Circuit board component recovery device

Abstract

The utility model discloses a circuit board component recovery device, which comprises a supporting assembly and a heating assembly, the supporting assembly comprises a rack, a rotating seat and a clamping piece, the rotating seat is rotatably mounted on the rack and is provided with a bearing surface for placing a circuit board, and the clamping piece is arranged on the rotating seat and is used for fixing the circuit board on the bearing surface. The heating assembly heats the circuit board fixed on the bearing surface. The rotating track of the rotating base is provided with a first position with the bearing face facing upwards and a second position with the bearing face facing downwards. The circuit board fixed on the bearing surface is heated by the heating assembly, so that soldering tin on the circuit board is melted, and at the moment, components which can be directly recycled can be picked up from the circuit board. And then the rotating seat is turned over and adjusted to the second position, and under the action of gravity, the remaining components on the circuit board fall off and are separated from the circuit board, so that the disassembly efficiency of the components of the circuit board is improved.

Description

Technical Field

[0001] The utility model relates to the field of circuit board recycling, in particular to a circuit board component recycling device. Background Art

[0002] There are a large number of components on waste circuit boards, some of which are in good condition and can be directly recycled, while others will have a negative impact on the subsequent circuit board recycling process. Therefore, disassembling the components on waste circuit boards is an important step in the circuit board recycling process.

[0003] The circuit board component recovery device can be found in the patent application number CN201822146905.6, which uses a high-temperature heating device to heat the circuit board by heat transfer to melt the solder on the solder joints, and then manually pick up the components on the circuit board one by one. However, the operation of manually picking up components one by one is cumbersome, which seriously affects and slows down the removal speed of circuit board components.

[0004] Therefore, how to improve the disassembly efficiency of circuit board components is a technical problem that needs to be solved urgently. Utility Model Content

[0005] The purpose of the utility model is to overcome the above technical deficiencies, propose a circuit board component recovery device, and solve the technical problem of how to improve the disassembly efficiency of circuit board components in the prior art.

[0006] In order to achieve the above technical purpose, the utility model adopts the following technical solutions:

[0007] A circuit board component recycling device, comprising:

[0008] A support assembly, comprising a frame, a rotating seat and a clamping member, wherein the rotating seat is rotatably mounted on the frame and has a supporting surface for placing a circuit board, and the clamping member is disposed on the rotating seat and is used to fix the circuit board on the supporting surface; and

[0009] A heating component that heats the circuit board fixed on the supporting surface;

[0010] Wherein, the rotation track of the rotating seat has a first position where the supporting surface faces upward, and a second position where the supporting surface faces downward.

[0011] In some embodiments, the heating assembly includes a first hot air gun and a second hot air gun mounted on the frame, the rotating seat is located between the first hot air gun and the second hot air gun, and when the rotating seat is in a first position, the first hot air gun sprays hot air toward the circuit board fixed on the supporting surface, and when the rotating seat is in a second position, the second hot air gun sprays hot air toward the circuit board fixed on the supporting surface.

[0012] In some embodiments, the circuit board component recovery device further includes a receiving assembly, which includes a receiving basin, and the receiving basin is placed under the rotating seat to receive components dropped from the circuit board when the rotating seat is in the second position.

[0013] In some embodiments, the receiving assembly further includes a guide cylinder, which is mounted below the rotating seat, with one end of the guide cylinder facing the rotating seat and the other end facing the receiving basin.

[0014] In some embodiments, the heating assembly further includes an auxiliary heating element, which is mounted on the supporting surface and is used to heat a side of the circuit board facing the supporting surface.

[0015] In some embodiments, the auxiliary heating element includes an electric heating plate, and the electric heating plate is laid on the supporting surface.

[0016] In some embodiments, the supporting surface is provided with a slot for placing a circuit board.

[0017] In some embodiments, the clamping member has a limiting state for preventing the circuit board from escaping from the slot, and a taking and placing state for allowing the circuit board to enter and exit the slot.

[0018] In some embodiments, there are a plurality of the clamping members, and the plurality of the clamping members circumferentially surround the slot.

[0019] In some embodiments, the handle extends from an edge of the rotating seat.

[0020] First, the circuit board is fixed on the supporting surface by a clamp, and then the rotating seat is adjusted to the first position. Then, the circuit board fixed on the supporting surface is heated by a heating component to melt the solder on the circuit board. At this time, the components that can be directly recycled can be picked up from the circuit board. Then, the rotating seat is flipped over and adjusted to the second position. Under the action of gravity, the remaining components on the circuit board fall off the circuit board. With the above-mentioned circuit board component recycling device, only the components that can be directly recycled need to be picked up manually, and the remaining components can be quickly disassembled in batches using gravity, thereby improving the efficiency of disassembling circuit board components. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of a circuit board component recovery device provided in an embodiment of the utility model.

[0022] Explanation of the reference numerals: supporting assembly 100 , frame 110 , rotating seat 120 , slot 121 , handle 122 , clamping member 130 , heating assembly 200 , first hot air gun 210 , second hot air gun 220 , auxiliary heating member 230 , electric heating plate 231 , receiving assembly 300 , guide cylinder 310 , material receiving basin 320 . DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0024] In order to solve the technical problem of how to improve the disassembly efficiency of circuit board components, the utility model provides a circuit board component recycling device, which only needs to manually pick up some valuable components and can rely on gravity to disassemble the remaining components in batches.

[0025] It should be noted that the circuit board component recovery device of the present invention is used for but not limited to circuit board recovery production lines, etc. For the convenience of explanation, in the present invention, only the circuit board component recovery device applied to the circuit board recovery production line is used as an example for explanation, and the principle of applying the circuit board component recovery device to other types of equipment is essentially the same as the principle applied to the circuit board recovery production line, which will not be elaborated here.

[0026] See also Figure 1 , Figure 1 The schematic diagram of the structure of the circuit board component recovery device in the embodiment of the utility model is as follows. The circuit board component recovery device includes a support assembly 100 and a heating assembly 200. The support assembly 100 includes a frame 110, a rotating seat 120 and a clamping member 130. The rotating seat 120 is rotatably mounted on the frame 110, and the rotating seat 120 has a supporting surface for placing the circuit board. The clamping member 130 is arranged on the rotating seat 120 and is used to fix the circuit board on the supporting surface. The heating assembly 200 heats the circuit board fixed on the supporting surface. Among them, the rotating track of the rotating seat 120 has a first position with the supporting surface facing upward, and a second position with the supporting surface facing downward.

[0027] In this embodiment, the circuit board is first fixed on the supporting surface using the clamp 130, and then the rotating seat 120 is adjusted to the first position, and then the heating component 200 is used to heat the circuit board fixed on the supporting surface, so that the solder on the circuit board melts, and then the components that can be directly recycled can be picked up from the circuit board. Then the rotating seat 120 is flipped over and adjusted to the second position. Under the action of gravity, the remaining components on the circuit board fall off the circuit board. Using the above-mentioned circuit board component recycling device, only the components that can be directly recycled need to be picked up manually, and the remaining components can be quickly disassembled in batches using gravity, thereby improving the disassembly efficiency of circuit board components.

[0028] In some embodiments, the heating assembly 200 includes a first hot air gun 210 and a second hot air gun 220 installed on the frame 110, and the rotating seat 120 is located between the first hot air gun 210 and the second hot air gun 220, and when the rotating seat 120 is in the first position, the first hot air gun 210 sprays hot air toward the circuit board fixed on the supporting surface, and when the rotating seat 120 is in the second position, the second hot air gun 220 sprays hot air toward the circuit board fixed on the supporting surface.

[0029] In this embodiment, when the rotating seat 120 is in the first position, the first hot air gun 210 sprays hot air toward the circuit board fixed on the supporting surface, and melts the solder through the hot air, so that the operator can pick up the components on the circuit board. When the rotating seat 120 is in the second position, the hot air sprayed by the second hot air gun 220 can not only heat the solder and maintain the molten state of the solder, but also flush the components, so that the components on the circuit board can fall off quickly. Therefore, the speed of the airflow sprayed by the second hot air gun 220 can be appropriately increased so that the components on the circuit board can fall off more quickly.

[0030] Based on the above embodiments, in some of the embodiments, the circuit board component recovery device also includes a receiving assembly 300, and the receiving assembly 300 includes a receiving basin 320, and the receiving basin 320 is placed under the rotating seat 120 to receive components dropped from the circuit board when the rotating seat 120 is in the second position.

[0031] In this embodiment, under the influence of gravity and airflow, the components falling from the circuit board will be received by the receiving basin 320 for subsequent unified processing.

[0032] In some of the embodiments, the receiving assembly 300 further includes a guide tube 310 . The guide tube 310 is mounted below the rotating seat 120 , and one end of the guide tube 310 faces the rotating seat 120 , and the other end faces the receiving basin 320 .

[0033] In this embodiment, the falling components will enter the guide cylinder 310 and slide into the receiving basin 320 under the guidance of the guide cylinder 310, ensuring that the components can fall into the receiving basin 320 smoothly and preventing the components from being scattered everywhere.

[0034] In some embodiments, the heating assembly 200 further includes an auxiliary heating element 230 . The auxiliary heating element 230 is installed on the supporting surface and is used to heat a side of the circuit board facing the supporting surface.

[0035] In this embodiment, the auxiliary heating element 230 heats the side of the circuit board facing the supporting surface, so that the circuit board can be heated more quickly and the melting speed of the solder on the circuit board can be accelerated.

[0036] In some embodiments, the auxiliary heating element 230 includes an electric heating plate 231 , and the electric heating plate 231 is laid on a supporting surface.

[0037] In this embodiment, the electric heating plate 231 is laid on the supporting surface so as to directly contact the side of the circuit board facing the supporting surface. The electric heating plate 231 emits heat to directly heat the circuit board.

[0038] In some embodiments, the supporting surface is provided with a slot 121 for placing the circuit board.

[0039] In this embodiment, under the limiting effect of the slot 121 , the circuit board can be more stably fixed on the supporting surface.

[0040] In some embodiments, the clamping member 130 has a limiting state for preventing the circuit board from being separated from the slot 121 , and a taking and placing state for allowing the circuit board to enter and exit the slot 121 .

[0041] In this embodiment, when the circuit board needs to be taken and placed, the clamp 130 can be adjusted to the take-and-place state. When the components on the circuit board need to be removed, the clamp 130 needs to be adjusted to the limit state to fix the circuit board in the slot 121.

[0042] In some embodiments, there are multiple clamping members 130 , and the multiple clamping members 130 surround the slot 121 along the circumferential direction.

[0043] In this embodiment, a plurality of clamping members 130 are used simultaneously, so that the circuit board can be clamped more stably.

[0044] In some embodiments, a handle 122 extends from the edge of the rotating base 120 .

[0045] In this embodiment, the operator can hold the handle 122 to drive the rotating base 120 to rotate, so that the rotating base 120 switches between the first position and the second position.

[0046] In order to better understand the present invention, the following Figure 1 The technical solution of the utility model is described in detail:

[0047] The circuit board is placed in the card slot 121, and the clamping member 130 is adjusted to the limit state, so that the circuit board is fixed in the card slot 121. Then the rotating seat 120 is adjusted to the first position, and the solder on the circuit board is melted under the joint action of the electric heating plate 231 and the first hot air gun 210, and then the components that can be directly recycled can be picked up from the circuit board. Then the rotating seat 120 is turned over and adjusted to the second position. Under the dual action of the airflow sprayed by the second hot air gun 220 and gravity, the remaining components on the circuit board fall off quickly, and the fallen components fall into the receiving basin 320 after being guided by the guide cylinder 310. Using the above-mentioned circuit board component recovery device, only the components that can be directly recovered need to be manually picked up, and the remaining components can be quickly disassembled in batches by gravity, thereby improving the disassembly efficiency of circuit board components.

[0048] The specific implementation methods of the utility model described above do not constitute a limitation on the protection scope of the utility model. Any other corresponding changes and modifications made according to the technical concept of the utility model should be included in the protection scope of the claims of the utility model.

Claims

1. A circuit board component recycling device, characterized in that: include: A support assembly, comprising a frame, a rotating seat and a clamping member, wherein the rotating seat is rotatably mounted on the frame and has a supporting surface for placing a circuit board, and the clamping member is disposed on the rotating seat and is used to fix the circuit board on the supporting surface; as well as A heating component that heats the circuit board fixed on the supporting surface; Wherein, the rotation track of the rotating seat has a first position where the supporting surface faces upward, and a second position where the supporting surface faces downward.

2. The circuit board component recycling device according to claim 1, characterized in that: The heating assembly includes a first hot air gun and a second hot air gun installed on the frame, the rotating seat is located between the first hot air gun and the second hot air gun, and when the rotating seat is in a first position, the first hot air gun sprays hot air to the circuit board fixed on the supporting surface, and when the rotating seat is in a second position, the second hot air gun sprays hot air to the circuit board fixed on the supporting surface.

3. The circuit board component recycling device according to claim 2, characterized in that: The circuit board component recovery device also includes a receiving assembly, which includes a receiving basin. The receiving basin is placed below the rotating seat to receive components dropped from the circuit board when the rotating seat is in the second position.

4. The circuit board component recycling device according to claim 3, characterized in that: The receiving assembly further comprises a guide cylinder, which is mounted below the rotating seat, with one end of the guide cylinder facing the rotating seat and the other end facing the material receiving basin.

5. The circuit board component recycling device according to claim 2, characterized in that: The heating assembly further comprises an auxiliary heating element, which is mounted on the supporting surface and is used for heating a side of the circuit board facing the supporting surface.

6. The circuit board component recycling device according to claim 5, characterized in that: The auxiliary heating element comprises an electric heating plate, and the electric heating plate is laid on the supporting surface.

7. The circuit board component recycling device according to claim 1, characterized in that: The supporting surface is provided with a slot for placing the circuit board.

8. The circuit board component recycling device according to claim 7, characterized in that: The clamping member has a limiting state for preventing the circuit board from escaping from the slot, and a taking and placing state for allowing the circuit board to enter and exit the slot.

9. The circuit board component recycling device according to claim 8, characterized in that: There are a plurality of the clamping members, and the plurality of the clamping members surround the clamping slot in a circumferential direction.

10. The circuit board component recycling device according to claim 1, characterized in that: A handle is extended from the edge of the rotating seat.

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