Bearing mechanism and semiconductor cleaning equipment

Abstract

The utility model provides a bearing mechanism and semiconductor cleaning equipment. The bearing mechanism comprises a first bearing device, a second bearing device and a controller. Wherein the first bearing device is provided with a first bearing part capable of ascending and descending in the cleaning tank; the second bearing device is provided with a second bearing part capable of ascending and descending in the cleaning tank; the first bearing part and the second bearing part are both used for supporting a wafer; the contact point position of the second bearing part on the surface of the wafer is different from the contact point position of the first bearing part on the surface of the wafer; the first bearing part and the second bearing part can be mutually inserted in the vertical direction, so that the first bearing part or the second bearing part can be switched to bear the wafer by controlling the lifting of the first bearing part and the second bearing part through the controller, and the contact point position of the wafer and the bearing parts can be switched; therefore, different contact points can be in contact with the cleaning liquid medicine, and each position of the surface of the wafer can be cleaned.

Description

Technical Field

[0001] The utility model belongs to the field of semiconductor cleaning, and in particular relates to a bearing mechanism and semiconductor cleaning equipment. Background Art

[0002] The cleaning process is a crucial part of the existing semiconductor process, and the tank wet process still accounts for a large proportion of the cleaning process. Specifically, the tank cleaning equipment usually uses a carrier to drive multiple wafers to be immersed in a cleaning tank containing different liquids in turn to perform the cleaning process. However, when the existing tank cleaning equipment performs the cleaning process, the wafer and the carrier remain in contact during the process, which will cause the contact points on the wafer surface to be unable to contact the cleaning solution, resulting in the wafer surface cannot be completely cleaned, and then defects are formed on the wafer surface in subsequent processes. Utility Model Content

[0003] The utility model at least partially solves the problem that the contact points of the wafer cannot be cleaned due to the existing carrying mechanism, and provides a carrying mechanism and semiconductor cleaning equipment.

[0004] The utility model provides a bearing mechanism for use in semiconductor cleaning equipment; the bearing mechanism comprises: a first bearing device, a second bearing device and a controller; wherein the first bearing device comprises a first bearing part that can be lifted and lowered in the cleaning tank; the second bearing device comprises a second bearing part that can be lifted and lowered in the cleaning tank; the first bearing part and the second bearing part are both used to support wafers;

[0005] The contact point position of the second bearing part on the wafer surface is different from the contact point position of the first bearing part on the wafer surface; the first bearing part and the second bearing part may be interlaced with each other in the vertical direction;

[0006] The controller is used for controlling the first carrying part and the second carrying part to rise or fall respectively, so as to switch between the first carrying part and the second carrying part to carry the wafer.

[0007] Optionally, the first bearing portion is a hollow structure, used for allowing the second bearing portion to pass through when the second bearing portion moves from a position lower than the first bearing portion to a position higher than the first bearing portion, and also used for allowing the second bearing portion to pass through when the second bearing portion moves from a position higher than the first bearing portion to a position lower than the first bearing portion.

[0008] Optionally, the bearing mechanism further includes a base; the base is disposed inside the cleaning tank and fixedly connected to the bottom plate of the cleaning tank; the base is used to bear the first bearing part when the first bearing part descends to the position of the base;

[0009] The base has a mounting through hole, and the second bearing portion can pass through the mounting through hole.

[0010] Optionally, the initial position of the second bearing portion is a position higher than the base; the initial position of the first bearing portion is a position lower than the second bearing portion and higher than the base;

[0011] The controller is also used to control the first carrying part to rise to the notch of the cleaning tank and take the wafer, and then descend so that the wafer is carried by the second carrying part;

[0012] The controller is further configured to control the second carrying part to descend to a position lower than the base when the first carrying part descends to the base, so that the wafer is carried by the first carrying part.

[0013] Optionally, a pressure sensor is provided on a surface of the base on one side facing the first carrying device; the pressure sensor is used to send a trigger signal to the controller when the first carrying part is on the pressure sensor; and the controller controls the second carrying device to descend when receiving the trigger signal;

[0014] The controller is further configured to start timing upon receiving the trigger signal, and control the first supporting part to rise after a preset timing period, until the first supporting part drives the wafer out of the cleaning tank.

[0015] Optionally, the first bearing part includes a plurality of first bearing bars arranged in parallel and at intervals; the second bearing part includes a plurality of second bearing bars arranged in parallel and at intervals;

[0016] Each of the plurality of first carrying bars and the plurality of second carrying bars has a plurality of latching teeth spaced apart along the length direction thereof, for carrying the wafers placed vertically;

[0017] The orthographic projections of the plurality of first bearing bars on the horizontal plane do not overlap with the orthographic projections of the plurality of second bearing bars on the horizontal plane, so that the plurality of second bearing bars can pass through the spaces between the plurality of first bearing bars.

[0018] Optionally, the first bearing device further includes a first driving assembly and two first fixing frames;

[0019] The two first fixing frames are respectively fixedly connected to two ends of the plurality of first bearing rods;

[0020] The power output end of the first driving component is used to connect to at least one of the first fixing frames; the first driving component is used to drive the first fixing frame to rise and fall.

[0021] Optionally, the second carrying device further includes a second driving assembly and a second fixing frame;

[0022] The second fixing frame is located at the bottom side of the plurality of second bearing bars and is fixedly connected to all the second bearing bars;

[0023] The second driving assembly is fixed to the bottom of the cleaning tank; the power output end of the second driving assembly is connected to the second fixing frame for driving the second fixing frame to rise and fall.

[0024] Optionally, a plurality of the first bearing bars are symmetrically arranged on both sides of all the second bearing bars.

[0025] As another technical solution, the utility model also provides a semiconductor cleaning device, which includes a plurality of cleaning tanks and the carrying mechanism as described above; wherein the cleaning tanks are used to contain cleaning liquid;

[0026] The second carrying devices of the carrying mechanism are consistent in number with the cleaning tanks and are arranged in the plurality of cleaning tanks in a one-to-one correspondence.

[0027] The utility model has the following beneficial effects:

[0028] The bearing mechanism provided by the embodiment of the utility model includes a first bearing device and a second bearing device, and the two respectively have a first bearing part and a second bearing part that can be lifted and lowered in the cleaning tank. Since the contact point positions of the first bearing part and the second bearing part on the surface of the wafer are different, and the two can intersperse with each other in the vertical direction, the interspersing can be achieved by controlling the lifting and lowering actions of the two. Furthermore, the utility model also proposes to use a controller to control the first bearing part and the second bearing part to rise or fall respectively, so as to switch the relative position relationship between the two, specifically to achieve a position state in which the first bearing part is higher than the second bearing part or a position state in which the second bearing part is higher than the first bearing part, so as to achieve the wafer being carried by the first bearing part and the second bearing part respectively, thereby switching the contact point position between the wafer and the bearing part, so that different contact points can all contact with the cleaning solution, thereby ensuring that all positions on the surface of the wafer can be cleaned. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A simplified structural diagram of the support mechanism provided by the embodiment of the utility model before the cleaning process begins;

[0030] Figure 2 A simplified structural diagram of the carrying mechanism provided by the embodiment of the utility model when the wafer is transferred to the second carrying device;

[0031] Figure 3A simplified structural diagram of the carrying mechanism provided by an embodiment of the utility model when a wafer is transferred to a first carrying device;

[0032] Figure 4 A simplified structural diagram of the support mechanism provided by the embodiment of the utility model after the cleaning process is completed;

[0033] Figure 5 A schematic diagram of the structure of a first carrying device provided in an embodiment of the utility model;

[0034] Figure 6 A schematic diagram of the structure of a second carrying device provided in an embodiment of the utility model;

[0035] Figure 7 A schematic diagram of the structure of the movable cover plate and the slot cover opening and closing device provided in the embodiment of the utility model;

[0036] Figure 8 A schematic diagram of the positions of the contact points between the first carrying part and the second carrying part and the wafer provided in an embodiment of the utility model. DETAILED DESCRIPTION

[0037] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0038] It should be understood that the specific embodiments and drawings described herein are only used to explain the present invention, rather than to limit the present invention.

[0039] It can be understood that, in the absence of conflict, the various embodiments of the present utility model and the various features in the embodiments can be combined with each other.

[0040] It can be understood that, for the convenience of description, the drawings of the present invention only show the parts related to the embodiments of the present invention, while the parts unrelated to the embodiments of the present invention are not shown in the drawings.

[0041] It is understandable that, in the absence of conflict, the functions and steps marked in the flowcharts and block diagrams of the embodiments of the present utility model may occur in an order different from that marked in the drawings.

[0042] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

[0043] Please refer to Figure 1The present embodiment provides a carrying mechanism, which is applied to semiconductor cleaning equipment. The semiconductor cleaning equipment has a cleaning tank 1 for containing a cleaning solution; specifically, the cleaning solution is, for example, hydrofluoric acid (HF), buffered oxide etchant (BOE), sulfuric acid peroxide mixture (SPM), phosphoric acid (H3PO4) and other acid and alkali solutions; or, the cleaning solution can also be deionized water.

[0044] The carrying mechanism comprises a first carrying device 2, a second carrying device 3 and a controller (not shown in the figure).

[0045] The first carrying device 2 and the second carrying device 3 respectively have a first carrying portion 21 and a second carrying portion 31. The first carrying portion 21 is used to support the wafer, and the first carrying portion 21 can be raised and lowered in the cleaning tank 1. The second carrying portion 31 is used to support the wafer, and the second carrying portion 31 can be raised and lowered in the cleaning tank 1. Figure 8 As shown, the position of the contact point B of the second bearing part 31 on the wafer surface is different from the position of the contact point A of the first bearing part 21 on the wafer surface. The first bearing part 21 and the second bearing part 31 can be arranged to intersect with each other, that is, when the first bearing part 21 and the second bearing part 31 move to one place, the bearing part of the lower one will pass through the other and be higher than the other, and under the action of gravity, the wafer will always be supported by the higher one of the first bearing part 21 and the second bearing part 31, so the bearing part of the wafer can be switched by controlling the relative position of the first bearing part 21 and the second bearing part 31. Furthermore, the controller is used to control the first carrier 21 and the second carrier 31 to rise or fall respectively so that one of them is at a higher position than the other, thereby realizing the switching of the wafer being carried by the first carrier 21 or the second carrier 31, and then realizing the switching of the contact points between the wafer and the carrier, so that all the contact points can contact with the cleaning solution, thereby realizing "no dead angle" cleaning of the wafer, thereby reducing the defect rate at the contact points in the subsequent process of the wafer and improving the product yield; it can also improve the utilization rate of the wafer surface, so that more grains can be formed on a certain area of ​​the wafer in the subsequent process, thereby reducing the cost of integrated circuit devices made of the wafer.

[0046] Specifically, the first bearing portion 21 is, for example, a hollow structure, so that when the second bearing portion 31 moves from a position lower than the first bearing portion 21 to a position higher than the first bearing portion 21, the first bearing portion 21 can allow the second bearing portion 31 to pass through; and when the second bearing portion 31 moves from a position higher than the first bearing portion 21 to a position lower than the first bearing portion 21, the first bearing portion 21 can allow the second bearing portion 31 to pass through; in this way, the first bearing portion 21 and the second bearing portion 31 can be interlaced with each other in the vertical direction. Figure 1-4 Taking the first carrying device 2 and the second carrying device 3 shown as an example, after the first carrying part 21 descends to the position of the second carrying part 31, the second carrying part 31 will pass through the first carrying part 21 and be higher than the first carrying part 21, so that the wafer carried on the first carrying part 21 falls on the second carrying part 31, thereby realizing the switching of the wafer from being carried by the first carrying part 21 to being carried by the second carrying part 31; and after the second carrying part 31 descends to the position of the first carrying part 21, the second carrying part 31 will pass through the first carrying part 21 and be lower than the first carrying part 21, so that the wafer carried on the second carrying part 21 falls on the first carrying part 31, thereby realizing the switching of the wafer from being carried by the second carrying part 21 to being carried by the first carrying part 31. Since the position of contact point B of the second carrier part 31 on the wafer surface is different from the position of contact point A of the first carrier part 21 on the wafer surface, the contact points between the wafer and the carrier part can be switched by switching the wafer to be carried by the first carrier device 2 or the second carrier device 3, so that all contact points can be in contact with the cleaning solution, so that when the first carrier part 21 carries the wafer, the contact points between the second carrier part 31 and the wafer can be cleaned, and when the second carrier part 31 carries the wafer, the contact points between the first carrier part 21 and the wafer can be cleaned.

[0047] Moreover, the switching process of the above-mentioned contact points is achieved by controlling the lifting and lowering actions of the first carrying part 21 and the second carrying part 31. During the switching process, the wafer is only subjected to gravity and supporting force, and the movement path of the wafer coincides with the movement path of the first carrying part 21 and the second carrying part 31 and are both along the vertical direction. Therefore, the wafer will not have relative movement with the first carrying part 21 or the second carrying part 31 in directions other than the vertical direction, which minimizes the possibility of friction between the wafer and the carrying part, thereby reducing damage to the wafer surface.

[0048] Furthermore, in some embodiments, Figure 5 As shown, the first bearing part 21 includes a plurality of first bearing rods 211 arranged in parallel and at intervals. Each of the plurality of first bearing rods 211 has a plurality of teeth arranged at intervals along the length direction thereof, and the plurality of first bearing rods 211 are used to carry a plurality of vertically placed wafers. Figure 6As shown, the second carrying part 31 includes a plurality of second carrying rods 311 arranged in parallel and at intervals. Each of the plurality of second carrying rods 311 has a plurality of teeth arranged at intervals along the length direction thereof, and the plurality of second carrying rods 311 are used to carry a plurality of vertically placed wafers.

[0049] The orthographic projections of the multiple first bearing rods 211 on the horizontal plane do not overlap with the orthographic projections of the multiple second bearing rods 311 on the horizontal plane, so that the multiple first bearing rods 211 and the multiple second bearing rods 311 can pass through the corresponding intervals when they move relative to each other in the vertical direction, thereby achieving that the multiple first bearing rods 211 and the multiple second bearing rods 311 can be interspersed with each other in the vertical direction.

[0050] It is easy to understand that the latching teeth of the first carrying rod 211 and the second carrying rod 311 are aligned one by one in the vertical direction, so that the wafer can fall naturally without colliding with the latching teeth during the mutual interpenetration of the two.

[0051] In some embodiments, Figure 5 As shown, the first bearing device 2 also includes a first driving assembly (not shown in the figure) and two first fixing frames 22. The two first fixing frames 22 are respectively fixedly connected to the two ends of the plurality of first bearing rods 211. The power output end of the first driving assembly is used to connect with the two first fixing frames 22 or one of the first fixing frames 22, and is used to drive the first fixing frames 22 to rise and fall, thereby driving the first bearing part 21 to rise and fall. Specifically, the controller is electrically connected to the first driving assembly so as to be able to send a control signal to the first driving assembly, thereby controlling the lifting action of the first bearing part.

[0052] Exemplarily, the material of the first supporting rod 211 and the first fixing frame 22 is quartz or fluorine-containing polymer material, or the surface of the first supporting device 2 and the first fixing frame 22 has a fluorine-containing material coating, so as to utilize the corrosion resistance of quartz and fluorine-containing polymer materials to ensure that the first supporting device 2 will not be corroded when immersed in the cleaning solution.

[0053] For example, Figure 5 As shown, the first fixing frame 22 is plate-shaped, and two first fixing frames 22 are connected to the plurality of first bearing rods 211 by bolts and nuts.

[0054] In some embodiments, Figure 1 and Figure 6As shown, the second bearing device 3 also includes a second driving assembly 33 and a second fixing frame 32. The second fixing frame 32 is located at the bottom side of the plurality of second bearing rods 311 and is fixedly connected to all the second bearing rods 311. The second driving assembly 33 is fixed to the bottom of the cleaning tank 1; the power output end of the second driving assembly 33 is connected to the second fixing frame 32, and is used to drive the second fixing frame 32 to rise and fall, thereby driving the second bearing part 31 to rise and fall. Specifically, the controller is electrically connected to the second driving assembly so as to be able to send a control signal to the second driving assembly, thereby controlling the lifting action of the second bearing part 31.

[0055] Exemplarily, since the second supporting device 3 is always kept immersed in the cleaning solution, the material of the second supporting rod 311 and the second fixing frame 32 is a quartz material or a fluorine-containing polymer material having a fluorine-containing material coating on the surface, so as to utilize the corrosion resistance of the fluorine-containing polymer material to ensure that the second supporting device 3 will not be corroded.

[0056] For example, Figure 6 As shown, the second fixing frame 32 is plate-shaped and extends horizontally; the bottom ends of the plurality of second bearing rods 311 are fixedly connected to the upper surface of the second fixing frame 32 .

[0057] Exemplarily, the second driving assembly 33 is a cylinder.

[0058] In some embodiments, multiple first supporting rods 211 are symmetrically arranged on both sides of all second supporting rods 311 so that the contact points between the first supporting rods 211 and the wafer are symmetrically arranged, and the contact points between the second supporting rods 311 and the wafer are located between the contact points between the first supporting rods 211 and the wafer, thereby providing stably supporting the wafer.

[0059] For example, Figure 5 and Figure 6 As shown, there are three second supporting rods 311 to ensure stable support for the wafer while minimizing the contact points; there are four first supporting rods 211 to enable the second supporting rods 311 to pass between two pairs of first supporting rods 211 while ensuring stable support for the wafer.

[0060] In some embodiments, Figure 3 As shown, the bearing mechanism further includes a base 4. The base 4 is disposed inside the cleaning tank 1; the base 4 is used to bear the first bearing part 21 when the first bearing part 21 descends to the position of the base 4, that is, the first bearing part 21 stops descending when it reaches the base 4. The base 4 has a mounting through hole, and the second bearing part 31 can pass through the mounting through hole; in this way, the second bearing part 31 can reach a position higher than the base 4 and a position lower than the base 4.

[0061] Exemplarily, the base 4 is fixedly connected to the bottom plate of the cleaning tank 1 ; alternatively, the base 4 may also be fixedly connected to the side wall of the cleaning tank 1 .

[0062] Further, in some embodiments, the initial position of the second bearing portion 31 is higher than the base 4; the initial position of the first bearing portion 21 is lower than the second bearing portion 31 and higher than the base 4. Figure 2 As shown, the controller is also used to control the first carrying part 21 to rise to the notch of the cleaning tank and take the wafer, and then descend, so that in the process of the first carrying part 21 descending from the top notch of the cleaning tank 1 to the base 4, the second carrying part 31 will pass through the first carrying part 21 to make the wafer fall on the second carrying part 31, so that the wafer is carried by the second carrying part 31, thereby realizing a single switching of the contact point.

[0063] like Figure 3 As shown, the controller is also used to control the first carrying part 21 to descend to the base 4, and control the second carrying part 31 to descend to a position lower than the base 4, so that in the process of the second carrying part 31 gradually descending to a position lower than the base 4, it can pass through the first carrying part 21, so that the wafer falls on the first carrying part 21, thereby realizing the switching of the contact point again.

[0064] like Figure 7 As shown, the top notch of the cleaning tank 1 is usually provided with a movable cover 11 and a slot cover opening and closing drive device 13, and a switch cover sensor 12 is also provided at the top notch of the cleaning tank 1 to detect the actual opening and closing state of the movable cover 11. On this basis, conventional semiconductor cleaning equipment usually transfers the wafer to the cleaning tank 1 after detecting that the movable cover 11 is opened, and closes the slot cover after transferring the wafer to the bottom of the cleaning tank 1, and detects that the movable cover 11 is closed as the beginning of the cleaning process, and starts timing the cleaning process at the same time to control the duration of the cleaning process. The slot cover opening and closing drive device 13 is usually driven by compressed air, so the change in the compressed air supply pressure affects the speed of the slot cover opening and closing. However, due to the large real-time pressure fluctuation of the compressed air supply pressure, in the factory production line of wafer processing, there may be errors in the completion time of the slot cover closing action between different cleaning tanks 1 in the same equipment and between cleaning tanks 1 in different equipment, which may lead to errors in the timing of the wafer cleaning process, resulting in low process uniformity of wafers in the same batch.

[0065] In order to solve this problem, in some embodiments, a pressure sensor 41 is provided on the surface of one side of the base 4 facing the first bearing device 2; the pressure sensor 41 is used to send a trigger signal to the controller when the first bearing part 21 is pressed on the surface of the base 4. The controller is also used to start timing after receiving the trigger signal, that is, the wafer carried by the first bearing part 21 is completely immersed in the cleaning solution as the beginning of the cleaning process. The controller is also used to control the first bearing part 21 to rise after the timing preset time, until the first bearing part 21 drives the wafer out of the cleaning tank 1, thereby ending the cleaning process. In this way, using the wafer position arrival signal as the starting point of the cleaning process can avoid the error caused by the pressure fluctuation of the compressed gas, so as to improve the timing accuracy of the cleaning process of the wafer, thereby improving the consistency of the wafer process time between the same batch and different batches, and improving the product yield. It should be noted that the above-mentioned "preset time" can be set according to the actual cleaning process requirements, and the preset time can be obtained by performing multiple cleaning processes and analyzing the process effects.

[0066] As another technical solution, this embodiment also provides a semiconductor cleaning device, which includes a plurality of cleaning tanks 1 and the above-mentioned carrying mechanism. The second carrying device 3 is the same in number as the cleaning tanks 1, and is arranged in the plurality of cleaning tanks 1 in a one-to-one correspondence; or the first carrying device 2 and the second carrying device 3 are the same in number as the cleaning tanks 1, and are arranged in the plurality of cleaning tanks 1 in a one-to-one correspondence.

[0067] One way of transferring wafers between different cleaning tanks is that the first carrier 2 can be used to drive the wafers into multiple cleaning tanks 1 to drive the wafers to be transferred between the multiple cleaning tanks 1, that is, Figure 4 As shown, after the wafer has completed the cleaning process in the current cleaning tank 1 according to the corresponding recipe, the first carrier 2 first moves upward and then horizontally transfers it to the next cleaning tank 1 to perform the cleaning process in other cleaning tanks.

[0068] Correspondingly, the first driving assembly of the first carrying device 2 is fixed outside the cleaning tank 1 , and the power output end of the first driving assembly can extend into the cleaning tank 1 through the top notch of the cleaning tank 1 .

[0069] Another way of transferring wafers between different cleaning tanks is that the wafer is transferred by the first carrier 2 to the slot of the cleaning tank where it is located, and the wafer is taken away by other transfer devices and transferred to the slot of the next cleaning tank, and the wafer is taken by the first carrier 2 set in the cleaning tank. In this way, wafers are transferred between different cleaning tanks by other transfer devices.

[0070] Based on the above-mentioned supporting mechanism and semiconductor cleaning equipment, this embodiment further proposes a wafer transfer process, which specifically includes:

[0071] S1. Before the cleaning process starts, the first bearing part 21 and the second bearing part 31 are both in the initial position; specifically, the first bearing part 21 is pressed on the upper surface of the base 4, and the second bearing part 31 is higher than the base 4 and inserted between the first bearing parts 21;

[0072] S2, in the film taking stage, the controller controls the first carrying part 21 to rise to the top port of the cleaning tank 1 to take the film, and then descend after taking the film;

[0073] S3, when the first carrying part 21 descends to a position flush with the second carrying part 31, the second carrying part 31 is inserted between the first carrying parts 21 so that the wafer falls on the second carrying part 31;

[0074] S4, the controller controls the first bearing part 21 to continue to descend until it descends to the surface of the base 4; at the same time, the pressure sensor 41 detects that the first bearing part is pressed thereon, and sends a trigger signal to the controller;

[0075] S5, the controller starts timing after receiving the trigger signal, and controls the second carrier 31 to descend until it descends to a position lower than the base 4; during this process, the second carrier 31 passes through the first carrier 21 so that the wafer falls on the first carrier 21;

[0076] S6 , after the controller counts the preset time, it controls the first carrying part 21 to carry the wafer and ascend until the wafer is moved out of the cleaning tank 1 , and the cleaning is completed.

[0077] S7. After cleaning is completed, the controller controls the first carrier device 2 to transfer the wafer to other cleaning tanks 1 for performing different cleaning processes.

[0078] It should be noted that the above steps S3-S5 can be performed cyclically to achieve multiple switching of the contact points. Specifically, the number of switching of the contact points can be set according to different cleaning requirements.

[0079] However, the wafer transfer process of the semiconductor cleaning equipment of this embodiment is not limited to the above process, wherein the initial position states and lifting nodes of the first carrying device 2 and the second carrying device 3 can be adjusted according to actual cleaning requirements.

[0080] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A bearing mechanism, applied to semiconductor cleaning equipment; characterized in that: include: A first carrying device, a second carrying device and a controller; The first carrying device has a first carrying portion that can be raised and lowered in a cleaning tank of the semiconductor cleaning equipment; The second carrying device has a second carrying portion that can be raised and lowered in the cleaning tank; The first bearing part and the second bearing part are both used for supporting a wafer; The contact point position of the second bearing part on the surface of the wafer is different from the contact point position of the first bearing part on the surface of the wafer; The first bearing portion and the second bearing portion may be interpenetrated with each other in a vertical direction; The controller is used for controlling the first carrying part and the second carrying part to rise or fall respectively, so as to switch between the first carrying part and the second carrying part to carry the wafer.

2. The supporting mechanism according to claim 1, characterized in that: The first bearing portion is a hollow structure, which is used for allowing the second bearing portion to pass through when the second bearing portion moves from a position lower than the first bearing portion to a position higher than the first bearing portion, and is also used for allowing the second bearing portion to pass through when the second bearing portion moves from a position higher than the first bearing portion to a position lower than the first bearing portion.

3. The supporting mechanism according to claim 2, characterized in that: It also includes a base; the base is arranged inside the cleaning tank; the base is used to carry the first bearing part when the first bearing part descends to the base position; The base has a mounting through hole, and the second bearing portion can pass through the mounting through hole.

4. The supporting mechanism according to claim 3, characterized in that: The initial position of the second bearing portion is a position higher than the base; the initial position of the first bearing portion is a position lower than the second bearing portion and higher than the base; The controller is also used to control the first carrying part to rise to the notch of the cleaning tank and take the wafer, and then descend so that the wafer is carried by the second carrying part; The controller is further configured to control the second carrying part to descend to a position lower than the base when the first carrying part descends to the base, so that the wafer is carried by the first carrying part.

5. The supporting mechanism according to claim 4, characterized in that: A pressure sensor is arranged on a surface of the base facing the first bearing device; the pressure sensor is used to send a trigger signal to the controller when the first bearing part is pressed on the pressure sensor; the controller controls the second bearing device to descend when receiving the trigger signal; The controller is further configured to start timing upon receiving the trigger signal, and control the first supporting part to rise after a preset timing period, until the first supporting part drives the wafer out of the cleaning tank.

6. The supporting mechanism according to claim 1, characterized in that: The first bearing part includes a plurality of first bearing bars arranged in parallel and at intervals; the second bearing part includes a plurality of second bearing bars arranged in parallel and at intervals; Each of the plurality of first carrying bars and the plurality of second carrying bars has a plurality of latching teeth spaced apart along the length direction thereof, for carrying the wafers placed vertically; The orthographic projections of the first bearing bars on the horizontal plane do not overlap with the orthographic projections of the second bearing bars on the horizontal plane, so that the second bearing bars can pass through the spaces between the first bearing bars.

7. The supporting mechanism according to claim 6, characterized in that: The first bearing device also includes a first driving assembly and two first fixing frames; The two first fixing frames are respectively fixedly connected to two ends of the plurality of first bearing rods; The power output end of the first driving component is used to connect to at least one of the first fixing frames; the first driving component is used to drive the first fixing frame to rise and fall.

8. The supporting mechanism according to claim 7, characterized in that: The second carrying device also includes a second driving assembly and a second fixing frame; The second fixing frame is located at the bottom side of the plurality of second bearing bars and is fixedly connected to all the second bearing bars; The second driving assembly is fixed to the bottom of the cleaning tank; the power output end of the second driving assembly is connected to the second fixing frame for driving the second fixing frame to rise and fall.

9. The supporting mechanism according to claim 6, characterized in that: A plurality of the first bearing bars are symmetrically arranged on both sides of all the second bearing bars.

10. A semiconductor cleaning device, characterized in that: It comprises a plurality of cleaning tanks and a carrying mechanism as claimed in any one of claims 1 to 9; wherein the cleaning tanks are used to contain cleaning liquid; The second carrying devices of the carrying mechanism are consistent in number with the cleaning tanks and are arranged in the plurality of cleaning tanks in a one-to-one correspondence.

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