Rotating tool for testing

By designing a test rotary tooling for components including motors, encoders, clamping plates and inner rings, the existing semiconductor testing technology has been solved, and the problem of low efficiency, low automation and difficulty in distinguishing between good and non-good products is achieved, and efficient, automated and precise positioning of semiconductor testing is achieved.

CN222587328UActive Publication Date: 2025-03-11SICHUAN XILONG SEMICON TECH CO LTD
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Patent Information

Application Number
CN202420663322.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-02
Publication Date
2025-03-11
Estimated Expiration
2034-04-02

AI Technical Summary

Technical Problem

The existing semiconductor testing technology is low in efficiency and low in automation, and it is difficult to accurately distinguish between good products and non-good products, which can easily lead to pin deformation.

Method used

A test rotary tool is designed, including relatively arranged end disks, motors, encoders, clamping vertical plates, inner push rods and inner rings, etc. The middle disk is driven to rotate through the motor, combined with the encoder to ensure rotation accuracy, and the stable clamping and precise positioning of semiconductors are achieved by using the clamping vertical plates and inner push rods, and the degree of automation and efficiency of classified cutting are improved through the design of the inner rings and arc grooves.

Benefits of technology

It improves the automation level and efficiency of semiconductor testing, realizes accurate positioning of semiconductors and accurate distinction between good and non-good products, and reduces the risk of pin deformation.

✦ Generated by Eureka AI based on patent content.

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Abstract

A rotating tool for testing comprises a pair of end discs which are oppositely arranged, a motor is installed on one end disc, a rotating shaft is rotationally arranged on the end disc, a middle disc is arranged at the inner side end of the rotating shaft, an output shaft of the motor is connected to one rotating shaft, the middle disc can be driven to rotate through the motor, and in order to facilitate testing, the rotating shaft is arranged on the rotating shaft. And an encoder can be arranged on the motor so as to ensure the precision during rotation adjustment. According to the utility model, automatic testing operation of semiconductors is facilitated, the semiconductors can be accurately positioned during testing, and meanwhile, classified blanking can be carried out.
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Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor testing, in particular to a rotating tool for testing. Background Art

[0002] Semiconductor testing is a necessary process in the semiconductor production process. The test can ensure the semiconductor yield. One type of semiconductor has four pins on it, and its package is a rectangular structure. During the test, the operator places the package on the test bench, and the semiconductor is placed upright, and then the test head is driven by the pressing mechanism to insert the pins into the test head, and then the power is turned on to perform the test operation. This test method is inefficient and has a low degree of automation during the test. When performing automated testing, the main problem is how to distinguish between good and bad products. Secondly, the existing test method is often prone to pin deformation due to the low positioning accuracy of the semiconductor. Utility Model Content

[0003] The utility model provides a testing rotating fixture to solve the above-mentioned deficiencies of the prior art, facilitate the testing of semiconductors, and facilitate the distinction between good semiconductors and bad semiconductors. In addition, the semiconductor can be accurately positioned, and the utility model has strong practicality.

[0004] In order to achieve the purpose of this utility model, the following technologies are proposed:

[0005] A test rotating tooling comprises a pair of oppositely arranged end plates, one of which is equipped with a motor, a rotating shaft is rotatably provided on the end plate, a middle plate is provided on the inner end of the rotating shaft, the output shaft of the motor is connected to one of the rotating shafts, the middle plate can be driven to rotate by the motor, and in order to facilitate testing, an encoder can be provided on the motor to ensure the accuracy of rotation adjustment.

[0006] A plurality of concave seats are installed on the middle disk, and a horizontal plate is installed at the outer end of the concave seat. A pair of guide holes are respectively opened at both ends of the horizontal plate, and screws are passed through the guide holes. A movable upper plate is provided at the upper end of the screws at the same end, and a clamping vertical plate is installed on the movable upper plate. An inner push plate is provided at the lower end of the screws at the same end, and an inner push rod is provided at the lower end of the inner push plate. Guide through rods are provided on both sides of the concave seat, and the guide through rods pass through the inner push plate. A spring is provided on the inner end sleeve of the guide through rod, and the spring is located on the inner side of the inner push plate. The semiconductor can be stably clamped by the clamping vertical plate, and the setting of the spring can make the inner push plate and the clamping vertical plate move outward, thereby facilitating the cancellation of the clamping of the semiconductor, thereby performing the unloading operation. A plurality of mounting rods are installed on the end plate, and an inner ring is installed on the inner end of the mounting rod. A feed notch and a discharge notch are opened on the inner side of the inner ring. The outer end of the inner push rod acts on the inner wall of the inner ring. When the inner push rod is located at the feed notch, the clamping vertical plate is opened and used to clamp the semiconductor. When the inner push rod is located at the discharge notch, the clamping vertical plate is opened and used to cancel the clamping of the semiconductor. By setting the inner ring and the feed notch and the discharge notch thereon, it is convenient to control the position of the clamping vertical plate, thereby facilitating the feeding and unloading operations of the semiconductor, thereby improving the degree of automation during testing.

[0007] Furthermore, a clamping protrusion is provided at the other end of the clamping vertical plate to limit the outer end of the semiconductor to ensure the accuracy after positioning and prevent the semiconductor from moving during rotation.

[0008] Furthermore, a limiting convex plate is provided on the transverse plate, and a slot is provided at the upper end of the limiting convex plate. Through the provision of the slot, the inner end of the semiconductor can be inserted into the slot, thereby further improving the positioning effect of the semiconductor.

[0009] Furthermore, a rolling ball is rotatably provided at the end of the inner push rod to improve the flexibility of the inner push rod when rotating.

[0010] Furthermore, a second discharge notch is provided on the inner side of the inner ring, an arc groove is provided on the inner ring, an arc hole is provided at the bottom of the arc groove, a connecting rod is inserted in the arc hole, a rotating push plate is hinged on the connecting rod, a rotating head is provided on the inner end of the rotating push plate, a sleeve ring is provided on the rotating head, a plurality of mounting feet are provided on the outer periphery of the sleeve ring, the mounting feet are mounted on the end plate, a bridge plate is installed on the inner end of the connecting rod, the bridge plate is located in the arc groove, a hinged rod is provided on the rotating push plate, a cylinder is hinged on the hinged rod, and the other end of the cylinder is hinged on the mounting rod. The second discharge notch is provided to facilitate the unloading of non-conforming products, and in order to avoid mis-unloading, resulting in the unloading of conforming products at the second discharge notch, a bridge plate is provided at the second discharge notch, and the bridge plate can make the conforming semiconductor move on the bridge plate when passing through the second discharge notch through the bridge plate, and the setting of the arc groove plays a role of avoiding the bridge plate, so as to prevent the bridge plate from protruding from the end face of the inner ring.

[0011] The advantages of the above technical solution are:

[0012] The utility model facilitates the automatic testing operation of semiconductors, can accurately position semiconductors during testing, and can also classify and unload materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to make the purpose, technical solutions and advantages of the utility model clearer, the utility model will be further described in detail below with reference to the accompanying drawings.

[0014] Figure 1 The three-dimensional structure of one embodiment is shown Figure 1 .

[0015] Figure 2 The three-dimensional structure of one embodiment is shown Figure 2 .

[0016] Figure 3 The three-dimensional structure of one embodiment is shown Figure 3 .

[0017] Figure 4 The three-dimensional structure of one embodiment is shown Figure 4 . DETAILED DESCRIPTION

[0018] like Figure 1~Figure 4 As shown, a test rotating tool comprises a pair of oppositely arranged end plates 1, one of which is equipped with a motor 10, a rotating shaft is rotatably arranged on the end plate 1, a middle plate 2 is arranged at the inner end of the rotating shaft, and the output shaft of the motor 10 is connected to one of the rotating shafts. The test head is arranged above the middle plate 2, and when the middle plate 2 drives the semiconductor to rotate above the test head, the cylinder on the test head can drive the test head to move downward, and the pins are inserted into the test head, and the test operation is performed.

[0019] A plurality of concave seats 3 are mounted on the middle plate 2. A horizontal plate 30 is mounted on the outer end of the concave seat 3. A limiting convex plate 40 is mounted on the horizontal plate 30. A clamping groove 41 is provided on the upper end of the limiting convex plate 40. A pair of guide holes 31 are respectively provided at both ends of the horizontal plate 30. Screws 32 are inserted into the guide holes 31. A movable upper plate 33 is provided on the upper end of the screws 32 at the same end. A clamping vertical plate 34 is mounted on the movable upper plate 33. A clamping convex 35 is provided on the other end of the clamping vertical plate 34. An inner push plate 36 is provided at the lower end of the screws 32 at the same end. An inner push rod 37 is provided at the lower end of the inner push plate 36. A rolling ball is rotatably provided at the end of the inner push rod 37. Guide rods 38 are provided on both sides of the concave seat 3. The guide rods 38 pass through the inner push plate 36. A spring 39 is provided on the inner end of the guide rod 38. The spring 39 is located on the inner side of the inner push plate 36.

[0020] A plurality of mounting rods 5 are mounted on the end plate 1, an inner ring 50 is mounted on the inner end of the mounting rod 5, a feed notch 51 and a discharge notch 52 are provided on the inner side of the inner ring 50, an outer end of the inner push rod 37 acts on the inner wall of the inner ring 50, when the inner push rod 37 is located at the feed notch 51, the clamping vertical plate 34 is opened and used for clamping the semiconductor, when the inner push rod 37 is located at the discharge notch 52, the clamping vertical plate 34 is opened and used for un-clamping the semiconductor. A second discharge notch 53 is also provided on the inner side of the inner ring 50, an arc-shaped groove is provided on the inner ring 50, an arc-shaped hole is provided at the bottom of the arc-shaped groove, a connecting rod 61 is passed through the arc-shaped hole, a rotating push plate 55 is hinged on the connecting rod 61, a rotating head 56 is provided at the inner end of the rotating push plate 55, a sleeve 57 is sleeved on the rotating head 56, a plurality of mounting feet 58 are provided on the outer periphery of the sleeve 57, the mounting feet 58 are installed on the end plate 1, a bridging plate 54 is installed on the inner end of the connecting rod 61, the bridging plate 54 is located in the arc-shaped groove, a hinged rod 59 is provided on the rotating push plate 55, a cylinder 60 is hinged on the hinged rod 59, and the other end of the cylinder 60 is hinged to the mounting rod 5.

[0021] When the present embodiment is testing, when one of the inner push rods 37 is located at the feed notch 51, the inner push rods 37 move outwards under the action of the springs 39, and the clamping vertical plates 34 are in an open state at this time, and then the semiconductor is passed between the clamping vertical plates 34, and then the middle plate 2 is driven by the motor 10 to rotate, so that when the inner push rods 37 move to the plane of the inner ring 50, the inner push rods 37 move inwards, and at the same time the springs 39 are compressed, and at this time the clamping vertical plates 34 clamp the semiconductor, and then the semiconductor moves to the bottom of the test head in the clamped state, and then the test head is set on the pins, and after the test is completed, the semiconductor is continued to be brought The semiconductor is rotated so as to move to the second discharge notch 53. If the semiconductor is good, the cylinder 60 is started before this. Driven by the cylinder 60, the rotating push plate 55 will rotate around the axial direction of the middle disk 2. At the same time, as the rotating push plate 55 rotates, the bridge plate 54 will overlap the second discharge notch 53, and then the good semiconductor will pass through the second discharge notch 53. When the semiconductor moves to the discharge notch 52, at this time, the inner push rod 37 loses its inner push force, thereby moving outward, and the clamping vertical plate 34 cancels the clamping operation on the semiconductor, and the semiconductor will fall from the middle disk 2.

[0022] The above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Obviously, those skilled in the art can make various changes and modifications to the utility model without departing from the spirit and scope of the utility model. Thus, if these modifications and variations of the utility model fall within the scope of the claims of the utility model and their equivalents, the utility model is also intended to include these modifications and variations.

Claims

1. A test rotating tool, characterized in that: It comprises a pair of end plates (1) arranged opposite to each other, wherein a motor (10) is mounted on one of the end plates (1), a rotating shaft is rotatably provided on the end plate (1), a middle plate (2) is provided at the inner end of the rotating shaft, and an output shaft of the motor (10) is connected to one of the rotating shafts; A plurality of concave seats (3) are mounted on the middle plate (2), a transverse plate (30) is mounted on the outer end of the concave seat (3), a pair of guide holes (31) are respectively opened at both ends of the transverse plate (30), a screw (32) is inserted into the guide hole (31), a movable upper plate (33) is arranged at the upper end of the screw (32) at the same end, a clamping vertical plate (34) is mounted on the movable upper plate (33), an inner push plate (36) is arranged at the lower end of the screw (32) at the same end, an inner push rod (37) is arranged at the lower end of the inner push plate (36), a guide rod (38) is arranged on both sides of the concave seat (3), the guide rod (38) is inserted into the inner push plate (36), a spring (39) is arranged on the inner end sleeve of the guide rod (38), and the spring (39) is located on the inner side of the inner push plate (36); A plurality of mounting rods (5) are mounted on the end plate (1), an inner ring (50) is mounted on the inner end of the mounting rod (5), a feed notch (51) and a discharge notch (52) are provided on the inner side of the inner ring (50), and an outer end of an inner push rod (37) acts on the inner wall of the inner ring (50). When the inner push rod (37) is located at the feed notch (51), the clamping vertical plate (34) is opened and used for clamping the semiconductor. When the inner push rod (37) is located at the discharge notch (52), the clamping vertical plate (34) is opened and used for unclamping the semiconductor.

2. The test rotating fixture according to claim 1, characterized in that: The other end of the clamping vertical plate (34) is provided with a clamping protrusion (35).

3. The test rotating fixture according to claim 1, characterized in that: A limiting convex plate (40) is provided on the transverse plate (30), and a clamping groove (41) is provided at the upper end of the limiting convex plate (40).

4. The test rotating fixture according to claim 1, characterized in that: A rolling ball is rotatably arranged at the end of the inner push rod (37).

5. The test rotating fixture according to claim 1, characterized in that: A second discharge notch (53) is further provided on the inner side of the inner ring (50). An arc groove is provided on the inner ring (50). An arc hole is provided at the bottom of the arc groove. A connecting rod (61) is inserted into the arc hole. A rotating push plate (55) is hingedly connected to the connecting rod (61). A rotating head (56) is provided at the inner end of the rotating push plate (55). A sleeve (57) is sleeved on the rotating head (56). A plurality of mounting feet (58) are provided on the outer periphery of the sleeve (57). The mounting feet (58) are mounted on the end plate (1). A bridge plate (54) is installed at the inner end of the connecting rod (61). The bridge plate (54) is located in the arc groove. A hinged rod (59) is provided on the rotating push plate (55). A cylinder (60) is hingedly connected to the hinged rod (59). The other end of the cylinder (60) is hingedly connected to the mounting rod (5).