LED packaging structure
By designing an LED packaging structure that includes a heat dissipation connection and an external connection, the shortcomings in the heat dissipation efficiency and installation methods of the traditional LED packaging structure are solved, and more efficient heat dissipation and a simpler installation process are achieved.
Patent Information
- Application Number
- CN202323480115.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-19
- Publication Date
- 2025-03-04
- Estimated Expiration
- 2033-12-19
AI Technical Summary
The traditional LED packaging structure has shortcomings in heat dissipation efficiency and installation methods, making it difficult to effectively maintain the heat dissipation performance of the LED chip, and the installation process is complicated.
An LED package structure including a mounting plate, an outer frame, a conductor, a mounting base, an LED chip, a heat dissipation connection part and an outer connection part is designed. The heat dissipation connection section realizes effective heat dissipation through the combination of welding layer, through cavity, thermal conduction layer and heat dissipation hole; the outer connection section simplifies the installation process through the combination of inner card layer, photocoat and limiting layer.
The LED package structure has a good heat dissipation structure in the mount, which improves the heat dissipation efficiency of the LED chip, and achieves better practical effects through simple installation methods.
Smart Images
Figure CN222564274U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of LED packaging structures, in particular to an LED packaging structure. Background Art
[0002] LED is a semiconductor lighting device that can convert electrical energy into visible light. LED lighting is an emerging industry developed in recent years. In recent years, with the decline in manufacturing costs and breakthroughs in technical bottlenecks such as luminous efficiency and light decay, my country's LED lighting industry has entered a rapid development stage and the application market has grown rapidly, which has led to a huge market for LED packaging products. There are many traditional LED packaging structures. Utility Model Content
[0003] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is that the utility model provides an LED packaging structure, including a mounting plate and an outer frame, the outer frame is fixed to the mounting plate, and a packaging mechanism is arranged inside the mounting plate and the outer frame;
[0004] The packaging mechanism includes: a conduction plate, a mounting seat, an LED chip, a heat dissipation connection part and an external connection part;
[0005] The mounting seat is fixed on the surface of the mounting plate, the conductive plate is installed in the mounting seat and the outer frame, the LED chip is installed on the base through the heat dissipation connection part, and the external connection part is arranged on the outer frame.
[0006] Furthermore, the heat dissipation connection part includes: a welding layer, a through cavity, a heat conductive layer and a heat dissipation hole;
[0007] The welding layer is connected between the LED chip and the mounting seat, the through cavity is opened in the mounting seat, the heat conductive layer is installed in the through cavity and fits with the welding layer, and the heat dissipation hole is opened on the bottom surface of the mounting plate.
[0008] Furthermore, the external connection part includes: an inner card layer, a light mask and a limiting layer;
[0009] The inner clamping layer is fixed around the circumscribed inner surface, and the limiting layer is fixed around the outer end surface of the light mask.
[0010] Preferably, the limiting layer is made of rubber.
[0011] Furthermore, an air-insulating cushion layer is installed on the bottom surface of the mounting plate.
[0012] Compared with the prior art, the advantages and positive effects of the present invention are that a good heat dissipation structure is arranged in the mounting base, which can maintain the heat dissipation efficiency of the LED chip, and the installation method is simple and convenient, with good practical effects. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor.
[0014] Figure 1 A schematic diagram of the structure of an LED packaging structure provided in this embodiment;
[0015] Figure 2 A partial enlarged view of a light shield portion of an LED packaging structure provided in this embodiment;
[0016] As shown in the figure: 1. Mounting plate; 2. External frame; 3. Conductive plate; 4. Mounting seat; 5. LED chip; 6. Welding layer; 7. Through cavity; 8. Thermal conductive layer; 9. Heat dissipation hole; 10. Inner card layer; 11. Light mask; 12. Limiting layer; 13. Spacer layer. DETAILED DESCRIPTION
[0017] In order to more clearly understand the above-mentioned purpose, features and advantages of the utility model, the utility model is further described below in conjunction with the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.
[0018] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments of the following disclosure.
[0019] Embodiment, attached by the specification Figure 1-2 It can be seen that the LED packaging structure of this solution includes a mounting plate 1 and an outer frame 2, wherein the outer frame 2 is fixed on the mounting plate 1, and a packaging mechanism is provided inside the mounting plate 1 and the outer frame 2;
[0020] The packaging mechanism includes: a conducting plate 3, a mounting seat 4, an LED chip 5, a heat dissipation connection part and an external connection part;
[0021] The mounting seat 4 is fixed on the surface of the mounting plate 1 , the conductive plate 3 is installed in the mounting seat 4 and the outer frame 2 , the LED chip 5 is installed on the base through the heat dissipation connection part, and the external connection part is arranged on the outer frame 2 .
[0022] The heat dissipation connection part includes: a welding layer 6, a through cavity 7, a heat conducting layer 8 and a heat dissipation hole 9;
[0023] The welding layer 6 is connected between the LED chip 5 and the mounting base 4 , the through cavity 7 is opened in the mounting base 4 , the thermal conductive layer 8 is installed in the through cavity 7 and fits with the welding layer 6 , and the heat dissipation hole 9 is opened on the bottom surface of the mounting board 1 .
[0024] The external connection part includes: an inner card layer 10, a light mask 11 and a limiting layer 12;
[0025] The inner clamping layer 10 is fixed around the circumscribed inner surface, and the limiting layer 12 is fixed around the outer end surface of the light mask 11.
[0026] It can be seen from the above content that the limiting layer 12 is made of rubber material.
[0027] It can be known from the above content that an air-insulating cushion layer 13 is installed on the bottom surface of the installation plate 1 .
[0028] Among them, it is important to point out that in the specific implementation process, the LED chip 5 is fixed on the mounting seat 4 through the welding layer 6 and adhered to the thermal conductive layer 8. The temperature can be dissipated to the bottom cavity 7 and the heat dissipation holes 9 through the thermal conductive layer 8. The air-insulating pad 13 at the bottom of the mounting plate 1 props up the mounting plate 1 to a certain height to facilitate heat dissipation. The light cover 11 can be directly inserted into the outer frame 2 and is limitedly connected to the inner card layer 10 to avoid falling off.
[0029] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.
Claims
1. An LED packaging structure, comprising a mounting plate (1) and an outer frame (2), wherein the outer frame (2) is fixed on the mounting plate (1), characterized in that: The mounting plate (1) and the outer frame (2) are provided with a packaging mechanism; The packaging mechanism comprises: a conduction plate (3), a mounting seat (4), an LED chip (5), a heat dissipation connection part and an external connection part; The mounting seat (4) is fixed on the surface of the mounting plate (1), the conductive plate (3) is mounted on the mounting seat (4) and the outer frame (2), the LED chip (5) is mounted on the mounting seat via the heat dissipation connection portion, and the external connection portion is arranged on the outer frame (2).
2. The LED packaging structure according to claim 1, characterized in that: The heat dissipation connection part comprises: a welding layer (6), a through cavity (7), a heat conduction layer (8) and a heat dissipation hole (9); The welding layer (6) is connected between the LED chip (5) and the mounting seat (4), the through cavity (7) is opened in the mounting seat (4), the heat conductive layer (8) is installed in the through cavity (7) and is in contact with the welding layer (6), and the heat dissipation hole (9) is opened on the bottom surface of the mounting plate (1).
3. The LED packaging structure according to claim 1, characterized in that: The external connection part comprises: an inner card layer (10), a light mask (11) and a limiting layer (12); The inner clamping layer (10) is fixed around the inner surface of the outer frame, and the limiting layer (12) is fixed around the outer end surface of the light mask (11).
4. The LED packaging structure according to claim 3, characterized in that: The limiting layer (12) is made of rubber material.
5. The LED packaging structure according to claim 1, characterized in that: An air-insulating cushion layer (13) is installed on the bottom surface of the installation plate (1).