Chip bonding device for chip processing

Abstract

The utility model discloses a chip bonding device for chip processing, which comprises a rack, the top of the rack is fixedly connected with a wire coil, the bottom of the rack is fixedly connected with a bottom plate, the top of the bottom plate is provided with a plurality of T-shaped blocks, the top of the bottom plate is provided with a clamping mechanism, the clamping mechanism comprises a bottom block, and the bottom block is fixedly connected with the wire coil. The top of the bottom block is engaged with a lifting block, the top of the lifting block is engaged with a knob, the middle of the knob is rotatably connected with a connecting rod, and one end of the connecting rod is engaged with a bolt. According to the chip bonding device for chip processing, substrates and chips with different sizes and different shapes can be fixed by arranging the clamping mechanism, so that the chips and the substrates are not easy to shake in the bonding process to influence the bonding effect, and when chips with different specifications are processed, the chip bonding device can be used for processing chips with different specifications. And other fixing instruments do not need to be replaced, so that the time for replacing the instruments is saved.

Description

Technical Field

[0001] The utility model relates to the field of chip processing, in particular to a chip bonding device used for chip processing. Background Art

[0002] During chip processing, a bonding process is required to connect the chip and the substrate through metal wires. During the bonding process, a professional bonding device is required for welding. Therefore, in the field of chip production, chip bonding devices play a vital role.

[0003] However, when using existing chip bonding devices, separate tools are needed to fix substrates of different shapes and sizes, as well as chips of different models, which increases equipment costs and makes replacement more cumbersome. The existing chip bonding devices cannot meet the welding requirements that require adjusting the relative height of the chip and the substrate. Utility Model Content

[0004] The main purpose of the utility model is to provide a chip bonding device for chip processing, which can effectively solve the technical problems in the background technology.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0006] A chip bonding device for chip processing comprises a frame, the top of the frame is fixedly connected to a wire coil, the bottom of the frame is fixedly connected to a base plate, a plurality of T-shaped blocks are arranged on the top of the base plate, and a clamping mechanism is arranged on the top of the base plate, the clamping mechanism comprises a base block, the top of the base block is engaged with a lifting block, the top of the lifting block is engaged with a knob, the middle part of the knob is rotatably connected to a connecting rod, and one end of the connecting rod is engaged with a connecting bolt.

[0007] As a further solution of the utility model, the middle part of the bolt is engaged with a clamping block, and the bottom of the clamping block is movably connected to the top of the connecting rod.

[0008] As a further solution of the utility model, a screw hole penetrating to the bottom is opened on the top of the clamping block, and a circular protrusion is provided on the top of the clamping block.

[0009] As a further solution of the utility model, a cylindrical protrusion is provided on the top of the bottom block, and a thread is provided on the outer circle portion of the cylindrical protrusion.

[0010] As a further solution of the utility model, a screw hole penetrating to the interior is opened at the bottom of the lifting block, and the screw hole of the lifting block matches the thread of the bottom block.

[0011] As a further solution of the utility model, a circular protrusion is provided on the top of the bolt, and the circular protrusion has the same diameter as the circular protrusion of the clamping block.

[0012] As a further solution of the utility model, a screw hole is opened at one end of the connecting rod, and a round hole is opened at the other end of the connecting rod.

[0013] The beneficial effects of the utility model are as follows: by setting a clamping mechanism, substrates and chips of different sizes and shapes can be fixed, and the chip and the substrate are not easy to shake during the bonding process to affect the bonding effect, and when processing chips of different specifications, there is no need to replace other fixing devices, thereby saving time for replacing devices;

[0014] By setting a clamp, the height of the chip and the substrate can be adjusted. When the curvature of the bonding wire needs to be adjusted, the curvature of the bonding wire can be adjusted by changing the height of the chip and the substrate. By adjusting the height of the chip, the operator can fine-tune the bonding process. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the overall structure of a chip bonding device for chip processing according to the utility model;

[0016] Figure 2 This is a cross-sectional view of a bolt of a chip bonding device for chip processing according to the utility model;

[0017] Figure 3 The utility model is a top view of a chip bonding device used for chip processing.

[0018] In the figure: 1, frame; 2, wire roll; 3, clamping mechanism; 4, bottom plate; 5, T-shaped block; 6, bottom block; 7, lifting block; 8, knob; 9, connecting rod; 10, bolt; 11, clamping block. DETAILED DESCRIPTION

[0019] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0020] like Figure 1-3 As shown, a chip bonding device for chip processing includes a frame 1, the top of the frame 1 is fixedly connected to a wire roll 2, the bottom of the frame 1 is fixedly connected to a base plate 4, a plurality of T-shaped blocks 5 are provided on the top of the base plate 4, and a clamping mechanism 3 is provided on the top of the base plate 4, the clamping mechanism 3 includes a base block 6, the top of the base block 6 is engaged with a lifting block 7, the top of the lifting block 7 is engaged with a knob 8, the middle of the knob 8 is rotatably connected to a connecting rod 9, and one end of the connecting rod 9 is engaged with a connecting bolt 10.

[0021] In this embodiment, the middle portion of the bolt 10 is engaged with the clamping block 11 , and the bottom portion of the clamping block 11 is movably connected to the top portion of the connecting rod 9 .

[0022] By setting the clamp block 11, the object between the clamp block 11 and the bolt 10 can be clamped by rising the clamp block 11. When the height between the chip and the substrate needs to be adjusted, the height difference between the chip and the substrate can be adjusted by clamping the chip or the substrate.

[0023] In this embodiment, a screw hole penetrating to the bottom is opened on the top of the clamping block 11 , and a circular protrusion is provided on the top of the clamping block 11 .

[0024] The clamping block 11 moves up and down by meshing with the bolt 10 , and cooperates with the bolt 10 to clamp the object.

[0025] In this embodiment, a cylindrical protrusion is provided on the top of the bottom block 6, and a thread is provided on the outer circumference of the cylindrical protrusion.

[0026] The bottom block 6 is connected to the lifting block 7 via a cylindrical protrusion and serves to fix the lifting block 7 .

[0027] In this embodiment, a screw hole penetrating to the interior is opened at the bottom of the lifting block 7 , and the screw hole of the lifting block 7 matches the thread of the bottom block 6 .

[0028] The lifting block 7 can move up and down along the bottom block 6 through meshing, thereby maintaining or releasing the position limitation between itself and the bottom block 6 .

[0029] In this embodiment, a circular protrusion is provided on the top of the bolt 10 , and the circular protrusion has the same diameter as the circular protrusion of the clamping block 11 .

[0030] The bolt 10 can move along its own axis when rotating, and when the bolt 10 moves down a certain distance, the chip or substrate can be fixed.

[0031] In this embodiment, a screw hole is formed at one end of the connecting rod 9 , and a round hole is formed at the other end of the connecting rod 9 .

[0032] The connecting rod 9 can connect the bolt 10 and the knob 8, so as to achieve the function of adjusting the contact position between the bolt 10 and the workpiece.

[0033] It should be noted that the utility model is a chip bonding device for chip processing, which can fix substrates and chips of different shapes and sizes when in use. The specific operation method is to insert the bottom block 6 and the lifting block 7 from the side of the bonding device into the gap between any two T-shaped blocks 5, and make the bottom of the bottom block 6 fit with the top of the bottom plate 4;

[0034] Place the chip against the middle of the bottom plate 4, and then move it downward until the bottom of the chip contacts the top of the T-shaped block 5, push the bottom block 6 to slide on the top of the bottom plate 4 to the edge of the chip, and after moving the bottom block 6 to a suitable position, turn the lifting block 7. When the lifting block 7 is turned, it will move up and down along the axis of the bottom block 6 under the meshing action of the thread, and the lifting block 7 can be turned in different directions to move in different directions;

[0035] Rotate the lifting block 7 to move it upward. After the lifting block 7 moves a certain distance, the top surface of the bottom protrusion will contact the bottom of the T-shaped block 5. Continue to rotate the lifting block 7 to move it upward to increase the friction force at the contact position with the T-shaped block 5. When the friction force between the lifting block 7 and the T-shaped block 5 increases to a certain extent, the lifting block 7 will be fixed.

[0036] After fixing the lifting block 7, turn the knob 8 to make the knob 8 rise under the action of the thread, thereby releasing the restriction on the other end of the connecting rod 9, so that the connection between the connecting rod 9 and the knob 8 can rotate, and turn the connecting rod 9 to make the other end rotate around the knob 8. When the connecting rod 9 rotates, the other end will drive the bolt 10 and the clamping block 11 to rotate together;

[0037] Turn the connecting rod 9 so that the bottom of the bolt 10 is directly above the chip, and then turn the knob 8 in the opposite direction to move the knob 8 downward until the knob 8 contacts the top of the other end of the connecting rod 9. After the knob 8 moves down a certain distance, the other end of the connecting rod 9 will be fixed to keep it in the current state.

[0038] After the connecting rod 9 is fixed, the bolt 10 is rotated to make it move downward under the action of the thread. After the bolt 10 moves downward for a certain distance, its bottom end will contact the chip. Appropriate force is applied to the chip through the bottom end of the bolt 10. By the same method, three to four action points are applied around the chip to fix the chip.

[0039] By rotating the bolt 10 in the opposite direction, the fixing of the chip by the bolt 10 can be released. By rotating the knob 8 in the opposite direction, the connecting rod 9 can be rotated again. By rotating the lifting block 7 in the opposite direction, the contact between the lifting block 7 and the T-shaped block 5 can be released, so that the bottom block 6 can be moved again.

[0040] By rotating the clamp block 11, it can be moved along the axis of the bolt 10 under the action of the thread, and the clamp block 11 can be controlled to move upward to clamp the object between the top of the clamp block 11 and the bottom of the protrusion of the bolt 10. The side of the chip or substrate is placed between the top of the clamp block 11 and the bottom of the protrusion of the bolt 10, and the clamp block 11 is rotated to move upward until the substrate is clamped;

[0041] By the same method, three clamping points are set on the edge of the substrate, so that the substrate can be stably fixed, and the bolt 10 is rotated to move upward before clamping, so that the height of the substrate clamping can be increased. When the chip is bonded, the relative height of the chip and the substrate and the welding head can be changed by changing the height of the substrate or the chip, thereby adjusting the curvature of the bonding wire after welding;

[0042] By setting up the clamping mechanism 3, the bonding device can fix chips and substrates of different sizes and shapes, and by adding the clamping mechanism 3, the clamping force points can be increased to improve stability, reduce shaking during bonding, and the clamping height can be adjusted to meet more complex process requirements.

[0043] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A chip bonding device for chip processing, characterized in that: The invention comprises a frame (1), the top of the frame (1) is fixedly connected to a wire roll (2), the bottom of the frame (1) is fixedly connected to a bottom plate (4), the top of the bottom plate (4) is provided with a plurality of T-shaped blocks (5), and the top of the bottom plate (4) is provided with a clamping mechanism (3), the clamping mechanism (3) comprises a bottom block (6), the top of the bottom block (6) is meshedly connected to a lifting block (7), the top of the lifting block (7) is meshedly connected to a knob (8), the middle of the knob (8) is rotatably connected to a connecting rod (9), and one end of the connecting rod (9) is meshedly connected to a connecting bolt (10).

2. A chip bonding device for chip processing according to claim 1, characterized in that: The middle part of the bolt (10) is engaged with a clamping block (11), and the bottom of the clamping block (11) is movably connected to the top of the connecting rod (9).

3. A chip bonding device for chip processing according to claim 2, characterized in that: The top of the clamping block (11) is provided with a screw hole penetrating to the bottom, and the top of the clamping block (11) is provided with a circular protrusion.

4. The chip bonding device for chip processing according to claim 1, characterized in that: A cylindrical protrusion is provided on the top of the bottom block (6), and a thread is provided on the outer circumference of the cylindrical protrusion.

5. The chip bonding device for chip processing according to claim 1, characterized in that: The bottom of the lifting block (7) is provided with a screw hole penetrating to the interior, and the screw hole of the lifting block (7) matches the thread of the bottom block (6).

6. The chip bonding device for chip processing according to claim 1, characterized in that: A circular protrusion is provided on the top of the bolt (10), and the circular protrusion has the same diameter as the circular protrusion of the clamping block (11).

7. The chip bonding device for chip processing according to claim 1, characterized in that: One end of the connecting rod (9) is provided with a screw hole, and the other end of the connecting rod (9) is provided with a round hole.

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