LED packaging structure
By adjusting the arrangement of LED chips in the LED packaging structure and using a combination of white glue and fluorescent glue layers, the problem of the inability to reduce blue light radiation power in the prior art is solved, and the safety of human eyes and the optimization of spectral effects are achieved.
Patent Information
- Application Number
- CN202420397131.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-01
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2034-03-01
AI Technical Summary
In the design of existing full spectrum LEDs, LEDs in the three bands adopt the order arrangement of high 470 bands - low 440 bands - medium 450 bands. Although the spectrum is closer to the solar spectrum, it cannot reduce the power of blue light radiation, which is more harmful to human eyes.
By sequentially setting a first LED chip with a band of 440 nm to 442.5 nm, a second LED chip with a band of 450 nm to 452.5 nm and a third LED chip with a band of 470 nm to 472.5 nm on the substrate, and white glue is placed on the periphery of the second LED chip and the third LED chip to increase the concentration of the high-band blue light, and then the combination of the first reflective layer and the yellow-green fluorescent glue layer allows the high-band blue light to be fully scattered and the blue light radiation power is reduced.
It effectively reduces the power of blue light radiation, reduces the harm to the human eye, and also obtains better spectral effects.
Smart Images
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Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of LED packaging, in particular to an LED packaging structure. Background Art
[0002] Modern people stay indoors for a long time and cannot get the health benefits of the sun. The significance of full spectrum is to reproduce sunlight. The rich spectrum of full spectrum light can reproduce the true color of objects, provide vivid lighting, relieve visual fatigue of human eyes, and thus improve the comfort of users' light environment. Due to the rapid development of LED technology, new LED light sources are increasingly used by people for their energy saving, environmental protection, durability and other characteristics, and are gradually replacing conventional lighting sources. But at the same time, the harm of LED light sources to the retina and the impact on the daily life rhythm of organisms are also reminding us to clearly see the risks of LED lighting to human biological safety.
[0003] At present, full-spectrum LEDs mainly use 440 band + 450 band + 470 band blue light chips plus blue-green powder + yellow-green powder + red powder to make RA parameters > 97 and R1-R15 parameters > 90. Among them, the three bands of LEDs are arranged in the order of high 470 band - low 440 band - middle 450 band. This design makes the final spectrum closer to the solar spectrum, but the blue light radiation power cannot be reduced, which is more harmful to the human eyes. Utility Model Content
[0004] In view of the shortcomings of the prior art, the purpose of the utility model is to provide an LED packaging structure, aiming to solve the technical problem in the prior art that three bands of LEDs are arranged in the order of high 470 band - low 440 band - middle 450 band. This design makes the final spectrum closer to the solar spectrum, but the blue light radiation power cannot be reduced, which poses a great harm to human eyes.
[0005] In order to achieve the above purpose, the utility model is implemented through the following technical solutions:
[0006] An LED packaging structure includes a substrate, on which a first LED chip with a wavelength band of 440nm to 442.5nm, a second LED chip with a wavelength band of 450nm to 452.5nm, and a third LED chip with a wavelength band of 470nm to 472.5nm are arranged in sequence, white glue is provided around the second LED chip and the third LED chip, a first reflecting layer is provided above the second LED chip and the third LED, a yellow-green fluorescent glue layer is coated above the first reflecting layer, and a red fluorescent glue layer is coated on the first LED chip.
[0007] According to one aspect of the above technical solution, a blocking and reflecting portion is provided between the first LED chip and the second LED chip, and the blocking and reflecting portion is used to reflect light.
[0008] According to one aspect of the above technical solution, a first blocking portion and a second blocking portion are further provided on the substrate, the first blocking portion is located at an end of the first LED chip away from the second LED chip, and the second blocking portion is located at an end of the third LED chip away from the second LED chip.
[0009] According to one aspect of the above technical solution, the first reflective layer is located between the blocking reflective portion and the second blocking portion, and the first reflective layer is concave downward and arranged in an arc shape.
[0010] According to one aspect of the above technical solution, a surface of the first blocking portion close to the first LED chip is tilted from top to bottom toward the first LED chip to form a first inclined surface, and a surface of the second blocking portion close to the third LED chip is tilted from top to bottom toward the third LED chip to form a second inclined surface, and a top horizontal height of the second inclined surface is less than a horizontal height of the first reflective layer.
[0011] According to one aspect of the above technical solution, a second reflective layer is further provided between the first blocking portion and the second blocking portion, and the second reflective layer is in a sawtooth shape.
[0012] According to one aspect of the above technical solution, the upper surface of the red fluorescent glue layer is in an arc shape.
[0013] According to one aspect of the above technical solution, the first LED chip, the second LED chip and the third LED chip are all fixedly connected to the substrate via solder pads.
[0014] According to one aspect of the above technical solution, electrodes of the first LED chip, the second LED chip and the third LED chip are connected to the substrate.
[0015] Compared with the prior art, the beneficial effects of the utility model are:
[0016] The positions of the original solid crystal chips are arranged in the order of high 470 band-low 440 band-medium 450 band to obtain a better spectrum. The present application arranges the first LED chip with a band of 440nm-442.5nm, the second LED chip with a band of 450nm-452.5nm, and the third LED chip with a band of 470nm-472.5nm in sequence, changes the position of the solid crystal chip, and makes the second LED chip in the medium band and the third LED chip in the high band together, thereby increasing the concentration of high-band blue light, and then applies white glue around the second LED chip and the third LED chip to radiate the high-band blue light. The radiation power is reduced, so that the harm of blue light is reduced. Finally, a first reflection layer is provided above the second LED chip and the third LED. A yellow-green fluorescent glue layer is coated on the first reflection layer. Because the high-band blue light LED chip has high excitation efficiency for the yellow-green fluorescent powder, through the effect of the first reflection layer, the blue light on the second LED chip and the third LED chip after being filtered by the white glue can fully contact with the yellow-green fluorescent glue layer and scatter out. A red fluorescent glue layer is coated on the first LED chip. Because the low-band blue light LED chip has high excitation efficiency for the red fluorescent powder, the blue light passing through the red fluorescent powder and the blue light passing through the yellow-green fluorescent glue layer interact with each other to form a better spectrum.
[0017] The utility model can obtain a better spectrum while reducing the harm of blue light. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 This is a schematic diagram of the structure of the LED packaging structure in the embodiment of the utility model;
[0019] Figure 2 for Figure 1 A magnified view of part A;
[0020] Figure 3 for Figure 1 A magnified view of part B;
[0021] Description of main component symbols:
[0022] substrate 10 The first reflection part 20 First slope 21 Second reflection part 30 second slope 31 Blocking reflection part 40 Second reflective layer 50 The first LED chip 60 Red fluorescent adhesive layer 61 electrode 90 Pads 91 Second LED chip 70 The third LED chip 80 White glue 92 First reflective layer 93 Yellow-green fluorescent adhesive layer 94
[0023] The following specific implementation manner will further illustrate the present utility model in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION
[0024] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.
[0025] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.
[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.
[0027] See also Figures 1 to 3 , shown is an LED packaging structure in an embodiment of the utility model, including a substrate 10, on which a first LED chip 60 with a wavelength of 440nm to 442.5nm, a second LED chip 70 with a wavelength of 450nm to 452.5nm, and a third LED chip 80 with a wavelength of 470nm to 472.5nm are sequentially arranged, white glue 92 is arranged around the second LED chip 70 and the third LED chip 80, a first reflective layer 93 is arranged above the second LED chip 70 and the third LED, a yellow-green fluorescent glue layer is coated above the first reflective layer 93, and a red fluorescent glue layer 61 is coated on the first LED chip 60.
[0028] It can be understood that the positions of the original solid crystal chips are arranged in the order of high 470 band-low 440 band-middle 450 band to obtain a better spectrum. The present application arranges the first LED chip 60 with a band of 440nm-442.5nm, the second LED chip 70 with a band of 450nm-452.5nm, and the third LED chip 80 with a band of 470nm-472.5nm in sequence, changes the position of the solid crystal chip, and makes the second LED chip 70 in the middle band and the third LED chip 80 in the high band together, thereby increasing the concentration of high-band blue light, and then by applying white glue 92 around the second LED chip 70 and the third LED chip 80, the high-band blue light radiation is reduced. The radiation power is reduced, so that the harm of blue light is reduced. Finally, a first reflective layer 93 is provided above the second LED chip 70 and the third LED. A yellow-green fluorescent glue layer is coated above the first reflective layer 93. Because the mid- and high-band blue LED chips have high excitation efficiency for the yellow-green fluorescent powder, through the action of the first reflective layer 93, the blue light on the second LED chip 70 and the third LED chip 80 filtered by the white glue 92 can fully contact with the yellow-green fluorescent glue layer 94 and scatter out. The first LED chip 60 is coated with a red fluorescent glue layer 61. Because the low-band blue LED chip has high excitation efficiency for the red fluorescent powder, the blue light passing through the red fluorescent powder and the blue light passing through the yellow-green fluorescent glue layer 94 interact with each other to form a better spectrum.
[0029] The utility model can obtain a better spectrum while reducing the harm of blue light.
[0030] It should be noted that, since the blue light emitted by the first LED chip 60 is not filtered by the white glue 92 , there is no need to provide a reflective layer.
[0031] Preferably, by adding 25% titanium dioxide to the white glue 92 and stirring and mixing, the filtering effect of blue light can be adjusted to obtain different blue light spectra.
[0032] Furthermore, a blocking reflection portion 40 is provided between the first LED chip 60 and the second LED chip 70, and the blocking reflection portion 40 is used to reflect light; a first blocking portion and a second blocking portion are also provided on the substrate 10, the first blocking portion is located at an end of the first LED chip 60 away from the second LED chip 70, and the second blocking portion is located at an end of the third LED chip 80 away from the second LED chip 70.
[0033] It can be understood that the idea of the present invention is that the blue light passing through the red phosphor and the blue light passing through the yellow-green phosphor glue layer 94 interact with each other to form a better spectrum. Therefore, before the low-band blue light passes through the red phosphor and before the mid- and high-band blue light passes through the yellow-green phosphor, there should not be much mixed light. This problem can be effectively solved by setting a blocking reflection part 40. At the same time, the blocking reflection part 40 can also make the blue light reflect onto the first reflection part 20 and the second reflection part 30, and then the first reflection part 20 and the second reflection part 30 reflect back, thereby making the blue light in the packaging structure space more uniform to improve the light efficiency.
[0034] Furthermore, the first reflective layer 93 is located between the blocking reflective portion 40 and the second blocking portion, and the first reflective layer 93 is concave downward and is arranged in an arc shape.
[0035] It can be understood that by arranging the first reflecting layer 93 between the blocking reflecting part 40 and the second blocking part, the mid- and high-band blue light can be completely confined within a certain space, and the first reflecting layer 93 is recessed downward and arranged in an arc shape, and the blue light passes through the first reflecting layer 93, which can improve the light mixing efficiency.
[0036] Furthermore, a surface of the first blocking portion close to the first LED chip 60 is inclined from top to bottom toward the first LED chip 60 to form a first inclined surface 21, and a surface of the second blocking portion close to the third LED chip 80 is inclined from top to bottom toward the third LED chip 80 to form a second inclined surface 31, and a top horizontal height of the second inclined surface 31 is less than a horizontal height of the first reflective layer 93.
[0037] It can be understood that the blue light reflected by the blocking reflection part 40 touches the first bevel 21 and the second bevel 31, which can increase the efficiency of the blue light being reflected back from the first bevel 21 and the second bevel 31 again. The top horizontal height of the second bevel 31 is smaller than the horizontal height of the first reflection layer 93 in order to increase the uniformity of the blue light in a certain space before the blue light in the medium and high wavelength bands enters the first reflection layer 93, so as to improve the light efficiency.
[0038] Furthermore, a second reflective layer 50 is disposed between the first blocking portion and the second blocking portion, and the second reflective layer 50 is in a sawtooth shape.
[0039] It can be understood that when the blue light passing through the red fluorescent glue layer 61 and the blue light passing through the yellow-green fluorescent glue layer 94 are mixed, they are finally reflected by the second reflective layer 50 to form a better spectrum. The jagged second reflective layer 50 can increase the refractive index and thus improve the light effect.
[0040] Furthermore, the upper surface of the red fluorescent glue layer 61 is in an arc shape.
[0041] It is understandable that, since there is no reflective layer above the first LED chip 60, the light scattering ability can be increased by setting the upper surface of the red fluorescent glue layer 61 to an arc shape, thereby better mixing light with the blue light passing through the yellow-green fluorescent glue.
[0042] Furthermore, the first LED chip 60 , the second LED chip 70 and the third LED chip 80 are all fixedly connected to the substrate 10 via a solder pad 91 ; electrodes 90 of the first LED chip 60 , the second LED chip 70 and the third LED chip 80 are connected to the substrate 10 .
[0043] In summary, the LED packaging structure in the above embodiment of the utility model is arranged in sequence by first LED chip with a wavelength of 440nm to 442.5nm, second LED chip with a wavelength of 450nm to 452.5nm, and third LED chip with a wavelength of 470nm to 472.5nm, and by changing the position of the solid crystal chip, so that the second LED chip with a medium wavelength and the third LED chip with a high wavelength are concentrated together, the concentration of high-band blue light is increased, and then white glue is applied around the second LED chip and the third LED chip to reduce the radiation power of high-band blue light, so that the harm of blue light is reduced. Low, and finally, a first reflective layer is provided above the second LED chip and the third LED, and a yellow-green fluorescent glue layer is coated on the first reflective layer. Because the high-band blue light LED chip has high excitation efficiency for the yellow-green phosphor, through the effect of the first reflective layer, the blue light on the second LED chip and the third LED chip after being filtered by the white glue can fully contact with the yellow-green fluorescent glue layer and scatter out, and a red fluorescent glue layer is coated on the first LED chip. Because the low-band blue light LED chip has high excitation efficiency for the red phosphor, the blue light passing through the red phosphor and the blue light passing through the yellow-green fluorescent glue layer interact with each other to form a better spectrum.
[0044] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0045] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. An LED packaging structure, characterized in that: It includes a substrate, on which a first LED chip with a wavelength band of 440nm to 442.5nm, a second LED chip with a wavelength band of 450nm to 452.5nm, and a third LED chip with a wavelength band of 470nm to 472.5nm are arranged in sequence, white glue is provided around the second LED chip and the third LED chip, a first reflecting layer is provided above the second LED chip and the third LED, a yellow-green fluorescent glue layer is coated above the first reflecting layer, and a red fluorescent glue layer is coated on the first LED chip.
2. The LED packaging structure according to claim 1, characterized in that: A blocking and reflecting portion is provided between the first LED chip and the second LED chip, and the blocking and reflecting portion is used for reflecting light.
3. The LED packaging structure according to claim 2, characterized in that: The substrate is further provided with a first blocking portion and a second blocking portion. The first blocking portion is located at an end of the first LED chip away from the second LED chip, and the second blocking portion is located at an end of the third LED chip away from the second LED chip.
4. The LED packaging structure according to claim 3, characterized in that: The first reflective layer is located between the blocking reflective portion and the second blocking portion, and the first reflective layer is concave downward and arranged in an arc shape.
5. The LED packaging structure according to claim 3, characterized in that: A surface of the first blocking portion close to the first LED chip is tilted from top to bottom toward the first LED chip to form a first inclined surface, and a surface of the second blocking portion close to the third LED chip is tilted from top to bottom toward the third LED chip to form a second inclined surface, and a top horizontal height of the second inclined surface is less than a horizontal height of the first reflective layer.
6. The LED packaging structure according to claim 3, characterized in that: A second reflective layer is further disposed between the first blocking portion and the second blocking portion, and the second reflective layer is in a sawtooth shape.
7. The LED packaging structure according to claim 1, characterized in that: The upper surface of the red fluorescent glue layer is in an arc shape.
8. The LED packaging structure according to claim 1, characterized in that: The first LED chip, the second LED chip and the third LED chip are all fixedly connected to the substrate via solder pads.
9. The LED packaging structure according to claim 1, characterized in that: Electrodes of the first LED chip, the second LED chip, and the third LED chip are connected to the substrate.