Multilayer circuit board capable of being spliced and stacked
By designing locating parts, slots, and blocks on the multi-layer circuit board, the rapid splicing between the lower PCB board and the upper PCB board is achieved, solving the problem of complex welding connections in existing ways, and improving the splicing efficiency and heat dissipation effect.
Patent Information
- Application Number
- CN202420914628.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-29
- Publication Date
- 2025-03-07
- Estimated Expiration
- 2034-04-29
AI Technical Summary
The existing splicable PCB circuit boards have complex welding connection methods and troublesome operation, which reduces work efficiency.
A multi-layer circuit board that can be spliced and stacked is designed. Through the coordination of positioning parts, slots, clamping blocks, rotating arms, grooves, positioning columns, and springs, the rapid splicing between the lower PCB board and the upper PCB board is achieved.
It realizes rapid docking of upper and lower PCB boards, fast splicing speed, simple and solid structure, and ensures heat dissipation of upper and lower PCB boards without accumulation of heat.
Smart Images

Figure CN222582645U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit boards, in particular to a multi-layer circuit board that can be spliced and stacked. Background Art
[0002] Printed circuit board (PCB), also known as printed circuit board, is the provider of electrical connections for electronic components. It has a history of more than 100 years; its design is mainly layout design; the main advantage of using circuit boards is that it greatly reduces wiring and assembly errors, improves the level of automation and production labor rate. According to the number of layers of the circuit board, it can be divided into single-sided board, double-sided board, four-layer board, six-layer board and other multi-layer boards.
[0003] Although existing PCB circuit boards that can be spliced can be spliced, they are usually connected by welding, which has many welding points and a complex structure. The operation is troublesome during splicing, which is inconvenient to use and reduces work efficiency. Utility Model Content
[0004] The purpose of the present invention is to solve at least one of the above technical deficiencies.
[0005] To this end, one purpose of the present invention is to provide a multi-layer circuit board that can be spliced and stacked to solve the problems mentioned in the background technology and overcome the shortcomings of the prior art.
[0006] In order to achieve the above-mentioned purpose, an embodiment of one aspect of the utility model provides a multi-layer circuit board that can be spliced and stacked, including a lower PCB board and a positioning piece, wherein the positioning piece is fixedly connected to several points on the top surface of the lower PCB board, and a card slot is opened on the inner side of the positioning piece;
[0007] A card block is clamped on the inner side of the card slot, and the bottom end of the card block abuts against the top surface of the lower PCB board;
[0008] A rotating arm is fixedly connected to the side of the clamping block, and a groove is formed in the middle of the rotating arm;
[0009] The top of the rotating arm is movably connected to an upper PCB board, and the interior of the upper PCB board is movably connected to a positioning column, the end of the positioning column is a hemispherical surface, and the end of the positioning column protrudes from the side of the upper PCB board;
[0010] The ends of the positioning column abut against the two sides of the rotating arm, and a spring is fixedly connected between the end of the positioning column and the inside of the upper PCB board.
[0011] Preferably, according to any of the above solutions, the lower PCB board is located below the upper PCB board, and the lower PCB board is parallel to the upper PCB board.
[0012] Adopting the above technical solution: The core of this application is the stacking of multi-layer circuit boards, with the upper PCB board stacked on top of the lower PCB board. It can accommodate more circuit components, provide stronger integration and functional scalability, and make fuller use of the internal space of the device.
[0013] Preferably, any of the above solutions has at least four positioning members, and the four positioning members are symmetrically distributed with respect to the middle surface of the upper PCB board.
[0014] The above technical solution is adopted: the core structure of the device is: positioning piece, card slot, card block, rotating arm, groove, positioning column, spring. The core advantages of the device are: the lower PCB board and the upper PCB board can be quickly spliced, the splicing structure is simple, and the splicing is convenient. The positioning piece is installed at the gap on the top surface of the lower PCB board. Before the upper PCB board is connected with the lower PCB board downward, the rotating arm is rotated to adjust the rotating arm to a state perpendicular to the upper PCB board. Under the action of the spring, the end of the positioning column protrudes from the side of the upper PCB board. The end of the positioning column limits the posture of the rotating arm from both sides. The rotating arm is bent at the groove so that the card block is inserted into the card slot. After the four card blocks are inserted, the upper PCB board and the lower PCB board are connected, and then the two are connected by cables and connectors. Such a structural design enables the upper and lower PCB boards to be quickly connected within a dozen seconds. The connection speed is fast, the structure is simple, and the structure is relatively strong. At the same time, a gap is reserved between the upper and lower PCB boards to ensure the heat dissipation of the upper and lower PCB boards without heat accumulation.
[0015] Preferably, any of the above solutions has the bottom of the card slot extending to the top surface of the lower PCB board, and the positioning piece is bonded to the lower PCB board by adhesive.
[0016] Preferably, in any of the above schemes, the cross-sectional shape of the card slot is trapezoidal, and the shape of the card block is matched with the shape of the card slot.
[0017] Preferably, any of the above solutions is that the material of the rotating arm and the clamping block is plastic, and the rotating arm is movably connected to the upper PCB board via a rotating shaft.
[0018] Preferably, in any of the above solutions, the positioning column limits the rotating arm from two sides.
[0019] Compared with the prior art, the advantages and beneficial effects of the utility model are:
[0020] The multi-layer circuit board that can be spliced and stacked can quickly splice the lower PCB board and the upper PCB board through the coordinated arrangement of the positioning piece, the card slot, the card block, the rotating arm, the groove, the positioning column, and the spring. The splicing structure is simple and the splicing is convenient. The positioning piece is installed at the gap on the top surface of the lower PCB board. Before the upper PCB board is lowered to dock with the lower PCB board, the rotating arm is rotated to adjust the rotating arm to a state perpendicular to the upper PCB board. Under the action of the spring, the end of the positioning column protrudes from the side of the upper PCB board. The end of the positioning column limits the posture of the rotating arm from both sides. The rotating arm is bent at the groove so that the card block is stuck in the card slot. After the four card blocks are all stuck, the upper PCB board is docked with the lower PCB board, and then the two are connected by using cables and connectors. Such a structural design enables the upper and lower PCB boards to be quickly docked within a dozen seconds. The docking speed is fast, the structure is simple, and the structure is relatively firm.
[0021] At the same time, a gap is reserved between the upper and lower PCB boards to ensure heat dissipation and prevent heat accumulation.
[0022] Additional aspects and advantages of the present invention will be given in part in the following description and in part will become apparent from the following description or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:
[0024] Figure 1 It is a structural schematic diagram of the utility model from the first perspective;
[0025] Figure 2 It is a structural schematic diagram of the utility model from a second viewing angle;
[0026] Figure 3 It is a schematic diagram of the top view structure of the utility model;
[0027] Figure 4 It is a partial cross-sectional structural schematic diagram of the positioning column of the utility model;
[0028] Figure 5 For this utility model Figure 1 Schematic diagram of the enlarged structure at point A in the middle.
[0029] In the figure: 1-lower PCB board, 2-positioning piece, 3-card slot, 4-card block, 5-rotating arm, 6-groove, 7-upper PCB board, 8-positioning column, 9-spring. DETAILED DESCRIPTION
[0030] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.
[0031] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0032] like Figure 1-5 As shown, the multi-layer circuit board that can be spliced and stacked comprises a lower PCB board 1 and a positioning member 2. The positioning members 2 are fixedly connected to several points on the top surface of the lower PCB board 1, and a card slot 3 is provided on the inner side of the positioning member 2;
[0033] A card block 4 is clamped inside the card slot 3, and the bottom end of the card block 4 abuts against the top surface of the lower PCB board 1;
[0034] A rotating arm 5 is fixedly connected to the side of the clamping block 4, and a groove 6 is formed in the middle of the rotating arm 5;
[0035] The top of the rotating arm 5 is movably connected to the upper PCB board 7, and the interior of the upper PCB board 7 is movably connected to a positioning column 8, the end of the positioning column 8 is a hemispherical surface, and the end of the positioning column 8 protrudes from the side of the upper PCB board 7;
[0036] The ends of the positioning column 8 abut against the two sides of the rotating arm 5 , and a spring 9 is fixedly connected between the end of the positioning column 8 and the inside of the upper PCB board 7 .
[0037] Embodiment 1: The lower PCB board 1 is located below the upper PCB board 7, and the lower PCB board 1 is parallel to the upper PCB board 7. The core of this application is the splicing and stacking of multi-layer circuit boards, and the upper PCB board 7 is stacked above the lower PCB board 1. It can accommodate more circuit components, provide stronger integration and functional expansibility, and make fuller use of the internal space of the device.
[0038] Embodiment 2: The number of positioning members 2 is at least four, and the four positioning members 2 are symmetrically distributed about the middle surface of the upper PCB board 7. The bottom of the card slot 3 extends to the top surface of the lower PCB board 1, and the positioning member 2 is bonded to the lower PCB board by adhesive. The cross-sectional shape of the card slot 3 is trapezoidal, and the shape of the card block 4 is adapted to the shape of the card slot 3. The material of the rotating arm 5 and the card block 4 is plastic, and the rotating arm 5 is movably connected to the upper PCB board 7 through a rotating shaft. The positioning column 8 limits the rotating arm 5 from both sides.
[0039] The working principle of the utility model is as follows:
[0040] The positioning member 2 is installed at the gap on the top surface of the lower PCB board 1. Before the upper PCB board 7 is moved downward to dock with the lower PCB board 1, the rotating arm 5 is rotated to adjust the rotating arm 5 to a state perpendicular to the upper PCB board 7. The end of the positioning column 8 protrudes from the side of the upper PCB board 7 under the action of the spring 9. The end of the positioning column 8 limits the posture of the rotating arm 5 from both sides. The rotating arm 5 is bent at the groove 6 to make the card block 4 snap into the card slot 3. After all four card blocks 4 are snapped in, the upper PCB board 7 is docked with the lower PCB board 1, and then the two are connected by cables and connectors.
[0041] Compared with the prior art, the present invention has the following beneficial effects:
[0042] The multi-layer circuit board that can be spliced and stacked can quickly splice the lower PCB board 1 and the upper PCB board 7 through the coordinated arrangement of the positioning member 2, the card slot 3, the card block 4, the rotating arm 5, the groove 6, the positioning column 8, and the spring 9. The splicing structure is simple and the splicing is convenient. The positioning member 2 is installed at the gap on the top surface of the lower PCB board 1. Before the upper PCB board 7 is downwardly connected with the lower PCB board 1, the rotating arm 5 is rotated to adjust the rotating arm 5 to a state perpendicular to the upper PCB board 7. Under the action of the spring 9, the end of the positioning column 8 protrudes from the side of the upper PCB board 7, and the positioning column 8 is fixed. The ends of the position post 8 limit the posture of the rotating arm 5 from both sides, and the rotating arm 5 is bent at the groove 6 to make the card block 4 snap into the card slot 3. After the four card blocks 4 are snapped in, the upper PCB board 7 is docked with the lower PCB board 1, and then the two are connected by cables and connectors. Such a structural design enables the upper and lower PCB boards to be quickly docked within a dozen seconds, with fast docking speed, simple structure, and relatively strong structure. At the same time, a gap is reserved between the upper and lower PCB boards to ensure heat dissipation of the upper and lower PCB boards without heat accumulation.
Claims
1. A multi-layer circuit board that can be spliced and stacked, characterized in that: It comprises a lower PCB board (1) and a positioning piece (2), wherein the positioning piece (2) is fixedly connected to a plurality of points on the top surface of the lower PCB board (1), and a card slot (3) is provided on the inner side of the positioning piece (2); A card block (4) is clamped on the inner side of the card slot (3), and the bottom end of the card block (4) abuts against the top surface of the lower PCB board (1); a rotating arm (5) is fixedly connected to the side of the card block (4), and a groove (6) is formed in the middle of the rotating arm (5); The top end of the rotating arm (5) is movably connected to an upper PCB board (7), and the interior of the upper PCB board (7) is movably connected to a positioning column (8), the end of the positioning column (8) is a hemispherical surface, and the end of the positioning column (8) protrudes from the side of the upper PCB board (7); The ends of the positioning column (8) abut against the two sides of the rotating arm (5), and a spring (9) is fixedly connected between the end of the positioning column (8) and the inside of the upper PCB board (7).
2. A multi-layer circuit board that can be spliced and stacked as claimed in claim 1, characterized in that: The lower PCB board (1) is located below the upper PCB board (7), and the lower PCB board (1) is parallel to the upper PCB board (7).
3. A multi-layer circuit board that can be spliced and stacked as claimed in claim 2, characterized in that: The number of the positioning members (2) is at least four, and the four positioning members (2) are symmetrically distributed with respect to the middle surface of the upper PCB board (7).
4. A multi-layer circuit board that can be spliced and stacked as claimed in claim 3, characterized in that: The bottom of the card slot (3) extends to the top surface of the lower PCB board (1), and the positioning piece (2) is bonded to the lower PCB board by adhesive.
5. A multi-layer circuit board that can be spliced and stacked as claimed in claim 4, characterized in that: The cross-sectional shape of the clamping slot (3) is a trapezoid, and the shape of the clamping block (4) is adapted to the shape of the clamping slot (3).
6. A multi-layer circuit board that can be spliced and stacked as claimed in claim 5, characterized in that: The rotating arm (5) and the clamping block (4) are made of plastic, and the rotating arm (5) is movably connected to the upper PCB board (7) via a rotating shaft.
7. A multi-layer circuit board that can be spliced and stacked as claimed in claim 6, characterized in that: The positioning column (8) limits the rotating arm (5) from two sides.