Display panel and device

Abstract

The embodiment of the utility model discloses a display panel and device. In one specific implementation mode, the display panel comprises a substrate, an isolation column located on the side, away from the substrate, of a pixel defining layer and a step structure located on the side, away from the substrate, of the isolation column; the isolation columns are located on the surface of the side, away from the substrate, of the pixel defining layer between the adjacent sub-pixels; the adjacent sub-pixels comprise a first sub-pixel and a second sub-pixel, the step structure comprises a first light-emitting material layer close to the first sub-pixel and a second light-emitting material layer close to the second sub-pixel, the first light-emitting material layer and the second light-emitting material layer are located on the surface of the side, away from the substrate, of the isolation column, and orthographic projections of the first light-emitting material layer and the second light-emitting material layer on the substrate are overlapped; the first packaging layer covers the surfaces of the sides, away from the substrate, of the first sub-pixel and the first light-emitting material layer, the second packaging layer covers the surfaces of the sides, away from the substrate, of the second sub-pixel and the second light-emitting material layer, and the third packaging layer at least covers the side face of the overlapped part formed by the first light-emitting material layer and the second light-emitting material layer.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and more specifically, to a display panel and a device. Background Art

[0002] In the related art, on the side of the display panel where the isolation column in the display area is away from the substrate, there is an overlapping area between the etching of the organic light-emitting layer, cathode and packaging layer between different sub-pixels, which can easily lead to the problem that water and oxygen cannot be completely isolated, thereby causing the phenomenon of poor black spots (GDSH); especially for the device structure of the stacked organic light-emitting diode (Tandem OLED), the increase in voltage will aggravate the packaging failure caused by the water and oxygen path, thereby reducing the product's packaging anti-reliability test capability. Utility Model Content

[0003] The present disclosure aims to provide a display panel and a device to solve at least one of the problems existing in the prior art.

[0004] In order to achieve the above objectives, the present invention adopts the following technical solutions:

[0005] In a first aspect, the present disclosure provides a display panel, the display panel comprising a substrate, a driving circuit layer formed on the substrate, a pixel defining layer located on one side of the driving circuit layer, a plurality of sub-pixels, an isolation column arranged on a side of the pixel defining layer away from the substrate, and a step structure arranged on a side of the isolation column away from the substrate;

[0006] The pixel definition layer has a plurality of openings, and the sub-pixel includes an anode, an organic light-emitting layer and a cathode which are stacked in sequence;

[0007] The isolation column is located on a surface of a pixel defining layer between adjacent sub-pixels and away from the substrate;

[0008] The adjacent sub-pixels include a first sub-pixel and a second sub-pixel, the step structure includes a first light-emitting material layer close to the first sub-pixel and a second light-emitting material layer close to the second sub-pixel, which are arranged on a surface of the isolation column away from the substrate, and the orthographic projection of the first light-emitting material layer on the substrate overlaps with the orthographic projection of the second light-emitting material layer on the substrate;

[0009] The display panel also includes an encapsulation layer, which includes a first encapsulation layer, a second encapsulation layer and a third encapsulation layer, the first encapsulation layer covers the first sub-pixel and the first light-emitting material layer on a side surface away from the substrate, the second encapsulation layer covers the second sub-pixel and the second light-emitting material layer on a side surface away from the substrate, and the third encapsulation layer covers at least the side surface of the overlapping portion formed by the first light-emitting material layer and the second light-emitting material layer.

[0010] Optionally, an orthographic projection of the third encapsulation layer on the substrate covers an orthographic projection of the step structure on the substrate.

[0011] Optionally, the encapsulation layer further includes a fourth encapsulation layer and a fifth encapsulation layer, the fourth encapsulation layer covers the first encapsulation layer, the second encapsulation layer and the third encapsulation layer; the fifth encapsulation layer covers a surface of the fourth encapsulation layer away from the substrate.

[0012] Optionally, a thickness of the third encapsulation layer is smaller than a thickness of the first encapsulation layer and a thickness of the second encapsulation layer.

[0013] Optionally, the first encapsulation layer, the second encapsulation layer and the third encapsulation layer are inorganic encapsulation layers respectively.

[0014] Optionally, the fourth encapsulation layer is an organic encapsulation layer, and the fifth encapsulation layer is an inorganic encapsulation layer.

[0015] Optionally, the isolation column includes a first metal layer, a second metal layer and a third metal layer stacked in sequence; the area of ​​the orthographic projection of the second metal layer on the substrate is smaller than the area of ​​the orthographic projection of the first metal layer on the substrate, and smaller than the area of ​​the orthographic projection of the third metal layer on the substrate.

[0016] Optionally, the first metal layer and the third metal layer are made of titanium, and the second metal layer is made of aluminum.

[0017] Optionally, the first light-emitting material layer is disposed in the same layer as the organic light-emitting layer of the first sub-pixel, and the second light-emitting material layer is disposed in the same layer as the organic light-emitting layer of the second sub-pixel.

[0018] Optionally, a first cathode layer arranged in the same layer as the cathode of the first sub-pixel is formed between the first light-emitting material layer and the first encapsulation layer, and a second cathode layer arranged in the same layer as the cathode of the second sub-pixel is formed between the second light-emitting material layer and the second encapsulation layer.

[0019] Optionally, the organic light-emitting layer is a stacked organic electroluminescent device layer.

[0020] A second aspect of the present disclosure provides a display panel, including the display panel provided by the first aspect of the present disclosure.

[0021] The beneficial effects of the present disclosure are as follows:

[0022] The technical solution disclosed in the present invention can effectively solve the problem that water and oxygen cannot be completely isolated and avoid the phenomenon of black spots by setting a third packaging layer to at least cover the side of the overlapping part of the first light-emitting material layer and the second light-emitting material layer; especially for the stacked organic light-emitting diode device structure, it can effectively avoid the increase in voltage that will aggravate the packaging failure caused by the water and oxygen path, thereby improving the product's packaging anti-reliability test capability. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The specific implementation methods of the present disclosure are further described in detail below with reference to the accompanying drawings.

[0024] Figure 1 A schematic structural diagram of a display panel provided by an embodiment of the present disclosure is shown.

[0025] Figure 2-Figure 10 An embodiment of the present disclosure provides Figure 1 Schematic diagram of the preparation process of the display panel shown.

[0026] Fig.11 A schematic diagram showing the preparation of a fourth encapsulation layer of a display panel provided by an embodiment of the present disclosure is shown.

[0027] Fig.12 A schematic diagram showing the preparation of a fifth encapsulation layer of a display panel provided by an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0028] The terms “on”, “formed on” and “disposed on” in the present disclosure may mean that one layer is directly formed or disposed on another layer, or may mean that one layer is indirectly formed or disposed on another layer, i.e., there are other layers between the two layers.

[0029] It should be noted that, although the terms "first", "second", etc. may be used herein to describe various parts, components, elements, regions, layers and / or parts, these parts, components, elements, regions, layers and / or parts should not be limited by these terms. Instead, these terms are used to distinguish one part, component, element, region, layer and / or part from another. Thus, for example, the first part, first member, first element, first region, first layer and / or first part discussed below may be referred to as the second part, second member, second element, second region, second layer and / or second part without departing from the teachings of the present disclosure.

[0030] In the present disclosure, unless otherwise specified, the term "co-layer arrangement" used refers to two layers, parts, components, elements or parts that can be formed by the same preparation process (such as a patterning process, etc.), and the two layers, parts, components, elements or parts are generally formed of the same material. For example, two or more functional layers are co-layered, which means that these co-layered functional layers can be formed using the same material layer and the same preparation process, thereby simplifying the preparation process of the display panel.

[0031] In the present disclosure, unless otherwise specified, the expression "patterning process" generally includes steps such as photoresist coating, exposure, development, etching, photoresist stripping, etc. The expression "one-time patterning process" means a process of forming patterned layers, components, members, etc. using one mask.

[0032] In the related art, on the side of the display panel where the isolation column in the display area is away from the substrate, there is an overlapping area between the etching of the organic light-emitting layer, cathode and packaging layer between different sub-pixels, which can easily lead to the problem that water and oxygen cannot be completely isolated, thereby causing the phenomenon of poor black spots (GDSH); especially for the device structure of the stacked organic light-emitting diode (Tandem OLED), the increase in voltage will aggravate the packaging failure caused by the water and oxygen path, thereby reducing the product's packaging anti-reliability test capability.

[0033] There is an overlapping part of the organic light-emitting material above the isolation column in the display area. When the etching scheme is used to remove the inorganic packaging layer, the organic light-emitting material and the cathode in the overlapping part may be exposed in the organic packaging layer. When the top layer (Roof) material of the isolation column is also metal or organic, it will be directly connected to the lower metal layer of the isolation column as well as the organic light-emitting material and the cathode. Especially when using a Tandem device, the voltage difference at this position is also very large, and corrosion is very likely to occur, resulting in display failure.

[0034] In view of this, an embodiment of the present disclosure provides a display panel, and exemplarily, the display panel is an OLED display panel. Figure 1 As shown, the display panel includes a substrate (not shown in Figure 1), a driving circuit layer 101 formed on a substrate, a pixel defining layer 102 located on a side of the driving circuit layer 101 away from the substrate, a plurality of sub-pixels, an isolation column 103 arranged on a side of the pixel defining layer 102 away from the substrate, and a step structure 105 arranged on a side of the isolation column 103 away from the substrate; the pixel defining layer 102 has a plurality of openings, and the sub-pixels include an anode 1041, an organic light-emitting layer 1042 and a cathode 1043 stacked in sequence; the isolation column 103 is located on a surface of a side of the pixel defining layer 102 away from the substrate between adjacent sub-pixels; the adjacent sub-pixels include a first sub-pixel and a second sub-pixel; the step structure 105 includes a first light-emitting material disposed on a surface of the isolation column 103 away from the substrate and close to the first sub-pixel Layer 1051RR and the second light-emitting material layer 1051GL near the second sub-pixel, the orthographic projection of the first light-emitting material layer 1051RR on the substrate overlaps with the orthographic projection of the second light-emitting material layer 1051GL on the substrate; the display panel also includes an encapsulation layer, the encapsulation layer includes a first encapsulation layer 106R, a second encapsulation layer 106G and a third encapsulation layer 1061, the first encapsulation layer 106R covers the first sub-pixel and the first light-emitting material layer 1051RR on one side of the surface away from the substrate, the second encapsulation layer 106G covers the second sub-pixel and the second light-emitting material layer 1051GL on one side of the surface away from the substrate, and the third encapsulation layer 1061 at least covers the side of the overlapping portion of the first light-emitting material layer 1051RR and the second light-emitting material layer 1051GL.

[0035] In a specific example, Figure 1 As shown, the side of the overlapping portion, for example Figure 1 The first light emitting material layer 1051RR and the second light emitting material layer 1051GL shown in FIG. 1 form a vertical plane in which the part overlaps.

[0036] In this embodiment, by setting a third packaging layer to at least cover the side surfaces of the overlapping portion of the first light-emitting material layer and the second light-emitting material layer, the problem of water and oxygen not being completely isolated can be effectively solved, thereby avoiding the occurrence of black spot defects. In particular, for the stacked organic light-emitting diode device structure, it can effectively avoid the packaging failure caused by the water and oxygen path that is aggravated by the increase in voltage, thereby improving the product's packaging anti-reliability test capability.

[0037] In a specific example, the substrate can be glass, quartz or other materials; further, the OLED display panel can also include a barrier layer and a buffer layer between the substrate and the driving circuit layer, for example, the barrier layer and the buffer layer can be formed on the entire surface of the substrate. Further, the barrier layer can be made of inorganic insulating materials such as silicon oxide, silicon nitride or silicon oxynitride, and the buffer layer can also be made of inorganic insulating materials such as silicon oxide, silicon nitride or silicon oxynitride.

[0038] The barrier layer in this embodiment is beneficial for blocking water and oxygen from entering the subsequently formed OLED display panel from the bottom; the buffer layer is beneficial for the subsequent material deposition quality.

[0039] In a specific example, the driving circuit layer may also be referred to as a thin film transistor (TFT) layer, including an active layer (Active) formed on the buffer layer by a patterning process, a gate insulating layer (GI) formed on the active layer by deposition or the like, a gate (Gate) of a thin film transistor formed on the gate insulating layer by a patterning process, a dielectric layer (ILD) formed on the gate by deposition or the like, a source-drain metal layer formed on the dielectric layer, and a second flat layer (PLN) covering the source-drain metal layer and the exposed dielectric layer, the source-drain metal layer forming the source (Source) and drain (Drain) of the thin film transistor, for example, the source is electrically connected to the active layer through a dielectric layer via. Further, the active layer may be made of materials such as polysilicon and metal oxide, the gate insulating layer may be made of inorganic insulating materials such as silicon oxide, silicon nitride or silicon oxynitride, the dielectric layer may be made of inorganic insulating materials such as silicon oxide, silicon nitride or silicon oxynitride; the gate material includes metals or alloy materials such as aluminum, titanium, cobalt, etc.; the second flat layer is, for example, an organic material.

[0040] In a specific example, Figure 1 As shown, the pixel defining layer 102 is made of, for example, organic material.

[0041] In a specific example, Figure 1 As shown, the anode 1041 (Anode) is, for example, a metal oxide such as ITO, IZO, or a metal such as Ag, Al, Mo, or an alloy thereof. The anode 1041 is electrically connected to the drain of the driving circuit layer 101 through a via hole opened in the second flat layer.

[0042] In a specific example, Figure 1 As shown, the organic light emitting layer 1042 is disposed in the opening of the pixel defining layer 102 , and the organic light emitting layer 1042 is broken at the side of the isolation column 103 .

[0043] In a specific example, Figure 1 As shown, the cathode 1043 covers the organic light-emitting layer 1042; further, the cathode 1043 extends to the side of the pixel defining layer 102 away from the substrate and is electrically connected to the side of the isolation column 103 through the metal isolation column 103; further, the material of the cathode 1043 may include metals such as Mg, Ca, Li or Al or their alloys, or metal oxides such as IZO, ZTO, or organic materials with conductive properties such as PEDOT / PSS (poly 3,4-ethylenedioxythiophene / polystyrene sulfonate).

[0044] In a specific example, Figure 1 As shown, taking the step structure on the isolation column between the adjacent first color sub-pixel region R and second color sub-pixel region G as an example, the step structure includes a first step substructure close to the first color sub-pixel and a second step substructure close to the second color sub-pixel.

[0045] In a specific example, Figure 1 As shown, the first step substructure is, for example, a single-sided step structure, and the corresponding second step substructure is a double-layer step structure partially overlapping with the first step substructure.

[0046] In a specific example, Figure 1 As shown, the first step substructure includes a first light-emitting material layer 1051RR close to the first color sub-pixel, a first cathode material layer covering the first light-emitting material layer 1052RR, and a first encapsulation layer 106R; further, the second step substructure includes a second light-emitting material layer 1051GL close to the second color sub-pixel, a second cathode material layer covering the second light-emitting material layer 1052GL, and a second encapsulation layer 106G.

[0047] In a specific example, Figure 1 As shown, the orthographic projection of the first light-emitting material layer 1051RR on the substrate overlaps with the orthographic projection of the second light-emitting material layer 1051GL on the substrate.

[0048] In a specific example, Figure 1 As shown, the first step substructure includes a first light-emitting material layer 1051RR, which is arranged on the same layer as the first color organic light-emitting layer of the first sub-pixel; the second step substructure includes a second light-emitting material layer 1051GL, which is arranged on the same layer as the organic light-emitting layer of the second color second sub-pixel.

[0049] It should be noted that the same-layer arrangement means that the two layers are obtained through the same preparation process, and does not mean that the top surface heights of the two layers are the same.

[0050] In a specific example, the second step substructure is, for example, a single-sided step structure, and the corresponding first step substructure is a double-layer step structure partially overlapping with the second step substructure.

[0051] In a specific example, Figure 1 As shown, the display panel also includes a first encapsulation layer corresponding to the first color sub-pixel and a second encapsulation layer corresponding to the second color sub-pixel located on the cathode, which are used to prevent water vapor from entering and compensate for over-etching caused by multiple etching processes during the preparation process.

[0052] In a specific example, Figure 1 As shown, the first encapsulation layer 106R covers the first color sub-pixel and two step sub-structures arranged adjacent to the first color sub-pixel region R; the second encapsulation layer 106G covers the second color sub-pixel and the step sub-structure adjacent to the second color sub-pixel region G. Further, the first encapsulation layer 106R and the second encapsulation layer 106G are not arranged in the same layer. This embodiment effectively improves the display quality of the display panel and ensures the encapsulation effect of the display panel.

[0053] In one specific example, combining preparation such as Figure 1 Taking the method of displaying a panel as an example, the display panel of the present disclosure is introduced. Figure 2-Figure 12 As shown, the preparation method comprises:

[0054] providing a substrate;

[0055] A driving circuit layer 101 is formed on one side of the substrate;

[0056] A pixel defining layer 102 is formed on a side of the driving circuit layer 101 away from the substrate, wherein the pixel defining layer 102 has a plurality of openings, and a plurality of sub-pixels are arranged in the plurality of openings, wherein the sub-pixels include an anode, an organic light-emitting layer, and a cathode which are stacked in sequence;

[0057] An isolation column 103 is formed on a side of the pixel defining layer 102 away from the substrate, that is, an isolation column 103 is formed on a surface of the pixel defining layer between adjacent sub-pixels away from the substrate;

[0058] like Figure 2 As shown, anodes 1041 are formed in the red sub-pixel region R, the green sub-pixel region G, and the blue sub-pixel region B, respectively.

[0059] like Figure 3-Figure 5 As shown, a first red organic light emitting layer material 1042R, a first cathode material 1043R and a first sub-encapsulation layer material 106R1 are deposited on the side of the pixel defining layer 102 and the isolation column 103 away from the substrate.

[0060] The first red organic light-emitting layer material 1042R, the first cathode material 1043R, and the first sub-encapsulation layer material 106R1 are patterned by a dry etching process, and the red organic light-emitting material 1042R, the first cathode material 1043R, and the first sub-encapsulation layer material 106R1 in the red sub-pixel region A and the edge region near the red sub-pixel region A on the isolation column 103 on both sides of the red sub-pixel region A are retained to form a red sub-pixel, a first red step sub-structure located on the right side of the red sub-pixel, a second red step sub-structure located on the left side of the red sub-pixel, and a first sub-encapsulation layer 106R (e.g., Figure 1The first red step substructure includes a first red light-emitting material layer 1051RR and a first cathode material layer 1052RR covering the first red light-emitting material layer 1051RR; the second red step substructure includes a second red light-emitting material layer 1051RL and a second cathode material layer 1052RL covering the second red light-emitting material layer 1051RL, and the result is as follows: Figure 6 Products shown.

[0061] like Figure 7 As shown, a second green organic light-emitting layer material 1042G, a second cathode material 1043G and a second sub-encapsulation layer material 106G1 are sequentially deposited on the side of the pixel defining layer 102 and the isolation column 103 away from the substrate;

[0062] The green organic light-emitting layer material 1042G, the second cathode material 1043G, and the second sub-encapsulation layer material 106G1 are patterned by a dry etching process, and the green organic light-emitting layer material 1042G, the second cathode material 1043G, and the second sub-encapsulation layer material 106G1 in the green sub-pixel region G and the edge region near the green sub-pixel region G on the isolation column 103 on both sides of the green sub-pixel region G are retained to form a green sub-pixel, a first green step sub-structure located on the right side of the green sub-pixel, a second green step sub-structure located on the left side of the green sub-pixel, and a second sub-encapsulation layer 106G (for example, Figure 1 The second encapsulation layer in the second green sub-step structure partially overlaps with the first red sub-step structure, the first green step substructure includes a first green light-emitting material layer 1051GR and a third cathode material layer 1052GR covering the first green light-emitting material layer 1051GR, and the second green step substructure includes a second green light-emitting material layer 1051GL and a fourth cathode material layer 1052GL covering the second green light-emitting material layer 1051GL, and the result is as follows Figure 8 Products shown;

[0063] like Fig. 9 As shown, a third blue organic light-emitting layer material 1042B, a third cathode material 1043B and a third sub-encapsulation layer material 106B1 are sequentially deposited on the side of the pixel defining layer 102 and the isolation column 103 away from the substrate;

[0064] The blue organic light-emitting layer material 1042B, the third cathode material 1043B and the third sub-encapsulation layer material 106B1 are patterned by a dry etching process, and the blue sub-pixel region B and the blue organic light-emitting material 1042B, the third cathode material 1043B and the third sub-encapsulation layer material 106B1 on the edge area of ​​the blue sub-pixel region B and the isolation column 103 on both sides of the blue sub-pixel region B are retained to obtain a blue sub-pixel, a step sub-structure located on both sides of the blue sub-pixel, and a third sub-encapsulation layer material covering the blue sub-pixel, the step sub-structure and the isolation column 103, forming a blue sub-pixel, a first blue step sub-structure located on the right side of the blue sub-pixel, and a blue sub-pixel located on the right side of the blue sub-pixel. The second blue step substructure on the left side of the subpixel and the third sub-encapsulation layer 106B covering the blue subpixel, the first blue step substructure and the second blue step substructure, the second blue step substructure overlaps with the first green step substructure, the first blue step substructure overlaps with the second red step substructure, the first blue step substructure includes a first blue light-emitting material layer 1051BR and a fifth cathode material layer 1052BR covering the first blue light-emitting material layer 1051BR, the second blue step substructure includes a second blue light-emitting material layer 1051BL and a sixth cathode material layer 1052BL covering the second blue light-emitting material layer 1051BL, Fig.10 Products shown.

[0065] In a specific example, Fig.10 As shown, the first sub-encapsulation layer 106A corresponding to the first red sub-pixel, the second sub-encapsulation layer 106B corresponding to the second green sub-pixel, and the third sub-encapsulation layer 106C corresponding to the third blue sub-pixel are not arranged in the same layer.

[0066] A fourth sub-packaging material is deposited on the sides of the overlapping portion of the second green sub-step structure and the first red sub-step structure, the sides of the overlapping portion of the second blue step sub-structure and the first green step sub-structure, and the sides of the overlapping portion of the first blue step sub-structure and the second red step sub-structure to form a third packaging layer.

[0067] Alternatively, a fourth sub-packaging material is deposited on the side of the step structure away from the substrate to form a third packaging layer 1061, so as to obtain Figure 1 Products shown.

[0068] In this embodiment, after all organic light-emitting materials have been evaporated and packaged, a third packaging layer is directly formed on the side of the step structure away from the isolation column, so as to package and protect the organic light-emitting materials and cathode that may be exposed in the organic packaging layer, thereby preventing subsequent display failure in voltage application and trust environment.

[0069] Compared with forming the third encapsulation layer by depositing the fourth sub-encapsulation material on the side of the pixel defining layer and the isolation column away from the substrate, this embodiment forms the third encapsulation layer by depositing the fourth sub-encapsulation material covering the step structure. This can effectively improve the side encapsulation performance of the overlapping part of the light-emitting material layer while saving encapsulation materials.

[0070] The fourth encapsulation layer 107 is formed by inkjet printing on the side of the pixel defining layer 102 and the isolation column 103 away from the substrate to obtain Fig.11 Products shown.

[0071] A fifth encapsulation layer 108 is formed by deposition or the like on the side of the pixel defining layer 102 and the isolation column 103 away from the substrate to obtain a Fig.12 Products shown.

[0072] In one possible implementation, Figure 1 As shown, the orthographic projection of the third encapsulation layer 1061 on the substrate covers the orthographic projection of the step structure 105 on the substrate.

[0073] In this embodiment, a third encapsulation layer is formed above the side of the step structure away from the isolation column to encapsulate and protect the organic light-emitting material and cathode that may be exposed in the organic encapsulation layer to prevent subsequent voltage application and display failure in a trust environment.

[0074] In one possible implementation, Figure 11-Figure 12 As shown, the encapsulation layer further includes a fourth encapsulation layer 107 and a fifth encapsulation layer 108 . The fourth encapsulation layer 107 covers the first encapsulation layer, the second encapsulation layer and the third encapsulation layer; the fifth encapsulation layer 108 covers a surface of the fourth encapsulation layer 107 that is away from the substrate.

[0075] In a specific example, Fig.11 As shown, the fourth encapsulation layer 107 covers the first encapsulation layer 106R, the second encapsulation layer 106G and the third encapsulation layer 1061 .

[0076] In a specific example, the fourth encapsulation layer is an organic encapsulation layer, which is formed by inkjet printing.

[0077] In a specific example, the fifth encapsulation layer is an inorganic encapsulation layer, which is formed by deposition or the like.

[0078] In a specific example, Fig.12As shown, in this embodiment, the third encapsulation layer 1061 formed by the side of the step structure 105 away from the substrate to the fifth encapsulation layer 108 include an inorganic encapsulation layer, an organic encapsulation layer and an inorganic encapsulation layer. Compared with the related art in which the side of the step structure away from the substrate does not have a third encapsulation layer but only has an organic encapsulation layer and an inorganic encapsulation layer, the fourth encapsulation layer and the fifth encapsulation layer in this embodiment can form multiple protections for the functional structure of the display panel and have a better encapsulation effect.

[0079] In one possible implementation, Figure 1 As shown, the thickness of the third encapsulation layer 1061 is less than the thickness of the first encapsulation layer 106R and the thickness of the second encapsulation layer 106G.

[0080] In one possible implementation, Figure 1 As shown, the first encapsulation layer 106R, the second encapsulation layer 106G and the third encapsulation layer 106I are respectively inorganic encapsulation layers.

[0081] In a specific example, Figure 1 As shown, the first encapsulation layer 106R, the second encapsulation layer 106G and the third encapsulation layer 1061 are inorganic encapsulation layers, which are formed by deposition or the like.

[0082] Further, such as Figure 1 As shown, the first encapsulation layer 106R, the second encapsulation layer 106G and the third encapsulation layer 1061 can be formed of inorganic materials such as silicon nitride, silicon oxide, and silicon oxynitride.

[0083] In one possible implementation, Fig.12 As shown, the fourth encapsulation layer 107 is an organic encapsulation layer, and the fifth encapsulation layer 108 is an inorganic encapsulation layer.

[0084] In a specific example, Fig.12 As shown, the fourth encapsulation layer 107 can be formed of organic materials such as polyimide (PI) and epoxy resin.

[0085] In a specific example, Fig.12 As shown, the fifth encapsulation layer 108 can be formed of inorganic materials such as silicon nitride, silicon oxide, and silicon oxynitride.

[0086] In one possible implementation, Figure 2 As shown, the isolation column 103 includes a first metal layer 1031, a second metal layer 1032 and a third metal layer 1033 which are stacked in sequence; the area of ​​the orthographic projection of the second metal layer 1032 on the substrate is smaller than the area of ​​the orthographic projection of the first metal layer 1031 on the substrate, and smaller than the area of ​​the orthographic projection of the third metal layer 1033 on the substrate.

[0087] In a specific example, Figure 2 As shown, the cross section of the isolation column 103 is an I-shape.

[0088] In one possible implementation, Figure 2 As shown, the materials of the first metal layer 1031 and the third metal layer 1033 are titanium, and the material of the second metal layer 1032 is aluminum.

[0089] In a specific example, in order to ensure that the organic light-emitting layer is broken on the side of the isolation column, at least one circle of grooves is formed on the side of the isolation column. By forming at least one circle of grooves on the side of the isolation column, the adhesion of the encapsulation layer covering the isolation column is enhanced.

[0090] In a specific example, Fig.10 As shown, cathodes of adjacent sub-pixels (eg, cathode 1043R and cathode 1043G) are electrically connected via the isolation column 103 .

[0091] In a specific example, the cross section of the isolation column may be rectangular, inverted trapezoidal, or eave-shaped.

[0092] In a possible implementation, the first light-emitting material layer is disposed in the same layer as the organic light-emitting layer of the first sub-pixel, and the second light-emitting material layer is disposed in the same layer as the organic light-emitting layer of the second sub-pixel.

[0093] In a specific example, Fig.10 As shown, taking the red sub-pixel, the first red step sub-structure located on the right side of the red sub-pixel, the green sub-pixel and the second green step sub-structure located on the left side of the green sub-pixel as examples, the first red light-emitting material layer 1051RR is arranged on the same layer as the first red organic light-emitting layer 1042R of the first red sub-pixel; the second green light-emitting material layer 1051GL is arranged on the same layer as the second green organic light-emitting layer 1042G of the second green sub-pixel.

[0094] In one possible implementation, a first cathode layer arranged in the same layer as the cathode of the first sub-pixel is formed between the first light-emitting material layer and the first encapsulation layer, and a second cathode layer arranged in the same layer as the cathode of the second sub-pixel is formed between the second light-emitting material layer and the second encapsulation layer.

[0095] In a specific example, Fig.10As shown, taking the red sub-pixel, the first red step sub-structure located on the right side of the red sub-pixel, the green sub-pixel and the second green step sub-structure located on the left side of the green sub-pixel as examples, a first cathode layer 1052RR which is arranged on the same layer as the cathode 1043R of the first red sub-pixel is further formed between the first red light-emitting material layer 1051RR and the first encapsulation layer 106R; a second cathode layer 1052GL which is arranged on the same layer as the cathode 1043G of the second green sub-pixel is further formed between the second green light-emitting material layer 1051GL and the second encapsulation layer 106G.

[0096] In a possible implementation, the organic light-emitting layer is a stacked organic electroluminescent device layer.

[0097] Another embodiment of the present disclosure provides a display device including the above display panel.

[0098] The display device may be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, etc., and this embodiment does not limit this.

[0099] Obviously, the above embodiments of the present disclosure are merely examples for clearly illustrating the present disclosure, and are not limitations on the implementation methods of the present disclosure. For ordinary technicians in this field, other different forms of changes or modifications can be made on the basis of the above description. It is impossible to list all the implementation methods here. All obvious changes or modifications derived from the technical solution of the present disclosure are still within the protection scope of the present disclosure.

Claims

1. A display panel, characterized in that: The display panel includes a substrate, a driving circuit layer formed on the substrate, a pixel defining layer located on one side of the driving circuit layer, a plurality of sub-pixels, an isolation column arranged on a side of the pixel defining layer away from the substrate, and a step structure arranged on a side of the isolation column away from the substrate; The pixel definition layer has a plurality of openings, and the sub-pixel includes an anode, an organic light-emitting layer and a cathode which are stacked in sequence; The isolation column is located on a surface of a pixel defining layer between adjacent sub-pixels and away from the substrate; The adjacent sub-pixels include a first sub-pixel and a second sub-pixel, the step structure includes a first light-emitting material layer close to the first sub-pixel and a second light-emitting material layer close to the second sub-pixel, which are arranged on a surface of the isolation column away from the substrate, and the orthographic projection of the first light-emitting material layer on the substrate overlaps with the orthographic projection of the second light-emitting material layer on the substrate; The display panel also includes an encapsulation layer, which includes a first encapsulation layer, a second encapsulation layer and a third encapsulation layer, the first encapsulation layer covers the first sub-pixel and the first light-emitting material layer on a side surface away from the substrate, the second encapsulation layer covers the second sub-pixel and the second light-emitting material layer on a side surface away from the substrate, and the third encapsulation layer covers at least the side surface of the overlapping portion formed by the first light-emitting material layer and the second light-emitting material layer.

2. The display panel according to claim 1, characterized in that: The orthographic projection of the third encapsulation layer on the substrate covers the orthographic projection of the step structure on the substrate.

3. The display panel according to claim 1, characterized in that: The encapsulation layer further includes a fourth encapsulation layer and a fifth encapsulation layer. The fourth encapsulation layer covers the first encapsulation layer, the second encapsulation layer and the third encapsulation layer. The fifth encapsulation layer covers a surface of the fourth encapsulation layer that is away from the substrate.

4. The display panel according to claim 1, characterized in that: The thickness of the third encapsulation layer is smaller than the thickness of the first encapsulation layer and the thickness of the second encapsulation layer.

5. The display panel according to claim 1, characterized in that: The first encapsulation layer, the second encapsulation layer and the third encapsulation layer are respectively inorganic encapsulation layers.

6. The display panel according to claim 3, characterized in that: The fourth encapsulation layer is an organic encapsulation layer, and the fifth encapsulation layer is an inorganic encapsulation layer.

7. The display panel according to claim 1, characterized in that: The isolation column includes a first metal layer, a second metal layer and a third metal layer stacked in sequence; the area of ​​the orthographic projection of the second metal layer on the substrate is smaller than the area of ​​the orthographic projection of the first metal layer on the substrate, and smaller than the area of ​​the orthographic projection of the third metal layer on the substrate.

8. The display panel according to claim 7, characterized in that: The materials of the first metal layer and the third metal layer are titanium, and the material of the second metal layer is aluminum.

9. The display panel according to claim 1, characterized in that: The first light-emitting material layer is disposed in the same layer as the organic light-emitting layer of the first sub-pixel, and the second light-emitting material layer is disposed in the same layer as the organic light-emitting layer of the second sub-pixel.

10. The display panel according to claim 9, characterized in that: A first cathode layer disposed in the same layer as the cathode of the first sub-pixel is formed between the first light-emitting material layer and the first encapsulation layer, and a second cathode layer disposed in the same layer as the cathode of the second sub-pixel is formed between the second light-emitting material layer and the second encapsulation layer.

11. The display panel according to claim 1, characterized in that: The organic light-emitting layer is a laminated organic electroluminescent device layer.

12. A display device, characterized in that: A display panel comprising any one of claims 1-11.

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