Low-power-consumption chip aging device

Abstract

The utility model relates to the technical field of chip production, in particular to a low-power-consumption chip aging device. Aiming at the problems that the existing aging device is troublesome to operate and cannot adapt to chips of various sizes, the adopted improvement comprises a rack and an aging assembly for aging a rectangular chip, the device further comprises at least three chip bearing units which are evenly distributed in the circumferential direction. The chip supporting unit comprises an outer supporting strip and an inner supporting strip which are matched to support the rectangular chip; the outer supporting strips and the inner supporting strips are arc-shaped; the opposite side faces of the outer supporting strip and the inner supporting strip are each provided with a sub-containing groove. The sub-placing grooves of the outer supporting strip and the sub-placing grooves of the inner supporting strip form chip placing grooves, and one chip placing groove is correspondingly arranged under the aging assembly. The adjusting assembly is used for adjusting the width of the chip placing groove corresponding to each chip bearing unit; the rack is provided with a rotating assembly for driving the adjusting assembly to rotate. Through the improvement, the position of the chip placing groove can be conveniently adjusted, and the chip placing groove can be adapted to rectangular chips with different widths.

Description

Technical Field

[0001] The utility model relates to the technical field of chip production, and more specifically to a low-power chip aging device. Background Art

[0002] A chip is a small silicon wafer containing an integrated circuit, which is a part of a computer or other electronic device. It uses semiconductor process technology to integrate all the semiconductors, resistors, capacitors and other components and the connecting wires between them required to form a circuit with a certain function on a small silicon wafer, and then welds and packages them in a tube shell to become a microstructure with the required circuit function.

[0003] The main purpose of chip aging is to evaluate the reliability of the chip after long-term use, including the chip's life, safety, environmental adaptability, etc. By simulating the environmental impact of the chip during long-term use, such as accelerated aging tests under conditions of high temperature, constant current, constant voltage, etc., the chip's life, failure rate and other data can be obtained, and the causes and mechanisms of chip failure can be analyzed and studied.

[0004] At present, chips are often aged by using an aging device, such as the device disclosed in patent publication number CN218180785U, which includes a base and a test component. The base is equipped with a chip placement board, and the surface of the chip placement board is provided with multiple chip placement slots. A support plate is vertically installed on one side of the base, and a top plate is vertically installed on the upper end of the support plate. The aging test component is installed on the top plate. The disadvantage of this device is that, since the aging detection probe is single and fixed, the aging detection probe can only perform aging tests on the chip directly below it. When testing the chips in other chip placement slots of the chip placement board, it is necessary to move the chip placement board in different directions, which is troublesome to operate, and the size of the chip placement slot is not adjustable, which makes it difficult to adapt to rectangular chips of various sizes.

[0005] Therefore, there is still a need to improve the existing aging devices to solve the problems of cumbersome operation and inability to adapt to chips of various sizes. Utility Model Content

[0006] The technical problem to be solved by the utility model is to provide a low-power chip aging device in view of the above-mentioned defects of the prior art.

[0007] The technical solution adopted by the utility model to solve its technical problems is:

[0008] A low-power chip aging device is constructed, comprising a frame and an aging component for aging rectangular chips; the low-power chip aging device also comprises at least three chip supporting units evenly distributed in a circle; the chip supporting unit comprises an outer supporting bar and an inner supporting bar for supporting rectangular chips; the outer supporting bar and the inner supporting bar are both arc-shaped; the opposite sides of the outer supporting bar and the inner supporting bar are provided with sub-placement grooves; the sub-placement grooves of the outer supporting bar and the sub-placement grooves of the inner supporting bar constitute a chip placement groove, and there is a corresponding chip placement groove directly below the aging component; the low-power chip aging device also comprises an adjusting component for adjusting the width of the chip placement groove corresponding to each chip supporting unit; the frame is equipped with a rotating component for driving the adjusting component to rotate.

[0009] In some embodiments, the rotating assembly includes a turntable, a driving assembly connected to the turntable and driving the turntable to rotate; the inner support bar surrounds the turntable; the outer support bar surrounds the inner support bar;

[0010] The adjustment assembly includes a plurality of adjustment units corresponding one by one to the plurality of chip supporting units; the adjustment unit includes an outer connecting block, an intermediate connecting block and an inner connecting block arranged in sequence along the radial direction of the outer supporting bar; the outer connecting block is located below the outer supporting bar and fixed to the middle part thereof; the intermediate connecting block is located below the inner supporting bar and fixed to the middle part thereof; the inner connecting block is located below the turntable and fixed to the middle part thereof; the adjustment unit also includes a laterally placed screw; the outer connecting block and the intermediate connecting block are both threadedly connected to the screw, and the movement directions of the outer connecting block and the intermediate connecting block are opposite; one end of the screw is rotatably connected to the inner connecting block, and the other end protrudes out of the outer edge of the turntable.

[0011] In some embodiments, the adjustment unit further includes a bearing; the bearing is embedded in and fixed on the inner connecting block; the bearing is sleeved on and fixed on the screw rod.

[0012] In some embodiments, the driving assembly includes a rotating shaft perpendicular to the rotating disk, a connecting ear sleeved and fixed on the rotating shaft, and a plurality of bolts; both sides of the connecting ear and both sides of the rotating disk are provided with a plurality of threaded holes corresponding to the plurality of bolts one by one;

[0013] The driving assembly also includes a transversely placed motor, a driving pulley, a driven pulley, and a belt connecting the driving pulley and the driven pulley; the motor is fixed to the frame; the driving pulley is sleeved and fixed on the motor shaft of the motor; the driven pulley is sleeved and fixed on the rotating shaft.

[0014] In some embodiments, the low-power chip aging device also includes a lifting head and a moving component for driving the lifting head to move along the Z axis; the outer support bar is provided with a lifting groove connected to the bottom of the sub-placement groove; the head of the lifting head is adapted to the lifting groove; and the moving component is installed on the rack.

[0015] In some embodiments, the lifting head includes a bottom connecting block and two lifting rods distributed in sequence along the length direction of the sub-placement groove; the bottom connecting block is connected to the moving component and driven by it; the two lifting rods are respectively fixed to the two sides of the bottom connecting block; the lifting rods are used to penetrate the lifting through groove.

[0016] In some embodiments, the moving assembly includes a linear cylinder; a cylinder body of the linear cylinder is fixed to the frame; and a movable end of the linear cylinder is threadedly connected to the bottom connecting block.

[0017] In some embodiments, the chip supporting units are provided in four groups.

[0018] In some embodiments, the rack is also fixed with a temporary storage slot; the temporary storage slot is used to prevent the rectangular chips to be aged.

[0019] Compared with the prior art, the beneficial effect of the utility model is that it is easy to complete the position adjustment of the chip placement slot, and can adapt to rectangular chips of different widths. Specifically, when the aging component performs aging treatment on the rectangular chip in the chip placement slot directly below it, the production personnel can add the rectangular chips to be aged to other chip placement slots. After the aging component completes the aging of the current chip, the rotating component drives the adjusting component to rotate, so that the next chip placement slot moves to the directly below the aging component 20, and the position adjustment of the chip supporting unit is quickly completed. In addition, the adjusting component can adjust the width of the chip placement slot corresponding to each chip supporting unit, more specifically refers to the space enclosed by the outer support bar and the inner support bar. When the outer support bar and the inner support bar move in opposite directions, the enclosed space becomes larger and can adapt to wider rectangular chips. When the outer support bar and the inner support bar move toward each other, the enclosed space becomes smaller and can adapt to narrower rectangular chips, so that different chips can be processed, and the versatility is good. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the utility model will be further described below in conjunction with the accompanying drawings and embodiments. The drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work:

[0021] Figure 1This is a schematic diagram of the overall structure of a low-power chip aging device in a preferred embodiment of the utility model;

[0022] Figure 2 yes Figure 1 A1 in the middle is an enlarged view;

[0023] Figure 3 yes Figure 1 A2 in the middle is an enlarged view;

[0024] Figure 4 This is a schematic diagram of the use of a chip supporting unit in a low-power chip aging device according to a preferred embodiment of the utility model;

[0025] Figure 5 This is another schematic diagram of the use of a chip supporting unit in a low-power chip aging device according to a preferred embodiment of the utility model. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the following will be described clearly and completely in combination with the technical solution in the embodiments of the utility model. Obviously, the described embodiments are partial embodiments of the utility model, not all embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the protection scope of the utility model.

[0027] A low power consumption chip aging device according to a preferred embodiment of the utility model is as follows Figure 1-Figure 5 As shown, it includes a rack 10 and an aging component 20 for aging rectangular chips (not shown in the figure); the low-power chip aging device also includes at least three chip supporting units 30 evenly distributed in a circle; the chip supporting unit 30 includes an outer support bar 300 and an inner support bar 301 for supporting the rectangular chip; the outer support bar 300 and the inner support bar 301 are both arc-shaped; the opposite sides of the outer support bar 300 and the inner support bar 301 are provided with sub-placement grooves 3000; the sub-placement grooves 3000 of the outer support bar 300 and the sub-placement grooves 3000 of the inner support bar 301 constitute a chip placement groove, and there is a chip placement groove corresponding to the aging component 20; the low-power chip aging device also includes an adjustment component 40 for adjusting the width of the chip placement groove corresponding to each chip supporting unit 30; the rack 10 is equipped with a rotating component 50 for driving the adjustment component 40 to rotate.

[0028] Compared with the prior art, the device provided in this embodiment is convenient for completing the position adjustment of the chip placement slot, and can adapt to rectangular chips of different widths. Specifically, when the aging component 20 performs aging treatment on the rectangular chip in the chip placement slot directly below it, the production personnel can add the rectangular chip to be aged to other chip placement slots. After the aging component 20 completes the aging of the current chip, the rotating component 50 drives the adjustment component 40 to rotate, so that the next chip placement slot moves to the directly below the aging component 20, and the position adjustment of the chip support unit 30 is quickly completed. In addition, the adjustment component 40 can adjust the width of the chip placement slot corresponding to each chip support unit 30, more specifically, it refers to the space enclosed by the outer support bar 300 and the inner support bar 301. When the outer support bar 300 and the inner support bar 301 move in opposite directions, the enclosed space becomes larger, which can adapt to wider rectangular chips. When the outer support bar 300 and the inner support bar 301 move toward each other, the enclosed space becomes smaller, which can adapt to narrower rectangular chips, so that different chips can be processed, and the versatility is good.

[0029] In some embodiments, the rotating assembly 50 includes a turntable 500, a driving assembly 501 connected to the turntable 500 and driving the turntable 500 to rotate; the inner support bar 301 surrounds the turntable 500; the outer support bar 300 surrounds the inner support bar 301;

[0030] The adjustment assembly 40 includes a plurality of adjustment units 400 corresponding one by one to the plurality of chip supporting units 30; the adjustment unit 400 includes an outer connecting block 4000, an intermediate connecting block 4001 and an inner connecting block 4002 which are sequentially arranged along the radial direction of the outer supporting bar 300; the outer connecting block 4000 is located below the outer supporting bar 300 and is fixed to the middle part thereof; the intermediate connecting block 4001 is located below the inner supporting bar 301 and is fixed to the middle part thereof; the inner connecting block 4002 is located below the turntable 500 and is fixed to the middle part thereof; the adjustment unit 400 also includes a laterally placed screw 4003; the outer connecting block 4000 and the intermediate connecting block 4001 are both threadedly connected to the screw 4003, and the movement directions of the outer connecting block 4000 and the intermediate connecting block 4001 are opposite; one end of the screw 4003 is rotatably connected to the inner connecting block 4002, and the other end protrudes from the outer edge of the turntable 500.

[0031] The rotating assembly 50 provided in the above embodiment has a simple structure, is easy to use, and is easy to manufacture. Specifically, when in use, the production personnel can hold and rotate the screw 4003 to make the outer connecting block 4000 and the middle connecting block 4001 move toward or in the opposite direction, ensuring that the center of the formed chip placement groove is always located directly below the aging assembly 20, and the alignment is accurate. In addition, the outer connecting block 4000, the middle connecting block 4001, and the inner connecting block 4002 are all arranged downward, which can reduce the space occupied on the turntable 500.

[0032] In some embodiments, the adjustment unit 400 further includes a bearing 4004; the bearing 4004 is embedded and fixed on the inner connection block 4002; the bearing 4004 is sleeved and fixed on the screw 4003. The bearing 4004 is used to realize the rotation connection, with low friction and high transmission accuracy.

[0033] In some embodiments, the driving assembly 501 includes a rotating shaft (not shown in the figure) perpendicular to the rotating disk 500, a connecting ear (not shown in the figure) sleeved and fixed on the rotating shaft, and a plurality of bolts (not shown in the figure); both sides of the connecting ear and both sides of the rotating disk 500 are provided with a plurality of threaded holes 5000 corresponding to the plurality of bolts one by one;

[0034] The driving assembly 501 also includes a horizontally placed motor 5010, a driving pulley (not shown in the figure), a driven pulley (not shown in the figure), and a belt 5011 connecting the driving pulley and the driven pulley; the motor 5010 is fixed to the frame 10; the driving pulley is sleeved and fixed on the motor shaft of the motor 5010; and the driven pulley is sleeved and fixed on the rotating shaft.

[0035] In the above embodiment, the turntable 500 and the connecting ears are fixed by bolts and threaded holes 5000, which is convenient for assembly and disassembly. At the same time, the driving component 501 adopts the above layout and is flat, which reduces the space occupied in the vertical direction.

[0036] In some embodiments, a low-power chip aging device further includes a lifting head 60 and a moving assembly for driving the lifting head 60 to move along the Z axis; the outer support bar 300 is provided with a lifting slot 3001 connected to the bottom of the sub-placement slot 3000; the head of the lifting head 60 is adapted to the lifting slot 3001; and the moving assembly is installed on the rack 10. After the aging assembly 20 completes the aging process of the chip, the rotating assembly 50 drives the chip supporting unit 30 to rotate, so that the chip supporting unit 30 carrying the chip that has completed aging moves to the top of the lifting head 60, and then the moving assembly drives the lifting head 60 upward, so that the lifting head 60 penetrates the lifting slot 3001, so that the chip can be lifted up, which is convenient for the production personnel to quickly take away the chip; after taking away the chip, the moving assembly drives the lifting head 60 downward to avoid the chip supporting unit 30, so that it can rotate to the next station for refilling.

[0037] In some embodiments, the lifting head 60 includes a bottom connecting block 600 and two lifting rods 601 distributed in sequence along the length direction of the sub-placement groove 3000; the bottom connecting block 600 is connected to the moving component and driven by it; the two lifting rods 601 are respectively fixed to the two sides of the bottom connecting block 600; the lifting rods 601 are used to penetrate into the lifting groove 3001, and two lifting rods 601 are set to push the two sides of the chip. After lifting, the chip is more stable, which is convenient for production personnel to take away the chip.

[0038] In some embodiments, the moving component includes a linear cylinder 700; the cylinder body of the linear cylinder 700 is fixed to the frame 10; the movable end of the linear cylinder 700 is threadedly connected to the bottom connecting block 600, so that the height of the lifting head 60 can be fine-tuned to adjust the lifting position of the chip.

[0039] In some embodiments, the chip supporting unit 30 is provided with four groups, with more workstations, which is beneficial to improve production efficiency.

[0040] In some embodiments, the rack 10 is also fixed with a temporary storage slot 80; the temporary storage slot 80 is used to prevent the rectangular chips to be aged, so as to facilitate the production personnel to replenish materials.

[0041] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to the utility model.

Claims

1. A low-power chip aging device, comprising a rack and an aging component for aging rectangular chips; characterized in that: The low-power chip aging device also includes at least three chip supporting units evenly distributed in a circle; the chip supporting unit includes an outer supporting bar and an inner supporting bar for supporting rectangular chips; the outer supporting bar and the inner supporting bar are both arc-shaped; the opposite sides of the outer supporting bar and the inner supporting bar are provided with sub-placing grooves; the sub-placing grooves of the outer supporting bar and the sub-placing grooves of the inner supporting bar constitute a chip placing groove, and there is a corresponding chip placing groove directly below the aging component; the low-power chip aging device also includes an adjusting component for adjusting the width of the chip placing groove corresponding to each of the chip supporting units; the frame is equipped with a rotating component for driving the adjusting component to rotate.

2. A low-power chip aging device according to claim 1, characterized in that: The rotating assembly includes a rotating disk and a driving assembly connected to the rotating disk and driving the rotating disk to rotate; the inner supporting bar surrounds the rotating disk; the outer supporting bar surrounds the inner supporting bar; The adjustment assembly includes a plurality of adjustment units corresponding one by one to the plurality of chip supporting units; the adjustment unit includes an outer connecting block, an intermediate connecting block and an inner connecting block arranged in sequence along the radial direction of the outer supporting bar; the outer connecting block is located below the outer supporting bar and fixed to the middle part thereof; the intermediate connecting block is located below the inner supporting bar and fixed to the middle part thereof; the inner connecting block is located below the turntable and fixed to the middle part thereof; the adjustment unit also includes a laterally placed screw; the outer connecting block and the intermediate connecting block are both threadedly connected to the screw, and the movement directions of the outer connecting block and the intermediate connecting block are opposite; one end of the screw is rotatably connected to the inner connecting block, and the other end protrudes out of the outer edge of the turntable.

3. A low-power chip aging device according to claim 2, characterized in that: The adjusting unit further comprises a bearing; the bearing is embedded in and fixed on the inner connecting block; the bearing is sleeved on and fixed on the screw rod.

4. A low-power chip aging device according to claim 2, characterized in that: The driving assembly includes a rotating shaft perpendicular to the rotating disk, a connecting ear sleeved and fixed on the rotating shaft, and a plurality of bolts; both sides of the connecting ear and both sides of the rotating disk are provided with a plurality of threaded holes corresponding to the plurality of bolts one by one; The driving assembly also includes a transversely placed motor, a driving pulley, a driven pulley, and a belt connecting the driving pulley and the driven pulley; the motor is fixed to the frame; the driving pulley is sleeved and fixed on the motor shaft of the motor; the driven pulley is sleeved and fixed on the rotating shaft.

5. The low-power chip aging device according to claim 1, characterized in that: The low-power chip aging device also includes a lifting head and a moving component for driving the lifting head to move along the Z axis; the outer support bar is provided with a lifting groove connected to the bottom of the sub-placement groove; the head of the lifting head is adapted to the lifting groove; and the moving component is installed on the rack.

6. A low-power chip aging device according to claim 5, characterized in that: The lifting head includes a bottom connecting block and two lifting rods distributed in sequence along the length direction of the sub-placing groove; the bottom connecting block is connected to the moving component and driven by it; the two lifting rods are respectively fixed to the two sides of the bottom connecting block; the lifting rods are used to penetrate the lifting through groove.

7. A low-power chip aging device according to claim 6, characterized in that: The moving assembly comprises a linear cylinder; a cylinder body of the linear cylinder is fixed to the frame; and a movable end of the linear cylinder is threadedly connected to the bottom connecting block.

8. The low-power chip aging device according to claim 1, characterized in that: The chip supporting units are provided with four groups.

9. The low-power chip aging device according to claim 1, characterized in that: The rack is also fixed with a temporary storage slot; the temporary storage slot is used to prevent the rectangular chips to be aged.

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