Chip protection ring structure and chip thereof
By designing a diamond metal block array distribution and multi-layer buffer structure in the chip protection ring structure, the problem that the chip protection ring structure in the prior art is difficult to weaken or slow down the destructive stress, and the protection effect of the sealing ring is significantly improved.
Patent Information
- Application Number
- CN202420556449.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-21
- Publication Date
- 2025-03-04
- Estimated Expiration
- 2034-03-21
AI Technical Summary
The existing chip protection ring structure is difficult to effectively weaken or slow down the damage stress during the chip cutting process, resulting in easy breakage or damage.
A chip protection ring structure is designed, including a seal ring and a buffer structure located outside the corner of the seal ring. The buffer structure consists of a plurality of diamond-shaped metal blocks, distributed along the two guiding directions, forming a gap with an obtuse angle, and forming different buffer metal layers in the vertical direction.
Through the distribution of diamond metal block array and multi-layer buffer structure, the direct impact of the damage stress on the sealing ring is reduced, and the damage stress is further weakened and slowed down through the setting of arc-edge metal blocks and strip-shaped metal blocks, which significantly improves the protection effect of the sealing ring.
Smart Images
Figure CN222562674U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductor manufacturing and relates to a chip protection ring structure and a chip thereof. Background Art
[0002] With the development of semiconductor technology, a seal ring structure is usually set in the chip. The seal ring is composed of metal layers stacked from bottom to top. It is set between the chip device area and the cutting path. It is a sealing ring set between the chip device area. It can prevent the cutting cracks from damaging the chip device area when the wafer is cut. At the same time, it can play a role in moisture-proof and electromagnetic damage.
[0003] Most existing seal rings are octagonal in shape, but when cutting, the top corners of the octagonal seal ring are most susceptible to cutting stress, making the corners of the seal ring more fragile and easy to break or damage. In order to guide the cracks to avoid entering the corners of the seal ring as much as possible, a seal ring with a buffer structure is set in the existing structure to obtain a better buffering effect, that is, by setting multiple layers of regular metal blocks in the direction parallel or perpendicular to the wafer, so as to buffer the destructive stress or guide the stress direction when the wafer is cut.
[0004] Most of the existing seal rings with buffer structures only consider how to best guide the direction of the destructive stress. However, since the destructive stress is guided, it will spread rapidly in the guiding direction, resulting in less resistance to the stress during rupture, making it easier to cause greater damage. Therefore, the existing seal ring lacks the function of weakening or slowing down the destructive stress other than guiding the direction.
[0005] Therefore, it is necessary to provide a chip protection ring structure and a chip thereof. Utility Model Content
[0006] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a chip protection ring structure and a chip thereof, so as to solve the problem that the chip protection ring structure in the prior art is difficult to weaken or slow down the destructive stress.
[0007] In order to achieve the above-mentioned purpose and other related purposes, the utility model provides a chip protection ring structure, the chip protection ring structure comprising:
[0008] Sealing ring;
[0009] A buffer structure, wherein the buffer structure is located outside the corner of the sealing ring and is spaced apart from the sealing ring, and the buffer structure comprises a plurality of rhombus-shaped metal blocks, wherein the plurality of rhombus-shaped metal blocks are arranged in an array along a first guide direction and a second guide direction, wherein a first direction gap extending along the first guide direction and a second direction gap extending along the second guide direction are formed between the rhombus-shaped metal blocks, and an angle between the first direction gap and the second direction gap toward the adjacent sealing ring is an obtuse angle.
[0010] Optionally, in a direction perpendicular to a plane formed by the first guiding direction and the second guiding direction, the diamond-shaped metal blocks form different buffer metal layers from bottom to top, the buffer metal layers are connected by metal contacts, and the diamond-shaped metal blocks in adjacent buffer metal layers are overlapped.
[0011] Optionally, an arc-edge metal block adjacent to the sealing ring is further arranged between the buffer structure and the sealing ring, and at least the edge of the arc-edge metal block facing the diamond-shaped metal block is arc-shaped, the arc surface of the arc-edge metal block faces away from the adjacent sealing ring, and the first direction gap and the second direction gap both intersect with the arc surface of the arc-edge metal block.
[0012] Optionally, the arc-edge metal block includes a plurality of block-shaped metal blocks arranged at intervals.
[0013] Optionally, the shape of the arc-edge metal block includes a semi-ellipse or an ellipse, or the arc-edge metal block is an arc-edge metal wall.
[0014] Optionally, a strip-shaped metal block adjacent to the sealing ring is further provided between the arc-edge metal block and the sealing ring.
[0015] Optionally, a strip-shaped metal block adjacent to the sealing ring is further provided between the buffer structure and the sealing ring.
[0016] Optionally, the strip-shaped metal block includes a plurality of strip-shaped metal blocks arranged at intervals, or the strip-shaped metal block is a strip-shaped metal wall.
[0017] Optionally, the sealing ring includes a single ring or a double ring; the sealing ring includes an open ring or a closed ring.
[0018] The present application also provides a chip, which includes any of the above-mentioned chip protection ring structures.
[0019] As described above, the chip protection ring structure and chip thereof of the utility model include a sealing ring and a buffer structure located outside the corner of the sealing ring and spaced apart from the sealing ring, the buffer structure includes a plurality of diamond-shaped metal blocks, the plurality of diamond-shaped metal blocks are distributed in an array along a first guide direction and a second guide direction, a first direction gap extending along the first guide direction and a second direction gap extending along the second guide direction are formed between the diamond-shaped metal blocks, and an angle between the first direction gap and the second direction gap toward the adjacent sealing ring is an obtuse angle.
[0020] The chip protection ring structure and chip thereof of the present application are distributed in an array of diamond metal blocks formed by diamond metal blocks, forming a gap with two extension directions and an obtuse angle, which can reduce the direct impact of the damage stress on the sealing ring; further, the arc-edge metal block with an arc surface can further weaken and slow down the damage stress, reducing the direct impact of the damage stress on the sealing ring; further, the setting of the strip metal block can also further block the damage stress to further protect the sealing ring. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 Shown is a schematic structural diagram of a chip protection ring structure in an embodiment of the present utility model.
[0022] Figure 2 Display as Figure 1 Schematic diagram of the local enlarged structure of area E in the middle.
[0023] Figure 3 Display as Figure 2 Schematic diagram of the cross-sectional structure along AA.
[0024] Figure 4 Display as Figure 2 Schematic diagram of another cross-sectional structure along AA.
[0025] Figure 5 Display as Figure 2 Schematic diagram of the cross-sectional structure along BB.
[0026] Figure 6 Display as Figure 2 Schematic diagram of the cross-sectional structure along CC.
[0027] Figure 7 Display as Figure 2 Schematic diagram of the cross-sectional structure along the middle line DD.
[0028] Component number description
[0029] 100 Sealing ring
[0030] 200 Buffer structure
[0031] 210 Diamond Metal Block
[0032] 220 Arc Edge Metal Block
[0033] 230 Metal Bar
[0034] 240 Metal Contact
[0035] 300 First direction clearance
[0036] 400 Second direction clearance DETAILED DESCRIPTION
[0037] The following is an explanation of the implementation of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific implementations, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.
[0038] It should be noted that the illustrations provided in this embodiment are only used to schematically illustrate the basic concept of the present invention. Therefore, the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.
[0039] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0040] like Figure 1 to Figure 7 The present embodiment provides a chip protection ring structure, which includes a sealing ring 100 and a buffer structure 200. The buffer structure 200 is located outside the corner of the sealing ring 100 and is spaced apart from the sealing ring 100. The buffer structure 200 includes a plurality of rhombus metal blocks 210. The plurality of rhombus metal blocks 210 are arranged in an array along a first guide direction X and a second guide direction Y. A first direction gap 300 extending along the first guide direction X and a second direction gap 400 extending along the second guide direction Y are formed between the rhombus metal blocks 210. The angle θ between the first direction gap 300 and the second direction gap 400 toward the adjacent sealing ring 100 is an obtuse angle.
[0041] It should be noted that the rhombus described in the present application does not include a square with right angles, and for the convenience of description, the first guiding direction is defined as X, the second guiding direction is defined as Y, and the direction perpendicular to the plane formed by the first guiding direction X and the second guiding direction Y is defined as Z.
[0042] Specifically, Figure 1 and Figure 2 In this embodiment, a plurality of the diamond-shaped metal blocks 210 are distributed in an array along the first guide direction X and the second guide direction Y, wherein, in the array formed by the diamond-shaped metal blocks 210, the diamond-shaped metal blocks 210 form a first direction gap 300 extending along the first guide direction X and a second direction gap 400 extending along the second guide direction Y, and the angle θ between the first direction gap 300 and the second direction gap 400 toward the adjacent sealing ring 100 is an obtuse angle. The value of the angle θ may include, for example, 120°, 135°, 150°, etc., which is not excessively limited here. The specific width and length of the first direction gap 300 and the second direction gap 400 can be set as needed, such as the first direction gap 300 can be set at equal intervals and have the same or different morphologies, and the second direction gap 400 can be set at equal intervals and have the same or different morphologies, which is not limited here.
[0043] The specific shape and size of the diamond-shaped metal block 210 are not limited here.
[0044] In this embodiment, by using the diamond-shaped metal block 210 having a diamond-shaped morphology and the first direction gap 300 and the second direction gap 400 having two extension directions and an obtuse angle θ, when performing a wafer cutting operation, the stress from the outside of the buffer structure 200 is blocked by the diamond-shaped metal block 210, thereby reducing the direct impact of the damage stress on the sealing ring 100, thereby weakening and slowing down the damage stress and protecting the sealing ring 100.
[0045] As an example, in a direction Z perpendicular to a plane formed by the first guiding direction X and the second guiding direction Y, the diamond metal blocks 210 form different buffer metal layers from bottom to top, the buffer metal layers are connected by metal contacts 240, and the diamond metal blocks 210 in adjacent buffer metal layers are overlapped.
[0046] Among them, Figure 3 , Figure 4 , Figure 6 and Figure 7, along the direction Z, the diamond-shaped metal blocks 210 preferably constitute multiple buffer metal layers, and the diamond-shaped metal blocks 210 in the buffer metal layers adjacent to each other are arranged in an overlapping manner, that is, the diamond-shaped metal blocks 210 located in the upper layer and the diamond-shaped metal blocks 210 located in the lower layer have an overlapping region along the direction Z, so as to further improve the blocking effect of the diamond-shaped metal blocks 210 on the damage stress, and the metal contact 240 connecting the upper and lower buffer metal layers can be arranged in the overlapping region. Of course, the diamond-shaped metal blocks 210 can also be arranged to extend directly from bottom to top along the direction Z as needed, which is not limited here.
[0047] The material of the diamond metal block 210 and the material of the metal contact 240 can be selected as needed, such as copper metal, etc., which is not limited here. The connection position of the diamond metal block 210 and the metal contact 240 can be set as needed, and the preferred position is located at the top corner area of the corner of the diamond metal block 210.
[0048] As an example, an arc-edge metal block 220 adjacent to the sealing ring 100 is also arranged between the buffer structure 200 and the sealing ring 100, and at least one edge of the arc-edge metal block 220 facing the diamond-shaped metal block 210 is arc-shaped, the arc surface of the arc-edge metal block 220 faces away from the adjacent sealing ring 100, and the first direction gap 300 and the second direction gap 400 both intersect with the arc surface of the arc-edge metal block 220.
[0049] Specifically, Figure 1 to Figure 5 In this embodiment, a plurality of arc-edge metal blocks 220 are arranged between the buffer structure 200 and the sealing ring 100, and are adjacent to the sealing ring 100 and have arc-shaped surfaces and are distributed in a block-like manner. The arc surface of the arc-edge metal block 220 faces away from the adjacent sealing ring 100, and the first direction gap 300 and the second direction gap 400 both intersect with the arc surface of the arc-edge metal block 220, so that the damage extending along the first direction gap 300 and the second direction gap 400 After the stress encounters the arc-edge metal block 220, the damage stress can be further weakened and slowed down through the obstruction of the arc-edge metal block 220, thereby further reducing the impact of the damage stress on the sealing ring 100; and because the arc surface of the arc-edge metal block 220 is facing away from the adjacent sealing ring 100, the stress from the outside can make the combined force away from the sealing ring 100 after encountering the arc-edge metal block 220 after the force is decomposed, because the arc surface bears the damage stress, it is easier to slow down the stress impact and reduce damage.
[0050] In this embodiment, the arc-edge metal block 220 is a plurality of block-shaped metal blocks arranged at intervals, but is not limited thereto. The arc-edge metal block 220 may also be an integral arc-edge metal wall, which is not excessively restricted here.
[0051] As an example, the shape of the arc-edge metal block 220 may include a semi-ellipse or an ellipse. In the present embodiment, the shape of the arc-edge metal block 220 is an ellipse, but it is not limited thereto. As required, the shape of the arc-edge metal block 220 may also be set to be a semi-ellipse, or a combination of a semi-ellipse and an ellipse. No excessive restrictions are made here.
[0052] The selection of the specific size, distribution, morphology, material, etc. of the arc-edge metal block 220 is not overly limited here.
[0053] Further, such as Figure 1 and Figure 2 As needed, a strip metal block 230 adjacent to the sealing ring 100 may be provided between the arc-edge metal block 220 and the sealing ring 100, so as to further block the damage stress through the provision of the strip metal block 230, thereby further weakening and slowing down the damage stress, so as to further reduce the impact of the damage stress on the sealing ring 100.
[0054] The specific size and material of the strip-shaped metal block 230 are not excessively limited here.
[0055] Of course, when the arc-edge metal block 220 is not set in the chip protection ring structure, the strip metal block 230 adjacent to the sealing ring 100 may also be set between the buffer structure 200 and the sealing ring 100, so that the damage stress extending along the first direction gap 300 and the second direction gap 400 can be further weakened and slowed down by the obstruction of the strip metal block 230 after encountering the strip metal block 230, thereby further reducing the impact of the damage stress on the sealing ring 100.
[0056] Among them, the strip metal block 230 may include a plurality of strip metal blocks 230 arranged at intervals, or the strip metal block 230 is a strip metal wall. In this embodiment, the strip metal block 230 is a strip metal wall, but it is not limited to this. The strip metal block 230 may also be a plurality of strip metal blocks 230 arranged at intervals.
[0057] The specific size, distribution, morphology, material, etc. of the strip-shaped metal block 230 are not excessively limited here.
[0058] As an example, the sealing ring 100 may include a single ring or a double ring. In this embodiment, Figure 1 and Figure 2 The sealing ring 100 is shown as a single-ring type, but it is not limited to this. The sealing ring 100 can also adopt a double-ring type sealing ring 100. There is no excessive limitation here and it can be set according to needs.
[0059] As an example, the sealing ring 100 may include an open loop or a closed loop, that is, the sealing ring 100 may be an open-loop sealing ring 100 with an opening, or a closed-loop sealing ring 100, which is not excessively limited here and can be set as needed.
[0060] This embodiment further provides a chip, which includes the chip protection ring structure. The type of the chip is not overly limited herein.
[0061] To sum up, the chip protection ring structure and chip thereof of the utility model include a sealing ring and a buffer structure located outside the corner of the sealing ring and spaced apart from the sealing ring, the buffer structure includes a plurality of diamond-shaped metal blocks, the plurality of diamond-shaped metal blocks are distributed in an array along a first guide direction and a second guide direction, a first direction gap extending along the first guide direction and a second direction gap extending along the second guide direction are formed between the diamond-shaped metal blocks, and an angle between the first direction gap and the second direction gap toward the adjacent sealing ring is an obtuse angle.
[0062] The chip protection ring structure and its chip of the present application, through the diamond metal block to form a diamond metal block array distribution, form a gap with two extension directions and an obtuse angle, which can reduce the direct impact of the damage stress on the sealing ring; further, the arc edge metal block with an arc surface can further weaken and slow down the damage stress, reduce the direct impact of the damage stress on the sealing ring; further, the setting of the strip metal block can also further block the damage stress, so as to further protect the sealing ring. Therefore, the utility model effectively overcomes various shortcomings in the prior art and has a high industrial utilization value.
[0063] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed in the present invention shall still be covered by the claims of the present invention.
Claims
1. A chip protection ring structure, characterized in that: The chip protection ring structure comprises: Sealing ring; A buffer structure, wherein the buffer structure is located outside the corner of the sealing ring and is spaced apart from the sealing ring, and the buffer structure comprises a plurality of rhombus-shaped metal blocks, wherein the plurality of rhombus-shaped metal blocks are arranged in an array along a first guide direction and a second guide direction, wherein a first direction gap extending along the first guide direction and a second direction gap extending along the second guide direction are formed between the rhombus-shaped metal blocks, and an angle between the first direction gap and the second direction gap toward the adjacent sealing ring is an obtuse angle.
2. The chip protection ring structure according to claim 1, characterized in that: In a direction perpendicular to a plane formed by the first guiding direction and the second guiding direction, the diamond-shaped metal blocks form different buffer metal layers from bottom to top, the buffer metal layers are connected by metal contacts, and the diamond-shaped metal blocks in adjacent buffer metal layers are overlapped.
3. The chip protection ring structure according to claim 1, characterized in that: An arc-edge metal block adjacent to the sealing ring is also arranged between the buffer structure and the sealing ring, wherein at least one side of the arc-edge metal block facing the diamond-shaped metal block is arc-shaped, the arc surface of the arc-edge metal block faces away from the adjacent sealing ring, and the first direction gap and the second direction gap both intersect with the arc surface of the arc-edge metal block.
4. The chip protection ring structure according to claim 3, characterized in that: The arc-edge metal block includes a plurality of block-shaped metal blocks arranged at intervals.
5. The chip protection ring structure according to claim 3, characterized in that: The shape of the arc-edge metal block includes a semi-ellipse or an ellipse, or the arc-edge metal block is an arc-edge metal wall.
6. The chip protection ring structure according to claim 3, characterized in that: A strip-shaped metal block adjacent to the sealing ring is also arranged between the arc-edge metal block and the sealing ring.
7. The chip protection ring structure according to claim 1, characterized in that: A strip-shaped metal block adjacent to the sealing ring is also arranged between the buffer structure and the sealing ring.
8. The chip protection ring structure according to claim 6 or 7, characterized in that: The strip-shaped metal block includes a plurality of strip-shaped metal blocks arranged at intervals, or the strip-shaped metal block is a strip-shaped metal wall.
9. The chip protection ring structure according to claim 1, characterized in that: The sealing ring includes a single ring or a double ring; the sealing ring includes an open ring or a closed ring.
10. A chip, characterized in that: The chip includes the chip protection ring structure as claimed in any one of claims 1 to 9.