Frequency converter water cooling plate humidity detection circuit

Abstract

The utility model discloses a frequency converter water cooling plate humidity detection circuit, comprising a filtering module, one end of which is connected with a sensor, the other end of which is connected with one end of a signal acquisition module, the other end of which is connected with one end of an isolation conversion module, the other end of which is connected with one end of a main controller, and the other end of which is connected with the other end of the main controller; the other end of the master controller is connected with one end of the bus transceiver module, and the other end of the bus transceiver module is an output end; the signal acquisition module further comprises a reference circuit. The circuit can detect the humidity of the water cooling plate in the high-voltage large-current frequency converter.

Description

Technical Field

[0001] The utility model belongs to the technical field of mine water-cooled frequency converters, and in particular relates to a frequency converter water-cooled plate humidity detection circuit. Background Art

[0002] The inverters used in coal mine equipment are basically high-voltage and high-current inverters, and the applied power can reach hundreds of kilowatts to thousands of kilowatts. The high-voltage output corresponds to a large amount of heat generated by itself. In order to ensure the normal operation of the electrical components inside the inverter at the rated ambient temperature, certain treatment is required for heat dissipation. At present, most inverters use a combination of water cooling and air cooling to dissipate heat. The circulating air inside the inverter exchanges the heat generated by itself on the water-cooled plate, and then is taken away by the circulating water in the water circulation system. The circulating water is corrosive to a certain extent, and there may be a risk of internal leakage accidents. In addition, due to the heat exchange, a certain degree of condensation will be generated on the surface of the water-cooled plate. There is a risk that the condensation will drip on the electrical components inside the inverter, causing damage to the insulation of the electrical components, resulting in equipment failure or even burning. However, traditional humidity detection devices cannot perform humidity detection on the water-cooled plate in high-voltage and high-current inverters.

[0003] Therefore, how to detect the humidity of the water cooling plate in the high voltage and high current inverter is a technical problem to be solved by those skilled in the art. Utility Model Content

[0004] The purpose of the utility model is to solve the technical problem that the prior art cannot effectively detect the humidity of the water cooling plate in the high voltage and high current inverter. To this end, the utility model provides a inverter water cooling plate humidity detection circuit, which includes:

[0005] A filter module, one end of which is connected to the sensor, and the other end of which is connected to one end of the signal acquisition module, the other end of which is connected to one end of the isolation conversion module, the other end of which is connected to one end of the main controller, the other end of which is connected to one end of the bus transceiver module, and the other end of which is an output end;

[0006] Wherein, the signal acquisition module also includes a reference circuit.

[0007] Furthermore, the filtering module includes four groups of sub-circuits, wherein:

[0008] The first group of sub-circuits is specifically as follows: one end of the resistor R1 is connected to the first external humidity detection point, the other end of the resistor R1 is respectively connected to one end of the resistor R2 and one end of the capacitor C2, the other end of the resistor R2 is respectively connected to the grounded capacitor C1 and the positive phase input end of the operational amplifier A1, the negative phase input end of the operational amplifier A1 is respectively connected to the grounded resistor R3 and one end of the resistor R4, the other end of the resistor R4, one end of the resistor R5, one end of the capacitor C3 and the other end of the capacitor C2 are all connected to the output end of the operational amplifier A1, the other end of the capacitor C3 is connected to one end of the resistor R6, and is also connected to the first external humidity monitoring point, the other end of the resistor R6 is respectively connected to the other end of the capacitor C4, the other end of the diode D2, the grounded resistor R8, and the second end of the inductor L1, the other end of the resistor R5 is respectively connected to one end of the capacitor C4, one end of the diode D2, the other end of the diode D1, the grounded resistor R7 and the first end of the inductor L1, one end of the diode D1 is grounded, and the third end and the fourth end of the inductor L1 are both connected to the signal acquisition module;

[0009] The second group of sub-circuits is specifically as follows: one end of the resistor R9 is connected to the second external humidity detection point, the other end of the resistor R9 is respectively connected to one end of the resistor R10 and one end of the capacitor C6, the other end of the resistor R10 is respectively connected to the grounded capacitor C5 and the positive phase input end of the operational amplifier A2, the negative phase input end of the operational amplifier A2 is respectively connected to the grounded resistor R11 and one end of the resistor R12, the other end of the resistor R12, one end of the resistor R13, one end of the capacitor C7 and the other end of the capacitor C6 are all connected to the output end of the operational amplifier A2, The other end of the capacitor C7 is connected to one end of the resistor R15, and is also connected to the second external humidity detection point. The other end of the resistor R15 is respectively connected to the other end of the capacitor C8, the other end of the diode D4, the grounding resistor R16, and the second end of the inductor L2. The other end of the resistor R13 is respectively connected to one end of the capacitor C8, one end of the diode D4, the other end of the diode D3, the grounding resistor R14, and the first end of the inductor L2. One end of the diode D3 is grounded. The third end and the fourth end of the inductor L2 are both connected to the signal acquisition module;

[0010] The third group of sub-circuits is specifically as follows: one end of the resistor R17 is connected to the third external humidity detection point, the other end of the resistor R17 is respectively connected to one end of the resistor R18 and one end of the capacitor C9, the other end of the resistor R18 is respectively connected to the grounded capacitor C9 and the positive phase input end of the operational amplifier A3, the negative phase input end of the operational amplifier A3 is respectively connected to the grounded resistor R19 and one end of the resistor R20, the other end of the resistor R20, one end of the resistor R21, one end of the capacitor C11 and the other end of the capacitor C10 are all connected to the output end of the operational amplifier A3, The other end of the capacitor C11 is connected to one end of the resistor R23 and is also connected to the third external humidity detection point. The other end of the resistor R23 is respectively connected to the other end of the capacitor C12, the other end of the diode D6, the grounding resistor R24, and the second end of the inductor L3. The other end of the resistor R21 is respectively connected to one end of the capacitor C12, one end of the diode D6, the other end of the diode D5, the grounding resistor R22, and the first end of the inductor L3. One end of the diode D5 is grounded. The third end and the fourth end of the inductor L3 are both connected to the signal acquisition module.

[0011] The fourth group of sub-circuits is specifically as follows: one end of the resistor R25 is connected to the fourth external humidity detection point, the other end of the resistor R25 is respectively connected to one end of the resistor R26 and one end of the capacitor C13, the other end of the resistor R26 is respectively connected to the grounded capacitor C13 and the positive phase input end of the operational amplifier A4, the negative phase input end of the operational amplifier A4 is respectively connected to the grounded resistor R27 and one end of the resistor R28, the other end of the resistor R28, one end of the resistor R29, one end of the capacitor C15 and the other end of the capacitor C14 are all connected to the output end of the operational amplifier A4 The other end of the capacitor C15 is connected to one end of the resistor R31 and is also connected to the fourth external humidity detection point. The other end of the resistor R31 is respectively connected to the other end of the capacitor C16, the other end of the diode D8, the grounding resistor R32, and the second end of the inductor L4. The other end of the resistor R29 is respectively connected to one end of the capacitor C16, one end of the diode D8, the other end of the diode D7, the grounding resistor R30 and the first end of the inductor L4. One end of the diode D7 is grounded. The third end and the fourth end of the inductor L4 are both connected to the signal acquisition module.

[0012] Furthermore, the signal acquisition module specifically includes a chip U1 and a reference circuit, wherein:

[0013] The VI NCOM pin of the chip U1 is grounded, the VI N0 pin of the chip U1 is respectively connected to one end of the capacitor C17 and the third end of the inductor L1, the VI N1 pin of the chip U1 is respectively connected to one end of the capacitor C18 and the fourth end of the inductor L1, the VI N2 pin of the chip U1 is respectively connected to one end of the capacitor C19 and the third end of the inductor L2, the VI N3 pin of the chip U1 is respectively connected to one end of the capacitor C20 and the fourth end of the inductor L2, the VI N4 pin of the chip U1 is respectively connected to one end of the capacitor C21 and the third end of the inductor L3, the VI N5 pin of the chip U1 is respectively connected to one end of the capacitor C22 and the fourth end of the inductor L3, the VI N6 pin of the chip U1 is respectively connected to one end of the capacitor C23 and the third end of the inductor L4, and the VI N8 pin of the chip U1 is respectively connected to one end of the capacitor C29 and the third end of the inductor L5. The N7 pin is respectively connected to one end of the capacitor C24 and the fourth end of the inductor L4, the other ends of the capacitors C17-C24 are all connected to the VB IAS pin and the RES- pin of the chip U1 and are grounded, the AVSS pin, the EP pin, the DGND pin, and the XTAL1 pin of the chip U1 are all grounded, the REGCAPA pin of the chip U1 is respectively connected to one end of the capacitor C28 and one end of the capacitor C29, the REGCAPD pin of the chip U1 is connected to one end of the capacitor C27, the AVDD pin of the chip U1 is respectively connected to one end of the capacitor C25 and one end of the capacitor C26, and is also connected to a 3.3V power supply, the IOVDD pin of the chip U1 is connected to a 3.3V power supply, the other ends of the capacitors C25-C29 are all grounded, the REFOUT pin of the chip U1 is connected to the grounded capacitor C30, and the DOUT pin, D The IN pin, SCLK pin and CS pin are all connected to the isolation conversion module, the ERROR pin of the chip U1 is connected to one end of the diode D13, the other end of the diode D13 is connected to one end of the resistor R35, the SYNC pin of the chip U1 is connected to one end of the resistor R34, the other end of the resistor R35 and the other end of the resistor R34 are both connected to the 3.3V power supply, the CLKIO pin of the chip U1 is connected to the OUT pin of the chip U5, the GND pin of the chip U5 is grounded, the VCC pin and EN / NC pin of the chip U5 are all connected to the grounded capacitor C53, the grounded capacitor C54 and 3.3V, the RES+ pin of the chip U1 is respectively connected to one end of the diode D9 in the reference circuit, the other end of the resistor R33, one end of the capacitor C55 and 2.5V power supply, one end of the resistor R33 is connected to the 9V power supply, the other end of the capacitor C55 and the other end of the diode D9 are grounded, the reference circuit also includes a chip U6, the Vin pin of the chip U6 is respectively connected to the 24V power supply, one end of the capacitor C58, and one end of the capacitor C57, the Vout pin of the chip U6 outputs 9V electricity and is connected to one end of the capacitor C56, and the GND pin of the chip U6, the other end of the capacitor C56, the other end of the capacitor C57, and the other end of the capacitor C58 are all grounded. .

[0014] Furthermore, the isolation conversion module specifically includes:

[0015] The VDD2A pin of chip U2 is respectively connected to a 3.3V power supply, one end of capacitor C32, one end of capacitor C31 and one end of resistor R36. The other end of capacitor C32, the other end of capacitor C31 and GND2 pin of chip U2 are all grounded. The other end of resistor R36 and VOA pin of chip U2 are all connected to the signal acquisition module. VOB pin of chip U2 is connected to the signal acquisition module through resistor R37. VOC pin of chip U2 is connected to the signal acquisition module through resistor R38. VID pin of chip U2 is connected to the signal acquisition module through resistor R39. VDD2B pin of chip U2 is connected to a 3.3V power supply. GND1 pin and GND1 pin of chip U2 are grounded. VDD1 B of chip U2 is connected to a 3.3V power supply. VOD pin of chip U2 is connected to a main controller through resistor R43. VIC pin of chip U2 is connected to a main controller through resistor R42. VI The B pin is connected to the main controller through the resistor R41, the VIA of the chip U2 is connected to the main controller and is also connected to the other end of the resistor R40, one end of the resistor R40 is respectively connected to the VDD1A pin of the chip U2 and the 3.3V power supply.

[0016] Furthermore, the main controller includes:

[0017] The CS pin, SCLK pin, MI SO pin and MOS I pin of the chip U3 are all connected to the isolation conversion module, the CANSTA pin of the chip U3 is connected to the grounding diode D14, the V4LED pin of the chip U3 is connected to the grounding diode D15, the V3LED pin of the chip U3 is connected to the grounding diode D16, the V2LED pin of the chip U3 is connected to the grounding diode D17, and the V1 of the chip U3 is connected to the grounding diode D18. The LED pin is connected to the grounding diode D18, the VSSA pin, VSS1 pin, VSS2 pin and VSS3 pin of the chip U3 are all grounded, the VBAT pin, VDDA pin, VDD1 pin, VDD2 pin and VDD3 pin of the chip U3 are all connected to the 3.3V power supply and the grounding capacitor C33-grounding capacitor C38, the TXD pin and RXD pin of the chip U3 are both connected to the bus transceiver module, the OSC pin of the chip U3 is connected to the OUT pin of the chip U7, the NRST pin of the chip U3 is respectively connected to the RESET pin of the chip U8 and one end of the resistor R44, the GND pin of the chip U7 is grounded and is also respectively connected to the other end of the capacitor C41 and the other end of the capacitor C42, the VCC pin and EN / NC pin of the chip U7 are both connected to the 3.3V power supply, one end of the capacitor C41, the capacitor C4 2, the GND pin of the chip U8 is respectively connected to the other end of the resistor R44, the other end of the capacitor C40, and the other end of the capacitor C39 and is also grounded, the PA0 pin of the chip U3 is connected to the other end of the resistor R45, the PA1 pin of the chip U3 is connected to the other end of the resistor R46, the PA2 pin of the chip U3 is connected to the other end of the resistor R47, the PA3 pin of the chip U3 is connected to the other end of the resistor R48, the PA4 pin of the chip U3 is connected to the other end of the resistor R49, the other ends of the resistors R45-R49 are also connected to the dip switch, the PA5 pin of the chip U3 is connected to the other end of the resistor R50, the PA6 of the chip U3 is connected to the other end of the resistor R51, one ends of the resistors R45-R51 are all connected to a 3.3V power supply, and the resistors R50-R51 are also connected to the dip switch.

[0018] Furthermore, the bus transceiver module specifically includes:

[0019] The GND1 pin of the chip U4 is grounded, the RXD pin of the chip U4 is connected to the main controller through a resistor R52, the TXD pin of the chip U4 is connected to the main controller through a resistor R53, the VIO pin and the VCC pin of the chip U4 are both connected to a 5V power supply and are also connected to one end of capacitors C43-C46, the other ends of the capacitors C43-C46 are grounded, the VI SOOUT pin of the chip U4 is respectively connected to one end of capacitor C49 and one end of capacitor C50, the GND2 pin of the chip U4 is respectively connected to the other end of capacitor C49 and the other end of capacitor C50 and is also grounded, the GND3 pin of the chip U4 is respectively connected to one end of capacitor C47 and one end of capacitor C48 and is also grounded, the VI SO The IN pin is respectively connected to the other end of the capacitor C47 and the other end of the capacitor C48, the S pin of the chip U4 is connected to the grounding resistor R54, the CANH pin of the chip U4 is connected to the third port of the inductor L5, the CANL pin of the chip U4 is connected to the fourth port of the inductor L5, the first end of the inductor L5 is respectively connected to one end of the capacitor C52, one end of the diode D10, one end of the diode D11, and one end of the resistor R55, the second end of the inductor L5 is respectively connected to the other end of the capacitor C51, the other end of the diode D10, the other end of the diode D12, and one end of the resistor R56, the other end of the capacitor C52 is connected to one end of the capacitor C51, the other end of the diode D11 is connected to one end of the diode D12 and is grounded, and the resistor R55 and the other end of the resistor R55 are both output ends of the bus transceiver module.

[0020] Furthermore, the isolation conversion module and the signal acquisition module are the acquisition side, and the power supplies of the acquisition side, the main controller and the bus transceiver module are all independent power supplies.

[0021] Compared with the prior art, the beneficial effects of the utility model are:

[0022] The utility model provides a frequency converter water cooling plate humidity detection circuit. Compared with the prior art, the circuit includes a filter module, one end of which is connected to a sensor, and the other end is connected to one end of a signal acquisition module, the other end of the signal acquisition module is connected to one end of an isolation conversion module, the other end of the isolation conversion module is connected to one end of a main controller, the other end of the main controller is connected to one end of a bus transceiver module, and the other end of the bus transceiver module is an output end; wherein the signal acquisition module also includes a reference circuit. The circuit of the application can detect the humidity of the water cooling plate in a high voltage and high current frequency converter. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of this specification, the drawings required for use in the embodiments will be briefly introduced below. The drawings described below are only some embodiments recorded in this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 The figure shows a schematic diagram of the structure of the filter module in the embodiment of this specification;

[0025] Figure 2 The figure shows a schematic diagram of the structure of the signal acquisition module in the embodiment of this specification;

[0026] Figure 3 The figure shows a schematic diagram of the structure of the isolation conversion module in the embodiment of this specification;

[0027] Figure 4 The figure shows a schematic diagram of the structure of the main controller in the embodiment of this specification;

[0028] Figure 5 The figure shows a schematic diagram of the structure of the bus transceiver module in the embodiment of this specification. DETAILED DESCRIPTION

[0029] In order to enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below in conjunction with the drawings in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of this specification.

[0030] like Figure 1 The structure diagram of the inverter water cooling plate humidity detection circuit provided by the embodiment of this specification is shown. Although this specification provides the structure shown in the following embodiment or the accompanying drawings, more or fewer structures can be included in the structure based on routine or no creative work, and these structures are not limited to the structures shown in the embodiments or the accompanying drawings of this specification. When the structure is applied in the actual device or terminal product, it can be executed sequentially or in parallel according to the embodiment or module structure.

[0031] The inverter water cooling plate humidity detection circuit provided in the embodiments of this specification can be used in various parking lots. The circuit includes:

[0032] A filter module, one end of which is connected to the sensor, and the other end of which is connected to one end of the signal acquisition module, the other end of which is connected to one end of the isolation conversion module, the other end of which is connected to one end of the main controller, the other end of which is connected to one end of the bus transceiver module, and the other end of which is an output end;

[0033] Wherein, the signal acquisition module also includes a reference circuit.

[0034] Specifically, one end of the filter module is connected to the sensor to obtain the analog signal transmitted by the sensor, thereby filtering the analog signal to exclude interference waves outside a certain frequency range, and then transmitting the filtered signal to the signal acquisition module. The signal acquisition module can also be called a primary processing module, which can modulate the filtered signal based on the reference circuit to achieve reference comparison signal correction and data processing of the filtered signal, and then input the modulated signal into the isolation conversion module for data and level conversion. The front and rear stages of the isolation conversion module adopt independent power supply methods to increase isolation reliability. The converted data is transmitted to the main controller, so that the main controller performs secondary processing on the converted data, such as calibration verification and filtering operations on the converted data, and finally sends the signal out after level conversion and signal conversion through the bus transceiver module. The front and rear stages of the bus transceiver module are independent power supplies, which can isolate the 2KV high-energy group pulse interference and surge function between the front and rear stages.

[0035] In the embodiments of the present application, Figure 1 The figure shows the structure of the filter module, which includes four groups of sub-circuits, among which:

[0036] The first group of sub-circuits is specifically as follows: one end of the resistor R1 is connected to the first external humidity detection point, the other end of the resistor R1 is respectively connected to one end of the resistor R2 and one end of the capacitor C2, the other end of the resistor R2 is respectively connected to the grounded capacitor C1 and the positive phase input end of the operational amplifier A1, the negative phase input end of the operational amplifier A1 is respectively connected to the grounded resistor R3 and one end of the resistor R4, the other end of the resistor R4, one end of the resistor R5, one end of the capacitor C3 and the other end of the capacitor C2 are all connected to the output end of the operational amplifier A1, the other end of the capacitor C3 is connected to one end of the resistor R6, and is also connected to the first external humidity monitoring point, the other end of the resistor R6 is respectively connected to the other end of the capacitor C4, the other end of the diode D2, the grounded resistor R8, and the second end of the inductor L1, the other end of the resistor R5 is respectively connected to one end of the capacitor C4, one end of the diode D2, the other end of the diode D1, the grounded resistor R7 and the first end of the inductor L1, one end of the diode D1 is grounded, and the third end and the fourth end of the inductor L1 are both connected to the signal acquisition module;

[0037] The second group of sub-circuits is specifically as follows: one end of the resistor R9 is connected to the second external humidity detection point, the other end of the resistor R9 is respectively connected to one end of the resistor R10 and one end of the capacitor C6, the other end of the resistor R10 is respectively connected to the grounded capacitor C5 and the positive phase input end of the operational amplifier A2, the negative phase input end of the operational amplifier A2 is respectively connected to the grounded resistor R11 and one end of the resistor R12, the other end of the resistor R12, one end of the resistor R13, one end of the capacitor C7 and the other end of the capacitor C6 are all connected to the output end of the operational amplifier A2, The other end of the capacitor C7 is connected to one end of the resistor R15, and is also connected to the second external humidity detection point. The other end of the resistor R15 is respectively connected to the other end of the capacitor C8, the other end of the diode D4, the grounding resistor R16, and the second end of the inductor L2. The other end of the resistor R13 is respectively connected to one end of the capacitor C8, one end of the diode D4, the other end of the diode D3, the grounding resistor R14, and the first end of the inductor L2. One end of the diode D3 is grounded. The third end and the fourth end of the inductor L2 are both connected to the signal acquisition module;

[0038] The third group of sub-circuits is specifically as follows: one end of the resistor R17 is connected to the third external humidity detection point, the other end of the resistor R17 is respectively connected to one end of the resistor R18 and one end of the capacitor C9, the other end of the resistor R18 is respectively connected to the grounded capacitor C9 and the positive phase input end of the operational amplifier A3, the negative phase input end of the operational amplifier A3 is respectively connected to the grounded resistor R19 and one end of the resistor R20, the other end of the resistor R20, one end of the resistor R21, one end of the capacitor C11 and the other end of the capacitor C10 are all connected to the output end of the operational amplifier A3, The other end of the capacitor C11 is connected to one end of the resistor R23 and is also connected to the third external humidity detection point. The other end of the resistor R23 is respectively connected to the other end of the capacitor C12, the other end of the diode D6, the grounding resistor R24, and the second end of the inductor L3. The other end of the resistor R21 is respectively connected to one end of the capacitor C12, one end of the diode D6, the other end of the diode D5, the grounding resistor R22, and the first end of the inductor L3. One end of the diode D5 is grounded. The third end and the fourth end of the inductor L3 are both connected to the signal acquisition module.

[0039] The fourth group of sub-circuits is specifically as follows: one end of the resistor R25 is connected to the fourth external humidity detection point, the other end of the resistor R25 is respectively connected to one end of the resistor R26 and one end of the capacitor C13, the other end of the resistor R26 is respectively connected to the grounded capacitor C13 and the positive phase input end of the operational amplifier A4, the negative phase input end of the operational amplifier A4 is respectively connected to the grounded resistor R27 and one end of the resistor R28, the other end of the resistor R28, one end of the resistor R29, one end of the capacitor C15 and the other end of the capacitor C14 are all connected to the output end of the operational amplifier A4 The other end of the capacitor C15 is connected to one end of the resistor R31 and is also connected to the fourth external humidity detection point. The other end of the resistor R31 is respectively connected to the other end of the capacitor C16, the other end of the diode D8, the grounding resistor R32, and the second end of the inductor L4. The other end of the resistor R29 is respectively connected to one end of the capacitor C16, one end of the diode D8, the other end of the diode D7, the grounding resistor R30 and the first end of the inductor L4. One end of the diode D7 is grounded. The third end and the fourth end of the inductor L4 are both connected to the signal acquisition module.

[0040] In the embodiments of the present application, Figure 2 The signal acquisition module structure diagram shown in the figure specifically includes a chip U1 and a reference circuit, wherein:

[0041] The VI NCOM pin of the chip U1 is grounded, the VI N0 pin of the chip U1 is respectively connected to one end of the capacitor C17 and the third end of the inductor L1, the VI N1 pin of the chip U1 is respectively connected to one end of the capacitor C18 and the fourth end of the inductor L1, the VI N2 pin of the chip U1 is respectively connected to one end of the capacitor C19 and the third end of the inductor L2, the VI N3 pin of the chip U1 is respectively connected to one end of the capacitor C20 and the fourth end of the inductor L2, the VI N4 pin of the chip U1 is respectively connected to one end of the capacitor C21 and the third end of the inductor L3, the VI N5 pin of the chip U1 is respectively connected to one end of the capacitor C22 and the fourth end of the inductor L3, the VI N6 pin of the chip U1 is respectively connected to one end of the capacitor C23 and the third end of the inductor L4, and the VI N8 pin of the chip U1 is respectively connected to one end of the capacitor C29 and the third end of the inductor L5. The N7 pin is respectively connected to one end of the capacitor C24 and the fourth end of the inductor L4, the other ends of the capacitors C17-C24 are all connected to the VB IAS pin and the RES- pin of the chip U1 and are grounded, the AVSS pin, the EP pin, the DGND pin, and the XTAL1 pin of the chip U1 are all grounded, the REGCAPA pin of the chip U1 is respectively connected to one end of the capacitor C28 and one end of the capacitor C29, the REGCAPD pin of the chip U1 is connected to one end of the capacitor C27, the AVDD pin of the chip U1 is respectively connected to one end of the capacitor C25 and one end of the capacitor C26, and is also connected to a 3.3V power supply, the IOVDD pin of the chip U1 is connected to a 3.3V power supply, the other ends of the capacitors C25-C29 are all grounded, the REFOUT pin of the chip U1 is connected to the grounded capacitor C30, and the DOUT pin, D The IN pin, SCLK pin and CS pin are all connected to the isolation conversion module, the ERROR pin of the chip U1 is connected to one end of the diode D13, the other end of the diode D13 is connected to one end of the resistor R35, the SYNC pin of the chip U1 is connected to one end of the resistor R34, the other end of the resistor R35 and the other end of the resistor R34 are both connected to the 3.3V power supply, the CLKIO pin of the chip U1 is connected to the OUT pin of the chip U5, the GND pin of the chip U5 is grounded, the VCC pin and EN / NC pin of the chip U5 are all connected to the grounded capacitor C53, the grounded capacitor C54 and 3.3V, the RES+ pin of the chip U1 is respectively connected to one end of the diode D9 in the reference circuit, the other end of the resistor R33, one end of the capacitor C55 and 2.5V power supply, one end of the resistor R33 is connected to the 9V power supply, the other end of the capacitor C55 and the other end of the diode D9 are grounded, the reference circuit also includes a chip U6, the Vin pin of the chip U6 is respectively connected to the 24V power supply, one end of the capacitor C58, and one end of the capacitor C57, the Vout pin of the chip U6 outputs 9V electricity and is connected to one end of the capacitor C56, and the GND pin of the chip U6, the other end of the capacitor C56, the other end of the capacitor C57, and the other end of the capacitor C58 are all grounded. .

[0042] In the embodiments of the present application, Figure 3 The figure shows the structure diagram of the isolation conversion module, which specifically includes:

[0043] The VDD2A pin of chip U2 is respectively connected to a 3.3V power supply, one end of capacitor C32, one end of capacitor C31 and one end of resistor R36. The other end of capacitor C32, the other end of capacitor C31 and GND2 pin of chip U2 are all grounded. The other end of resistor R36 and VOA pin of chip U2 are all connected to the signal acquisition module. VOB pin of chip U2 is connected to the signal acquisition module through resistor R37. VOC pin of chip U2 is connected to the signal acquisition module through resistor R38. VID pin of chip U2 is connected to the signal acquisition module through resistor R39. VDD2B pin of chip U2 is connected to a 3.3V power supply. GND1 pin and GND1 pin of chip U2 are grounded. VDD1 B of chip U2 is connected to a 3.3V power supply. VOD pin of chip U2 is connected to a main controller through resistor R43. VIC pin of chip U2 is connected to a main controller through resistor R42. VI The B pin is connected to the main controller through the resistor R41, the VIA of the chip U2 is connected to the main controller and is also connected to the other end of the resistor R40, one end of the resistor R40 is respectively connected to the VDD1A pin of the chip U2 and the 3.3V power supply.

[0044] In the embodiments of the present application, Figure 4 The main controller structure is shown as follows, which includes:

[0045] The CS pin, SCLK pin, MI SO pin and MOS I pin of the chip U3 are all connected to the isolation conversion module, the CANSTA pin of the chip U3 is connected to the grounding diode D14, the V4LED pin of the chip U3 is connected to the grounding diode D15, the V3LED pin of the chip U3 is connected to the grounding diode D16, the V2LED pin of the chip U3 is connected to the grounding diode D17, and the V1 of the chip U3 is connected to the grounding diode D18. The LED pin is connected to the grounding diode D18, the VSSA pin, VSS1 pin, VSS2 pin and VSS3 pin of the chip U3 are all grounded, the VBAT pin, VDDA pin, VDD1 pin, VDD2 pin and VDD3 pin of the chip U3 are all connected to the 3.3V power supply and the grounding capacitor C33-grounding capacitor C38, the TXD pin and RXD pin of the chip U3 are both connected to the bus transceiver module, the OSC pin of the chip U3 is connected to the OUT pin of the chip U7, the NRST pin of the chip U3 is respectively connected to the RESET pin of the chip U8 and one end of the resistor R44, the GND pin of the chip U7 is grounded and is also respectively connected to the other end of the capacitor C41 and the other end of the capacitor C42, the VCC pin and EN / NC pin of the chip U7 are both connected to the 3.3V power supply, one end of the capacitor C41 and one end of the capacitor C42, the chip The GND pin of U8 is respectively connected to the other end of the resistor R44, the other end of the capacitor C40, and the other end of the capacitor C39 and is also grounded, the PA0 pin of the chip U3 is connected to the other end of the resistor R45, the PA1 pin of the chip U3 is connected to the other end of the resistor R46, the PA2 pin of the chip U3 is connected to the other end of the resistor R47, the PA3 pin of the chip U3 is connected to the other end of the resistor R48, the PA4 pin of the chip U3 is connected to the other end of the resistor R49, the other ends of the resistors R45-R49 are also connected to the dip switch, the PA5 pin of the chip U3 is connected to the other end of the resistor R50, the PA6 of the chip U3 is connected to the other end of the resistor R51, one end of the resistors R45-R51 are all connected to a 3.3V power supply, and the resistors R50-R51 are also connected to the dip switch, which is specifically a dip switch for adjusting the station number and the baud rate.

[0046] In the embodiments of the present application, Figure 5 The figure shows the structure diagram of the bus transceiver module, which specifically includes:

[0047] The GND1 pin of the chip U4 is grounded, the RXD pin of the chip U4 is connected to the main controller through a resistor R52, the TXD pin of the chip U4 is connected to the main controller through a resistor R53, the VIO pin and the VCC pin of the chip U4 are both connected to a 5V power supply and are also connected to one end of capacitors C43-C46, the other ends of the capacitors C43-C46 are grounded, the VI SOOUT pin of the chip U4 is respectively connected to one end of capacitor C49 and one end of capacitor C50, the GND2 pin of the chip U4 is respectively connected to the other end of capacitor C49 and the other end of capacitor C50 and is also grounded, the GND3 pin of the chip U4 is respectively connected to one end of capacitor C47 and one end of capacitor C48 and is also grounded, the VI SO The IN pin is respectively connected to the other end of the capacitor C47 and the other end of the capacitor C48, the S pin of the chip U4 is connected to the grounding resistor R54, the CANH pin of the chip U4 is connected to the third port of the inductor L5, the CANL pin of the chip U4 is connected to the fourth port of the inductor L5, the first end of the inductor L5 is respectively connected to one end of the capacitor C52, one end of the diode D10, one end of the diode D11, and one end of the resistor R55, the second end of the inductor L5 is respectively connected to the other end of the capacitor C51, the other end of the diode D10, the other end of the diode D12, and one end of the resistor R56, the other end of the capacitor C52 is connected to one end of the capacitor C51, the other end of the diode D11 is connected to one end of the diode D12 and is grounded, and the resistor R55 and the other end of the resistor R55 are both output ends of the bus transceiver module.

[0048] Among them, the isolation conversion module and the signal acquisition module are the acquisition side, and the power supplies of the acquisition side, the main controller and the bus transceiver module are all independent power supplies. The model of chip U1 can be specifically AD4111, the model of chip U2 can be specifically AD7442, the model of chip U3 can be specifically STM32F103, the model of chip U4 can be specifically TD541CAN, chip U5 is a crystal oscillator, chip U6 is a reference power supply, chip U7 is a crystal oscillator, and chip U8 is a reset chip.

[0049] It should be understood that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there may be an intervening element at the same time; when an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element at the same time. In addition, the "connection" used here may include wireless connection; the term "and / or" used includes any unit and all combinations of one or more associated listed items.

[0050] It should be understood that the various parts of the present application can be implemented by hardware, software, firmware or a combination thereof. In the above-mentioned embodiments, multiple steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented by hardware, as in another embodiment, it can be implemented by any one of the following technologies known in the art or their combination: a discrete logic circuit having a logic gate circuit for implementing a logic function for a data signal, a dedicated integrated circuit having a suitable combination of logic gate circuits, a programmable gate array (PGA), a field programmable gate array (FPGA), etc.

[0051] A person skilled in the art may understand that all or part of the steps in the method for implementing the above-mentioned embodiment may be completed by instructing related hardware through a program, and the program may be stored in a computer-readable storage medium, which, when executed, includes one or a combination of the steps of the method embodiment.

[0052] In addition, each functional unit in each embodiment of the present application may be integrated into a processing module, or each unit may exist physically separately, or two or more units may be integrated into one module. The above-mentioned integrated module may be implemented in the form of hardware or in the form of a software functional module. If the integrated module is implemented in the form of a software functional module and sold or used as an independent product, it may also be stored in a computer-readable storage medium.

[0053] The storage medium mentioned above can be a read-only memory, a magnetic disk or an optical disk, etc.

[0054] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0055] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

[0056] The above contents are further detailed descriptions of the present invention in combination with specific preferred implementations, and the specific implementation of the present invention cannot be considered to be limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. A frequency converter water cooling plate humidity detection circuit, characterized in that: The circuit comprises: A filter module, one end of which is connected to the sensor, and the other end of which is connected to one end of the signal acquisition module, the other end of which is connected to one end of the isolation conversion module, the other end of which is connected to one end of the main controller, the other end of which is connected to one end of the bus transceiver module, and the other end of which is an output end; Wherein, the signal acquisition module also includes a reference circuit.

2. The inverter water cooling plate humidity detection circuit according to claim 1, characterized in that: The filtering module includes four groups of sub-circuits, wherein: The first group of sub-circuits is specifically as follows: one end of the resistor R1 is connected to the first external humidity detection point, the other end of the resistor R1 is respectively connected to one end of the resistor R2 and one end of the capacitor C2, the other end of the resistor R2 is respectively connected to the grounded capacitor C1 and the positive phase input end of the operational amplifier A1, the negative phase input end of the operational amplifier A1 is respectively connected to the grounded resistor R3 and one end of the resistor R4, the other end of the resistor R4, one end of the resistor R5, one end of the capacitor C3 and the other end of the capacitor C2 are all connected to the output end of the operational amplifier A1, the other end of the capacitor C3 is connected to one end of the resistor R6, and is also connected to the first external humidity monitoring point, the other end of the resistor R6 is respectively connected to the other end of the capacitor C4, the other end of the diode D2, the grounded resistor R8, and the second end of the inductor L1, the other end of the resistor R5 is respectively connected to one end of the capacitor C4, one end of the diode D2, the other end of the diode D1, the grounded resistor R7 and the first end of the inductor L1, one end of the diode D1 is grounded, and the third end and the fourth end of the inductor L1 are both connected to the signal acquisition module; The second group of sub-circuits is specifically as follows: one end of the resistor R9 is connected to the second external humidity detection point, the other end of the resistor R9 is respectively connected to one end of the resistor R10 and one end of the capacitor C6, the other end of the resistor R10 is respectively connected to the grounded capacitor C5 and the positive phase input end of the operational amplifier A2, the negative phase input end of the operational amplifier A2 is respectively connected to the grounded resistor R11 and one end of the resistor R12, the other end of the resistor R12, one end of the resistor R13, one end of the capacitor C7 and the other end of the capacitor C6 are all connected to the output end of the operational amplifier A2, The other end of the capacitor C7 is connected to one end of the resistor R15, and is also connected to the second external humidity detection point. The other end of the resistor R15 is respectively connected to the other end of the capacitor C8, the other end of the diode D4, the grounding resistor R16, and the second end of the inductor L2. The other end of the resistor R13 is respectively connected to one end of the capacitor C8, one end of the diode D4, the other end of the diode D3, the grounding resistor R14, and the first end of the inductor L2. One end of the diode D3 is grounded. The third end and the fourth end of the inductor L2 are both connected to the signal acquisition module; The third group of sub-circuits is specifically as follows: one end of the resistor R17 is connected to the third external humidity detection point, the other end of the resistor R17 is respectively connected to one end of the resistor R18 and one end of the capacitor C9, the other end of the resistor R18 is respectively connected to the grounded capacitor C9 and the positive phase input end of the operational amplifier A3, the negative phase input end of the operational amplifier A3 is respectively connected to the grounded resistor R19 and one end of the resistor R20, the other end of the resistor R20, one end of the resistor R21, one end of the capacitor C11 and the other end of the capacitor C10 are all connected to the output end of the operational amplifier A3, The other end of the capacitor C11 is connected to one end of the resistor R23 and is also connected to the third external humidity detection point. The other end of the resistor R23 is respectively connected to the other end of the capacitor C12, the other end of the diode D6, the grounding resistor R24, and the second end of the inductor L3. The other end of the resistor R21 is respectively connected to one end of the capacitor C12, one end of the diode D6, the other end of the diode D5, the grounding resistor R22, and the first end of the inductor L3. One end of the diode D5 is grounded. The third end and the fourth end of the inductor L3 are both connected to the signal acquisition module. The fourth group of sub-circuits is specifically as follows: one end of the resistor R25 is connected to the fourth external humidity detection point, the other end of the resistor R25 is respectively connected to one end of the resistor R26 and one end of the capacitor C13, the other end of the resistor R26 is respectively connected to the grounded capacitor C13 and the positive phase input end of the operational amplifier A4, the negative phase input end of the operational amplifier A4 is respectively connected to the grounded resistor R27 and one end of the resistor R28, the other end of the resistor R28, one end of the resistor R29, one end of the capacitor C15 and the other end of the capacitor C14 are all connected to the output end of the operational amplifier A4 The other end of the capacitor C15 is connected to one end of the resistor R31 and is also connected to the fourth external humidity detection point. The other end of the resistor R31 is respectively connected to the other end of the capacitor C16, the other end of the diode D8, the grounding resistor R32, and the second end of the inductor L4. The other end of the resistor R29 is respectively connected to one end of the capacitor C16, one end of the diode D8, the other end of the diode D7, the grounding resistor R30 and the first end of the inductor L4. One end of the diode D7 is grounded. The third end and the fourth end of the inductor L4 are both connected to the signal acquisition module.

3. The inverter water cooling plate humidity detection circuit according to claim 2, characterized in that: The signal acquisition module specifically includes a chip U1 and a reference circuit, wherein: The VINCOM pin of the chip U1 is grounded, the VIN0 pin of the chip U1 is connected to one end of the capacitor C17 and the third end of the inductor L1 respectively, the VIN1 pin of the chip U1 is connected to one end of the capacitor C18 and the fourth end of the inductor L1 respectively, the VIN2 pin of the chip U1 is connected to one end of the capacitor C19 and the third end of the inductor L2 respectively, the VIN3 pin of the chip U1 is connected to one end of the capacitor C20 and the fourth end of the inductor L2 respectively, the VIN4 pin of the chip U1 is connected to one end of the capacitor C21 and the third end of the inductor L3 respectively, and the VIN5 pin of the chip U1 is connected to one end of the capacitor C21 and the third end of the inductor L3 respectively. The VIN pins of the chip U1 are respectively connected to one end of the capacitor C22 and the fourth end of the inductor L3, the VIN6 pin of the chip U1 is respectively connected to one end of the capacitor C23 and the third end of the inductor L4, the VIN7 pin of the chip U1 is respectively connected to one end of the capacitor C24 and the fourth end of the inductor L4, the other ends of the capacitors C17-C24 are all connected to the VBIAS pin and the RES- pin of the chip U1 and are grounded, the AVSS pin, EP pin, DGND pin, and XTAL1 pin of the chip U1 are all grounded, and the REGCAPA pin of the chip U1 is respectively connected to one end of the capacitor C28 and one end of the capacitor C29 The REGCAPD pin of the chip U1 is connected to one end of the capacitor C27, the AVDD pin of the chip U1 is respectively connected to one end of the capacitor C25 and one end of the capacitor C26, and is also connected to a 3.3V power supply, the IOVDD pin of the chip U1 is connected to the 3.3V power supply, the other ends of the capacitors C25-C29 are all grounded, the REFOUT pin of the chip U1 is connected to the grounded capacitor C30, the DOUT pin, DIN pin, SCLK pin, and CS pin of the chip U1 are all connected to the isolation conversion module, the ERROR pin of the chip U1 is connected to one end of the diode D13, and the diode The other end of the diode D13 is connected to one end of the resistor R35, the SYNC pin of the chip U1 is connected to one end of the resistor R34, the other end of the resistor R35 and the other end of the resistor R34 are both connected to a 3.3V power supply, the CLKIO pin of the chip U1 is connected to the OUT pin of the chip U5, the GND pin of the chip U5 is grounded, the VCC pin and the EN / NC pin of the chip U5 are both connected to the grounded capacitor C53, the grounded capacitor C54 and 3.3V, and the RES+ pin of the chip U1 is respectively connected to one end of the diode D9 in the reference circuit, the other end of the resistor R33, one end of the capacitor C55 and 2.5V power supply, one end of the resistor R33 is connected to the 9V power supply, the other end of the capacitor C55 and the other end of the diode D9 are grounded, the reference circuit also includes a chip U6, the Vin pin of the chip U6 is respectively connected to the 24V power supply, one end of the capacitor C58, and one end of the capacitor C57, the Vout pin of the chip U6 outputs 9V electricity and is connected to one end of the capacitor C56, and the GND pin of the chip U6, the other end of the capacitor C56, the other end of the capacitor C57, and the other end of the capacitor C58 are all grounded. .

4. The inverter water cooling plate humidity detection circuit according to claim 1, characterized in that: The isolation conversion module specifically includes: The VDD2A pin of chip U2 is respectively connected to a 3.3V power supply, one end of capacitor C32, one end of capacitor C31 and one end of resistor R36. The other end of capacitor C32, the other end of capacitor C31 and GND2 pin of chip U2 are all grounded. The other end of resistor R36 and VOA pin of chip U2 are all connected to the signal acquisition module. The VOB pin of chip U2 is connected to the signal acquisition module through resistor R37. The VOC pin of chip U2 is connected to the signal acquisition module through resistor R38. The VID pin of chip U2 is connected to the signal acquisition module through resistor R39. The VDD2B pin of chip U2 is connected to a 3.3V power supply. The GND1 pin and GND1 pin of chip U2 are grounded. B is connected to a 3.3V power supply, the VOD pin of the chip U2 is connected to the main controller through a resistor R43, the VIC pin of the chip U2 is connected to the main controller through a resistor R42, the VIB pin of the chip U2 is connected to the main controller through a resistor R41, the VIA of the chip U2 is connected to the main controller and is also connected to the other end of the resistor R40, and one end of the resistor R40 is respectively connected to the VDD1A pin of the chip U2 and the 3.3V power supply.

5. The inverter water cooling plate humidity detection circuit according to claim 1, characterized in that: The main controller comprises: The CS pin, SCLK pin, MISO pin, and MOSI pin of the chip U3 are all connected to the isolation conversion module, the CANSTA pin of the chip U3 is connected to the grounding diode D14, the V4LED pin of the chip U3 is connected to the grounding diode D15, the V3LED pin of the chip U3 is connected to the grounding diode D16, the V2LED pin of the chip U3 is connected to the grounding diode D17, and the V1 of the chip U3 is connected to the grounding diode D18. The LED pin is connected to the grounding diode D18, the VSSA pin, VSS1 pin, VSS2 pin and VSS3 pin of the chip U3 are all grounded, the VBAT pin, VDDA pin, VDD1 pin, VDD2 pin and VDD3 pin of the chip U3 are all connected to the 3.3V power supply and the grounding capacitor C33-grounding capacitor C38, the TXD pin and RXD pin of the chip U3 are both connected to the bus transceiver module, the OSC pin of the chip U3 is connected to the OUT pin of the chip U7, the NRST pin of the chip U3 is respectively connected to the RESET pin of the chip U8 and one end of the resistor R44, the GND pin of the chip U7 is grounded and is also respectively connected to the other end of the capacitor C41 and the other end of the capacitor C42, the VCC pin and EN / NC pin of the chip U7 are both connected to the 3.3V power supply, one end of the capacitor C41, the capacitor C4 2, the GND pin of the chip U8 is respectively connected to the other end of the resistor R44, the other end of the capacitor C40, and the other end of the capacitor C39 and is also grounded, the PA0 pin of the chip U3 is connected to the other end of the resistor R45, the PA1 pin of the chip U3 is connected to the other end of the resistor R46, the PA2 pin of the chip U3 is connected to the other end of the resistor R47, the PA3 pin of the chip U3 is connected to the other end of the resistor R48, the PA4 pin of the chip U3 is connected to the other end of the resistor R49, the other ends of the resistors R45-R49 are also connected to the dip switch, the PA5 pin of the chip U3 is connected to the other end of the resistor R50, the PA6 of the chip U3 is connected to the other end of the resistor R51, one ends of the resistors R45-R51 are all connected to a 3.3V power supply, and the resistors R50-R51 are also connected to the dip switch.

6. The inverter water cooling plate humidity detection circuit according to claim 1, characterized in that: The bus transceiver module specifically includes: The GND1 pin of the chip U4 is grounded, the RXD pin of the chip U4 is connected to the main controller through a resistor R52, the TXD pin of the chip U4 is connected to the main controller through a resistor R53, the VIO pin and the VCC pin of the chip U4 are both connected to a 5V power supply and are also connected to one end of capacitors C43-C46, the other ends of the capacitors C43-C46 are grounded, the VISOOUT pin of the chip U4 is respectively connected to one end of capacitor C49 and one end of capacitor C50, the GND2 pin of the chip U4 is respectively connected to the other end of capacitor C49 and the other end of capacitor C50 and is also grounded, the GND3 pin of the chip U4 is respectively connected to one end of capacitor C47 and one end of capacitor C48 and is also grounded, the VISOIN pin of the chip U4 is respectively connected to the capacitors C The S pin of the chip U4 is connected to the grounding resistor R54, the CANH pin of the chip U4 is connected to the third port of the inductor L5, the CANL pin of the chip U4 is connected to the fourth port of the inductor L5, the first end of the inductor L5 is respectively connected to one end of the capacitor C52, one end of the diode D10, one end of the diode D11, and one end of the resistor R55, the second end of the inductor L5 is respectively connected to the other end of the capacitor C51, the other end of the diode D10, the other end of the diode D12, and one end of the resistor R56, the other end of the capacitor C52 is connected to one end of the capacitor C51, the other end of the diode D11 is connected to one end of the diode D12 and is grounded, and the resistor R55 and the other end of the resistor R55 are both output ends of the bus transceiver module.

7. The inverter water cooling plate humidity detection circuit according to claim 1, characterized in that: The isolation conversion module and the signal acquisition module are the acquisition side, and the power supplies of the acquisition side, the main controller and the bus transceiver module are all independent power supplies.

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