Device for capturing and collecting product dust in semiconductor process

Abstract

The utility model provides a device for capturing and collecting semiconductor process product dust. The device comprises a mounting box; the two connecting ports are fixedly mounted in the middle of the top and the bottom of the outer surface of the mounting box respectively, a corrugated pipe is arranged on one side of each connecting port, and a buckling device is arranged on one side of each corrugated pipe. According to the device for capturing and collecting the product dust in the semiconductor manufacturing process, the mounting box and the floor surface are separated and detached through the bolts, the mounting box, the #-shaped structure three-dimensional component and the cooling coil shaped like the Chinese character'hui 'capture by-products which are discharged from the cavity and become solid from gas, the mounting box is detached regularly, and the products are sent out for cleaning. And meanwhile, faults caused by dust falling of the vacuum pump can be solved, the service time of the equipment cavity can be prolonged through cooperation of the capacity, the production cycle is prolonged, the maintenance cycle is shortened, and the production utilization rate of the cavity is increased.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor processing, in particular to a device for capturing and collecting dust produced by semiconductor process. Background Art

[0002] In the field of power devices, byproduct dust is usually generated during the chemical vapor deposition process. This device is carried out during the equipment maintenance period. The dust captured in the device is sent out for cleaning together with the device, and the turnover device is installed at the same time to resume production.

[0003] In the use of existing equipment, the equipment cavity is directly connected to the vacuum pump through a vacuum pipeline, and then the outlet of the vacuum pump is connected to a scrubber for exhaust gas treatment. After being treated by the scrubber, the exhaust gas is discharged to the plant system for further treatment and testing before being discharged to the outside. However, when the existing equipment is used, since the reaction temperature in the cavity is usually above 350 degrees, the by-products usually exist in a gaseous state. After entering the vacuum pipeline, the temperature will drop a lot, causing the by-products to condense into powder, and then combine into solid products that adhere to the vacuum tube wall and then fall into the vacuum pump in blocks or flakes, causing the rotor in the vacuum pump to get stuck, resulting in vacuum pump failure affecting production; and the accumulation of by-products in the vacuum tube causes the equipment to require frequent maintenance, shortening the processing efficiency of the equipment.

[0004] Therefore, it is necessary to provide a device for capturing and collecting dust produced by semiconductor processes to solve the above technical problems. Utility Model Content

[0005] The utility model provides a device for capturing and collecting dust of semiconductor process products, and solves the problem that the reaction temperature in the cavity is usually high temperature above 350 degrees, and the by-products usually exist in gaseous state. After entering the vacuum pipeline, the temperature will drop a lot, causing the by-products to condense into powder, and then combine into solid products to adhere to the vacuum tube wall and subsequently fall into the vacuum pump in blocks or sheets, causing the rotor in the vacuum pump to get stuck, resulting in vacuum pump failure affecting production; and the accumulation of by-products in the vacuum tube causes the equipment to require frequent maintenance, shortening the processing efficiency of the equipment.

[0006] In order to solve the above technical problems, the utility model provides a device for capturing and collecting dust from semiconductor process products, comprising: a mounting box;

[0007] A connection interface, wherein the two connection interfaces are respectively fixedly installed in the middle of the top and the bottom of the outer surface of the installation box, a bellows is provided on one side of the connection interface, a buckle device is provided on one side of the bellows, a first vacuum pipeline is provided on one side of one of the buckle devices, and a cavity is provided on one side of the first vacuum pipeline;

[0008] A second vacuum pipeline, the second vacuum pipeline is arranged on one side of the other snap device, and one end of the second vacuum pipeline is fixedly connected to a vacuum pump;

[0009] A three-dimensional component with a tic-tac-toe structure is arranged inside the installation box, and a U-shaped cooling coil is arranged on the surface inside the installation box. Support frames are fixedly installed on both sides of the bottom of the installation box, and a floor surface is arranged at the bottom of the support frame. Connecting blocks are fixedly installed on both sides of the bottom of the outer surface of the support frame, and the connecting blocks are fixedly installed on the bottom of the floor surface by bolts.

[0010] While the tic-tac-toe structure three-dimensional components are being maintained in conjunction with the cavity, the installation box is dismantled and a new installation box is installed. The dismantled one is sent to a cleaning company. After the installation box is disassembled and disassembled, the tic-tac-toe structure three-dimensional components (with powder adsorbed) are chemically cleaned, washed with water, dried, and then reinstalled into the cleaned installation box for next use.

[0011] Preferably, one end of the U-shaped cooling coil is fixedly connected to a water inlet pipe, and the other end of the U-shaped cooling coil is fixedly connected to a water outlet pipe.

[0012] Compared with the related art, the device for capturing and collecting dust from semiconductor process products provided by the utility model has the following beneficial effects:

[0013] The utility model provides a device for collecting and capturing dust of semiconductor process products. The installation box and the floor surface are separated and removed by bolts. The installation box, the three-dimensional components of the tic-tac-toe structure and the U-shaped cooling coils capture the byproducts discharged from the cavity that are changed from gas to solid. The installation box is regularly disassembled and sent out for cleaning. At the same time, the failure of the vacuum pump caused by the falling of dust can be solved. The use time of the equipment cavity can be extended by coordinating the size of the capacity, the production cycle is increased, the maintenance cycle is shortened, and the production utilization rate of the cavity is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A schematic diagram of the structure of a first embodiment of a device for capturing and collecting dust from semiconductor process products provided by the utility model;

[0015] Numbers in the figure: 1. Installation box, 2. Connection interface, 3. Bellows, 4. Clip device, 5. First vacuum pipeline, 6. Cavity, 7. Second vacuum pipeline, 8. Vacuum pump, 9. Support foot, 10. Connection block, 11. Floor surface, 12. T-shaped three-dimensional component, 13. U-shaped cooling coil, 14. Water inlet pipe, 15. Water outlet pipe. DETAILED DESCRIPTION

[0016] The utility model is further described below in conjunction with the accompanying drawings and implementation modes.

[0017] Please refer to Figure 1 ,in, Figure 1 The schematic diagram of the first embodiment of the device for collecting dust from semiconductor process products provided by the utility model. The device for collecting dust from semiconductor process products includes: an installation box 1;

[0018] A connection interface 2, wherein the two connection interfaces 2 are respectively fixedly installed in the middle of the top and the bottom of the outer surface of the installation box 1, a bellows 3 is provided on one side of the connection interface 2, a buckle device 4 is provided on one side of the bellows 3, a first vacuum pipeline 5 is provided on one side of one of the buckle devices 4, and a cavity 6 is provided on one side of the first vacuum pipeline 5;

[0019] a second vacuum pipeline 7, the second vacuum pipeline 7 being arranged on one side of the other snap-fit ​​device 4, and one end of the second vacuum pipeline 7 being fixedly connected to a vacuum pump 8;

[0020] A three-dimensional component 12 of a tic-tac-toe structure is arranged inside the installation box 1, and a U-shaped cooling coil 13 is arranged on the surface inside the installation box 1. Support frames 9 are fixedly installed on both sides of the bottom of the installation box 1, and a floor surface 11 is arranged at the bottom of the support frame 9. Connecting blocks 10 are fixedly installed on both sides of the bottom of the outer surface of the support frame 9, and the connecting blocks 10 are fixedly installed on the bottom of the floor surface 11 by bolts.

[0021] One end of the U-shaped cooling coil 13 is fixedly connected to a water inlet pipe 14 , and the other end of the U-shaped cooling coil 13 is fixedly connected to a water outlet pipe 15 .

[0022] Cooling water is added through the water inlet pipe 14 , and the cooling water moves in the U-shaped cooling coil 13 to cool the internal space of the installation box 1 .

[0023] The openings in the middle of the upper surface and the middle of the lower surface of the installation box 1 need to be designed to be consistent with the diameter of the vacuum pipeline, and are connected to the vacuum tube through the buffer bellows 3 using a snap device 4.

[0024] A honeycomb-shaped or tic-tac-toe structure that is connected both up and down is installed in the installation box 1 to capture dust formed by the by-products discharged from the cavity.

[0025] The structure designed and installed in the device can capture by-product dust, thereby eliminating and reducing the dust in the vacuum pipeline at the upper end of the vacuum pump, ensuring the safe operation of the vacuum pump and the service life of the equipment cavity.

[0026] While the tic-tac-toe structure three-dimensional components are maintained in conjunction with the cavity, the installation box is dismantled and a new installation box is installed. The dismantled one is sent to a cleaning company. After the installation box is disassembled and disassembled, the tic-tac-toe structure three-dimensional components (with adsorbed dust) are chemically cleaned, washed with water, dried, and reinstalled into the cleaned installation box for next use.

[0027] The working principle of the device for capturing and collecting dust from semiconductor process products provided by the utility model is as follows:

[0028] During operation, first, a mounting box 1 is installed at the bottom of the cavity 6 to capture dust, and is connected to the process cooling circulating water of the factory for use.

[0029] The connecting block 10 and the floor surface 11 can be disassembled and separated by bolts, and the disassembled installation box 1 can be moved out to a cleaning company to remove dust particles captured in the honeycomb or tic-tac-toe structure components, and then reinstalled back into the device after cleaning and sent back to the company for reinstallation and reuse.

[0030] Compared with the related art, the device for capturing and collecting dust from semiconductor process products provided by the utility model has the following beneficial effects:

[0031] The utility model provides a device for collecting and capturing dust of semiconductor process products. The installation box 1 and the floor surface 11 are separated and removed by bolts. The installation box 1, the three-dimensional component 12 of the cross structure and the U-shaped cooling coil 13 capture the byproducts discharged from the cavity 6 that are changed from gas to solid. The installation box 1 is regularly disassembled and sent out for cleaning. At the same time, the failure of the vacuum pump caused by the falling of dust can be solved. The use time of the equipment cavity can be extended by coordinating the size of the capacity, the production cycle is increased, the maintenance cycle is shortened, and the production utilization rate of the cavity is improved.

[0032] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A device for capturing and collecting dust from semiconductor process products, characterized in that: include: Installation box; A connection interface, wherein the two connection interfaces are respectively fixedly installed in the middle of the top and the bottom of the outer surface of the installation box, a bellows is provided on one side of the connection interface, a buckle device is provided on one side of the bellows, a first vacuum pipeline is provided on one side of one of the buckle devices, and a cavity is provided on one side of the first vacuum pipeline; A second vacuum pipeline, the second vacuum pipeline is arranged on one side of the other snap device, and one end of the second vacuum pipeline is fixedly connected to a vacuum pump; A three-dimensional component with a tic-tac-toe structure is arranged inside the installation box, and a U-shaped cooling coil is arranged on the surface inside the installation box. Support frames are fixedly installed on both sides of the bottom of the installation box, and a floor surface is arranged at the bottom of the support frame. Connecting blocks are fixedly installed on both sides of the bottom of the outer surface of the support frame, and the connecting blocks are fixedly installed on the bottom of the floor surface by bolts.

2. The device for capturing and collecting dust from semiconductor process products according to claim 1, characterized in that: One end of the U-shaped cooling coil is fixedly connected to a water inlet pipe, and the other end of the U-shaped cooling coil is fixedly connected to a water outlet pipe.

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