Section polishing device for wafer processing

Abstract

The utility model discloses a section polishing device for wafer processing, which comprises a base provided with a support frame, and further comprises a support polishing mechanism and an overturning clamping mechanism which are arranged on the support frame, the overturning clamping mechanism comprises supporting shafts and first air cylinders, the supporting shafts are rotationally arranged on the side walls of the two sides of the supporting frame, one set of supporting shafts penetrate through the side walls of the supporting frame and are connected with overturning assemblies, an overturning frame is arranged between the two sets of supporting shafts, and the first air cylinders are fixedly connected to the side walls of the two sides of the overturning frame; a clamping block is arranged at the output end of the first air cylinder. The utility model belongs to the technical field of wafer processing, and particularly relates to a section polishing device for wafer processing.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer processing, in particular to a cut surface polishing device for wafer processing. Background Art

[0002] Wafer refers to the silicon chip used in the production of silicon semiconductor integrated circuits. It is the basic material for manufacturing semiconductor chips. Wafer cutting and polishing machines are mainly used to polish the cut surfaces of wafers after cutting. By fitting the cut surface of the wafer with the surface of the high-speed rotating polishing roller, the high-speed rotating polishing roller can polish the cut surface of the wafer to a smooth surface.

[0003] The patent with publication number CN214559899U discloses a surface polishing device for wafer processing. The utility model adopts the design of the polishing mechanism. When the motor rotates forward, it drives the rotating shaft to rotate. The rotation of the rotating shaft drives the sleeve and the belt device to rotate. The belt device drives the telescopic rod and the polishing plate to move, and the rotating shaft and the first reciprocating screw do not rotate. When the motor rotates reversely, the rotating shaft drives the first reciprocating screw and the second reciprocating screw to rotate. The first reciprocating screw drives the first bearing seat and the connecting plate to move. At this time, the connecting plate drives the telescopic rod to move up and down. The second reciprocating screw drives the second bearing seat, the vertical rod and the square telescopic rod to move. The square telescopic rod drives the vacuum suction cup to move. The wafer is adsorbed on the top of the vacuum suction cup, thereby effectively polishing the wafer.

[0004] However, when the above device is in use, after polishing of a single side of the wafer is completed, the wafer needs to be disassembled, the unpolished side needs to be replaced, and it needs to be fixed again for polishing. This operation is relatively cumbersome and time-consuming, and is not conducive to improving wafer processing efficiency. Utility Model Content

[0005] The technical problem to be solved by the utility model is that after the single-side polishing is completed, the wafer needs to be dismantled and fixed again after the direction is changed, which is inconvenient to operate and has low processing efficiency.

[0006] In order to achieve the above functions, the technical solution adopted by the utility model is as follows: a surface polishing device for wafer processing, comprising a base, a support frame is provided on the base, and also includes a support grinding mechanism and a flip clamping mechanism provided on the support; the flip clamping mechanism includes a support shaft and a cylinder 1, the support shaft is rotatably arranged on both side walls of the support frame, one group of the support shafts passes through the side walls of the support frame and is connected to a flip assembly, a flip frame is provided between the two groups of the support shafts, the cylinder 1 is fixedly connected to the both side walls of the flip frame, and a clamping block is provided at the output end of the cylinder 1.

[0007] Furthermore, the flip assembly includes a fixed plate and a worm gear, the fixed plate is arranged on the side wall of the support frame, the fixed plate is symmetrically arranged in two groups, a worm is rotatably arranged between the two groups of fixed plates, the worm gear is connected to the protruding end of one group of the support shafts, and the worm gear is meshed with the worm gear.

[0008] Furthermore, the supporting and polishing mechanism includes cylinder 2 and cylinder 3, cylinder 2 is arranged on the top wall of the supporting frame, and a polishing machine is provided at the output end of cylinder 2, and cylinder 3 is arranged on the top wall of the base, and a support plate is provided at the output end of cylinder 3, and the support plate is arranged below the polishing machine.

[0009] Furthermore, the support frame is arranged in an inverted U shape.

[0010] Preferably, one end of the worm passes through the fixing plate and is provided with a motor.

[0011] The utility model adopts the above structure to achieve the following beneficial effects: the utility model provides a surface polishing device for wafer processing, which can flip the support table and the flip frame by setting a worm and a worm gear, and fix the wafer in cooperation with cylinder one and a clamping block, so that it is convenient to flip the wafer after polishing one side of the wafer is completed, and there is no need to disassemble and reinstall the wafer, so the operation is convenient and labor-saving. At the same time, cylinder three and the support plate can provide support for the wafer during the polishing process to ensure the stability of the wafer during polishing. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is an overall structural diagram of a wafer processing faceting and polishing device proposed by the utility model;

[0013] Figure 2 This is a left-side structural diagram of a wafer processing faceting and polishing device proposed by the utility model;

[0014] Figure 3 This is a top view of the structure of a surface polishing device for wafer processing proposed by the utility model.

[0015] Among them, 1. base, 2. support frame, 3. support grinding mechanism, 4. flip clamping mechanism, 5. support shaft, 6. cylinder one, 7. flip assembly, 8. flip frame, 9. clamping block, 10. fixed plate, 11. worm gear, 12. worm, 13. cylinder two, 14. cylinder three, 15. polishing machine, 16. support plate, 17. motor. DETAILED DESCRIPTION

[0016] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0017] In the description of the present utility model, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance. The present utility model is further described in detail below in conjunction with the accompanying drawings.

[0018] like Figure 1-3 As shown, a faceting polishing device for wafer processing proposed by the utility model comprises a base 1, a support frame 2 is arranged on the base 1, the support frame 2 is arranged in an inverted U shape, and also comprises a supporting polishing mechanism 3 and a flipping clamping mechanism 4 arranged on the support; the flipping clamping mechanism 4 comprises a supporting shaft 5 and a cylinder 6, the supporting shaft 5 is rotatably arranged on the side walls of the supporting frame 2, one group of the supporting shafts 5 penetrates the side walls of the supporting frame 2 and is connected with a flipping assembly 7, a flipping frame 8 is arranged between the two groups of supporting shafts 5, the cylinder 6 is fixedly connected to the side walls of the flipping frame 8, and a clamping block 9 is arranged at the output end of the cylinder 6. After polishing of one side of the wafer is completed, the supporting polishing mechanism 3 is adjusted to be away from the flipping frame 8, the flipping assembly 7 is started, the supporting shaft 5 rotates, the supporting shaft 5 drives the flipping frame 8 to rotate, and at the same time the flipping frame 8 drives the cylinder 6 and the clamping block 9 to rotate, the wafer is turned over, the supporting polishing mechanism 3 is adjusted again, and polishing starts, eliminating the operation of disassembling and reinstalling the wafer, saving time and effort, and greatly improving the polishing efficiency of the wafer.

[0019] like Figure 1 and 2 As shown, the flipping assembly 7 includes a fixed plate 10 and a worm gear 11. The fixed plate 10 is arranged on the side wall of the support frame 2. Two groups of fixed plates 10 are symmetrically arranged. A worm 12 is rotatably arranged between the two groups of fixed plates 10. One end of the worm 12 passes through the fixed plate 10 and is provided with a motor 17. The worm gear 11 is connected to the protruding end of one group of support shafts 5. The worm gear 11 is meshed with the worm 12. When the motor 17 is started, the worm 12 is driven to rotate. The worm 12 drives the worm wheel 11 to rotate, and then drives the support shaft 5 to rotate to flip the wafer.

[0020] like Figure 1As shown, the supporting and polishing mechanism 3 includes a cylinder 2 13 and a cylinder 3 14. The cylinder 2 13 is arranged on the top wall of the supporting frame 2. A polishing machine 15 is arranged at the output end of the cylinder 2 13. The cylinder 3 14 is arranged on the top wall of the base 1. A support plate 16 is arranged at the output end of the cylinder 3 14. The support plate 16 is arranged below the polishing machine 15. After the wafer is fixed, the cylinder 3 14 is started to drive the support plate 16 to move so that the support plate 16 is against the bottom wall of the wafer to provide support for the wafer. At the same time, the cylinder 2 13 is started to drive the polishing machine 15 to move downward to polish the wafer.

[0021] The above description of the utility model and its implementation methods is not restrictive. The drawings show only one implementation method of the utility model, and the actual structure is not limited thereto. In short, if ordinary technicians in this field are inspired by it and design structural methods and embodiments similar to the technical solution without creativity without departing from the purpose of the invention of the utility model, they should all fall within the protection scope of the utility model.

Claims

1. A wafer processing faceting polishing device, comprising a base, on which a support frame is provided, characterized in that: It also includes a support grinding mechanism and a flip clamping mechanism provided on the support; the flip clamping mechanism includes a support shaft and a cylinder 1, the support shaft is rotatably provided on the side walls of the support frame, one group of the support shafts penetrates the side walls of the support frame and is connected to a flip assembly, a flip frame is provided between the two groups of the support shafts, the cylinder 1 is fixedly connected to the side walls of the flip frame, and a clamping block is provided at the output end of the cylinder 1.

2. The wafer processing surface polishing device according to claim 1, characterized in that: The flip assembly includes a fixed plate and a worm gear. The fixed plate is arranged on the side wall of the support frame. The fixed plates are symmetrically arranged in two groups. A worm is rotatably arranged between the two groups of fixed plates. The worm gear is connected to the protruding end of one group of the support shafts, and the worm gear is meshed with the worm.

3. The wafer processing surface polishing device according to claim 2, characterized in that: The supporting and polishing mechanism includes cylinder 2 and cylinder 3, wherein cylinder 2 is arranged on the top wall of the supporting frame, and a polishing machine is arranged at the output end of cylinder 2, and cylinder 3 is arranged on the top wall of the base, and a support plate is arranged at the output end of cylinder 3, and the support plate is arranged below the polishing machine.

4. The wafer processing surface polishing device according to claim 3, characterized in that: The support frame is arranged in an inverted U shape.

5. The wafer processing surface polishing device according to claim 4, characterized in that: One end of the worm passes through the fixing plate and is provided with a motor.

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