Printed circuit board (PCB) thin plate fixing device

Abstract

A PCB thin plate fixing device comprises a panel outer frame, a bottom plate outer frame and a PCB core plate arranged between the panel outer frame and the bottom plate outer frame. Panel outer frame containing holes are formed in the four corners of the panel outer frame, first magnets are arranged in the panel outer frame containing holes, bottom plate outer frame containing holes corresponding to the panel outer frame containing holes are formed in the four corners of the bottom plate outer frame, and second magnets are arranged in the bottom plate outer frame containing holes; therefore, through the panel outer frame and the bottom plate outer frame, the circuit board can be well fixed in the panel outer frame and the bottom plate outer frame, so that damage caused by shaking of the circuit board in the production process is reduced, it is guaranteed that the circuit board is not bent to cause local plating thickness or breaking and scrapping, and no potential quality hazards exist.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board production, in particular to a PCB thin plate fixing device. Background Art

[0002] The horizontal degumming / copper deposition equipment used in the PCB manufacturing process has clear requirements for the thickness of the circuit board. Usually, the minimum board thickness required by the equipment must be greater than 0.2mm. Circuit boards with a thickness of less than 0.2mm are prone to bending and swaying in the drying section and high-pressure water washing section of the horizontal line equipment, causing the circuit board to break and be scrapped, thereby reducing the quality of the PCB, increasing the scrap rate, and ultimately increasing the production loss cost.

[0003] The use of fixture and slide plate degumming / copper deposition method can greatly improve PCB quality and reduce production scrap rate. Therefore, the industry is studying how to transform horizontal degumming / copper deposition equipment and chemical copper equipment so that horizontal degumming / copper deposition equipment can be suitable for the production of circuit boards with a thickness of less than 0.2mm while ensuring the quality of degumming / copper deposition and maintaining a low scrap rate.

[0004] The current state of the existing PCB horizontal line equipment is unable to produce copper clad laminates with a thickness of 0.2mm or less. With the high-precision design of the industry, the thickness of the client's boards is getting thinner and thinner, and the processing requirements of the process equipment are getting higher. Many equipment cannot produce thin PCBs, which affects product delivery and quality issues. Utility Model Content

[0005] The technical problem to be solved by the utility model is to provide a PCB thin plate fixing device.

[0006] The technical solution adopted by the utility model to solve the technical problem is:

[0007] A PCB thin plate fixing device comprises a panel outer frame, a bottom plate outer frame, and a PCB core board arranged between the panel outer frame and the bottom plate outer frame; the panel outer frame is provided with panel outer frame receiving holes at four corners, and a first magnetic magnet is arranged in the panel outer frame receiving holes; the bottom plate outer frame is provided with bottom plate outer frame receiving holes corresponding to the panel outer frame receiving holes at four corners, and a second magnetic magnet is arranged in the bottom plate outer frame receiving holes.

[0008] In one embodiment, the panel outer frame and the bottom plate outer frame are consistent in length and width.

[0009] In one embodiment, the length and width of the PCB core board are 0.2 inches smaller than the panel frame or the base frame.

[0010] In one embodiment, the depth of the panel outer frame receiving hole and the bottom plate outer frame receiving hole is 1.0 mm±2 mil.

[0011] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0012] The utility model comprises a panel outer frame, a bottom plate outer frame, and a PCB core board arranged between the panel outer frame and the bottom plate outer frame; panel outer frame receiving holes are provided at the four corners of the panel outer frame, first magnetic magnets are provided in the panel outer frame receiving holes, bottom plate outer frame receiving holes corresponding to the panel outer frame receiving holes are provided at the four corners of the bottom plate outer frame, and second magnetic magnets are provided in the bottom plate outer frame receiving holes; thus, the circuit board can be well fixed in the panel outer frame and the bottom plate outer frame through the panel outer frame and the bottom plate outer frame, thereby reducing damage to the circuit board caused by shaking during the production process, ensuring that the circuit board is not bent to cause local plating thickness or breakage and scrapping, etc., without any quality risks. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the overall structure of Embodiment 1 of the present utility model;

[0014] Figure 2 For this utility model Figure 1 Schematic diagram of the bottom plate frame structure;

[0015] Figure 3 For this utility model Figure 1 Schematic diagram of the panel frame structure;

[0016] Figure 4 For this utility model Figure 1 Schematic diagram of the PCB core board structure.

[0017] In the figure: 10, panel frame, 11, first magnetic attraction, 20, bottom plate frame, 21, second magnetic attraction, 30, PCB core board. DETAILED DESCRIPTION

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0019] Example 1

[0020] like Figure 1-4 As shown, this embodiment includes a panel outer frame 10, a bottom plate outer frame 20, and a PCB core board 30 arranged between the panel outer frame 10 and the bottom plate outer frame 20; the panel outer frame 10 is provided with a panel outer frame receiving hole at each of the four corners, and a first magnetic magnet 11 is arranged in the panel outer frame receiving hole; the bottom plate outer frame receiving holes corresponding to the panel outer frame receiving holes are provided at the four corners of the bottom plate outer frame 20, and a second magnetic magnet 21 is arranged in the bottom plate outer frame receiving hole;

[0021] In this embodiment, the panel outer frame 10 and the bottom plate outer frame 20 have the same length and width; and the length and width of the PCB core board 30 are 0.2 inches smaller than the panel outer frame 10 or the bottom plate outer frame 20;

[0022] In addition, the depth of the panel frame receiving hole and the bottom plate frame receiving hole is 1.0mm±2mil.

[0023] Therefore, the utility model uses a panel outer frame 10, a bottom plate outer frame 20, and a PCB core board 30 arranged between the panel outer frame 10 and the bottom plate outer frame 20; panel outer frame 10 is provided with panel outer frame accommodating holes at the four corners, and the panel outer frame accommodating holes are provided with first magnetic magnets 11; bottom plate outer frame accommodating holes corresponding to the panel outer frame accommodating holes are provided at the four corners of the bottom plate outer frame 20, and the bottom plate outer frame accommodating holes are provided with second magnetic magnets 21; therefore, through the panel outer frame 10 and the bottom plate outer frame 20, the circuit board can be well fixed in the panel outer frame 10 and the bottom plate outer frame 20, thereby reducing the damage to the circuit board caused by shaking during the production process, ensuring that the circuit board does not bend to cause local plating thickness or breakage and scrapping, etc., without any quality risks.

[0024] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the technical solution of the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solution recorded in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solution from the spirit and scope of the technical solution of each embodiment of the utility model.

Claims

1. A PCB thin plate fixing device, characterized in that: The invention comprises a panel outer frame (10), a bottom plate outer frame (20), and a PCB core board (30) arranged between the panel outer frame (10) and the bottom plate outer frame (20); the panel outer frame (10) is provided with panel outer frame receiving holes at four corners, and a first magnetic magnet (11) is arranged in the panel outer frame receiving holes; the bottom plate outer frame (20) is provided with bottom plate outer frame receiving holes corresponding to the panel outer frame receiving holes at four corners, and a second magnetic magnet (21) is arranged in the bottom plate outer frame receiving holes.

2. The PCB thin plate fixing device according to claim 1, characterized in that: The panel outer frame (10) and the bottom plate outer frame (20) have the same length and width.

3. The PCB thin plate fixing device according to claim 2, characterized in that: The length and width of the PCB core board (30) are 0.2 inches smaller than the dimensions of the panel outer frame (10) or the base plate outer frame (20).

4. The PCB thin plate fixing device according to claim 3 is characterized in that: The depth of the panel outer frame receiving hole and the bottom plate outer frame receiving hole is 1.0 mm ± 2 mil.

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