Bonding jig

Abstract

The utility model provides a bonding jig, and belongs to the technical field of optical communication and integrated circuit packaging. According to the utility model, the bonding carrying strip is fixedly arranged on the bearing platform, the top of the bonding carrying strip is provided with the positioning groove and the two stamping grooves, the two stamping grooves are arranged at the two ends of the positioning groove in the length direction, the positioning groove is communicated with the two stamping grooves, and the depth of the stamping grooves is greater than that of the positioning groove. The pressing blocks and the stamping grooves are arranged in a one-to-one correspondence mode, and the pressing blocks and the stamping grooves are connected in an embedded mode. When the semiconductor module is placed in the positioning groove, the pressing block is embedded with the stamping groove, and the folding parts are arranged at the two ends of the length of the semiconductor module, so that the pressing block presses the folding parts, and the technical problem that the semiconductor module is easy to fall off during bonding in the prior art is solved.

Description

Technical Field

[0001] The utility model belongs to the technical field of optical communication and integrated circuit packaging, and in particular relates to a bonding fixture. Background Art

[0002] The semiconductor module (mounted SUB + chip) is directly bonded first, and then the tube shell is mounted. In the prior art, when the bonding tool is used to install the substrate, the positioning time of the substrate is relatively long, the positioning accuracy is not high, and the installed substrate is prone to tilt, resulting in the phenomenon of desoldering and welding leakage during the welding process. In addition, the vacuum holding substrate structure is prone to leakage due to the uneven back side of the substrate, resulting in unstable holding and energy waste. Utility Model Content

[0003] The embodiment of the utility model provides a bonding jig, aiming to solve the technical problem in the prior art that semiconductor modules are easily dropped off during bonding.

[0004] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is: to provide a bonding jig, including a bearing platform, a bonding carrier bar and a pressure block. The bonding carrier bar is arranged on the top of the bearing platform, the bonding carrier bar is fixedly connected to the bearing platform, the top of the bonding carrier bar is provided with a positioning groove and two stamping grooves, the two stamping grooves are arranged at both ends of the length direction of the positioning groove, the positioning groove is connected with the two stamping grooves, and the depth of the stamping groove is greater than the depth of the positioning groove; the pressure block group includes two pressure blocks, the pressure blocks are arranged one by one with the stamping grooves, and the pressure blocks are embedded and connected with the stamping grooves.

[0005] In a possible implementation, a through hole is formed at the bottom of the stamping groove, and a vent hole is formed at the bottom of the positioning groove.

[0006] In a possible implementation, the pressing block is matched with the stamping groove, and a connecting hole is formed on the pressing block, and the connecting hole is connected with the through hole.

[0007] In a possible implementation, a pressing portion is further provided on the pressing block, the pressing portion is fixedly connected to a side wall of the pressing block, and an upper end surface of the pressing portion is flush with an upper end surface of the pressing block.

[0008] In a possible implementation manner, a side wall of the pressing block close to the positioning groove is arranged at an angle to a central axis of the pressing block.

[0009] In a possible implementation manner, there are a plurality of bonding carrier bars and a plurality of pressing block groups, and the pressing block groups are arranged in a one-to-one correspondence with the bonding carrier bars.

[0010] In a possible implementation manner, the pressing block is connected to the stamping groove via a bolt connection structure.

[0011] In a possible implementation manner, the depth of the positioning groove is smaller than the height of the semiconductor module.

[0012] In a possible implementation, the bonding carrier strip is made of magnetic material.

[0013] In a possible implementation manner, the connecting hole is in the shape of an oblong hole.

[0014] The beneficial effect of the bonding jig provided by the utility model is that: compared with the prior art, the utility model fixes the bonding carrier strip on the carrier platform, and the top of the bonding carrier strip is provided with a positioning groove and two stamping grooves, the two stamping grooves are provided at both ends of the length direction of the positioning portion, the positioning groove is connected with the two stamping grooves, and the depth of the stamping groove is greater than the depth of the positioning groove. The pressing block is provided in a one-to-one correspondence with the stamping groove, and the pressing block is embedded in the stamping groove. When the semiconductor module is placed in the positioning groove, the pressing block is embedded in the stamping groove. Since the semiconductor module itself has folding parts at both ends of its length, the pressing block presses the folding parts, thereby solving the technical problem in the prior art that the semiconductor module is easy to fall off during bonding. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of the structure of a bonding fixture provided in an embodiment of the utility model;

[0016] Figure 2 for Figure 1 A partial enlarged view of the middle A area;

[0017] Description of reference numerals:

[0018] 1. Carrying platform; 2. Bonding carrier strip; 21. Positioning groove; 22. Stamping groove; 24. Ventilation hole;

[0019] 3. Pressing block; 23. Through hole; 31. Connecting hole; 32. Pressing part; 4. Semiconductor module. DETAILED DESCRIPTION

[0020] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0021] It should be further explained that the drawings and implementation modes of the present invention mainly describe the concept of the present invention. On the basis of this concept, some specific forms and settings of connection relationships, positional relationships, power mechanisms, power supply systems, hydraulic systems and control systems may not be fully described. However, on the premise that those skilled in the art understand the concept of the present invention, those skilled in the art can implement the above-mentioned specific forms and settings in a well-known manner.

[0022] When an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or indirectly connected to the other element.

[0023] The directions or positional relationships indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0024] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, "multiple" means two or more, and "several" means one or more, unless otherwise clearly and specifically defined.

[0025] The bonding jig provided by the utility model is now disclosed.

[0026] Please also read Figure 1 and Figure 2 The bonding jig includes a carrier platform 1, a bonding carrier bar 2 and a pressure block. The bonding carrier bar 2 is arranged on the top of the carrier platform 1, and the bonding carrier bar 2 is fixedly connected to the carrier platform 1. The top of the bonding carrier bar 2 is provided with a positioning groove 21 and two punching grooves 22. The two punching grooves 22 are arranged at both ends of the length direction of the positioning groove 21. The positioning groove 21 is connected with the two punching grooves 22, and the depth of the punching groove 22 is greater than the depth of the positioning groove 21; the pressure block group includes two pressure blocks 3, and the pressure blocks 3 are arranged one by one with the punching grooves 22, and the pressure blocks 3 are embedded and connected with the punching grooves 22.

[0027] Compared with the prior art, the bonding jig provided by the utility model is that a bonding carrier strip 2 is fixedly arranged on a carrier platform 1, and a positioning groove 21 and two punching grooves 22 are arranged on the top of the bonding carrier strip 2. The two punching grooves 22 are arranged at both ends of the length direction of the positioning portion. The positioning groove 21 is connected with the two punching grooves 22, and the depth of the punching groove 22 is greater than the depth of the positioning groove 21. The pressing block 3 is arranged in a one-to-one correspondence with the punching groove 22, and the pressing block 3 is embedded and connected with the punching groove 22. When the semiconductor module 4 is placed in the positioning groove 21, the pressing block 3 is embedded with the punching groove 22. Since the semiconductor module 4 itself has folding parts at both ends of its length, the pressing block 3 presses the folding parts, thereby solving the technical problem in the prior art that the semiconductor module 4 is easy to fall off during bonding.

[0028] In the above embodiment, a through hole 23 is provided at the bottom of the stamping groove 22, and an air hole 24 is provided at the bottom of the positioning groove 21. By providing the through hole 23 at the bottom of the stamping groove 22, the problem that the gas between the pressing block 3 and the stamping groove 22 cannot be discharged in time during the stamping process, which affects the stamping effect, is solved. At the same time, the air hole 24 is provided at the bottom of the positioning groove 21 to facilitate the discharge of gas between the positioning groove 21 and the semiconductor module 4, thereby improving the bonding quality between the positioning groove 21 and the semiconductor module 4.

[0029] Specifically, the punching groove 22 is a rectangular groove, which facilitates the processing and manufacturing of the punching groove 22 .

[0030] Furthermore, the pressing block 3 is adapted to the punching groove 22 , and a connecting hole 31 is provided on the pressing block 3 , and the connecting hole 31 is connected to the through hole 23 , so that the air can be discharged quickly and conveniently.

[0031] Furthermore, a clamping portion 32 is provided on the pressing block 3, and the clamping portion 32 is fixedly connected to the side wall of the pressing block 3; and the upper end surface of the clamping portion 32 is flush with the upper end surface of the pressing block 3. The setting of the clamping portion 32 can enable the folding portions at both ends of the semiconductor module 4 to be folded quickly, thereby improving the bonding efficiency and quality.

[0032] Based on the above embodiment, the side wall of the pressing block 3 close to the positioning groove 21 is set at an angle to the central axis of the pressing block 3, and the side surface of the pressing block 3 is set at an angle to the central axis, which facilitates the insertion and separation of the pressing block 3 and the positioning groove 21.

[0033] Furthermore, there are multiple bonding carriers 2 and multiple pressing block groups, and the pressing block groups are arranged in a one-to-one correspondence with the bonding carriers 2. Multiple bonding carriers 2 and multiple pressing block groups are provided, which improves the bonding efficiency of the semiconductor module 4.

[0034] As another embodiment of the present invention, the pressing block 3 is connected to the stamping groove 22 via a bolt connection structure; the pressing block 3 is connected to the stamping groove 22 via a bolt connection structure, which facilitates the disassembly and replacement of the semiconductor module 4 at a later stage.

[0035] Furthermore, the depth of the positioning groove 21 is smaller than the height of the semiconductor module 4, which facilitates the placement of the semiconductor.

[0036] Furthermore, the bonding carrier 2 is made of magnetic material, which further improves the connection strength between the semiconductor module 4 and the bonding carrier 2 .

[0037] In terms of material and structure, magnetic materials are divided into two categories: metal and alloy magnetic materials and ferrite magnetic materials. Ferrite magnetic materials are further divided into polycrystalline structure and single crystal structure materials.

[0038] In terms of application functions, magnetic materials are divided into permanent magnetic materials, soft magnetic materials, magnetic recording-torque magnetic materials, gyromagnetic materials, etc. Soft magnetic materials, permanent magnetic materials, and magnetic recording-torque magnetic materials include both metal materials and ferrite materials; while gyromagnetic materials and high-frequency soft magnetic materials can only be ferrite materials, because metals will produce huge eddy current effects at high frequencies and microwave frequencies, making metal magnetic materials unusable, while ferrites have very high resistivity, which will effectively overcome this problem and be widely used.

[0039] Magnetic materials are classified into powder materials, liquid materials, block materials, thin film materials, etc. in terms of form. Magnetic materials are widely used in electroacoustics, telecommunications, electric meters, motors, memory elements, microwave elements, etc. They can be used in magnetic tapes that record language, music, and image information, magnetic storage devices for computers, passenger vouchers, and magnetic cards for fare settlement, etc.

[0040] Specifically, the connecting hole 31 is in the shape of an oblong hole, which is convenient for later hole position adjustment.

[0041] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A bonding fixture, characterized in that: include: A carrying platform (1); A bonding carrier bar (2) is arranged on the top of the carrier platform (1), the bonding carrier bar (2) is fixedly connected to the carrier platform (1), a positioning groove (21) and two punching grooves (22) are arranged on the top of the bonding carrier bar (2), the two punching grooves (22) are arranged at both ends of the positioning groove (21) in the length direction, the positioning groove (21) is connected to the two punching grooves (22), and the depth of the punching groove (22) is greater than the depth of the positioning groove (21); The pressing block group comprises two pressing blocks (3), wherein the pressing blocks (3) and the punching grooves (22) are arranged in a one-to-one correspondence, and the pressing blocks (3) and the punching grooves (22) are embedded and connected.

2. The bonding jig according to claim 1, characterized in that: A through hole (23) is provided at the bottom of the punching groove (22), and a vent hole (24) is provided at the bottom of the positioning groove (21).

3. The bonding jig according to claim 2, characterized in that: The pressing block (3) is adapted to the punching groove (22), and a connecting hole (31) is provided on the pressing block (3), wherein the connecting hole (31) is communicated with the through hole (23).

4. The bonding jig according to claim 3, characterized in that: The pressing block (3) is also provided with a pressing portion (32), the pressing portion (32) is fixedly connected to the side wall of the pressing block (3), and the upper end surface of the pressing portion (32) is flush with the upper end surface of the pressing block (3).

5. The bonding jig according to claim 4, characterized in that: The side wall of the pressing block (3) close to the positioning groove (21) is arranged at an angle with the central axis of the pressing block (3).

6. The bonding jig according to claim 5, characterized in that: There are a plurality of the bonding carrier strips (2) and the pressing block groups, and the pressing block groups are arranged in a one-to-one correspondence with the bonding carrier strips (2).

7. The bonding jig according to claim 6, characterized in that: The pressing block (3) is connected to the stamping groove (22) via a bolt connection structure.

8. The bonding jig according to claim 7, characterized in that: The depth of the positioning groove (21) is smaller than the height of the semiconductor module (4).

9. The bonding jig according to any one of claims 1 to 8, characterized in that: The bonding carrier strip (2) is made of magnetic material.

10. The bonding jig according to claim 3, characterized in that: The connecting hole (31) is in the shape of an oblong hole.

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