Superconducting material surface modification plating solution temperature control automatic adjusting device

Abstract

The utility model relates to the technical field of electroplating, and discloses a superconducting material surface modification plating solution temperature control automatic adjusting device which comprises a hot water tank, a heat supply pipeline, an electroplating solution tank and a digital display temperature controller, one end of the heat supply pipeline is communicated with a water pump, and a temperature probe is connected with an intelligent electronic valve through a probe connecting wire. The input end of the digital display temperature controller is electrically connected with a power supply, the digital display temperature controller is bidirectionally and electrically connected with the intelligent electronic valve, and the input end of the intelligent electronic valve is electrically connected with the temperature probe. According to the utility model, the digital display temperature controller, the intelligent electronic valve and the temperature probe are matched for use, so that when the digital display temperature controller detects the temperature of the electroplating liquid through the temperature probe, the digital display temperature controller can control the intelligent electronic valve to be switched on and off after the temperature of the electroplating liquid becomes low or high; therefore, hot water circulation in the heat supply pipeline is automatically controlled, and the temperature of the electroplating liquid in the electroplating liquid tank is controlled within a specified range by the U-shaped titanium pipe.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating, in particular to an automatic temperature control device for superconducting material surface modification plating solution. Background Art

[0002] In the surface modification of superconducting materials, acid copper is used for modification. The temperature parameters in acid copper plating are related to the quality of copper plating. After the superconducting material is modified, a 15-30μm pure copper plating layer is formed on the surface. The copper layer is required to be uniform and firm. The main purposes are: to enhance the conductivity, so that the current can be better conducted on the surface; to prevent rust, copper has certain corrosion resistance, prolong the service life of superconducting materials, enhance mechanical strength and hardness, and improve wear resistance and pressure resistance. The copper layer will use an excellent dye-free copper plating process. Temperature control is very important. It is set within the range of 40±5°. The coating is uniform, the bonding force is strong and the appearance is consistent. The plating solution has the best stability, which can ensure a wide range of current density.

[0003] At present, it is very troublesome to control the temperature of the plating solution within the range of 40±5°. At present, when controlling the temperature of the plating solution, heat conduction is generally used to control the temperature of the plating solution. However, it is difficult to always ensure that the temperature of the plating solution is within the range of 40±5° when controlling the temperature of the plating solution. Therefore, we propose an automatic temperature control device for superconducting material surface modified plating solution, which can automatically control the process of hot water conduction when the temperature of the plating solution is controlled. Utility Model Content

[0004] In order to solve the technical problems raised in the above background technology, the utility model provides a temperature control automatic regulating device for superconducting material surface modification plating solution.

[0005] The utility model is realized by adopting the following technical scheme: a superconducting material surface modification plating solution temperature control automatic regulating device comprises a hot water tank, and the outer side of the hot water tank is connected with a water pump.

[0006] A heating pipeline, one end of which is connected to a water pump, and the other end of which is connected to a U-shaped titanium tube.

[0007] The heating pipe includes a bent end and a connecting end, an intelligent electronic valve is installed in the middle of the bent end, manual valves A are installed on both sides of the bent end located at the intelligent electronic valve, and a manual valve B is installed in the middle of the connecting end.

[0008] The electroplating liquid tank is arranged on the side of the heating pipe, a temperature probe is installed on the inner side of the electroplating liquid tank, and the temperature probe is connected to the intelligent electronic valve through the probe wiring. The U-shaped titanium tube is installed on the inner side of the electroplating liquid tank, and one end of the U-shaped titanium tube passes through the electroplating liquid tank through a conduit to communicate with the hot water tank.

[0009] A control box, wherein a digital temperature controller and a digital temperature control alarm are installed inside the control box, and the digital temperature control alarm is connected to the intelligent electronic valve via a signal line.

[0010] The input ends of the digital temperature controller and the digital temperature control alarm are both electrically connected to a power source, the digital temperature controller is bidirectionally electrically connected to the intelligent electronic valve, and the input end of the intelligent electronic valve is electrically connected to a temperature probe.

[0011] As a further improvement of the above solution, clamps are installed at equal intervals on the surface of the electroplating liquid tank, and the heating pipes are clamped into the inner sides of the clamps.

[0012] As a further improvement of the above solution, the hot water tank contains hot water of - degrees.

[0013] As a further improvement of the above solution, the temperature probe is a thermistor.

[0014] As a further improvement of the above solution, the number of the clamps is four, and a clamping groove for the heating pipe to be clamped into is provided in the middle of the clamp.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] The utility model uses a digital temperature controller, an intelligent electronic valve and a temperature probe in coordination, so that when the digital temperature controller detects the temperature of the plating solution through the temperature probe, when the temperature of the plating solution becomes low or high, the digital temperature controller can control the intelligent electronic valve to be turned on and off, thereby automatically controlling the circulation of hot water in the heating pipeline, so that the U-shaped titanium tube controls the plating solution in the plating solution tank within a specified temperature range. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the control flow of the utility model.

[0019] Description of main symbols:

[0020] 1 hot water tank, 2 water pump, 3 heating pipe, 4 intelligent electronic valve, 5 manual valve A, 6 manual valve B, 7 electroplating liquid tank, 8 temperature probe, 9 probe wiring, 10 digital display temperature controller, 11 card, 12 power supply, 13 U-type titanium tube, 14 control box, 15 digital display temperature control alarm. DETAILED DESCRIPTION

[0021] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.

[0022] Embodiment 1:

[0023] Please combine Figure 1-2 The present embodiment provides an automatic temperature control device for superconducting material surface modification plating solution, comprising a hot water tank 1 for storing hot water, the outside of the hot water tank 1 is connected to a water pump 2, and the hot water in the hot water tank 1 is 80-90 degrees.

[0024] A heating pipe 3 for circulating hot water has one end connected to the water pump 2 and the other end connected to a U-shaped titanium tube 13 .

[0025] The heating pipe 3 includes a bent end and a connecting end. An intelligent electronic valve 4 is installed in the middle of the bent end. Manual valves A5 are installed on both sides of the intelligent electronic valve 4 at the bent end, and a manual valve B6 is installed in the middle of the connecting end.

[0026] The plating liquid tank 7 is used to store the plating liquid. The plating liquid tank 7 is arranged on the side of the heating pipe 3. A temperature probe 8 is installed on the inner side of the plating liquid tank 7. The temperature probe 8 is a thermistor. The temperature probe 8 is connected to the intelligent electronic valve 4 through the probe wiring 9. A U-shaped titanium tube 13 is installed on the inner side of the plating liquid tank 7, and one end of the U-shaped titanium tube 13 passes through the plating liquid tank 7 through a conduit to communicate with the hot water tank 1. Clips 11 are installed at equal intervals on the surface of the plating liquid tank 7. The heating pipe 3 is clipped into the inner side of the clips 11. There are four clips 11, and a slot for the heating pipe 3 to be clipped into is opened in the middle of the clip 11.

[0027] The control box 14 monitors and adjusts the upper and lower thresholds of the temperature set by the digital temperature controller 10. The digital temperature controller 10 and the digital temperature control alarm 15 are installed inside the control box 14. The digital temperature control alarm 15 is connected to the intelligent electronic valve 4 through a signal line.

[0028] The input ends of the digital temperature controller 10 and the digital temperature control alarm 15 are both electrically connected to the power supply 12 , the digital temperature controller 10 is bidirectionally electrically connected to the intelligent electronic valve 4 , and the input end of the intelligent electronic valve 4 is electrically connected to the temperature probe 8 .

[0029] The implementation principle of an automatic temperature control device for superconducting material surface modification plating solution in the embodiment of the present application is as follows: the digital temperature controller 10 sets the upper and lower temperature thresholds. When the temperature probe 8 detects the temperature of the plating solution, the digital temperature controller 10 controls the on and off of the intelligent electronic valve 4, so that the hot water in the heating pipe 3 can flow into the U-shaped titanium tube 13, and the circulating hot water can control the temperature of the plating solution in the plating liquid tank 7. At the same time, if the digital temperature controller 10 fails, manual operation of the manual valve A5 and the manual valve B6 can also control the on and off of the heating pipe 3 to ensure that the temperature of the plating solution in the plating liquid tank 7 is controlled within the range of 40±5°.

[0030] The above-mentioned implementation modes are only preferred implementation modes of the present invention, and cannot be used to limit the protection scope of the present invention. Any non-substantial changes and substitutions made by technicians in this field on the basis of the present invention shall fall within the scope of protection required by the present invention.

Claims

1. A superconducting material surface modification plating solution temperature control automatic regulating device, characterized in that: include: A hot water tank (1), the outside of which is connected to a water pump (2); A heating pipe (3), one end of the heating pipe (3) being connected to the water pump (2), and the other end of the heating pipe (3) being connected to a U-shaped titanium tube (13); The heating pipe (3) comprises a bent end and a connecting end, an intelligent electronic valve (4) is installed in the middle of the bent end, manual valves A (5) are installed on both sides of the bent end located on the intelligent electronic valve (4), and a manual valve B (6) is installed in the middle of the connecting end; An electroplating liquid tank (7), the electroplating liquid tank (7) being arranged on the side of the heating pipe (3), a temperature probe (8) being installed on the inner side of the electroplating liquid tank (7), the temperature probe (8) being connected to the intelligent electronic valve (4) via a probe connection (9), the U-shaped titanium tube (13) being installed on the inner side of the electroplating liquid tank (7), and one end of the U-shaped titanium tube (13) passing through the electroplating liquid tank (7) via a conduit and being connected to the hot water tank (1); A control box (14), wherein a digital temperature controller (10) and a digital temperature control alarm (15) are installed inside the control box (14), and the digital temperature control alarm (15) is connected to the intelligent electronic valve (4) via a signal line; The input ends of the digital temperature controller (10) and the digital temperature control alarm (15) are both electrically connected to the power supply (12), the digital temperature controller (10) is bidirectionally electrically connected to the intelligent electronic valve (4), and the input end of the intelligent electronic valve (4) is electrically connected to the temperature probe (8).

2. The superconducting material surface modification plating solution temperature control automatic regulating device according to claim 1, characterized in that: The surface of the electroplating liquid tank (7) is provided with clamps (11) installed at equal intervals, and the heating pipe (3) is clamped into the inner side of the clamps (11).

3. The automatic temperature control device for superconducting material surface modification plating solution according to claim 1, characterized in that: The hot water tank (1) contains hot water at 80-90 degrees.

4. The automatic temperature control device for superconducting material surface modification plating solution according to claim 1, characterized in that: The temperature probe (8) is a thermal probe.

5. The automatic temperature control device for superconducting material surface modification plating solution according to claim 2, characterized in that: The number of the clamping pieces (11) is four, and a clamping slot for the heating pipe (3) to be clamped into is provided in the middle of the clamping piece (11).

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