Reflector temperature control system based on double light source processing

Abstract

The utility model provides a reflector temperature control system based on double light source processing, and relates to the technical field of data processing and temperature control. The system comprises a reflector, N semiconductor chilling plates, M heat-sensitive sensors and a controller, each semiconductor is connected with the reflector and the controller, the controller is connected with the heat-sensitive sensors, and the semiconductor chilling plates are used for cooling the reflector; the heat-sensitive sensor is used for measuring temperature data of the reflecting mirror and sending the temperature data to the controller; the controller is used for receiving the temperature data sent by the heat-sensitive sensor and controlling each semiconductor chilling plate; the N semiconductor chilling plates comprise a circular semiconductor chilling plate and N-1 annular semiconductor chilling plates, the N ring areas of the reflecting mirror are connected with the N semiconductor chilling plates respectively, and one or more heat-sensitive sensors are arranged between each semiconductor chilling plate and the reflecting mirror. The temperature of the reflector can be accurately controlled, and the temperature of the reflector can be fed back in real time.

Description

Technical Field

[0001] The present disclosure relates to the technical field of data processing and temperature control, and in particular to a reflector temperature control system based on dual light source processing. Background Art

[0002] In the related art, the two lasers of the reflector processed by dual light sources need to be switched quickly, and the temperature of the reflector changes quickly. The reflector cooling method using water as the medium and a water cooling mechanism is connected to the water cavity of the reflector bracket through the water inlet and outlet pipes. The reflector is cooled as a whole through the reflector bracket. Due to the large capacity of the water cooling machine and the compactness of the reflector module, the cooling of the reflector is delayed, and the set temperature cannot be accurately controlled. In addition, the method of detecting the temperature of the reflector through a photosensitive sensor cannot reflect the temperature distribution of each area of ​​the reflector.

[0003] Therefore, how to increase the cooling rate of the reflector, accurately control the temperature of the reflector, and provide real-time feedback on the temperature of the reflector has become one of the important research directions. Summary of the invention

[0004] The present disclosure aims to solve one of the technical problems in the related art at least to some extent.

[0005] The first aspect of the present disclosure proposes a reflector temperature control system based on dual light source processing, including a reflector, N semiconductor refrigeration sheets, M thermal sensors, and a controller, each semiconductor is connected to the reflector and the controller respectively, and the controller is connected to multiple thermal sensors, wherein:

[0006] Semiconductor cooling sheet, used to dissipate heat from the reflector;

[0007] Thermistor, used to measure the temperature data of the reflector and send it to the controller;

[0008] A controller, used to receive temperature data sent by the thermistor and control each semiconductor cooling chip according to the temperature data;

[0009] Wherein, N and M are integers greater than 2, and M≥N.

[0010] In some embodiments, the N semiconductor refrigerators include a circular semiconductor refrigerator and N-1 annular semiconductor refrigerators, the circular semiconductor refrigerator is deployed at the center of the reflector, and the annular semiconductor refrigerators are nested in turn on the circular semiconductor refrigerator.

[0011] In some embodiments, the reflector is divided into N circles, the N circles are Gaussian distributed, and the N circles are respectively connected to N semiconductor cooling plates.

[0012] In some embodiments, one or more thermal sensors are provided between each semiconductor refrigeration chip and the reflector, and a gap exists between the thermal sensor and the semiconductor refrigeration chip.

[0013] In some embodiments, there is a thermistor between the circular semiconductor refrigeration plate and the reflector, and the thermistor is deployed at the center of the reflector. There are multiple thermistors between the annular semiconductor refrigeration plate and the reflector, and the multiple thermistors are evenly distributed in the circle where the annular semiconductor refrigeration plate is located.

[0014] In some embodiments, the system further includes a host computer, which is connected to the controller and is used to receive and display alarm information sent by the controller. The alarm information is sent by the controller when the temperature data exceeds a preset temperature range.

[0015] In some implementations, the host computer includes a display, and the host computer displays the alarm information based on the display.

[0016] In some embodiments, the controller includes a signal conditioning circuit, a logic controller and a drive circuit, and the logic controller is connected to the signal conditioning circuit and the drive circuit respectively, wherein:

[0017] A signal conditioning circuit is used to perform signal processing on the input temperature data, including filtering, amplification, gain adjustment, and analog-to-digital conversion operations;

[0018] A logic controller, used for generating adjustment instructions corresponding to each semiconductor refrigeration piece according to temperature data;

[0019] The driving circuit is used to convert the adjustment instruction into the cooling temperature of the semiconductor refrigeration plate to control the temperature of the reflecting mirror.

[0020] The second aspect of the present disclosure provides a temperature control method for a reflector based on dual light source processing, comprising:

[0021] Receive candidate temperature data sent by M thermistors, and obtain associations between the M thermistors and N semiconductor refrigeration chips, where M and N are integers greater than 2, and M is greater than or equal to N;

[0022] For each semiconductor refrigeration chip, based on candidate temperature data of one or more thermistors associated with the semiconductor refrigeration chip, a target temperature value of the semiconductor refrigeration chip is obtained;

[0023] A reference temperature value of the reflector is obtained, and based on the reference temperature value and the target temperature value of each semiconductor cooling chip, each semiconductor cooling chip is subjected to differentiated temperature control.

[0024] In some embodiments, one or more thermal sensors are provided between each semiconductor cooling sheet and the reflector, and obtaining the association relationship between the M thermal sensors and the N semiconductor cooling sheets includes:

[0025] For each semiconductor refrigeration chip, one or more thermistors belonging to the semiconductor refrigeration chip are determined as thermistors associated with the semiconductor refrigeration chip.

[0026] In some embodiments, based on a reference temperature value and a target temperature value of each semiconductor cooling chip, differential temperature control is performed on each semiconductor cooling chip, including:

[0027] For each semiconductor refrigeration chip, in response to a difference between a target temperature value and a reference temperature value of the semiconductor refrigeration chip being greater than a preset first temperature threshold, a first adjustment instruction is generated based on the difference and sent to the semiconductor refrigeration chip, the first adjustment instruction being used to control the semiconductor refrigeration chip to lower the temperature;

[0028] In response to the difference between the target temperature value and the reference temperature value of the semiconductor refrigeration chip being less than a preset second temperature threshold, a second adjustment instruction is generated based on the difference and sent to the semiconductor refrigeration chip, the second adjustment instruction being used to control the semiconductor refrigeration chip to increase the temperature;

[0029] The first temperature threshold is greater than or equal to the second temperature threshold.

[0030] In some embodiments, after performing differential temperature control on each semiconductor refrigeration chip, the method further includes:

[0031] Generate alarm information and send it to the host computer.

[0032] The third aspect of the present disclosure provides a reflector temperature control device based on dual light source processing, comprising:

[0033] An acquisition module, used to receive candidate temperature data sent by M thermistors, and acquire associations between the M thermistors and N semiconductor refrigeration chips, where M and N are integers greater than 2, and M is greater than or equal to N;

[0034] A determination module, for obtaining, for each semiconductor refrigeration chip, a target temperature value of the semiconductor refrigeration chip based on candidate temperature data of one or more thermistors associated with the semiconductor refrigeration chip;

[0035] The temperature control module is used to obtain a reference temperature value of the reflector, and based on the reference temperature value and a target temperature value of each semiconductor cooling chip, perform differentiated temperature control on each semiconductor cooling chip.

[0036] In some embodiments, the acquisition module is further used to:

[0037] For each semiconductor refrigeration chip, one or more thermistors belonging to the semiconductor refrigeration chip are determined as thermistors associated with the semiconductor refrigeration chip.

[0038] In some embodiments, the temperature control module is further used to:

[0039] For each semiconductor refrigeration chip, in response to a difference between a target temperature value and a reference temperature value of the semiconductor refrigeration chip being greater than a preset first temperature threshold, a first adjustment instruction is generated based on the difference and sent to the semiconductor refrigeration chip, the first adjustment instruction being used to control the semiconductor refrigeration chip to lower the temperature;

[0040] In response to the difference between the target temperature value and the reference temperature value of the semiconductor refrigeration chip being less than a preset second temperature threshold, a second adjustment instruction is generated based on the difference and sent to the semiconductor refrigeration chip, the second adjustment instruction being used to control the semiconductor refrigeration chip to increase the temperature;

[0041] The first temperature threshold is greater than or equal to the second temperature threshold.

[0042] In some embodiments, the reflector temperature control device based on dual light source processing further includes an alarm module for:

[0043] Generate alarm information and send it to the host computer.

[0044] A fourth aspect of the present disclosure provides an electronic device, including:

[0045] at least one processor; and

[0046] a memory communicatively connected to at least one processor; wherein,

[0047] The memory stores instructions that can be executed by at least one processor, and the instructions are executed by at least one processor so that the at least one processor can execute the reflector temperature control method based on dual light source processing provided in the embodiment of the first aspect of the present disclosure.

[0048] The fifth aspect embodiment of the present disclosure proposes a computer-readable storage medium having computer instructions stored thereon, wherein the computer instructions are used to enable a computer to execute the reflector temperature control method based on dual-light source processing provided in the first aspect embodiment of the present disclosure.

[0049] The sixth aspect embodiment of the present disclosure proposes a computer program product, including a computer program, which, when executed by a processor, implements the reflector temperature control method based on dual light source processing provided in the first aspect embodiment of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] Figure 1It is a structural schematic diagram of a reflector temperature control system based on dual light source processing according to an embodiment of the present disclosure;

[0051] Figure 2 It is a schematic diagram of the structure of a semiconductor refrigeration plate according to an embodiment of the present disclosure;

[0052] Figure 3 is a structural diagram of a thermal sensor according to an embodiment of the present disclosure;

[0053] Figure 4 is a flow chart of a reflector temperature control method based on dual light source processing according to an embodiment of the present disclosure;

[0054] Figure 5 is a structural block diagram of a reflector temperature control device based on dual light source processing according to an embodiment of the present disclosure;

[0055] Figure 6 It is a schematic diagram of the structure of an electronic device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0056] Embodiments of the present disclosure are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present disclosure, and should not be construed as limiting the present disclosure.

[0057] The following describes the reflector temperature control system based on dual light source processing according to an embodiment of the present disclosure in conjunction with the accompanying drawings.

[0058] Figure 1 FIG. 1 is a schematic diagram of a temperature control system of a reflector based on dual light source processing according to an embodiment of the present disclosure. Figure 1 As shown, the system includes a reflector, N semiconductor cooling sheets, M thermal sensors, and a controller. Each semiconductor is connected to the reflector and the controller, respectively. The controller is connected to multiple thermal sensors, wherein:

[0059] The semiconductor refrigeration sheet is used to dissipate heat from the reflector. In the embodiment of the present disclosure, a semiconductor refrigeration sheet is used for heat dissipation. The semiconductor refrigeration sheet does not require a medium for heat conduction and is directly attached to the reflector. The cooling speed is fast and the temperature control accuracy is high.

[0060] Thermistor is used to measure the temperature data of the reflector and send it to the controller; a thermistor is a sensor that can change its resistance value or generate a voltage signal according to temperature changes. They are usually used to measure temperature and detect temperature changes. Optionally, the thermistor can be, for example, a thermistor or a temperature-sensitive resistor.

[0061] Wherein, N and M are integers greater than 2, and M≥N.

[0062] N semiconductor cooling pieces, including a circular semiconductor cooling piece and N-1 annular semiconductor cooling pieces, the reflector is divided into N circles, the N circles are Gaussian distributed, and the N semiconductor cooling pieces are connected respectively. A circular semiconductor cooling piece and two annular semiconductor cooling pieces are used as examples for explanation. Figure 2 As shown, the semiconductor cooling plate includes a circular semiconductor cooling plate 210, annular semiconductor cooling plates 220, and annular semiconductor cooling plates 230. The semiconductor cooling plates are nested with each other and connected to the reflector 200. There are one or more thermal sensors between each semiconductor cooling plate and the reflector, and there is a gap between the thermal sensor and the semiconductor cooling plate.

[0063] In the disclosed embodiment, a thermistor is deployed at the center of the circular semiconductor cooling plate, that is, at the center of the reflector. In addition, four thermistors are evenly distributed in the circle where the annular semiconductor cooling plate is located. Figure 3 As shown, a thermistor 310 is deployed in the center of the circular semiconductor cooling sheet, and four thermistors are evenly deployed on the annular semiconductor cooling sheet adjacent to the circular semiconductor cooling sheet, namely thermistor 321, thermistor 322, thermistor 323, and thermistor 324. Four thermistors are also evenly deployed on the outermost annular semiconductor cooling sheet, namely thermistor 331, thermistor 332, thermistor 333, and thermistor 334. In the disclosed embodiment, a semiconductor cooling sheet is adopted, which has no medium and can be customized in shape. It is small in size, has no leakage risk, is safer, and has a more reasonable structure.

[0064] Optionally, in the disclosed embodiment, a thermal conductive adhesive is used to bond the thermal sensor, and the thermal conductive adhesive mainly comprises silver powder and thermal conductive grease, and has good high temperature resistance and durability. In some embodiments, the position of the thermal sensor on the reflector is first determined, and then an appropriate amount of thermal conductive adhesive is applied to the bottom of the sensor, and then the position is adjusted and waited for bonding.

[0065] The controller is used to receive the temperature data sent by the thermistor and control each semiconductor refrigeration piece according to the temperature data; optionally, the controller in the embodiment of the present disclosure may include a signal conditioning circuit, a logic controller PLC, and a drive circuit, wherein the thermistor feeds back the temperature signal data to the logic controller PLC through a signal processor, and the signal conditioning circuit is used to perform signal processing on the input temperature data, including filtering, amplification, gain adjustment, and analog-to-digital conversion operations, and the logic controller performs statistical operations on the temperature signal data of each circle area, and then compares it with the preset temperature range. If it exceeds the temperature range, an adjustment instruction is output, and the adjustment instruction is converted into the cooling temperature of the semiconductor refrigeration piece through the drive circuit to perform thermal balance on the reflector. In the embodiment of the present disclosure, the cooling of the semiconductor refrigeration piece is controlled by the logic controller according to the temperature feedback of the thermistor sensor of the reflector, so as to realize closed-loop control of the temperature.

[0066] In the disclosed embodiment, according to the Gaussian distribution of the light beam, a method of partition cooling of the reflector is proposed, and semiconductor cooling plates are attached to different areas of the reflector and differentiated temperature control is performed on each cooling plate. In the disclosed embodiment, the reflector is divided into different areas, and each area is attached with a thermistor, and the temperature of each area of ​​the reflector can be fed back in real time through the thermistor. In some embodiments, the reflector temperature control system based on dual light source processing also includes a host computer, which is connected to the controller to receive and display the alarm information sent by the controller to improve the safety of the system. The alarm information is sent by the controller when the temperature data exceeds the preset temperature range. Optionally, the host computer includes a display, and the alarm information can be displayed based on the display. Optionally, the host computer can also provide light reminders or sound reminders based on the alarm information, which is not limited in the disclosed embodiment.

[0067] Figure 4 is a flow chart of a reflector temperature control method based on dual light source processing according to an embodiment of the present disclosure, such as Figure 4 As shown, the method comprises the following steps:

[0068] S401, receiving candidate temperature data sent by M thermistors, and obtaining associations between the M thermistors and N semiconductor cooling sheets.

[0069] Wherein, M and N are integers greater than 2, and M is greater than or equal to N.

[0070] In some embodiments, one or more thermistors are provided between each semiconductor refrigeration plate and the reflector. For each semiconductor refrigeration plate, one or more thermistors belonging to the semiconductor refrigeration plate are determined as thermistors associated with the semiconductor refrigeration plate.

[0071] S402, for each semiconductor refrigeration chip, based on candidate temperature data of one or more thermistors associated with the semiconductor refrigeration chip, obtaining a target temperature value of the semiconductor refrigeration chip;

[0072] In the embodiment of the present disclosure, the candidate temperature data may be a temperature signal. In the embodiment of the present disclosure, after the temperature signal is acquired, the temperature signal may be processed and optimized based on a signal conditioning circuit, for example, including filtering, amplification, gain adjustment, analog-to-digital conversion, etc., to improve the accuracy of the temperature signal, improve the signal-to-noise ratio, and reduce interference, so that the system can work more reliably.

[0073] Optionally, the candidate temperature data may be converted into candidate temperature values, and then the average value of the candidate temperature values ​​may be used as the target temperature value.

[0074] S403, obtaining a reference temperature value of the reflector, and performing differentiated temperature control on each semiconductor cooling chip based on the reference temperature value and a target temperature value of each semiconductor cooling chip.

[0075] For each semiconductor refrigeration chip, in response to the difference between the target temperature value and the reference temperature value of the semiconductor refrigeration chip being greater than a preset first temperature threshold, a first adjustment instruction is generated based on the difference and sent to the semiconductor refrigeration chip, and the first adjustment instruction is used to control the semiconductor refrigeration chip to lower the temperature; for example, for semiconductor refrigeration chip A, if the reference temperature value of the reflector is 20 degrees Celsius, the target temperature value of semiconductor refrigeration chip A is 30 degrees Celsius, and the first temperature threshold is 5 degrees Celsius, then the difference between the target temperature value and the reference temperature value of semiconductor refrigeration chip A is 10 degrees Celsius, which is greater than the preset first temperature threshold, and a first adjustment instruction is generated and sent to semiconductor refrigeration chip A to instruct semiconductor refrigeration chip A to lower the temperature.

[0076] In response to the difference between the target temperature value and the reference temperature value of the semiconductor refrigeration chip being less than a preset second temperature threshold, a second adjustment instruction is generated based on the difference and sent to the semiconductor refrigeration chip, and the second adjustment instruction is used to control the semiconductor refrigeration chip to increase the temperature; for example, for semiconductor refrigeration chip B, if the reference temperature value of the reflector is 20 degrees Celsius, the target temperature value of semiconductor refrigeration chip B is 10 degrees Celsius, and the second temperature threshold is -5 degrees Celsius, then the difference between the target temperature value and the reference temperature value of semiconductor refrigeration chip B is -10 degrees Celsius, which is less than the preset second temperature threshold, and a second adjustment instruction is generated and sent to semiconductor refrigeration chip B to instruct semiconductor refrigeration chip B to increase the temperature.

[0077] The first temperature threshold is greater than or equal to the second temperature threshold.

[0078] Because the laser energy is in the form of Gaussian distribution, the temperature in the center of the reflector is high, and the surrounding temperature gradually decreases. The present invention can measure the temperature of each area of ​​the reflector and dissipate heat. The reflector surface is partitioned according to the Gaussian distribution of laser energy. Each area has an independent temperature measurement module (thermistor) and heat dissipation module (semiconductor cooling sheet). The temperature control of the reflector is more balanced, avoiding surface changes caused by uneven heat dissipation of the reflector. The semiconductor cooling sheet used can achieve temperature control of ±0.01°C, with higher control accuracy.

[0079] In some embodiments, after performing differentiated temperature control on each semiconductor refrigeration plate, an alarm message is generated and sent to a host computer. The alarm message is sent by the controller when the temperature data exceeds a preset temperature range. Optionally, the host computer includes a display, and the alarm message can be displayed based on the display. Optionally, the host computer can also perform light reminders or sound reminders based on the alarm message, which is not limited in the embodiments of the present disclosure.

[0080] In the disclosed embodiment, a semiconductor cooling plate is used, which has no medium and can be customized in shape. It is small in size, has no leakage risk, is safer, and has a more reasonable structure. The controller controls the cooling of the semiconductor cooling plate according to the temperature feedback of the thermistor sensor to achieve closed-loop control of the temperature, thereby avoiding changes in the surface shape caused by uneven heat dissipation of the reflector. The cooling speed of the reflector can be increased, the temperature of the reflector can be accurately controlled, and the temperature of the reflector can be fed back in real time.

[0081] Figure 5 is a structural block diagram of a reflector temperature control device based on dual light source processing according to an embodiment of the present disclosure, such as Figure 5 As shown, the reflector temperature control device 500 based on dual light source processing includes:

[0082] The acquisition module 510 is used to receive the candidate temperature data sent by M thermistors, and acquire the association relationship between the M thermistors and N semiconductor refrigeration chips, where M and N are integers greater than 2, and M is greater than or equal to N;

[0083] A determination module 520 is used to obtain a target temperature value of each semiconductor refrigeration chip based on candidate temperature data of one or more thermistors associated with the semiconductor refrigeration chip.

[0084] The temperature control module 530 is used to obtain a reference temperature value of the reflector, and perform differentiated temperature control on each semiconductor cooling chip based on the reference temperature value and a target temperature value of each semiconductor cooling chip.

[0085] In some implementations, the acquisition module 510 is further configured to:

[0086] For each semiconductor refrigeration chip, one or more thermistors belonging to the semiconductor refrigeration chip are determined as thermistors associated with the semiconductor refrigeration chip.

[0087] In some embodiments, the temperature control module 530 is further configured to:

[0088] For each semiconductor refrigeration chip, in response to a difference between a target temperature value and a reference temperature value of the semiconductor refrigeration chip being greater than a preset first temperature threshold, a first adjustment instruction is generated based on the difference and sent to the semiconductor refrigeration chip, the first adjustment instruction being used to control the semiconductor refrigeration chip to lower the temperature;

[0089] In response to the difference between the target temperature value and the reference temperature value of the semiconductor refrigeration chip being less than a preset second temperature threshold, a second adjustment instruction is generated based on the difference and sent to the semiconductor refrigeration chip, the second adjustment instruction being used to control the semiconductor refrigeration chip to increase the temperature;

[0090] The first temperature threshold is greater than or equal to the second temperature threshold.

[0091] In some embodiments, the reflector temperature control device 500 based on dual light source processing further includes an alarm module 540 for:

[0092] Generate alarm information and send it to the host computer.

[0093] In the disclosed embodiment, a semiconductor cooling plate is used, which has no medium and can be customized in shape. It is small in size, has no leakage risk, is safer, and has a more reasonable structure. The controller controls the cooling of the semiconductor cooling plate according to the temperature feedback of the thermistor sensor to achieve closed-loop control of the temperature, thereby avoiding changes in the surface shape caused by uneven heat dissipation of the reflector. The cooling speed of the reflector can be increased, the temperature of the reflector can be accurately controlled, and the temperature of the reflector can be fed back in real time.

[0094] The acquisition, transmission, storage, use, and processing of data in the technical solution disclosed in this disclosure are in compliance with the relevant provisions of national laws and regulations. It should be noted that in the embodiments of this disclosure, some existing solutions in the industry such as certain software, components, and models may be mentioned, which should be considered as exemplary, and their purpose is only to illustrate the feasibility of implementing the technical solution of this application, but it does not mean that the applicant has or will necessarily use the solution.

[0095] Figure 6 It is a schematic diagram of the structure of an electronic device according to an embodiment of the present disclosure.

[0096] like Figure 6 As shown, the electronic device 600 includes:

[0097] The memory 601 and the processor 602, a bus 603 connecting different components (including the memory 601 and the processor 602), the memory 601 stores a computer program, and when the processor 602 executes the program, the reflector temperature control method based on dual light source processing of the embodiment of the present disclosure is implemented.

[0098] Bus 603 represents one or more of several types of bus structures, including a memory bus or memory controller, a peripheral bus, an accelerated graphics port, a processor or a local bus using any of a variety of bus structures. For example, these architectures include but are not limited to Industry Standard Architecture (ISA) bus, Micro Channel Architecture (MAC) bus, Enhanced ISA bus, Video Electronics Standards Association (VESA) local bus and Peripheral Component Interconnect (PCI) bus.

[0099] The electronic device 600 typically includes a variety of electronic device readable media. These media can be any available media that can be accessed by the electronic device 600, including volatile and non-volatile media, removable and non-removable media.

[0100] The memory 601 may also include computer system readable media in the form of volatile memory, such as random access memory (RAM) 604 and / or cache memory 605. The electronic device 600 may further include other removable / non-removable, volatile / non-volatile computer system storage media. By way of example only, the storage system 606 may be used to read and write non-removable, non-volatile magnetic media ( Figure 6 not shown, usually called a "hard drive"). Although Figure 6 Not shown in the figure, a disk drive for reading and writing to a removable non-volatile disk (e.g., a "floppy disk"), and an optical disk drive for reading and writing to a removable non-volatile optical disk (e.g., a CD-ROM, a DVD-ROM, or other optical media) may be provided. In these cases, each drive may be connected to the bus 603 via one or more data medium interfaces. The memory 601 may include at least one program product having a set (e.g., at least one) of program modules that are configured to perform the functions of the various embodiments of the present disclosure.

[0101] A program / utility 608 having a set (at least one) of program modules 607 may be stored, for example, in the memory 601, such program modules 607 including but not limited to an operating system, one or more application programs, other program modules, and program data, each of which or some combination may include an implementation of a network environment. The program modules 607 generally perform the functions and / or methods of the embodiments described in the present disclosure.

[0102] The electronic device 600 may also communicate with one or more external devices 609 (e.g., keyboard, pointing device, display 611, etc.), one or more devices that enable a user to interact with the electronic device 600, and / or any device that enables the electronic device 600 to communicate with one or more other computing devices (e.g., network card, modem, etc.). Such communication may be performed through an input / output (I / O) interface 612. Furthermore, the electronic device 600 may also communicate with one or more networks (e.g., local area network (LAN), wide area network (WAN) and / or public network, such as the Internet) through a network adapter 613. Figure 6 As shown, the network adapter 613 communicates with other modules of the electronic device 600 via the bus 603. It should be understood that, although not shown in the figure, other hardware and / or software modules can be used in conjunction with the electronic device 600, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup storage systems.

[0103] The processor 602 executes various functional applications and data processing by running the programs stored in the memory 601 .

[0104] It should be noted that the implementation process and technical principles of the electronic device of this embodiment refer to the aforementioned explanation of the reflector temperature control method based on dual light source processing in the embodiment of the present disclosure, and will not be repeated here.

[0105] In order to implement the above embodiments, the present disclosure also proposes a computer-readable storage medium.

[0106] When the instructions in the computer-readable storage medium are executed by the processor of the electronic device, the electronic device can perform the above-mentioned reflector temperature control method based on dual light source processing. Optionally, the computer-readable storage medium can be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, etc.

[0107] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. The present disclosure is intended to cover any variations, uses or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The description and examples are to be considered exemplary only, and the true scope and spirit of the present disclosure are indicated by the following claims.

[0108] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A reflector temperature control system based on dual light source processing, characterized in that: It includes a reflector, N semiconductor cooling sheets, M thermal sensors, and a controller, each of the semiconductors is connected to the reflector and the controller, respectively, and the controller is connected to a plurality of the thermal sensors, wherein: The semiconductor cooling sheet is used to dissipate heat from the reflector; The thermistor is used to measure the temperature data of the reflector and send it to the controller; The controller is used to receive the temperature data sent by the thermistor and control each of the semiconductor cooling chips according to the temperature data; Wherein, N and M are integers greater than 2, and M≥N.

2. The system according to claim 1, characterized in that The N semiconductor refrigeration plates include a circular semiconductor refrigeration plate and N-1 annular semiconductor refrigeration plates. The circular semiconductor refrigeration plate is deployed at the center of the reflector, and the annular semiconductor refrigeration plates are nested on the circular semiconductor refrigeration plates in sequence.

3. The system according to claim 2, characterized in that The reflector is divided into N circles, the N circles are Gaussian distributed, and the N circles are respectively connected to the N semiconductor cooling plates.

4. The system according to claim 3, characterized in that One or more thermistors are provided between each of the semiconductor refrigeration sheets and the reflector, and a gap exists between the thermistors and the semiconductor refrigeration sheets.

5. The system according to claim 3, characterized in that There is a thermistor between the circular semiconductor refrigeration plate and the reflector, and the thermistor is deployed at the center of the reflector. There are multiple thermistors between the annular semiconductor refrigeration plate and the reflector, and the multiple thermistors are evenly distributed in the circle where the annular semiconductor refrigeration plate is located.

6. The system according to claim 1, characterized in that It also includes a host computer, which is connected to the controller and is used to receive and display alarm information sent by the controller. The alarm information is sent by the controller when the temperature data exceeds a preset temperature range.

7. The system according to claim 6, characterized in that The host computer includes a display, and the host computer displays the alarm information based on the display.

8. The system according to claim 1, characterized in that The controller includes a signal conditioning circuit, a logic controller and a driving circuit, wherein the logic controller is connected to the signal conditioning circuit and the driving circuit respectively, wherein: The signal conditioning circuit is used to perform signal processing on the input temperature data, including filtering, amplification, gain adjustment, and analog-to-digital conversion operations; The logic controller is used to generate an adjustment instruction corresponding to each semiconductor refrigeration plate according to the temperature data; The driving circuit is used to convert the adjustment instruction into the cooling temperature of the semiconductor refrigeration plate to control the temperature of the reflecting mirror.

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