Apparatus for manufacturing display apparatus and mask assembly

Abstract

An apparatus for manufacturing a display apparatus and a mask assembly are provided, the apparatus comprising a mask assembly wherein the mask assembly comprises: a first mask layer comprising a silicon material and having a first portion and a second portion on the first portion, a first portion opening disposed in the first portion and a plurality of second portion openings disposed in the second portion above the first portion opening; and a second mask layer disposed on the first mask layer. The second mask layer includes an inorganic material, in which the second mask layer has a plurality of second mask openings over the plurality of second partial openings, and in a cross-sectional view, a width of each of the plurality of second partial openings increases as a distance from the second mask layer increases. According to the embodiment, manufacturing time and manufacturing cost of the mask assembly can be reduced, and deformation in the mask assembly can be reduced.

Description

[0001] This application is based on and claims the benefit of priority from Korean Patent Application No. 10-2023-0093952 filed in the Korean Intellectual Property Office on July 19, 2023, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] One or more embodiments relate to an apparatus and a method, and more particularly, to an apparatus for manufacturing a display apparatus, a method for manufacturing a display apparatus, and a mask assembly. Background Art

[0003] Mobile electronic devices are widely used. Specifically, small and portable electronic devices such as mobile phones and tablet personal computers (PCs) are widely used as mobile electronic devices.

[0004] In order to support various functions, such as providing visual information to a user, a mobile electronic device includes a display device. Recently, as the components driving the display device have been miniaturized, the portion of the electronic device occupied by the display device has gradually increased. The display device occupying a larger portion of the electronic device has promoted the development of a display structure that allows the display to be bent from a flat state to a preset angle. Utility Model Content

[0005] The utility model aims to provide a device for manufacturing a display device, wherein the device comprises a mask assembly, and the mask assembly has a simplified manufacturing process and improved durability.

[0006] However, the disclosure is not limited thereto.

[0007] Additional aspects will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the disclosed presented embodiments.

[0008] According to one or more embodiments, an apparatus for manufacturing a display device includes: a chamber; a mask assembly, disposed inside the chamber to face a display substrate; and a deposition source, disposed inside the chamber to face the mask assembly and configured to supply a deposition material so that the deposition material passes through the mask assembly and is deposited on the display substrate, wherein the mask assembly includes a first mask layer and a second mask layer, the first mask layer includes a silicon material and has a first portion and a second portion on the first portion, wherein a first portion opening is disposed in the first portion, and a plurality of second portion openings are disposed in the second portion above the first portion opening, the second mask layer is disposed on the first mask layer and includes an inorganic material, the second mask layer has a plurality of second mask openings above the plurality of second portion openings, and wherein, in a cross-sectional view, a width of each of the plurality of second portion openings increases as a distance from the second mask layer increases.

[0009] In a plan view, boundaries of at least two of the plurality of second partial openings may contact each other.

[0010] At least two of the plurality of second partial openings may be spaced apart from each other.

[0011] The plurality of second sub-portions of the second portion forming the plurality of second portion openings may be tapered.

[0012] Each of the plurality of second sub-portions may have a width at any point along its length between 0 μm and 14 μm, inclusive.

[0013] In a cross-sectional view, an inclination angle of side surfaces of the plurality of second partial openings may be greater than 0° and less than or equal to 85° relative to a plane parallel to a top surface of the mask assembly.

[0014] The first part and the second part may be integral.

[0015] According to one or more embodiments, a mask assembly includes: a first mask layer, including a silicon material and having a first portion and a second portion on the first portion, wherein the first portion opening is arranged in the first portion, and a plurality of second portion openings are arranged in the second portion above the first portion opening; and a second mask layer, arranged on the first mask layer and including an inorganic material, the second mask layer having a plurality of second mask openings above the plurality of second portion openings, and wherein, in a cross-sectional view, a width of each of the plurality of second portion openings may increase as a distance from the second mask layer increases.

[0016] In a plan view, boundaries of at least two of the plurality of second partial openings may contact each other.

[0017] At least two of the plurality of second partial openings may be spaced apart from each other.

[0018] The plurality of second sub-portions of the second portion forming the plurality of second portion openings may be tapered.

[0019] Each of the plurality of second sub-portions may have a width at any point along its length between 0 μm and 14 μm, inclusive.

[0020] In a cross-sectional view, an inclination angle of side surfaces of the plurality of second partial openings may be greater than 0° and less than or equal to 85° relative to a plane parallel to a top surface of the mask assembly.

[0021] The first part and the second part may be integral.

[0022] According to one or more embodiments, a method for manufacturing a display device includes the steps of: setting a display substrate in a chamber; setting a mask assembly in the chamber; and supplying a deposition material from a deposition source toward the mask assembly, wherein the step of setting the mask assembly includes: setting a second mask layer on a first mask layer; patterning the second mask layer so that a plurality of second mask openings are set in the second mask layer; etching the first mask layer through the plurality of second mask openings to form a plurality of second partial openings in the first mask layer; and forming an opening in a lower portion of the first mask layer.

[0023] In the step of etching the first mask layer, a first space may be formed in a lower portion of the plurality of second partial openings, and the first space may be connected to the plurality of second partial openings.

[0024] When a portion of the first mask layer is etched, the plurality of second partial openings formed in the first mask layer may be spatially separated from each other.

[0025] The step of forming an opening in the lower portion of the first mask layer may include: disposing a protective layer so that at least a portion of the protective layer is accommodated in the plurality of second partial openings and the plurality of second mask openings; etching the lower portion of the first mask layer to expose the lower portion of the protective layer; and removing the protective layer.

[0026] The step of disposing the protective layer may include disposing a portion of the protective layer in a first space formed in lower portions of the plurality of second partial openings.

[0027] Etching the lower portion of the first mask layer to expose the lower portion of the protective layer may include exposing a portion of the first mask layer sealed by the protective layer through the protective layer.

[0028] These and / or other aspects will become apparent and more readily understood through a detailed description of the embodiments, the drawings, and the claims.

[0029] According to the embodiments, manufacturing time and manufacturing cost of the mask assembly may be reduced, and deformation in the mask assembly may be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The above and other aspects, features and advantages of the disclosed specific embodiments will become more apparent through the following description in conjunction with the accompanying drawings, in which:

[0031] Figure 1 is a schematic cross-sectional view of an apparatus for manufacturing a display device according to an embodiment;

[0032] Figure 2 is a schematic cross-sectional view of a mask assembly according to an embodiment;

[0033] Figure 3is a schematic plan view of a portion of a mask assembly according to an embodiment;

[0034] Figures 4 to 9 is a schematic cross-sectional view of a mask assembly according to an embodiment;

[0035] Fig.10 is a schematic perspective view of a display device according to an embodiment;

[0036] Fig.11 is a schematic cross-sectional view of a display device according to an embodiment;

[0037] Fig.12 is a schematic plan view of a display panel according to an embodiment;

[0038] Fig.13 is an equivalent circuit diagram of a pixel of a display device according to an embodiment;

[0039] Fig.14 is a schematic cross-sectional view of a mask assembly according to an embodiment;

[0040] Fig.15 is a schematic plan view of a portion of a mask assembly according to an embodiment; and

[0041] Figures 16 to 21 is a schematic cross-sectional view of a mask assembly according to an embodiment. DETAILED DESCRIPTION

[0042] Now will refer to embodiment in detail, its example is shown in the accompanying drawings, wherein the same reference numerals refer to the same elements from time to time. In this respect, the embodiments provided may have different forms, and should not be construed as being limited to the description set forth herein. Therefore, the embodiments are only described below with reference to the accompanying drawings to explain the aspects of this description. As used herein, the term "and / or" includes any combination and all combinations of one or more of the related listed items. Throughout the disclosure, the statement "at least one (kind / person) of a, b and c" represents only a, only b, only c, both a and b, both a and c, both b and c, all of a, b and c or its variation.

[0043] Since the disclosure allows various changes and many embodiments, specific embodiments will be shown in the drawings and described in the written description. The disclosed effects and features and methods for achieving them will be clarified with reference to the embodiments described in detail below with reference to the drawings. However, the disclosure is not limited to the following embodiments and can be implemented in various forms.

[0044] Hereinafter, embodiments will be described with reference to the accompanying drawings, wherein like reference numerals refer to like elements throughout and repeated descriptions thereof will be omitted.

[0045] Although terms such as "first" and "second" may be used to describe various elements, such elements are not limited to any order by the above terms. The above terms are used to distinguish one element from another element.

[0046] As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0047] It will be understood that the terms “comprises” and / or “comprising” and variations thereof as used herein specify the presence of stated features or elements, but do not preclude the addition of one or more other features or elements.

[0048] It will also be understood that when a layer, region or element is referred to as being “on” another layer, region or element, it can be directly or indirectly on the other layer, region or element. That is, for example, intervening layers, regions or elements may be present.

[0049] For convenience of explanation, the size of the elements in the drawings may be exaggerated or reduced. As an example, for convenience of description, the size and thickness of each element shown in the drawings are arbitrarily represented, and therefore, the disclosure is not necessarily limited thereto.

[0050] The x-axis, y-axis, and z-axis are not limited to the three orthogonal axes of the rectangular coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or can represent different orientations that are not perpendicular to each other.

[0051] Where a particular embodiment can be implemented differently, a particular process sequence can be performed in a different order than the order in which the process steps are described. For example, two processes described in succession can be performed simultaneously or in a reverse order.

[0052] Figure 1 is a schematic cross-sectional view of an apparatus 1 for manufacturing a display apparatus according to an embodiment.

[0053] The apparatus 1 for manufacturing a display apparatus may include a chamber CH, a first supporter SP1, a second supporter SP2, a mask assembly MA, a deposition source SC, a magnetic part MG, a vision part VS, and a pressure regulator PSC.

[0054] A space may be formed inside the chamber CH. The display substrate DS and the mask assembly MA may be accommodated in the space. In this case, a portion of the chamber CH may be open, and the gate valve GB may be installed in the open portion of the chamber CH. In this case, the open portion of the chamber CH may be opened or closed according to the operation of the gate valve GB.

[0055] In this case, the display substrate DS may refer to a display substrate DS in which at least one of an organic layer, an inorganic layer, and a metal layer is deposited on a substrate 100 described below while manufacturing a display device. Alternatively, the display substrate DS may be a substrate 100 on which any one of an organic layer, an inorganic layer, and a metal layer has not been deposited.

[0056] The first support member SP1 may be configured to support the display substrate DS. In this case, the first support member SP1 may be in the form of a plate fixed inside the chamber CH. In another embodiment, the first support member SP1 may be in the form of a shuttle in which the display substrate DS is disposed and which is linearly movable inside the chamber CH. In another embodiment, the first support member SP1 may include an electrostatic chuck or an adhesive chuck which is disposed in the chamber CH to be fixed or movable inside the chamber CH.

[0057] The second support member SP2 may be configured to support the mask assembly MA. In this case, the second support member SP2 may be disposed inside the chamber CH. The second support member SP2 may fine-tune the position of the mask assembly MA. In this case, the second support member SP2 may include a separate driver, an alignment unit, etc., to move the mask assembly MA in different directions.

[0058] In another embodiment, the second support SP2 may be in the form of a shuttle. In this case, the mask assembly MA may be placed on the second support SP2. The second support SP2 may be configured to transfer the mask assembly MA. For example, the second support SP2 may be moved to the outside of the chamber CH, and after the mask assembly MA is placed on the second support SP2, the second support SP2 may then enter the chamber CH from the outside of the chamber CH.

[0059] In this case, the first support member SP1 may be formed integrally with the second support member SP2. In this case, the first support member SP1 and the second support member SP2 may include a movable shuttle. In this case, the first support member SP1 and the second support member SP2 may include a structure configured to fix the mask assembly MA to the display substrate DS when the display substrate DS is placed on the mask assembly MA, and configured to linearly move the display substrate DS and the mask assembly MS at the same time.

[0060] Hereinafter, for convenience of description, a form in which the first support member SP1 and the second support member SP2 are formed to be distinguished from each other and arranged at different positions and a form in which the first support member SP1 and the second support member SP2 are disposed inside the chamber CH are mainly described in detail.

[0061] The mask assembly MA may be disposed inside the chamber CH to face the display substrate DS. The deposition material M may pass through the mask assembly MA and be deposited on the display substrate DS.

[0062] The deposition source SC may be disposed to face the mask assembly MA and configured to supply the deposition material M so that the deposition material M passes through the mask assembly MA and is deposited on the display substrate DS. In this case, the deposition source SC may evaporate or sublime the deposition material M by applying heat to the deposition material M. The deposition source SC may be disposed to be fixed inside the chamber CH, or disposed inside the chamber CH to be linearly movable in one direction.

[0063] The magnetic portion MG may be disposed inside the chamber CH to face the display substrate DS and / or the mask assembly MA. In this case, the magnetic portion MG may apply a magnetic force to the mask assembly MA and attract the mask assembly MA toward the display substrate DS.

[0064] The visual part VS can be set in the chamber CH, and can capture the position of the display substrate DS and the mask assembly MA. In this case, the visual part VS may include a camera configured to shoot the display substrate DS and the mask assembly MA. The position of the display substrate DS and the mask assembly MA can be determined based on the image captured by the visual part VS, and the deformation of the mask assembly MA can be determined. In addition, the first support member SP1 can be configured to fine-tune the position of the display substrate DS based on the captured image, or the second support member SP2 can be configured to fine-tune the position of the mask assembly MA based on the captured image. Hereinafter, the case where the second support member SP2 is configured to fine-tune the position of the mask assembly MA and align the position of the display substrate DS and the mask assembly MA is mainly described in detail.

[0065] The pressure regulator PSC may be connected to the chamber CH and configured to adjust the internal pressure of the chamber CH. As an example, the pressure regulator PSC may be configured to adjust the internal pressure of the chamber CH to be equal to or similar to the atmospheric pressure. In addition, the pressure regulator PSC may be configured to adjust the internal pressure of the chamber CH to be equal to or similar to a vacuum state.

[0066] The pressure regulator PSC may include a connection pipe 81 and a pump 82, wherein the connection pipe 81 is connected to the chamber CH and the pump 82 is mounted to the connection pipe 81. In this case, external air may be introduced through the connection pipe 81 according to the operation of the pump 82, or gas inside the chamber CH may be guided to the outside through the connection pipe 81 according to the operation of the pump 82.

[0067] A method of manufacturing a display device (not shown) by using the apparatus 1 for manufacturing the display device is described. First, a display substrate DS may be prepared.

[0068] The pressure regulator PSC may maintain the interior of the chamber CH at a state equal to or similar to the atmospheric pressure. The gate valve GB may operate to open an open portion of the chamber CH.

[0069] Then, the display substrate DS may be loaded from the outside to the inside of the chamber CH. In this case, various methods may be used to load the display substrate DS into the chamber CH. As an example, the display substrate DS may be loaded from the outside of the chamber CH to the inside of the chamber CH by a robotic arm disposed outside the chamber CH. In another embodiment, in the case where the first support member SP1 is formed in a shuttle form, the first support member SP1 may be transported from the inside of the chamber CH to the outside of the chamber CH, and then, the display substrate DS may be placed on the first support member SP1 by a separate robotic arm disposed outside the chamber CH, and the first support member SP1 may be loaded from the outside of the chamber CH to the inside of the chamber CH.

[0070] As described above, the mask assembly MA may be disposed inside the chamber CH. In another embodiment, the mask assembly MA may be loaded from the outside of the chamber CH to the inside of the chamber CH in the same or similar manner as the display substrate DS.

[0071] When the display substrate DS is loaded into the interior of the chamber CH, the display substrate DS may be placed on the first support member SP1. In this case, the visual portion VS may be configured to capture the position of the display substrate DS and the mask assembly MA. The positions of the display substrate DS and the mask assembly MA may be determined based on the image captured by the visual portion VS. In this case, the apparatus 1 for manufacturing a display device may include a separate controller (not shown) to determine the positions of the display substrate DS and the mask assembly MA.

[0072] When the determination of the positions of the display substrate DS and the mask assembly MA is completed, the second support member SP2 may finely adjust the position of the mask assembly MA.

[0073] Then, the deposition source SC operates to supply the deposition material M toward the mask assembly MA, and the deposition material M passing through the mask assembly MA may be deposited on the display substrate DS. In this case, the deposition source SC may move in parallel with the display substrate DS and the mask assembly MA, or the display substrate DS and the mask assembly MA may move in parallel with the deposition source SC. That is, the deposition source SC may move relative to the display substrate DS and the mask assembly MA. In this case, the pump 82 may maintain the pressure of the chamber CH in a state equal to or similar to vacuum by sucking gas inside the chamber CH and discharging the gas to the outside.

[0074] As described above, the deposition material M supplied from the deposition source SC can pass through the mask assembly MA and be deposited on the display substrate DS, thereby forming at least one of multiple layers, for example, at least one of the organic layers, inorganic layers and metal layers stacked in the display device described below.

[0075] Figure 2 is a schematic cross-sectional view of a mask assembly MA according to an embodiment, and Figure 3 is a schematic plan view of a portion of a mask assembly MA according to an embodiment. Specifically, Figure 2 can correspond to along Figure 3 A cross section of the mask assembly taken along line II-II'.

[0076] Reference Figure 2 and Figure 3 , the mask assembly MA may include a first mask layer 41 and a second mask layer 42 .

[0077] The first mask layer 41 may include a silicon material. As an example, the first mask layer 41 may include silicon oxide (SiO x ), silicon nitride (SiN x ) and silicon oxynitride (SiO x N y ) at least one of.

[0078] The first mask layer 41 may include a first portion 411 and a second portion 412. The first portion 411 and the second portion 412 may be integrally provided. That is, the first portion 411 and the second portion 412 may include the same material.

[0079] The first portion 411 may support the second portion 412 at a lower portion of the second portion 412, and a first portion opening OP411 may be provided in the first portion 411. The first portion opening OP411 may be provided in the center of the first portion 411. The first portion 411 may be provided in a ring shape around the periphery of the first portion opening OP411. For example, one first portion opening OP411 may be provided. The inner peripheral surface of the first portion 411 forming the first portion opening OP411 is referred to as a 1-1 surface 411S1, and the lower surface of the first portion 411 is referred to as a 1-2 surface 411S2. The 1-2 surface 411S2 may be parallel to the upper surface of the mask assembly MA and the 1-1 surface 411S1 may be inclined relative to the 1-2 surface 411S2.

[0080] The second portion 412 may be disposed on the first portion 411, and a plurality of second portion openings OP412 may be disposed in the second portion 412. The plurality of second portion openings OP412 may overlap with the first portion opening OP411. For example, the plurality of second portion openings OP412 may overlap with one first portion opening OP411. The inner peripheral surface of the second portion 412 forming the plurality of second portion openings OP412 is referred to as a 2-1 surface 412S1.

[0081] 2-1 surface 412S1 may be inclined relative to the upper surface of the mask assembly MA. That is, in the cross-sectional view, the side surfaces of the plurality of second partial openings OP412 may be inclined relative to the upper surface of the mask assembly MA. In the cross-sectional view, the width of each of the plurality of second partial openings OP412 may gradually increase away from the second mask layer 42 described below. That is, in the cross-sectional view, the first portion 411 and the second portion 412 (or the plurality of second sub-portions of the second portion 412 forming the plurality of second partial openings OP412) may be tapered, becoming thinner as the distance from the second mask layer 42 increases. In this structure, the deposition material M (see Figure 1 A phenomenon in which at least a portion of the OP412 is blocked by the second portion 412 and does not pass through the second portion opening OP412 (ie, a shadow phenomenon) may be reduced.

[0082] In the cross-sectional view, the inclination angle of the side surface of the plurality of second partial openings OP412 is referred to as a first angle ANG1. For example, relative to a plane parallel to the upper surface of the mask assembly MA, the first angle ANG1 may be greater than 0° and less than or equal to 85°. In addition, as the second portion 412 becomes thinner, the width (in the x-direction) of the second portion 412 (or the plurality of second sub-portions of the second portion 412 forming the plurality of second partial openings OP412) at any point along the z-direction may be between 0 μm and 14 μm, inclusive. Figure 3 As shown in FIG. 4 , in a plan view, boundaries of at least two of the plurality of second partial openings OP412 may contact each other.

[0083] The second mask layer 42 may be disposed on the first mask layer 41. The second mask layer 42 may include an inorganic material. As an example, the second mask layer 42 may include silicon oxide (SiO x ), silicon nitride (SiN x ) and silicon oxynitride (SiO x N y ) at least one of.

[0084] A plurality of second mask openings OP42 may be provided in the second mask layer 42. The plurality of second mask openings OP42 may be placed above the plurality of second partial openings OP412. The deposition material M (see Figure 1 ) may sequentially pass through the first partial opening OP411, the plurality of second partial openings OP412, and the plurality of second mask openings OP42. Since the second portion 412 supports the second mask layer 42, deformation of the second mask layer 42 is reduced and durability of the second mask layer 42 may be improved.

[0085] In the cross-sectional view, the width of the plurality of second partial openings OP412 in contact with the second mask layer 42 may be equal to the width of the plurality of second mask openings OP42. The inner peripheral surface of the second mask layer 42 forming the plurality of second mask openings OP42 is referred to as a 3-1 surface 42S1, and the upper surface of the second mask layer 42 is referred to as a 3-2 surface 42S2. The 2-1 surface 412S1 and the 3-1 surface 42S1 may contact each other. The angle between the 3-1 surface 42S1 and the 3-2 surface 42S2 may be about 90°.

[0086] In plan view, although Figure 3 4 shows that the shapes of the first mask layer 41, the second mask layer 42 and the first partial opening OP411 are quadrilaterals, and the shapes of the plurality of second partial openings OP412 and the plurality of second mask openings OP42 are circular, but this is only an example, and the shape of the mask assembly MA is not limited thereto.

[0087] Figures 4 to 9 is a schematic cross-sectional view of a mask assembly MA according to an embodiment.

[0088] exist Figures 4 to 9 In, with Figures 1 to 3 The same reference numerals as in the drawings denote the same components, and thus repeated descriptions thereof are omitted.

[0089] First, refer to Figure 1 The method of manufacturing a display device may include displaying a substrate DS (see Figure 1 ) is set in chamber CH (see Figure 1 ) inside, the mask assembly MA is set in the chamber CH (see Figure 1 ) inside, and from the deposition source SC (see Figure 1 ) supplies deposition material M toward mask assembly MA (see Figure 1 ).

[0090] Reference Figures 4 to 9 , the mask assembly MA is placed in the chamber CH (see Figure 1 )The internal operations are known.

[0091] Reference Figure 4, the disposition of the mask assembly MA may include disposing the second mask layer 42 on the first mask layer 41. In this case, the upper surface of the first mask layer 41 and the lower surface of the second mask layer 42 may contact each other. The first mask layer 41 and the second mask layer 42 may be fixed to each other.

[0092] Reference Figure 5 , the disposing of the mask assembly MA may include patterning the second mask layer 42 so that a plurality of second mask openings OP42 are disposed in the second mask layer 42 .

[0093] While the second mask layer 42 is patterned, the 3-1 surface 42S1 may be formed. A portion of the upper surface of the first mask layer 41 may be exposed from the second mask layer 42 through a plurality of second mask openings OP42. As an example, the patterning of the second mask layer 42 may be performed by dry etching via a photolithography process. However, this is only an example, and the patterning of the second mask layer 42 is not limited thereto.

[0094] Reference Figure 6 , the disposing of the mask assembly MA may include etching a portion of the first mask layer 41 overlapping the plurality of second mask openings OP42 to form a plurality of second partial openings OP412 in the first mask layer 41 .

[0095] In the etching of the portion of the first mask layer 41, a first space ARE1 may be formed below the plurality of second partial openings OP412. The first space ARE1 and the plurality of second partial openings OP412 may be connected to each other. The first mask layer 41 may be divided into a first portion 411 and a second portion 412 based on the first space ARE1. A portion of the first mask layer 41 disposed below the upper surface of the first space ARE1 is referred to as a first portion 411, and a portion of the first mask layer 41 disposed on the upper surface of the first space ARE1 is referred to as a second portion 412.

[0096] As an example, a portion of the first mask layer 41 may be dry etched by an etching gas. In the etching of a portion of the first mask layer 41, the second mask layer 42 may be used as a mask relative to the etching gas. That is, with the 3-1 surface 42S1 as a boundary, the etching gas may pass through the plurality of second mask openings OP42 without passing through the 3-2 surface 42S2. Therefore, a portion of the first mask layer 41 overlapping the plurality of second mask openings OP42 may be etched, and a plurality of second partial openings OP412 and a first space ARE1 may be formed. During this process, because a separate photoresist process is not required, the process is simplified, the required time may be shortened, and the manufacturing cost may be reduced.

[0097] In this case, in a cross-sectional view, a width of each of the plurality of second partial openings OP412 may gradually increase away from the second mask layer 42. However, this is merely an example, and a portion of the first mask layer 41 may be wet-etched by an etching solution.

[0098] Reference Figures 7 to 9 , the provision of the mask assembly MA may include forming an opening in a lower portion of the first mask layer 41 .

[0099] First, refer to Figure 7 Forming the opening in the lower portion of the first mask layer 41 may include disposing the protection layer PRL so that at least a portion of the protection layer PRL is accommodated in the plurality of second partial openings OP412 and the plurality of second mask openings OP42. Here, the protection layer PRL may include a photoresist material.

[0100] In the provision of the protection layer PRL, a portion of the protection layer PRL may be provided in the first space ARE1 formed below the plurality of second partial openings OP412. In addition, a portion of the protection layer PRL may be provided on the second mask layer 42. The protection layer PRL may be in contact with the first portion 411, the second portion 412, and the second mask layer 42. Specifically, the 2-1 surface 412S1, the 3-1 surface 42S1, and the 3-2 surface 42S2 may be sealed relative to the outside by the protection layer PRL.

[0101] Reference Figure 8 Forming the opening in the lower portion of the first mask layer 41 may include etching the lower portion of the first mask layer 41 to expose the lower surface of the protection layer PRL from the first mask layer 41 to the outside.

[0102] As an example, the lower portion of the first mask layer 41 may be dry-etched by an etching gas. Because the opening is formed in the lower portion of the first mask layer 41, the first portion 411 is exposed to the outside, and the second portion 412 may be in contact with the protective layer PRL. In addition, the 1-1 surface 411S1 may be formed in the first portion 411. In this case, because the second portion 412 surrounded by the protective layer PRL and the second mask layer 42 are protected by the protective layer PRL, the second portion 412 and the second mask layer 42 may not be etched. However, this is only an example, and the lower portion of the first mask layer 41 may be wet-etched by an etching solution.

[0103] Reference Fig. 9 , forming the opening in the lower portion of the first mask layer 41 may include removing the protection layer PRL.

[0104] The protective layer PRL may be removed from the first partial opening OP411, the plurality of second partial openings OP412, and the plurality of second mask openings OP42. The protective layer PRL may be removed by developing the protective layer PRL containing the photoresist material. Therefore, the outer surfaces of the first portion 411, the second portion 412, and the second mask layer 42 may be exposed to the outside. That is, the 1-1 surface 411S1, the 2-1 surface 412S1, the 3-1 surface 42S1, and the 3-2 surface 42S2 may be exposed to the outside.

[0105] Fig.10 is a schematic perspective view of a display device 2 according to the embodiment.

[0106] Reference Fig.10 , the display device 2 includes a display area DA and a peripheral area PA surrounding the display area DA. The display device 2 may be configured to display an image by using light emitted from a plurality of pixels arranged in the display area DA.

[0107] The peripheral area PA may completely surround the display area DA. The peripheral area PA is a kind of non-display area in which pixels are not arranged and a driver or wiring configured to supply an electrical signal or power to the pixels may be arranged.

[0108] like Fig.10 As shown in , although the display device 2 may have a rectangular shape in which the horizontal length is greater than the vertical length, the embodiment is not limited thereto. The display device 2 may have various shapes such as a polygonal shape, a circular shape, an elliptical shape, and the like.

[0109] Hereinafter, although an organic light emitting display device is described as an example of the display device 2 according to the embodiment, the display device is not limited thereto. In another embodiment, another type of display device such as a quantum dot light emitting display may be used.

[0110] Fig.11 is a schematic cross-sectional view of a display device according to an embodiment. Fig.11 Can correspond to Fig.10 The line A-A'.

[0111] Reference Fig.11 , the display device 2 may include a display panel 10, an input sensing layer 40 and an optical functional layer 50 disposed on the display panel 10. These elements may be covered by a window 60. The display device 2 may be various electronic devices such as a mobile phone, a notebook computer, and a smart watch.

[0112] The display panel 10 may be configured to display an image. The display panel 10 may include pixels arranged in a display area DA. The pixels may each include a display element and a pixel circuit connected to the display element. The display element may include an organic light emitting diode or a quantum dot organic light emitting diode, etc.

[0113] The input sensing layer 40 may obtain coordinate information corresponding to an external input such as a touch event. The input sensing layer 40 may include a sensing electrode (or a touch electrode) and a trace connected to the sensing electrode. The input sensing layer 40 may be disposed on the display panel 10. The input sensing layer 40 may sense an external input by using a self-capacitance method and / or a mutual capacitance method.

[0114] The input sensing layer 40 may be directly formed on the display panel 10, or formed separately and then bonded to the display panel 10 through an adhesive layer such as a transparent adhesive. As an example, the input sensing layer 40 may be continuously formed after a process of forming the display panel 10. In this case, the input sensing layer 40 may be a part of the display panel 10, and the adhesive layer may not be provided between the input sensing layer 40 and the display panel 10. Although Fig.11 , the input sensing layer 40 is shown to be disposed between the display panel 10 and the optical function layer 50 , but the input sensing layer 40 may be disposed on the optical function layer 50 .

[0115] The optical function layer 50 may include an anti-reflection layer. The anti-reflection layer may reduce the reflectivity of light (external light) incident from the outside toward the display panel 10 through the window 60. In an embodiment, the anti-reflection layer may include a black matrix and a color filter. The color filter may be arranged by taking into account the colors of the various lights emitted from the pixels of the display panel 10, respectively.

[0116] In another embodiment, the anti-reflection layer may include a phase retarder and a polarizer. The phase retarder may include a film-type retarder or a liquid crystal retarder. The phase retarder may include a λ / 2 phase retarder and / or a λ / 4 phase retarder. The polarizer may include a film-type polarizer or a liquid crystal polarizer. The film-type polarizer may include a stretchable synthetic resin film, and the liquid crystal polarizer may include liquid crystals arranged in a predetermined arrangement. Each of the phase retarder and the polarizer may also include a protective film. The phase retarder and the polarizer themselves or the protective film may be defined as a base layer of the anti-reflection layer.

[0117] In another embodiment, the anti-reflection layer may include a destructive interference structure. The destructive interference structure may include a first reflective layer and a second reflective layer respectively disposed at different layers. The first reflected light and the second reflected light respectively reflected by the first reflective layer and the second reflective layer may destructively interfere, thereby reducing the reflectivity of the external light.

[0118] In an embodiment, the optical function layer 50 may be continuously formed after the process of forming the display panel 10 and / or the input sensing layer 40. In this case, the adhesive layer may not be disposed between the optical function layer 50 and the display panel 10 and / or the input sensing layer 40.

[0119] Despite Fig.11 Although not shown in the figure, a layer including an optically transparent adhesive or an optically transparent resin, etc. may be provided between the window 60 and the optical function layer 50 .

[0120] Fig.12 is a schematic plan view of a display panel according to an embodiment. Fig.11 As described, the display device according to the embodiment may include the display panel 10 . Fig.12 It can be understood as the substrate 100 of the display panel 10 .

[0121] Reference Fig.12 , the display panel 10 may include a display area DA and a peripheral area PA outside the display area DA. The display area DA is a portion configured to display an image, and a plurality of pixels P may be arranged in the display area DA. The display area DA may have various shapes such as a circular shape, an elliptical shape, a polygonal shape, or a shape of a specific figure. Fig.12 2 shows that the display area DA has a substantially rectangular shape with rounded corners.

[0122] Each of the pixels P may represent a sub-pixel and include a display element such as an organic light emitting diode OLED. The pixel P may be configured to emit, for example, red light, green light, blue light, or white light.

[0123] The peripheral area PA may be arranged outside the display area DA. An external circuit may be arranged in the peripheral area PA, wherein the external circuit is configured to drive the pixel P. The first scan driving circuit 11, the second scan driving circuit 12, the emission control driving circuit 13, the terminal 14, the driving power line 15, and the common power line 16 may be arranged in the peripheral area PA.

[0124] The first scan drive circuit 11 may be configured to provide a scan signal to the pixel P through the scan line SL. The second scan drive circuit 12 may be arranged in parallel with the first scan drive circuit 11 with the display area DA therebetween. Some of the pixels P arranged in the display area DA may be electrically connected to the first scan drive circuit 11, and the other pixels P may be connected to the second scan drive circuit 12. When necessary, the second scan drive circuit 12 may be omitted, and all the pixels P arranged in the display area DA may be electrically connected to the first scan drive circuit 11.

[0125] The emission control driving circuit 13 may be disposed at one side of the first scanning driving circuit 11 and configured to provide an emission control signal to the pixel P through the emission control line EL. Fig.12 2 shows that the emission control driving circuit 13 is arranged on only one side of the display area DA, but like the first scan driving circuit 11 and the second scan driving circuit 12, the emission control driving circuit 13 may be arranged on two opposite sides of the display area DA.

[0126] In an embodiment, the peripheral area PA may include a curved area extending to one side (-y direction) of the display area DA. When viewed from the front surface of the display device, the curved area may be curved toward the rear surface of the display area DA to reduce the area of ​​the non-display area.

[0127] The driving chip 20 may be disposed in the peripheral area PA. The driving chip 20 may include an integrated circuit configured to drive the display panel 10. Although the integrated circuit may be a data driving integrated circuit configured to generate a data signal, the embodiment is not limited thereto.

[0128] The terminal 14 may be disposed in the peripheral area PA. The terminal 14 may be exposed by not being covered by the insulating layer and electrically connected to the printed circuit board 30. The terminal 34 of the printed circuit board 30 may be electrically connected to the terminal 14 of the display panel 10.

[0129] The printed circuit board 30 is configured to transmit a signal or power of a controller (not shown) to the display panel 10. The control signal generated by the controller may be transmitted to the drive circuit respectively through the printed circuit board 30. In addition, the controller may be configured to transmit the driving voltage ELVDD to the driving power line 15 and the common voltage ELVSS to the common power line 16. The driving voltage ELVDD may be transmitted to each pixel P through the driving voltage line PL connected to the driving power line 15, and the common voltage ELVSS may be transmitted to the counter electrode of the pixel P connected to the common power line 16. The driving power line 15 may have a shape extending in one direction (x-axis direction) below the display area DA. The common power line 16 may have a ring shape and have a shape partially surrounding the display area DA, the ring shape having an open side.

[0130] The controller is configured to generate a data signal, and the generated data signal is transmitted to the input line IL through the driving chip 20, and is transmitted to the pixel P through the data line DL connected to the input line IL. For reference, "line" may mean "wiring". This applies to the following embodiments and modifications thereof.

[0131] Reference Figures 1 to 9 The described display substrate DS may include Fig.11 Specifically, refer to Figures 1 to 9 The described display substrate DS may include Fig.11 The substrate 100.

[0132] Fig.13 is an equivalent circuit diagram of a pixel of a display device according to an embodiment.

[0133] Reference Fig.13 , one pixel P may include a pixel circuit PC and an organic light emitting diode OLED as a display element connected to the pixel circuit PC. The pixel circuit PC may include a first thin film transistor T1, a second thin film transistor T2, and a storage capacitor Cst. Each pixel P may emit, for example, red light, green light, or blue light by using an organic light emitting diode OLED, or may emit red light, green light, blue light, or white light.

[0134] The second thin film transistor T2 is a switching thin film transistor, which may be connected to the scan line SL and the data line DL, and is configured to transmit a data voltage to the first thin film transistor T1 based on a switching voltage, the data voltage is input from the data line DL, and the switching voltage is input from the scan line SL. The storage capacitor Cst may be connected to the second thin film transistor T2 and the driving voltage line PL, and is configured to store a voltage corresponding to a difference between a voltage transmitted from the second thin film transistor T2 and a driving voltage ELVDD supplied to the driving voltage line PL.

[0135] The first thin film transistor T1 is a driving thin film transistor, which can be connected to the driving voltage line PL and the storage capacitor Cst, and is configured to control a driving current according to the voltage stored in the storage capacitor Cst, and the driving current flows from the driving voltage line PL to the organic light emitting diode OLED. The organic light emitting diode OLED can be configured to emit light with a preset brightness corresponding to the driving current. The counter electrode (e.g., cathode) of the organic light emitting diode OLED can be configured to receive a common voltage ELVSS.

[0136] Although the reference Fig.13 The pixel circuit PC is described as including two thin film transistors and one storage capacitor, but the embodiment is not limited thereto. The number of thin film transistors and the number of storage capacitors may be variously changed according to the design of the pixel circuit PC. As an example, in addition to two thin film transistors, the pixel circuit PC may also include four or more thin film transistors.

[0137] Fig.14 is a schematic cross-sectional view of a mask assembly MA according to an embodiment, Fig.15 is a schematic plan view of a portion of a mask assembly MA according to an embodiment. Specifically, Fig.14 can correspond to along Fig.15 A cross section of the mask assembly MA taken along line XIV-XIV'.

[0138] exist Fig.14 and Fig.15 In, with Figure 2 and Figure 3 The same reference numerals as in the drawings denote the same components, and thus repeated descriptions thereof are omitted.

[0139] Reference Fig.14 and Fig.15 , the mask assembly MA may include a first mask layer 41 and a second mask layer 42 .

[0140] The first mask layer 41 may include a first portion 411 and a second portion 412 .

[0141] The first portion 411 may support the second portion 412 at a lower portion of the second portion 412, and a first portion opening OP411 may be provided in the first portion 411. The first portion opening OP411 may be provided in the center of the first portion 411. An inner peripheral surface of the first portion 411 forming the first portion opening OP411 is referred to as a 1-1 surface 411S1, and a lower surface of the first portion 411 is referred to as a 1-2 surface 411S2. The 1-2 surface 411S2 may be parallel to an upper surface of the mask assembly MA, and the 1-1 surface 411S1 may be inclined relative to the 1-2 surface 411S2.

[0142] The second portion 412 may be disposed on the first portion 411, and a plurality of second portion openings OP412 may be disposed in the second portion 412. The plurality of second portion openings OP412 may overlap with the first portion opening OP411. An inner peripheral surface of the second portion 412 forming the plurality of second portion openings OP412 is referred to as a 2-1 surface 412S1, and a lower surface of the second portion 412 is referred to as a 2-2 surface 412S2.

[0143] The upper surface of the mask assembly MA, the 1-2 surface 411S2, and the 2-2 surface 412S2 may be parallel to each other. The 2-1 surface 412S1 may be inclined relative to the upper surface of the mask assembly MA. That is, in the cross-sectional view, the side surfaces of the plurality of second partial openings OP412 may be inclined relative to the upper surface of the mask assembly MA. In the cross-sectional view, the width of each of the plurality of second partial openings OP412 may gradually increase away from the second mask layer 42 described below. That is, in the cross-sectional view, the second portion 412 may be tapered to become narrower as the distance from the second mask layer 42 increases. In this structure, the deposition material M (see Figure 1 The shadow phenomenon in which at least a portion of the ) is blocked by the second portion 412 and does not pass through the second portion opening OP412 can be reduced. Fig.15As shown in FIG. 4 , in a plan view, at least two of the plurality of second partial openings OP412 may be spaced apart from each other.

[0144] The second mask layer 42 may be disposed on the first mask layer 41. A plurality of second mask openings OP42 may be disposed in the second mask layer 42. The plurality of second mask openings OP42 may overlap with the plurality of second partial openings OP412. The deposition material M (see Figure 1 ) may sequentially pass through the first partial opening OP411, the plurality of second partial openings OP412, and the plurality of second mask openings OP42. Since the second portion 412 supports the second mask layer 42, deformation of the second mask layer 42 is reduced and durability of the second mask layer 42 may be improved.

[0145] In the cross-sectional view, the width of the plurality of second partial openings OP412 in contact with the second mask layer 42 may be equal to the width of the plurality of second mask openings OP42. The inner peripheral surface of the second mask layer 42 forming the plurality of second mask openings OP42 is referred to as a 3-1 surface 42S1, and the upper surface of the second mask layer 42 is referred to as a 3-2 surface 42S2. The 2-1 surface 412S1 and the 3-1 surface 42S1 may contact each other. The angle between the 3-1 surface 42S1 and the 3-2 surface 42S2 may be about 90°.

[0146] In plan view, although Fig.15 4 shows that the shapes of the first mask layer 41, the second mask layer 42 and the first partial opening OP411 are quadrilaterals, and the shapes of the plurality of second partial openings OP412 and the plurality of second mask openings OP42 are circular, but this is only an example, and the shape of the mask assembly MA is not limited thereto.

[0147] Figures 16 to 21 is a schematic cross-sectional view of a mask assembly according to an embodiment.

[0148] exist Figures 16 to 21 In, with Fig.14 and 15 The same reference numerals as in the drawings denote the same components, and thus repeated descriptions thereof are omitted.

[0149] Reference Figures 16 to 21 , the mask assembly MA is placed in the chamber CH (see Figure 1 )The internal operations are known.

[0150] Reference Fig.16 , the disposing of the mask assembly MA may include disposing the second mask layer 42 on the first mask layer 41 .

[0151] Reference Fig.17, the disposing of the mask assembly MA may include patterning the second mask layer 42 so that a plurality of second mask openings OP42 are disposed in the second mask layer 42 .

[0152] While the second mask layer 42 is patterned, the 3-1 surface 42S1 may be formed. A portion of the upper surface of the first mask layer 41 may be exposed from the second mask layer 42 through the plurality of second mask openings OP42.

[0153] Reference Fig.18 , the mask assembly MA may include etching a portion of the first mask layer 41 overlapping with the plurality of second mask openings OP42 to form a plurality of second partial openings OP412 in the first mask layer 41 (see Fig.21 ).

[0154] For example, a portion of the first mask layer 41 can be dry-etched by an etching gas. When etching a portion of the first mask layer 41, the second mask layer 42 can be used as a mask relative to the etching gas. That is, with the 3-1 surface 42S1 as a boundary, the etching gas can pass through multiple second mask openings OP42 without passing through the 3-2 surface 42S2. Therefore, the portion of the first mask layer 41 overlapping with the multiple second mask openings OP42 can be etched, and multiple pre-second partial openings OP41 (including multiple second partial openings OP412 to be formed later) can be formed. Multiple pre-second partial openings OP41 can be separated from each other in space. During this process, because a separate photoresist process is not required, the process is simplified, the required time can be shortened, and the manufacturing cost can be reduced. In this case, in the cross-sectional view, the width of each of the multiple pre-second partial openings OP41 can gradually increase as the distance from the second mask layer 42 increases.

[0155] Reference Figures 19 to 21 , the provision of the mask assembly MA may include forming an opening in a lower portion of the first mask layer 41 .

[0156] First, refer to Fig.19 , forming the opening in the lower portion of the first mask layer 41 may include disposing a protection layer PRL so that at least a portion of the protection layer PRL is accommodated in the plurality of second partial openings OP412 (see Fig.21 ) and a plurality of second mask openings OP42. Here, the protection layer PRL may include a photoresist material.

[0157] In the provision of the protection layer PRL, a portion of the protection layer PRL may be provided on the second mask layer 42. The protection layer PRL may be in contact with the 3-1 surface 42S1 and the 3-2 surface 42S2.

[0158] Reference Fig. 20Forming the opening in the lower portion of the first mask layer 41 may include etching the lower portion of the first mask layer 41 to expose the lower surface of the protection layer PRL from the first mask layer 41 to the outside.

[0159] During this process, a portion of the first mask layer 41 sealed by the protective layer PRL may be exposed to the outside from the protective layer PRL. Therefore, a portion of the first mask layer 41 exposed from the protective layer PRL may be etched. The first mask layer 41 may be divided into a first portion 411 and a second portion 412 based on the etched lower surface of the first mask layer 41. A portion of the first mask layer 41 disposed below the etched lower surface of the first mask layer 41 is referred to as a first portion 411, and a portion of the first mask layer 41 disposed on the etched lower surface of the first mask layer 41 is referred to as a second portion 412. That is, the etched lower surface of the first mask layer 41 may be a 2-2 surface 412S2, which is a lower surface of the second portion 412.

[0160] Reference Fig.21 , forming the opening in the lower portion of the first mask layer 41 may include removing the protection layer PRL.

[0161] The protective layer PRL may be removed from the first partial opening OP411, the plurality of second partial openings OP412, and the plurality of second mask openings OP42. The protective layer PRL may be removed by developing the protective layer PRL containing a photoresist material. Thus, the surfaces of the first portion 411, the second portion 412, and the second mask layer 42 adjacent to the first partial opening OP411, the second partial opening OP412, and the second mask opening OP42 may be exposed. That is, the 1-1 surface 411S1, the 2-1 surface 412S1, the 3-1 surface 42S1, and the 3-2 surface 42S2 may be exposed.

[0162] According to the embodiments, manufacturing time and manufacturing cost of the mask assembly may be reduced, and deformation in the mask assembly may be reduced.

[0163] The disclosed effects are not limited to the above-mentioned effects, and other effects not mentioned can be clearly understood by a person of ordinary skill in the art from the appended claims.

[0164] It should be understood that the embodiments described herein should be considered in a descriptive sense only and not for limiting purposes. The description of features or aspects within each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the drawings, it will be understood by those of ordinary skill in the art that various changes in form and detail may be made therein without departing from the spirit and scope defined by the appended claims.

Claims

1. A device for manufacturing a display device, characterized in that: The device comprises: Chamber; a mask assembly disposed inside the chamber to face the display substrate; and a deposition source disposed inside the chamber to face the mask assembly and configured to supply a deposition material so that the deposition material passes through the mask assembly and is deposited on the display substrate, Wherein, the mask assembly comprises: a first mask layer comprising a silicon material and having a first portion and a second portion on the first portion, wherein a first portion opening is disposed in the first portion and a plurality of second portion openings are disposed in the second portion above the first portion opening; and a second mask layer disposed on the first mask layer and comprising an inorganic material, the second mask layer having a plurality of second mask openings above the plurality of second partial openings, and Wherein, in the cross-sectional view, the width of each of the plurality of second partial openings increases as the distance from the second mask layer increases.

2. The device according to claim 1, characterized in that In a plan view, boundaries of at least two of the plurality of second partial openings contact each other.

3. The device according to claim 1, characterized in that At least two of the plurality of second partial openings are spaced apart from each other.

4. The device according to claim 1, characterized in that The plurality of second sub-portions of the second portion forming the plurality of second portion openings are tapered.

5. The device according to claim 4, characterized in that Each of the plurality of second sub-portions has a width between 0 μm and 14 μm at any point along its length.

6. The device according to claim 1, characterized in that In a cross-sectional view, an inclination angle of side surfaces of the plurality of second partial openings relative to a plane parallel to a top surface of the mask assembly is greater than 0° and less than or equal to 85°.

7. The device according to claim 1, characterized in that The first portion and the second portion are integral.

8. A mask assembly, characterized in that: The mask assembly comprises: a first mask layer comprising a silicon material and having a first portion and a second portion on the first portion, wherein a first portion opening is disposed in the first portion and a plurality of second portion openings are disposed in the second portion above the first portion opening; and a second mask layer disposed on the first mask layer and comprising an inorganic material, the second mask layer having a plurality of second mask openings above the plurality of second partial openings, and Wherein, in the cross-sectional view, the width of each of the plurality of second partial openings increases as the distance from the second mask layer increases.

9. The mask assembly according to claim 8, characterized in that: In a plan view, boundaries of at least two of the plurality of second partial openings contact each other.

10. The mask assembly according to claim 8, characterized in that: At least two of the plurality of second partial openings are spaced apart from each other.

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