and sensor, etc. The heating device 3 generates heat during operation, so the temperature of this area can be higher than that of other areas of the first circuit board 1. Through the heat absorption of the first part 4a of the first heat conductor 4 and the heat conduction to the second part 4b, the second area of ​​the display screen 2 covered by the second part 4b is larger than the first area 1a, so that the heat can be conducted to a larger area, dispersing the heat, reducing the hot spots concentrated in a certain local area of ​​the display screen 2, and dispersing the local heat, thereby achieving a uniform heat effect, and avoiding the problem of excessively high local temperature of the display screen 2 corresponding to the heating device 3.

[0034] The second portion 4 b of the first heat conductor 4 may also cover the area of ​​the first circuit board 1 except the first area 1 a ; the second area of ​​the display screen 2 may be the entire area occupied by the display screen 2 , or may be a partial area of ​​the display screen 2 .

[0035] Among them, the first heat conductor 4 can be made of but not limited to graphite material, silicone material or phase change material. Graphite has excellent thermal conductivity. The first heat conductor 4 made of graphite material also has the advantage of light weight, which is conducive to the lightweight design of electronic equipment.

[0036] For further information, see Attachment Figure 1 and attached Figure 2 In a specific implementation, the positional relationship between the second area of ​​the display screen 2 and the first area 1a of the first circuit board 1 may include multiple situations. Two of the situations are illustrated below. The first situation is that the second area of ​​the display screen 2 does not cover the first area 1a of the first circuit board 1, for example, the second area and the first area 1a meet the coplanar condition; the second situation is that the second area of ​​the display screen 2 covers the first area 1a of the first circuit board 1, for example, the second area and the first area 1a are stacked, which can reduce the overall volume of the first heat conductor 4 and the electronic device, and increase the setting area of ​​the first heat conductor 4, thereby improving the heat conduction and heat equalization effects; of course, it can also include the situation where the second area of ​​the display screen 2 partially covers the first area 1a of the first circuit board 1, which is not specifically limited here.

[0037] Furthermore, in a specific implementation, the first part 4a of the first heat conductor 4 can be located on the first surface of the first heat conductor 4, the second part 4b of the first heat conductor 4 can be located on the second surface of the first heat conductor 4, the second surface can be opposite to the first surface, the first heat conductor 4 can be set to a double-layer structure in which the first part 4a and the second part 4b are not arranged in the same layer, or in order to reduce the thickness of the first heat conductor 4, the first heat conductor 4 can be set to two parts of the same layer, and the two parts achieve heat conduction through contact or connection, or in order to further improve the heat conduction efficiency on the basis of reducing the thickness of the first heat conductor 4, the first heat conductor 4 can also be set to a whole layer structure, specifically: the first surface of the first heat conductor 4 is the same as the area of ​​the second surface of the first heat conductor 4. In this case, the first part 4a can occupy a local area of ​​the first surface, and the second part 4b can occupy the entire area of ​​the second surface, but is not limited to this.

[0038] For further information, see Attachment Figure 3In a specific implementation, in order to achieve a stable connection between the first heat-conducting member 4 and the first circuit board 1 and the display screen 2, an insulating adhesive layer 5 can be respectively arranged between the first heat-conducting member 4 and the first circuit board 1, and between the first heat-conducting member 4 and the display screen 2, and its viscosity can be used to achieve a reliable bonding effect, and the insulating adhesive layer 5 has good insulation, voltage resistance, flame retardancy and other properties, can prevent leakage, and has high safety; wherein, the insulating adhesive layer 5 can be but not limited to polyester, epoxy, silicone and other types of materials; in addition, in order to reduce the overall thickness of the display module of the electronic device without affecting the thermal conductivity effect, the thickness of the first heat-conducting member 4 can be set to about 50um, and the thickness of the insulating adhesive layer 5 can be about 10um, but not limited to this.

[0039] For further information, see Attachment Figure 4 In order to improve the heat conduction effect and efficiency between the first heat-conducting member 4 and the heating device 3 of the first circuit board 1, in a specific implementation, a heat-conducting adhesive layer 6 can be arranged between the first heat-conducting member 4 and the first circuit board 1. The heat-conducting adhesive layer 6 has good adhesion and thermal conductivity. The first heat-conducting member 4 and the first circuit board 1 can be bonded and fixed only by the heat-conducting adhesive layer 6, or the heat-conducting adhesive layer 6 can also cooperate with the insulating adhesive layer to achieve the bonding and fixation between the first heat-conducting member 4 and the first circuit board 1. In this case, the heat-conducting adhesive layer 6 is arranged between the insulating adhesive layer and the first circuit board 1; wherein the heat-conducting adhesive layer 6 can be but is not limited to silicone-type heat-conducting adhesive, epoxy-type heat-conducting adhesive, etc.

[0040] For further information, see Attachment Figure 5 In a specific implementation, the electronic device provided in this embodiment also includes: a first body 81 and a second body 82. Taking the electronic device as a laptop computer as an example below, the first body 81 can be the display part of the laptop computer, and the second body 82 can be the host part of the laptop computer. Therefore, the first circuit board 1 and the display screen 2 can be arranged in the first body 81, and the second circuit board 9 can be arranged in the second body 82. The second circuit board 9 can be a motherboard, and devices such as a central processing unit (CPU), memory, and storage devices can be installed. The second body 82 is also configured with a heat dissipation module, such as an air-cooled heat dissipation module and / or a water-cooled heat dissipation module, to efficiently dissipate the heat of the devices in the second body 82.

[0041] For details, please refer to the attached Figure 5The heating device 3 may include: a first component 31 and a second component 32. The first component 31 may be arranged in the first area 1a of the first circuit board 1, and the first part 4a of the first heat conductor 4 covers the first component 31 for conducting the heat generated by the first component 31. The second component 32 is arranged on the second circuit board 9, and the second component 32 is electrically connected to the first circuit board 1. Such an arrangement does not affect the connection between the second component 32 and the first circuit board 1, and the second component 32 can be arranged in the second body 82. In this way, the heat dissipation module in the second body 82 can be used to dissipate the heat of the second component 32, that is, the heat of the second component 32 will not affect the display screen 2, which is conducive to reducing the temperature of the display screen 2; wherein, the electrical connection between the second component 32 and the first circuit board 1 can be directly realized through the flexible circuit board 10, or the second component 32 can be arranged to be electrically connected to the second circuit board 9, and then the electrical connection between the first circuit board 1 and the second circuit board 9 is indirectly realized. The electrical connection between the first circuit board 1 and the second circuit board 9 can be realized through the flexible circuit board 10.

[0042] For further information, see Attachment Figure 6 In order to further reduce the conduction of heat from the heating device 3 to the display screen 2, in a specific implementation, a second heat-conducting member 11 can be arranged between the side of the first circuit board 1 away from the display screen 2 and the shell wall of the first body 81. The second heat-conducting member 11 can be in at least partial contact with the shell wall of the first body 81, so that the high temperature generated by the operation of the first circuit board 1 can be conducted to the shell wall of the first body 81 through the second heat-conducting member 11, thereby reducing the heat conducted to the display screen 2, which is beneficial to lowering the temperature of the display screen 2; wherein, the second heat-conducting member 11 and the first heat-conducting member 4 can be made of the same heat-conducting material, but are not limited to this.

[0043] For details, please refer to the attached Figure 6 In order to improve the conduction of heat generated by the first part of the device 31 to the second heat-conducting member 11, in the technical solution adopted in the present application, a third heat-conducting member 12 can be arranged between the first part of the device 31 and the second heat-conducting member 11, and the third heat-conducting member 12 can only cover the area where the first part of the device 31 is located. The heat absorption performance of the third heat-conducting member 12 is better than that of the second heat-conducting member 11. For example, the second heat-conducting member 11 can be made of graphite material, and the third heat-conducting member 12 can be made of graphene, heat pipe or phase change material with better heat absorption performance, but not limited to this, so that the heat generated by the first part of the device 31 can be quickly and concentratedly absorbed and conducted to the second heat-conducting member 11.

[0044] Specifically, in order to improve the absorption of heat conducted by the second heat-conducting member 11 by the first body 81, the shell wall of the first body 81 facing away from the display screen 2 can be made of metal material as a whole, or only the part corresponding to the second heat-conducting member 11 can be made of metal material. This can improve the heat absorption effect of the corresponding shell wall of the display screen 2, which is beneficial to the conduction of heat of the second heat-conducting member 11.

[0045] Furthermore, in order to further reduce the influence of the heat generated by the heating device 3 on the display screen 2, in a specific implementation, the heating device 3 includes: a first part device 31 and a second part device 32, the first part device 31 is arranged on the side of the first circuit board 1 facing the display screen 2, and the first part of the first heat conductor 4 covers the first part device 31, and the second part device 32 is arranged on the side of the first circuit board 1 away from the display screen 2, thereby reducing the conduction of the heat generated by the second part device 32 to the display screen 2, which is beneficial to reducing the temperature of the display screen 2.

[0046] Further, in the case where the heating device 3 includes the first part device 31 and the second part device 32, in the technical solution adopted by the present application, the second part device 32 can be a device for realizing the control function of the display screen 2, such as: a timing control chip (T-con IC) and a power management integrated circuit (Power Management IC, PM IC) PM IC, the timing control chip is used to convert the received digital RGB signal and clock signal into a control signal that can be recognized by the display screen 2, and directly control the display of the display screen 2, and the power management integrated circuit ensures the stable operation and optimal performance of the display screen 2 by providing stable power supply, managing battery charging, realizing programmable logic control and energy-saving optimization, etc. Therefore, this type of device is a high-energy consumption device with a high heat generation, and reducing the temperature conduction from the second part device 32 to the display screen 2 can effectively reduce the temperature of the display screen 2. Or the second part device 32 can be a device with a higher heat generation than the first part device 31, and the second part device 32 is isolated from the display screen 2 as much as possible to reduce the temperature conduction, which can effectively protect the display screen 2.

[0047] For further information, see Attachment Figure 2 In a specific implementation, in order to improve safety, a target functional component 7 is provided on the surface of the first circuit board 1. The target functional component 7 covers the first part of the device 31. The target functional component 7 has electromagnetic shielding and thermal conductivity properties. By covering the first part of the device 31, the electromagnetic shielding function of the first part of the device 31 can be achieved, and the heat generated by the first part of the device 31 can be quickly conducted; wherein, the target functional component 7 can be but is not limited to one of a copper foil Mylar layer, an electromagnetic shielding film or a thermal conductive graphite layer.

[0048] It should be noted that in the description of this specification, the terms "upper", "lower", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application; the terms "connect", "install", "fixed", etc. should be understood in a broad sense, for example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0049] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0050] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An electronic device, characterized in that: include: A first circuit board and a display screen, wherein a first area of ​​the first circuit board is provided with a heating device; A first heat conducting member is disposed between the first circuit board and the display screen, and the first heat conducting member includes a first part and a second part. The first part covers the first area, and is used for absorbing heat generated in the first area and conducting the heat to the second part. The second part covers a second area of ​​the display screen, and the area of ​​the second area is larger than that of the first area.

2. The electronic device according to claim 1, characterized in that: The second area of ​​the display screen covers the first area of ​​the first circuit board.

3. The electronic device according to claim 1, characterized in that: The first portion of the first heat conductive member is located on a first surface of the first heat conductive member, and the second portion is located on a second surface of the first heat conductive member, and the second surface and the first surface are opposite to each other.

4. The electronic device according to claim 3, characterized in that: The first surface of the first heat conducting member has the same area as the second surface of the first heat conducting member.

5. The electronic device according to claim 2, characterized in that: An insulating adhesive layer is provided between the first heat-conducting member and the first circuit board and / or between the first heat-conducting member and the display screen; and / or, A heat-conducting adhesive layer is also arranged between the first heat-conducting member and the first circuit board.

6. The electronic device according to claim 1, characterized in that: Also includes: A first body and a second body, the first circuit board and the display screen are arranged in the first body, and the second circuit board is arranged in the second body; The heating device includes: a first component and a second component, the first component is arranged in the first area of ​​the first circuit board, and the first part of the first heat conductor covers the first component, the second component is arranged in the second circuit board, and the second component is electrically connected to the first circuit board.

7. The electronic device according to claim 1, characterized in that: The heating device includes: a first component and a second component, wherein the first component is arranged on a side of the first circuit board facing the display screen, and the first part of the first heat conductor covers the first component, and the second component is arranged on a side of the first circuit board facing away from the display screen.

8. The electronic device according to claim 6 or 7, characterized in that: The second part of components is a component of the control function of the display screen; and / or, The heat generated by the second part of the components is higher than the heat generated by the first part of the components.

9. The electronic device according to claim 6, characterized in that: A second heat conducting member is disposed between a side of the first circuit board facing away from the display screen and a shell wall of the first body, and the second heat conducting member is in at least partial contact with the shell wall of the first body.

10. The electronic device according to claim 9, characterized in that: A third heat conducting member is disposed between the first part of the components and the second heat conducting member, and the heat absorption performance of the third heat conducting member is better than that of the second heat conducting member, and / or A target functional part is arranged on the surface of the first circuit board, the target functional part covers the first part of components, and the target functional part is used to provide electromagnetic shielding function and heat conduction function for the first part of components.

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