Shell for camera and camera

By setting up an insulating ring and an insulating plate in the camera housing to isolate the heat conduction and convection paths, the temperature rise problem caused by the image acquisition component due to the heat conduction of the motherboard is solved, and the working performance of the camera is significantly improved.

CN222563873UActive Publication Date: 2025-03-04HANGZHOU HIKROBOT TECH CO LTD
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Patent Information

Application Number
CN202420648159.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-03-29
Publication Date
2025-03-04
Estimated Expiration
2034-03-29

AI Technical Summary

Technical Problem

The image acquisition component in the camera is sensitive to temperature rise. The heat generated by the motherboard is transmitted to the image acquisition component through the shell, resulting in rapid temperature rise and affecting the camera's working performance.

Method used

A shell for the camera is designed, and the installation space inside the shell is separated into two parts by setting up a heat insulation ring and a heat insulation board, reducing the heat transfer of the motherboard to the image acquisition component.

Benefits of technology

It significantly reduces the temperature rise of the image acquisition component, reduces the impact on the camera's working performance, and avoids performance losses caused by increasing the heat dissipation device or reducing the motherboard power.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN222563873U_ABST
    Figure CN222563873U_ABST
Patent Text Reader

Abstract

The shell comprises a first shell body, a second shell body, a heat insulation ring and a heat insulation plate which are fixedly installed into a whole, the heat insulation ring is arranged between the first shell body and the second shell body and separates the first shell body and the second shell body, and the heat insulation ring is matched with the first shell body and the second shell body to form an installation space; the heat insulation plate is arranged in the installation space and divides the installation space into a first containing cavity and a second containing cavity, the first containing cavity is used for installing an image collecting assembly of the camera, the second containing cavity is used for installing a main board of the camera, and the heat insulation plate is further provided with a wiring hole communicating the first containing cavity with the second containing cavity. The utility model also discloses a camera comprising the housing. The heat conduction efficiency of heat between the first shell and the second shell is reduced through the heat insulation ring, and the heat convection efficiency of heat between the first containing cavity and the second containing cavity is reduced through the heat insulation plate. The temperature rise of the image acquisition assembly can be reduced, and the influence on the working performance of the camera is reduced.
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Description

Technical Field

[0001] The present application relates to the technical field of image acquisition equipment, and in particular to a housing for a camera and a camera. Background Art

[0002] Cameras are increasingly used in industrial measurement and inspection. During the operation of the camera, the mainboard and some image acquisition components will generate heat (for example, the image acquisition components in a laser 3D camera generally include a laser module and a lens module. The laser in the laser module and the sensor circuit board in the lens module will generate heat during operation). Large temperature rise will seriously affect the performance of optical devices, resulting in reduced linearity, repeatability and stability of the measurement. Especially for optical devices such as lasers that are sensitive to temperature rise, the "temperature drift" problem will be more serious when encountering large temperature rises.

[0003] In order to solve the above problems, three solutions are generally adopted in the related technology: one solution is to reduce the power of the mainboard and directly reduce the heat generated by the whole machine, but this will inevitably reduce the working performance of the camera; another solution is to set heat dissipation fins on the outer casing of the camera to dissipate heat through heat convection with the outside world, but this solution is not effective for high-power motherboards, and there is still a problem of reduced camera performance in actual applications; another solution is to set a refrigeration device inside the camera, but this solution is relatively expensive and may affect the life of electronic components due to condensation problems. Utility Model Content

[0004] The present application aims to solve one of the technical problems in the related art to a certain extent. To this end, the present application provides a housing for a camera and a camera.

[0005] In order to achieve the above-mentioned purpose, the present application adopts the following technical solution: a housing for a camera, comprising a first housing, a second housing, a heat-insulating ring and a heat-insulating plate fixedly mounted in one body, the heat-insulating ring being arranged between the first housing and the second housing to separate the two, and the heat-insulating ring cooperates with the first housing and the second housing to form an installation space;

[0006] The heat insulation board is arranged in the installation space and divides the installation space into a first cavity and a second cavity, the first cavity is used to install the image acquisition component of the camera, the second cavity is used to install the mainboard of the camera, and the heat insulation board is also provided with a wiring hole connecting the first cavity and the second cavity.

[0007] The application of this application has the following beneficial effects: the inventor has found through research that the main heat-generating component in the camera is the mainboard, and the component in the camera that is more sensitive to temperature rise is the image acquisition component. The heat transfer efficiency of the heat generated by the mainboard to the image acquisition component through the camera housing is much higher than the heat transfer efficiency of the heat convection through the camera housing to the outside world, and the heat generated by the mainboard will also be transferred to the image acquisition component in the form of heat convection inside the camera housing. This leads to the problem of rapid temperature rise in the image acquisition component, which in turn affects the working performance of the camera. The application sets a heat insulation ring and a heat insulation board. On the one hand, the heat insulation ring is used to separate the first shell from the second shell, thereby reducing the heat conduction efficiency between the first shell and the second shell; on the other hand, the heat insulation board is used to separate the installation space inside the shell into a first cavity and a second cavity, thereby reducing the heat convection efficiency between the first cavity and the second cavity. In this way, the heat generated by the mainboard can be significantly reduced from being transferred to the image acquisition component, thereby reducing the temperature rise of the image acquisition component and reducing the impact on the working performance of the camera.

[0008] Optionally, the first shell includes a first bottom wall and a first side wall arranged around the first bottom wall, the first bottom wall and the first side wall cooperate to form a concave cavity with an opening, the heat insulation board is located in the concave cavity and is arranged close to the opening, and the heat insulation board cooperates with the first bottom wall and the first side wall to form the first cavity.

[0009] Optionally, a first mounting protrusion is formed on the first side wall, the first mounting protrusion has a first assembly surface, and the heat insulation board is arranged in contact with the first assembly surface and fixedly connected to the first mounting protrusion.

[0010] Optionally, a second mounting protrusion is formed on the first side wall, and the housing also includes a support column detachably mounted on the second mounting protrusion, an end face of the support column forms a second assembly surface for mounting the mainboard, and the support column is provided with a threaded hole for cooperating with a screw so that the mainboard can be mounted on the support column by means of a screw passing through the mainboard.

[0011] Optionally, the support column is configured to be electrically connected to the first shell.

[0012] Optionally, a connecting column is formed on the end face of the first side wall, the connecting column is provided with a threaded hole, the insulating ring is provided with a first connecting hole adapted to the connecting column, and the connecting column is inserted into the first connecting hole; the second shell is provided with a second connecting hole coaxial with the first connecting hole, and the second shell and the insulating ring are fixed to the first shell by means of screws inserted into the second connecting hole and tightened in the threaded hole.

[0013] Optionally, a positioning column is also formed on the end face of the first side wall, the length of the positioning column is greater than the length of the connecting column, the insulation ring is provided with a positioning hole adapted to the positioning column, the second shell is provided with a positioning groove adapted to the positioning column, and the positioning column passes through the positioning hole and extends into the positioning groove.

[0014] Optionally, the second shell includes a second bottom wall and a second side wall arranged around the second bottom wall, and the heat insulation ring is sandwiched between an end surface of the first side wall and an end surface of the second side wall;

[0015] Alternatively, the second shell is a flat plate, and the heat insulation ring is sandwiched between the end surface of the first side wall and the flat plate.

[0016] Optionally, the housing further comprises an elastic heat insulating member disposed at the wiring hole, and the elastic heat insulating member is used to close the wiring hole.

[0017] Optionally, the first shell and the second shell are both made of metal, and the heat insulation ring and the heat insulation plate are both made of plastic.

[0018] Optionally, a first sealing ring is sandwiched between the thermal insulation ring and the first shell, and a second sealing ring is sandwiched between the thermal insulation ring and the second shell.

[0019] In addition, the present application also provides a camera, including an image acquisition component and a mainboard, the camera also includes a housing as described in any one of the above technical solutions, the image acquisition component is arranged in a first cavity, the mainboard is arranged in a second cavity, and the image acquisition component is electrically connected to the mainboard through a cable passing through the wiring hole. The reasoning process of the beneficial effects of the camera provided by the present application and the aforementioned housing is similar, and will not be repeated here.

[0020] These features and advantages of the present application will be disclosed in detail in the following specific embodiments and drawings. The best embodiments or means of the present application will be described in detail in conjunction with the drawings, but they are not intended to limit the technical solutions of the present application. In addition, there are multiple features, elements, and components that appear in each of the following texts and drawings, and different symbols or numbers are marked for convenience, but they all represent components with the same or similar structures or functions. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The present application is further described below in conjunction with the accompanying drawings:

[0022] Figure 1 A schematic structural diagram of a housing for a camera provided in an embodiment of the present application;

[0023] Figure 2 Explosion of a camera housing provided by an embodiment of the present invention Figure 1;

[0024] Figure 3 Explosion of a camera housing provided by an embodiment of the present invention Figure 2 ;

[0025] Figure 4 A cross-sectional view of a camera to which the housing provided by the embodiment is applied;

[0026] Figure 5 is a top view of the first shell;

[0027] Figure 6 for Figure 2 A magnified schematic diagram of part A;

[0028] Figure 7 for Figure 2 A magnified schematic diagram of part B;

[0029] Figure 8 for Figure 3 A magnified schematic diagram of part C;

[0030] Fig. 9 for Figure 3 The enlarged schematic diagram of the D part;

[0031] Fig.10 for Figure 4 Enlarged schematic diagram of part E in the middle.

[0032] Among them, 1. first shell; 10. first bottom wall; 100. third assembly surface; 101. fourth assembly surface; 11. first side wall; 110. first mounting protrusion; 111. second mounting protrusion; 112. support column; 1120. second screw; 113. connecting column; 114. positioning column; 12. first sealing ring; 13. light outlet hole; 14. light collecting hole; 15. thermal pad; 2. second shell; 20. second bottom wall; 21. second side wall; 22. second connecting hole; 23. second sealing ring; 24. third screw; 3. thermal insulation ring; 30. first connecting hole; 31. positioning hole; 4. thermal insulation board; 40. wiring hole; 41. elastic thermal insulation member; 42. first screw; 5. first cavity; 6. second cavity; 7. laser module; 8. lens module; 9. main board. DETAILED DESCRIPTION

[0033] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments based on the embodiments are intended to be used to explain the present application and cannot be understood as limiting the present application.

[0034] References to "one embodiment" or "an example" or "an example" in this specification mean that a particular feature, structure, or characteristic described in conjunction with the embodiment itself may be included in at least one embodiment disclosed in the present application. The appearance of the phrase "in one embodiment" in various places in the specification does not necessarily refer to the same embodiment.

[0035] After research, the inventor found that the main heat-generating component in the camera is the mainboard, and the component in the camera that is more sensitive to temperature rise is the image acquisition component. The heat transfer efficiency of the mainboard to the image acquisition component through the camera housing is much higher than the heat transfer efficiency of the camera housing to the outside through thermal convection, and the heat generated by the mainboard will also be transferred to the image acquisition component through thermal convection inside the camera housing. This leads to the problem of rapid temperature rise in the image acquisition component, which in turn affects the working performance of the camera.

[0036] This embodiment provides a housing for a camera, such as Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown in , the housing includes a first shell 1, a second shell 2, a heat insulating ring 3 and a heat insulating plate 4 fixedly installed in one body. The heat insulating ring 3 is arranged between the first shell 1 and the second shell 2 to separate the two, and the heat insulating ring 3 cooperates with the first shell 1 and the second shell 2 to form an installation space. The heat insulating plate 4 is arranged in the installation space and divides the installation space into a first cavity 5 and a second cavity 6. The first cavity 5 is used to install the image acquisition component of the camera, and the second cavity 6 is used to install the main board 9 of the camera. The heat insulating plate 4 is also provided with a wiring hole 40 that connects the first cavity 5 with the second cavity 6.

[0037] The solutions in the related art either consider reducing the heat generation or improving the heat dissipation (cooling) capacity when solving the above-mentioned problems. However, the present application, without changing the existing natural heat dissipation through the outer shell and the outside world, sets a heat insulation ring 3 and a heat insulation plate 4. On the one hand, the heat insulation ring 3 is used to separate the first shell 1 from the second shell 2, thereby reducing the heat conduction efficiency between the first shell 1 and the second shell 2; on the other hand, the heat insulation plate 4 is used to separate the installation space inside the outer shell into the first cavity 5 and the second cavity 6, thereby reducing the heat convection efficiency between the first cavity 5 and the second cavity 6. In this way, the heat generated by the mainboard 9 can be significantly reduced from being transferred to the image acquisition component, thereby reducing the temperature rise of the image acquisition component and reducing the impact on the working performance of the camera.

[0038] This embodiment also shows a camera using the housing provided by the present application, which includes an image acquisition component and a mainboard 9, wherein the image acquisition component is arranged in the first cavity 5, the mainboard 9 is arranged in the second cavity 6, and the image acquisition component and the mainboard 9 are electrically connected by a cable passing through the wiring hole 40. Specifically in this embodiment, the image acquisition component includes a laser module 7 and a lens module 8, and a light exit hole 13 corresponding to the laser module 7 and a light-collecting hole 14 corresponding to the lens module 8 are also arranged on the first housing. During the operation of the camera, the mainboard 9 and the image acquisition component located in the housing will generate heat, and the heat emitted by the mainboard 9 can be thermally conducted to the first housing 1, and then dissipated by thermal convection with the outside through the first housing 1. The heat emitted by the image acquisition component can be thermally conducted to the second housing 2, and then dissipated by thermal convection with the outside through the second housing 2. Due to the effects of the heat insulation ring 3 and the heat insulation board 4, only a very small part of the heat emitted by the mainboard 9 can be transferred to the image acquisition component along the first housing 1, the heat insulation ring 3, and the second housing 2 by heat conduction. This can reduce the heat generated by the mainboard 9 from being transferred to the image acquisition component, thereby reducing the temperature rise of the image acquisition component and reducing the impact on the camera's working performance. Fig.10 As shown in the figure, in this embodiment, a thermal pad 15 is further provided between the mainboard 9 and the inner wall of the first shell 1, so that the heat generated by the mainboard 9 can be quickly transferred to the first shell 1 by heat conduction, thereby accelerating the heat transfer to the outside.

[0039] In order to improve the heat dissipation efficiency of the first shell 1 and the second shell 2 in heat convection with the outside world, the first shell 1 and the second shell 2 in this embodiment are both made of metal material, specifically, both are made of aluminum alloy. Of course, aluminum material, stainless steel material, tempered glass material, ceramic material, plastic material, etc. can also be used. A heat dissipation fin structure can also be set on the outside of the first shell and the second shell. The insulation ring 3 and the insulation board 4 are both made of plastic material, especially polystyrene board, polyurethane foam board, extruded polystyrene foam board and other plastic materials with good heat insulation ability. In some other optional implementations, insulation materials such as glass fiber, asbestos, vacuum board, aerogel pad, etc. can also be selected.

[0040] like Figure 2As shown in, as mentioned above, in order to realize the electrical connection between the image acquisition component located in the first chamber and the main board 9 located in the second chamber, a wiring hole 40 is also provided on the heat insulation board 4 in this embodiment, so that a cable can be passed through the wiring port, and the image acquisition component is electrically connected to the main board 9 through the cable, so as to realize the signal control and data transmission between the main board 9 and the image acquisition component. Since it is necessary to electrically connect the main board 9 to the laser module 7 and the lens module 8 respectively, two rectangular wiring holes 40 are provided in this embodiment. In order to prevent the heat generated by the main board 9 from being transferred to the second chamber through the wiring holes 40 by heat convection, the housing provided in this embodiment also includes an elastic heat insulating member 41 provided at the wiring hole 40, and the elastic heat insulating member 41 is used to close the wiring hole 40. Specifically, the elastic heat insulating member 41 in this embodiment is a heat insulating foam. In other optional embodiments, glass wool, aerogel pads, etc. can also be selected as elastic heat insulating members.

[0041] like Figure 2 As shown in , in this embodiment, a first sealing ring 12 is sandwiched between the insulation ring 3 and the first shell 1, and a second sealing ring 23 is sandwiched between the insulation ring 3 and the second shell 2. Specifically, the first shell 1 in this embodiment includes a first bottom wall 10 and a first side wall 11 arranged around the first bottom wall 10, and the second shell 2 includes a second bottom wall 20 and a second side wall 21 arranged around the second bottom wall 20. Sealing grooves are respectively arranged on the end surface of the first side wall 11 and the end surface of the second side wall 21, and the first sealing ring 12 and the second sealing ring 23 are respectively arranged in the corresponding sealing grooves, and then the first sealing ring 12 and the second sealing ring 23 are clamped by the fixed connection between the first shell 1 and the second shell 2. By providing the first sealing ring 12 and the second sealing ring 23, the camera can have good dustproof and waterproof effects. In addition, the first sealing ring 12 and the second sealing ring 23 are both made of rubber material, and the thermal conductivity of the rubber material is low, which can cooperate with the insulation ring 3 to play a good insulation effect between the first shell 1 and the second shell 2.

[0042] Furthermore, in addition to solving the problem that the temperature rise affects the working performance of the camera, the housing provided in this embodiment also designs the overall structure of the housing from the perspective of easy assembly. Figure 2 and Figure 4As shown in , in this embodiment, the first bottom wall 10 and the first side wall 11 in the first shell 1 cooperate to form a concave cavity with an opening, the heat insulation board 4 is located in the concave cavity and is arranged close to the opening, and the heat insulation board 4 cooperates with the first bottom wall 10 and the first side wall 11 to form a first cavity 5. That is, taking the placement method in which the first shell 1 is located at the bottom and the second shell 2 is located at the top as an example, the heat insulation board 4 in this embodiment is located below the heat insulation ring 3. In this way, the portion of the first side wall 11 that is higher than the heat insulation board 4 cooperates with the heat insulation board 4, the heat insulation ring 3 and the second shell 2 to form the aforementioned second cavity 6. Combined with Figure 5 As shown in the figure, the above-mentioned design scheme is adopted, which makes it convenient to set a connection structure for connecting with the insulation board 4, the main board 9, the insulation ring 3, the first shell 1, etc. on the first shell 1, and makes it convenient to assemble the insulation board 4, the main board 9, the insulation ring 3, the first shell 1, etc. one by one on the first shell 1 from bottom to top.

[0043] Combination Figure 2 , Figure 3 , Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown in , in order to realize the assembly of the heat insulation board 4, in this embodiment, a first mounting protrusion 110 is formed on the first side wall 11, and the first mounting protrusion 110 has a first assembly surface. The heat insulation board 4 is arranged in contact with the first assembly surface and is fixedly connected to the first mounting protrusion 110. Specifically in this embodiment, a threaded hole is provided on the first mounting protrusion 110, and a through hole is provided on the heat insulation board 4. A screw is passed through the through hole on the heat insulation board 4 and then screwed into the threaded hole on the first mounting protrusion 110, so that the heat insulation board 4 can be fixedly installed on the first mounting protrusion 110. In order to facilitate the distinction between the screws used at different installation positions, in this embodiment, the screw used to install the heat insulation board 4 is referred to as the first screw 42, that is, the heat insulation board 4 is locked and fixed to the first mounting protrusion 110 using the first screw 42.

[0044] In order to realize the assembly of the mainboard 9, in this embodiment, a second mounting protrusion 111 is formed on the first side wall 11, and the housing further comprises a support column 112 detachably mounted on the second mounting protrusion 111, the end surface of the support column 112 forms a second assembly surface for mounting the mainboard 9, and the support column 112 is provided with a threaded hole for cooperating with a screw, so that the mainboard 9 is mounted on the support column 112 by means of a screw (not shown in the figure) passing through the mainboard 9. In order to facilitate the assembly operation, in this embodiment, the support column 112 and the second mounting protrusion 111 are designed separately, and after the assembly of the heat insulation board 4 is completed, the support column 112 is fixedly mounted on the second mounting protrusion 111, and then the mainboard 9 is assembled. Specifically, the threaded hole is provided at one end of the support column 112, and a flange for connecting to the second mounting protrusion 111 is formed at the other end of the support column 112, and a through hole is provided on the flange. The support column 112 can be fixedly installed on the second mounting protrusion 111 by using the second screw 1120 to pass through the through hole on the flange and tighten it into the threaded hole on the second mounting protrusion 111.

[0045] The first assembly surface, the second assembly surface, and the third assembly surface 100 and the fourth assembly surface 101 described here all refer to high-precision assembly surfaces with high flatness. By setting high-precision assembly surfaces, assembly reliability and assembly accuracy can be guaranteed. Among them, the third assembly surface 100 and the fourth assembly surface 101 are arranged at the bottom of the first bottom wall 10, and a groove structure or a protrusion structure is arranged on the first bottom wall 10, and the third assembly surface 100 and the fourth assembly surface 101 are formed on the bottom wall of the groove structure or the end face of the protrusion structure. The third assembly surface 100 is used to install the laser module 7, and the fourth assembly surface 101 is used to assemble the lens module 8.

[0046] Furthermore, in order to meet the conductive requirements of electromagnetic compatibility (EMC), in this embodiment, the support column 112 is configured to be electrically connected to the first housing 1. Specifically, in this embodiment, the first housing 1 and the support column 112 are both made of conductive metal materials. In this way, the mainboard 9 placed on the support column 112 can achieve EMC conduction with the laser module 7 and the lens module 8 through the support column 112 and the first housing 1, meet the overall electromagnetic compatibility requirements of the camera, and improve the camera's anti-electromagnetic interference capability.

[0047] Since the contact area between the support column 112 and the mainboard 9 is small, and the contact position between the support column 112 and the mainboard 9 can be designed to be in an area on the mainboard 9 where less heat is generated, the heat transferred from the support column 112 to the first shell 1 is within an acceptable range. Of course, in some optional embodiments, it is also possible to choose to use a material with heat insulation properties to make the support column, such as using plastic to make the support column. Then, a through threaded hole is opened on the support column, and a conductive film is coated in the threaded hole, so that the mainboard can achieve electrical conduction with the support column through a screw that passes through the mainboard and is tightened in the threaded hole on the support column, and at the same time, the heat transferred from the support column to the first shell can be reduced.

[0048] Combination Figure 2 , Figure 3 , Figure 5 , Figure 8 and Fig. 9 As shown in , in order to realize the assembly of the heat insulation ring 3, in this embodiment, a connecting column 113 is formed on the end surface of the first side wall 11, a threaded hole is provided on the connecting column 113, and the heat insulation ring 3 is provided with a first connecting hole 30 adapted to the connecting column 113, and the connecting column 113 penetrates the first connecting hole 30. A second connecting hole 22 coaxial with the first connecting hole 30 is provided in the second shell 2, and the second shell 2 and the heat insulation ring 3 are fixedly installed on the first shell 1 by a third screw 24 penetrating the second connecting hole 22 and tightened in the threaded hole.

[0049] Furthermore, when placing the heat insulating ring 3, the connecting column 113 can be used to cooperate with the first connecting hole 30 to achieve preliminary positioning of the heat insulating ring 3, but when placing the second shell 2, it is difficult to rely on the connecting column 113 to achieve positioning. Therefore, in this embodiment, the end surface of the first side wall 11 is also formed with a positioning column 114, the length of the positioning column 114 is greater than the length of the connecting column 113, the heat insulating ring 3 is provided with a positioning hole 31 adapted to the positioning column 114, and the second shell 2 is provided with a positioning groove adapted to the positioning column 114, and the positioning column 114 passes through the positioning hole 31 and extends into the positioning groove. After such a setting, the second shell 2 can achieve preliminary positioning through the positioning column 114 passing through the positioning hole 31, which is convenient for assembly operation.

[0050] The assembly process of the camera using the housing provided in this embodiment is described as follows: First, the laser module 7 and the lens module 8 are respectively mounted on the third assembly surface 100 and the fourth assembly surface 101 on the first bottom wall 10. Secondly, the heat insulation board 4 is placed on the first assembly surface and mounted on the first mounting protrusion 110 by the first screw 42. While assembling the heat insulation board 4, the FPC cables on the laser module 7 and the lens module 8 are respectively passed through the wiring holes 40 provided on the heat insulation board 4, and the wiring holes 40 are blocked with heat insulation foam after threading. After that, the first sealing ring 12 and the support column 112 are assembled, the first sealing ring 12 is placed in the sealing groove on the first side wall 11, and the support column 112 is locked and fixed on the second mounting protrusion 111 by the second screw 1120. Then, the main board 9 is placed on the second assembly surface on the support column 112, and the main board 9 is locked and fixed on the support column 112 by screws. Then assemble the heat-insulating ring 3, align the first through-hole on the heat-insulating ring 3 with the connecting column 113 on the first side wall 11, and align the positioning hole 31 on the heat-insulating ring 3 with the positioning column 114 on the first side wall 11, and place the heat-insulating ring 3 on the end face of the first side wall 11. Then place the second sealing ring 12 in the sealing groove on the second side wall 21, and align the positioning groove on the second housing 2 with the positioning column 114 that passes through the positioning hole 31, and place the second housing 2 on the heat-insulating ring 3. Finally, use five third screws 24 to penetrate into the second through-holes and tighten them into the threaded holes on the connecting column 113 to complete the assembly of the camera.

[0051] As mentioned above, in this embodiment, the second shell 2 includes a second bottom wall 20 and a second side wall 21 arranged around the second bottom wall 20, and the heat-insulating ring 3 is sandwiched between the end face of the first side wall 11 and the end face of the second side wall 21. In an optional embodiment, the second shell can also be designed as a flat plate structure, and accordingly, the heat-insulating ring is sandwiched between the end face of the first side wall and the flat plate. In this solution, the thickness of the heat-insulating ring needs to be increased so that a second cavity with a size sufficient to meet the requirements can be constructed.

[0052] In addition, if Figure 4 As shown in the figure, in this embodiment, the heat insulation board 4 is arranged below the heat insulation ring 3, and the heat insulation ring 3 is installed on the first side wall 11 of the first shell 1. In an optional embodiment, the heat insulation board can also be arranged above the heat insulation ring, or the heat insulation board can also be arranged within the inner ring of the heat insulation ring. It is also possible to set a mounting structure for assembling the heat insulation board and the main board on the heat insulation ring or the second shell, and adjust the overall size of the shell accordingly.

[0053] The above are only specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Those skilled in the art should understand that the present application includes but is not limited to the contents described in the drawings and the above specific embodiments. Any modification that does not deviate from the functional and structural principles of the present application will be included in the scope of the claims.

Claims

1. A housing for a camera, characterized in that: The invention comprises a first shell (1), a second shell (2), a heat-insulating ring (3) and a heat-insulating plate (4) which are fixedly mounted in one body, the heat-insulating ring (3) being arranged between the first shell (1) and the second shell (2) to separate the two, and the heat-insulating ring (3) cooperates with the first shell (1) and the second shell (2) to form an installation space; The heat insulation board (4) is arranged in the installation space and divides the installation space into a first cavity (5) and a second cavity (6); the first cavity (5) is used to install an image acquisition component of the camera, and the second cavity (6) is used to install a mainboard of the camera; and the heat insulation board (4) is also provided with a wiring hole (40) for connecting the first cavity (5) and the second cavity (6).

2. The housing according to claim 1, wherein: The first shell (1) comprises a first bottom wall (10) and a first side wall (11) arranged around the first bottom wall (10); the first bottom wall (10) and the first side wall (11) cooperate to form a concave cavity with an opening; the heat insulation board (4) is located in the concave cavity and is arranged close to the opening; the heat insulation board (4) cooperates with the first bottom wall (10) and the first side wall (11) to form the first cavity (5).

3. The housing according to claim 2, characterized in that The first side wall (11) is formed with a first mounting protrusion (110), the first mounting protrusion (110) having a first assembly surface, and the heat insulation board (4) is arranged in contact with the first assembly surface and is fixedly connected to the first mounting protrusion (110).

4. The housing according to claim 2, characterized in that The first side wall (11) is formed with a second mounting protrusion (111), and the housing further comprises a support column (112) detachably mounted on the second mounting protrusion (111), an end surface of the support column (112) forming a second assembly surface for mounting a mainboard, and the support column (112) is provided with a threaded hole for cooperating with a screw, so that the mainboard can be mounted on the support column (112) by means of a screw passing through the mainboard.

5. The housing according to claim 4, characterized in that The support column (112) is configured to be electrically connected to the first shell (1).

6. The housing according to claim 2, wherein: A connecting column (113) is formed on the end surface of the first side wall (11), the connecting column (113) is provided with a threaded hole, the heat insulation ring (3) is provided with a first connecting hole (30) adapted to the connecting column (113), and the connecting column (113) penetrates into the first connecting hole (30); The second shell (2) is provided with a second connecting hole (22) coaxial with the first connecting hole (30), and the second shell (2) and the heat insulating ring (3) are fixedly mounted on the first shell (1) by means of screws which penetrate into the second connecting hole (22) and are screwed into the threaded hole.

7. The housing according to claim 6, characterized in that A positioning column (114) is also formed on the end surface of the first side wall (11), and the length of the positioning column (114) is greater than the length of the connecting column (113). The heat insulating ring (3) is provided with a positioning hole (31) adapted to the positioning column (114), and the second shell (2) is provided with a positioning groove adapted to the positioning column (114). The positioning column (114) passes through the positioning hole (31) and extends into the positioning groove.

8. The housing according to any one of claims 2 to 7, characterized in that The second shell (2) comprises a second bottom wall (20) and a second side wall (21) arranged around the second bottom wall (20), and the heat insulation ring (3) is sandwiched between the end surface of the first side wall (11) and the end surface of the second side wall (21); Alternatively, the second shell (2) is a flat plate, and the heat insulating ring (3) is sandwiched between the end surface of the first side wall (11) and the flat plate.

9. The housing according to any one of claims 1 to 7, characterized in that The housing further comprises an elastic heat insulating member (41) arranged at the wiring hole (40), and the elastic heat insulating member (41) is used to close the wiring hole (40).

10. The housing according to any one of claims 1 to 7, characterized in that The first shell (1) and the second shell (2) are both made of metal, and the heat insulation ring (3) and the heat insulation plate (4) are both made of plastic.

11. The housing according to any one of claims 1 to 7, characterized in that A first sealing ring (12) is sandwiched between the thermal insulation ring (3) and the first shell (1), and a second sealing ring (23) is sandwiched between the thermal insulation ring (3) and the second shell (2).

12. A camera, comprising an image acquisition component and a main board (9), characterized in that: The camera further comprises a housing as claimed in any one of claims 1 to 11, the image acquisition component is arranged in the first cavity (5), the main board (9) is arranged in the second cavity (6), and the image acquisition component and the main board (9) are electrically connected via a cable passing through the wiring hole (40).