Chip thermocompression bonding device

Abstract

The invention relates to the technical field of semiconductors, in particular to a chip thermocompression bonding device, which comprises a driving mechanism comprising a shell and a main shaft rotationally connected to the shell; the hot-pressing mechanism is detachably connected to the tail end of the main shaft, the hot-pressing mechanism and the main shaft are communicated in the axial direction to form a first channel, the hot-pressing mechanism comprises a heat dissipation assembly and a heating assembly in the axial direction, the heat dissipation assembly and the heating assembly are sequentially conducted through the first channel, and the tail end of the heating assembly is used for adsorbing a chip; and the protection mechanism is internally provided with a plurality of second channels, the input ends of the second channels are used for introducing protective gas, and the output ends of the second channels are arranged towards the hot pressing mechanism so as to output the protective gas to the chip and cool the hot pressing mechanism. The chip is prevented from being oxidized or polluted at high temperature, and meanwhile, the temperature of the hot-pressing mechanism and the main shaft is reduced, so that accurate movement and positioning of the pressing head are ensured, and the bonding quality and the reliability of a final product are improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a chip thermal compression bonding device. Background Art

[0002] With the promotion and application of power modules, and the gradual application of wide bandgap semiconductors represented by silicon carbide and gallium nitride, traditional welding processes and materials have been difficult to meet the requirements of high-power semiconductors working at high frequencies and high temperatures. As an emerging chip welding technology, silver sintering patch technology has gradually gained widespread attention and application in the industry due to its excellent reliability, thermal conductivity and adaptability to high temperatures. The silver sintering bonding process uses silver powder, silver paste (silver paste) or silver film as the intermediate layer material, and under specific temperature, pressure and time conditions, through solid diffusion or liquid sintering, it achieves a close bond and reliable connection between the chip and the substrate to meet the performance requirements of high-power semiconductors.

[0003] However, during the hot-compression bonding operation of chips, the heating element at the end of the bonding equipment will release a large amount of heat energy. This heat is not only used to achieve effective bonding between chips, but will also inevitably radiate to the surroundings and along the equipment. As the core transmission component in the hot-compression bonding equipment, the spindle is responsible for accurately controlling the movement and positioning of the pressure head. Its stability and accuracy are directly related to the bonding quality and the reliability of the final product. However, when the heat at the end of the equipment is transferred to the spindle by conduction, convection or radiation, the spindle temperature will increase. The thermal expansion coefficient of the spindle material determines the degree of deformation after heating. This dimensional change caused by temperature will directly affect the mechanical properties and dynamic characteristics of the spindle.

[0004] Specifically, the thermal stress generated by the spindle after heating is an issue that cannot be ignored. Thermal stress is an internal stress state caused by uneven temperature distribution inside the material. It may cause changes in the microstructure of the spindle material, such as grain growth and residual stress accumulation, which in turn affects the overall strength and stiffness of the spindle. Under long-term effects, thermal stress may also accelerate fatigue damage to the spindle and shorten its service life.

[0005] In addition, the angular accuracy of the spindle is a key factor in ensuring accurate chip alignment and uniform pressure distribution. When the spindle is heated, the straightness of its axis, the clearance of the bearings, and the stability of the transmission system may be affected, resulting in a decrease in angular accuracy. This will not only reduce the quality of the bond, such as increasing interface defects and reducing bond strength, but may also cause equipment vibration and noise, further affecting production efficiency and product quality. Summary of the invention

[0006] The purpose of the present invention is to provide a chip thermal compression bonding device to solve the problem in the prior art that heat is radiated to the spindle and damages the spindle during chip bonding.

[0007] The technical solution of the present invention is: a chip hot pressing bonding device, comprising: a driving mechanism, comprising a shell and a main shaft, the main shaft is rotatably connected to the shell; a hot pressing mechanism, detachably connected to the end of the main shaft, the hot pressing mechanism and the main shaft are axially connected to form a first channel, the hot pressing mechanism includes a heat dissipation component and a heating component along the axial direction, the first channel sequentially connects the heat dissipation component and the heating component, and the end of the heating component is used to adsorb the chip; a protective mechanism, a plurality of second channels are provided therein, the input end of the second channel is used to introduce protective gas, and the output end of the second channel is arranged toward the direction of the hot pressing mechanism to output protective gas to the chip and cool the hot pressing mechanism.

[0008] Preferably, the heat dissipation component includes a base and a conduit, the conduit is supported in the base, the conduit axially connects the main shaft and the heating component, the base includes heat dissipation holes and heat dissipation space, the conduit is located in the heat dissipation space, and a number of the heat dissipation holes connect the heat dissipation space and the outside world.

[0009] Preferably, the output end of the second channel is arranged axially, and the heat dissipation holes are arranged radially, and the gas path of the output end of the second channel intersects with the gas path of the heat dissipation holes to accelerate the airflow exchange between the heat dissipation space and the outside.

[0010] Preferably, the heating assembly includes a hot nozzle and a thermal insulation member, the hot nozzle is detachably connected to the thermal insulation member, the hot nozzle is heated by a heating plate, the hot nozzle is connected to the conduit in the thermal insulation member, the thermal insulation member is fixed to the bottom of the base, and the thermal insulation member blocks the contact between the base and the hot nozzle to prevent heat from radiating toward the base.

[0011] Preferably, the hot nozzle partially protrudes out of the thermal insulation member, and the hot nozzle includes a connecting part, a supporting part and a pressurizing part in sequence along the axial direction, the connecting part is detachably connected to the thermal insulation member and is communicated with the conduit, the supporting part abuts against the bottom of the thermal insulation member, and the pressurizing part protrudes out of the bottom surface of the supporting part.

[0012] Preferably, the shell is provided with a retaining ring, the retaining ring is fixedly connected to the main shaft, the retaining ring is limitedly built into the shell along the axis, the main shaft drives the retaining ring to rotate relative to the shell, and the shell and the main shaft are both radially sealed with the shell.

[0013] Preferably, the shell is fixedly provided with a driving motor, the output shaft of the driving motor is axially arranged, the output shaft of the driving motor is fixedly connected to one end of the main shaft, the driving motor drives the main shaft to rotate, and the main shaft drives the hot pressing mechanism to rotate.

[0014] Preferably, a pressure head is provided between the main shaft and the driving motor, a pressure sensor is fixedly provided on the housing, and the pressure sensor is electrically connected to the pressure head to detect the bonding force on the chip.

[0015] Compared with the prior art, the advantages of the present invention are:

[0016] (1) The protective gas is introduced into several second channels in the protection mechanism, which can provide the necessary protective atmosphere (such as inert gas protection) during the chip bonding process to prevent the chip from being oxidized or contaminated at high temperatures. At the same time, when the protective gas flows through the hot pressing mechanism, it can also take away some heat, further reducing the temperature of the hot pressing mechanism and the spindle. Through the dual effects of the heat dissipation component of the hot pressing mechanism and the protective gas of the protection mechanism, the temperature rise of the spindle caused by heating is effectively reduced. This not only reduces the dimensional change of the spindle caused by thermal expansion, but also maintains the stability of the mechanical properties and dynamic characteristics of the spindle, thereby ensuring the precise movement and positioning of the pressure head and improving the bonding quality and reliability of the final product.

[0017] (2) The conduit located in the base has a good heat dissipation effect. The heat in the conduit can be quickly transferred to the base through the heat dissipation space and dissipated to the outside through the heat dissipation holes. The efficient heat dissipation of the conduit helps to reduce its temperature, thereby maintaining its stable thermal conductivity, thereby effectively reducing the heat transferred from the heating component to the spindle, which helps to reduce the temperature of the spindle and reduce the thermal stress caused by the temperature increase, thereby protecting the microstructure of the spindle material and extending the service life of the spindle. The base and the conduit make the entire heat dissipation component compact and occupy a small space. This compact structure is conducive to the overall layout of the device.

[0018] (3) The output end of the second channel intersects with the gas path of the heat dissipation hole, which can form a more optimized heat dissipation path. This path not only includes axial heat dissipation from the heating component to the main shaft, but also increases radial heat dissipation. This multi-dimensional heat dissipation path enables heat to be more evenly distributed in the heat dissipation space, further improving the heat dissipation effect, and forming a more uniform airflow distribution in the heat dissipation space, so that the heat in the heat dissipation space can be taken away more quickly, thereby avoiding local overheating and improving the uniformity of heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention will be further described below in conjunction with the accompanying drawings and embodiments:

[0020] Figure 1It is a schematic cross-sectional structure diagram of a chip thermal compression bonding device according to the present invention;

[0021] Figure 2 This is a schematic structural diagram of a chip thermal compression bonding device according to the present invention;

[0022] Figure 3 It is a cross-sectional structural schematic diagram of the hot pressing mechanism of the present invention;

[0023] Figure 4 It is a schematic cross-sectional structural diagram of the heating assembly of the present invention;

[0024] Figure 5 It is a schematic cross-sectional structure diagram of the hot nozzle of the present invention;

[0025] Figure 6 It is a schematic cross-sectional structural diagram of the sealing rotating mechanism of the present invention.

[0026] Description of reference numerals:

[0027] 1. Driving mechanism; 11. Shell; 12. Main shaft; 13. First channel; 14. Driving motor; 15. Coupling; 16. Negative pressure chamber; 2. Hot pressing mechanism; 21. Heat dissipation assembly; 211. Base; 2111. Heat dissipation space; 2112. Heat dissipation hole; 212. Conduit; 22. Heating assembly; 221. Hot nozzle; 2211. Connecting part; 2212. Supporting part; 2213. Pressurizing part; 222. Heat insulation; 2221. Upper heat insulation part; 2222. Lower heat insulation part; 3. Protective mechanism; 31. Air pipe; 32. Protective frame; 33. Second channel; 34. Air outlet; 4. Sealing rotation mechanism; 41. Retaining ring; 42. Sealing ring for first shaft; 43. Sealing ring for second shaft; 44. Bearing; 5. Pressure detection assembly; 51. Pressure sensor; 52. Pressure head. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0029] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0030] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0031] like Figure 1 and Figure 2 As shown, a chip hot-pressing bonding device includes a driving mechanism 1 and a hot-pressing mechanism 2. The hot-pressing mechanism 2 is detachably connected to the output end of the driving mechanism 1. The driving mechanism 1 drives the hot-pressing mechanism 2 to perform hot-pressing bonding on the chip on the workbench. The driving mechanism 1 includes a shell 11 and a spindle 12. The spindle 12 is rotatably connected to the inside of the shell 11. The hot-pressing mechanism 2 is connected to the inside of the spindle 12 along the axial direction and is configured to form a first channel 13. Negative pressure is formed in the first channel 13 for adsorbing the chip. A chip hot-pressing bonding device is fixedly mounted on an XYZ motion module. After the chip hot-pressing bonding device adsorbs the chip, the chip is sent to the next process under the drive of the XYZ motion module.

[0032] The hot pressing mechanism 2 includes a heat dissipation component 21 and a heating component 22 arranged in sequence along the axial direction, and the main shaft 12, the heat dissipation component 21 and the heating component 22 are connected in sequence. The heating component 22 generates heat to perform hot pressing bonding on the chip, and the heat dissipation component 21 blocks the heat transfer between the heating component 22 and the main shaft 12 to prevent the heat of the heating component 22 from extending in the axial direction and causing adverse effects.

[0033] like Figure 3 As shown, the heat dissipation component 21 includes a base 211 and a conduit 212. The base 211 is used to support and protect the conduit 212, so that the two ends of the conduit 212 are connected to the heating component 22 and the main shaft 12 respectively. Preferably, the two ends of the base 211 along the axial direction are open, the inner wall of the base 211 is sealed and connected to the end of the main shaft 12 through a heat dissipation sealing ring, and the conduit 212 is built into the base 211. The base 211 plays a role in supporting and protecting the conduit 212. The outer wall of the conduit 212 abuts against the inner wall of the base 211, and the conduit 212 is connected to the main shaft 12. More preferably, the inner wall of the base 211 is stepped, the diameter of the conduit 212 is smaller than the diameter of the main shaft 12, and the outer wall of the conduit 212 is stepped, so that the base 211 can support the conduit 212 along the axial direction. The conduit 212 passes through the other end of the base 211 and is connected to the heating component 22.

[0034] The base 211 includes a heat dissipation space 2111 and a plurality of heat dissipation holes 2112. The heat dissipation holes 2112 are opened on the side walls of the base 211 and connect the heat dissipation space 2111 with the outside world, so that the heat dissipation space 2111 and the outside air can circulate. The heat in the heat dissipation space 2111 can be dissipated from the heat dissipation holes 2112, thereby cooling the conduit 212 and reducing the heat radiation along the conduit 212 to the main shaft 12.

[0035] The conduit 212 is located in the heat dissipation space 2111 , and the conduit 212 is arranged in a straight line along the axis. In other embodiments, the conduit 212 can be arranged in a spiral in the heat dissipation space 2111 to increase the heat conduction path of the conduit 212 to improve the heat dissipation effect of the conduit 212 in the heat dissipation space 2111 .

[0036] like Figure 4 and Figure 5 As shown, the heating assembly 22 includes a hot nozzle 221 and a heat insulating member 222. The heat insulating member 222 is fixedly connected to the side of the base 211 away from the main shaft 12. The conduit 212 is inserted into the heat insulating member 222. The hot nozzle 221 is partially detachably inserted into the heat insulating member 222. The hot nozzle 221 and the conduit 212 are connected in the heat insulating member 222. Specifically, the hot nozzle 221 includes a connecting portion 2211, a supporting portion 2212 and a pressurizing portion 2213 in sequence along the axial direction. The outer wall of the connecting portion 2211 abuts against the inner wall of the heat insulating member 222. The conduit 212 is inserted into the connecting portion 2211 so that the conduit 212 and the suction nozzle can be connected. The supporting portion 2212 abuts against the bottom of the heat insulating member 222 to disperse the pressure of the pressurizing portion 2213, so as to reduce the stress concentration when the chip is hot pressed and bonded. The bottom surface of the pressurizing portion 2213 is a plane, ensuring that the pressure applied during the bonding process is evenly distributed, thereby avoiding poor bonding or chip damage caused by uneven pressure. Preferably, the outer wall of the hot nozzle 221 is transitionally matched with the heat insulating member 222, and the hot nozzle 221 and the heat insulating member 222 can be tightly connected without generating too much interference, and the hot nozzle 221 can be quickly replaced according to the size of the chip to be operated. In this embodiment, the bottom surface of the pressurizing portion 2213 is a square to correspond to a square chip.

[0037] In the present embodiment, the heating method for the hot nozzle 221 is heating by a heating plate. The heating assembly 22 also includes a heating plate, a thermocouple device and an electric slip ring. The heating plate and the thermocouple device are both built into the base 211. The heating plate is fitted with the hot nozzle 221. The electric slip ring is sleeved on the main shaft 12. The electric slip ring is electrically connected to the thermocouple device and the heating plate through wires. The electric slip ring maintains stable current conduction when the main shaft 12 rotates, so as to avoid interference of the wires with the rotational motion of the main shaft 12.

[0038] In this embodiment, the heat insulating member 222 includes an upper heat insulating portion 2221 and a lower heat insulating portion 2222 along the axial direction. Specifically, the bottom surface of the base 211 is open, the upper heat insulating portion 2221 is fixedly arranged on the bottom surface of the base 211, and a portion of the upper heat insulating portion 2221 extends toward the bottom of the base 211. The outer peripheral side of the conduit 212 is in contact with the outer peripheral side of the upper heat insulating portion 2221. Preferably, the conduit 212 is threadedly connected with the upper heat insulating portion 2221 to ensure that the conduit 212 and the upper heat insulating portion 2221 can be firmly connected. Part of the conduit 212 penetrates into the cavity of the lower heat insulating portion 2222, and the cavity diameter of the lower heat insulating portion 2222 is larger than the heat insulating cavity of the upper heat insulating portion 2221 to accommodate the hot nozzle 221. The connecting portion 2211 is in contact with the bottom of the upper heat insulating portion 2221, and the upper heat insulating portion 2221 blocks the heat of the connecting portion 2211 from radiating toward the base 211.

[0039] like Figure 1 As shown, the housing 11 is provided with a protection mechanism 3, which includes a plurality of air pipes 31 and a protection frame 32. The protection frame 32 is fixedly connected to the bottom of the housing 11. In this embodiment, the protection frame 32 is annularly fixed to the bottom of the housing 11, and the protection frame 32 is arranged around the main shaft 12. The protection frame 32 is provided with a plurality of second channels 33, and the second channels 33 have an input end and an output end. The input end of the second channel 33 is connected to the air pipe 31, and the output end of the second channel 33 is arranged toward the hot pressing mechanism 2. The air pipe 31 passes protective gas and blows air toward the hot pressing mechanism 2. On the one hand, the chip is protected and the risk of chip oxidation is reduced. On the other hand, the gas flow of the heat dissipation component 21 is accelerated to enhance the heat dissipation effect. In this embodiment, the air pipe 31 is connected to the air pump, and the air pump passes protective gas into the second channel 33 through the air pipe 31.

[0040] Preferably, an annular hole is provided in the second channel 33, and the second channels 33 are all connected to the annular hole. The protective gas enters the annular hole from the input end of the second channel 33, and forms a circulation in the output process after flowing in the annular hole. The protective gas enables the protective gas to be more evenly distributed in the target area, thereby improving the protection effect on the chip. At the same time, the gas circulation can also increase the residence time of the protective gas in the target area, which can effectively prevent the invasion of harmful gases from the outside or the occurrence of chip redox reactions.

[0041] In this embodiment, the input section of the second channel 33 is connected to the annular hole in the radial direction, the output section of the second channel 33 is connected to the annular hole in the axial direction, and the second channel 33 is located on the same vertical plane, and most of the protective gas introduced from the air pipe 31 flows directly out through the output end through the second channel 33, and part of the gas flows along the annular hole. In other embodiments, the input section and the output section of the second channel 33 are located in different vertical planes, that is, the protective gas introduced into the input section needs to flow in the annular hole before flowing out from the output end.

[0042] The protection frame 32 is provided with a plurality of gas outlet holes, which are all connected to the annular hole and are distributed in an array along the circumference of the protection frame 32. The gas outlet holes constitute the output section of the second channel 33. The protective gas flowing out of the gas outlet holes forms a stable gas protective layer.

[0043] In this embodiment, the air outlet is arranged along the axial direction, that is, the protective gas is arranged along the axial direction, and the protective gas flows along the axial direction toward the hot pressing mechanism 2. In other embodiments, the air outlet is arranged obliquely, specifically, the air outlet is arranged obliquely with the hot pressing mechanism 2 as the center, and the protective gas can gather toward the end of the hot pressing mechanism 2 to improve the protection effect on the chip.

[0044] In this embodiment, the heat dissipation holes 2112 are opened in the radial direction, that is, the heat dissipation space 2111 and the external gas flow in the radial direction, and the air outlet holes are arranged in the axial direction, and the gas path of the air outlet holes is perpendicular to the gas path of the heat dissipation holes 2112. Since the gas at the air outlet holes passes through the external air pump, the protective gas is continuously output toward the hot pressing mechanism 2, and the axial air outlet holes stir the airflow outside the heat dissipation space 2111 to accelerate the exchange of airflow between the heat dissipation space 2111 and the outside, thereby increasing the flow rate of the gas in the heat dissipation space 2111 and greatly increasing the heat dissipation rate of the conduit 212 in the heat dissipation space 2111, thereby blocking the heat of the heating component 22 from radiating upward through the conduit 212, reducing the risk of thermal deformation of the main shaft 12 after being heated, ensuring the geometric accuracy of the main shaft 12, so that the axis of the main shaft 12 can be maintained at the designed position, and reducing the error of the hot pressing bonding of the chip; at the same time, it can reduce the risk of thermal stress inside the main shaft 12, thereby reducing the risk of fatigue and damage of the main shaft 12 material and increasing the service life of the main shaft 12.

[0045] In this embodiment, the protective gas is nitrogen. In other embodiments, the protective gas may be hydrogen or argon.

[0046] The protection mechanism 3, the heat dissipation component 21 and the heating component 22 are sequentially arranged in the axial direction, so that the protective gas can simultaneously realize gas protection for the chip and accelerate the heat dissipation of the conduit 212. The structure in the axial direction is highly integrated, which improves the compactness of the structural layout, reduces the occupied space, makes the whole more compact and lightweight, forms a compact and efficient whole, and improves the reliability and stability of the overall structure.

[0047] The drive mechanism 1 includes a drive motor 14 and a coupling 15. The axis of the output shaft of the drive motor 14 is coaxially arranged with the rotation axis of the main shaft 12. The drive motor 14 is connected to the main shaft 12 through the coupling 15, thereby driving the main shaft 12 to rotate. By adjusting the angle of the main shaft 12, the edge of the pressurizing part 2213 can correspond to the edge of the chip, and the bottom surface of the pressurizing part 2213 overlaps with the surface of the chip. After the chip is hot-pressed and bonded, the chip can be adsorbed and rotated to a specific angle and placed on the workbench of the next process. In this embodiment, the coupling 15 is a ball spline shaft. In other embodiments, the coupling 15 can adopt a flange coupling 15 and a sleeve coupling 15.

[0048] The housing 11 has a built-in negative pressure chamber 16, and the first channel 13 is connected to the negative pressure chamber 16. In this embodiment, the negative pressure chamber 16 is connected to a negative pressure machine outside the housing 11, and the negative pressure machine evacuates the negative pressure chamber 16, so that the first channel 13 forms a negative pressure channel. Specifically, a hole is opened in the side wall of the main shaft 12, so that the first channel 13 and the negative pressure chamber 16 can always be in a connected state when the main shaft 12 rotates.

[0049] like Figure 6 As shown, a sealing rotating mechanism 4 is provided in the housing 11 to seal the negative pressure chamber 16. The sealing rotating mechanism 4 includes a retaining ring 41 and a plurality of first shaft sealing rings 42 and a plurality of second shaft sealing rings 43. The retaining ring 41 is axially limitedly connected to the housing 11. The plurality of first shaft sealing rings 42 are embedded in the housing 11, and the first shaft sealing rings 42 abut against the outer wall of the retaining ring 41. The housing 11 abuts against the first shaft sealing ring 42 with the retaining ring 41 to achieve a sealing effect. The retaining ring 41 is axially limitedly connected to the housing 11, and the retaining ring 41 rotates relative to the housing 11. The retaining ring 41 is fixedly arranged on the outer side of the main shaft 12, and a plurality of second sealing rings are embedded between the retaining ring 41 and the main shaft 12. To seal the negative pressure chamber 16.

[0050] A bearing 44 is provided on both sides of the upper and lower sides of the retaining ring 41 along the axis. The inner wall of the bearing 44 is fixedly connected to the main shaft 12, and the outer wall of the bearing 44 is fixedly connected to the housing 11. The retaining ring 41 abuts against the bearing 44 along the axial direction, and the main shaft 12 rotates relative to the housing 11 through the bearing 44.

[0051] like Figure 1 As shown, a pressure detection assembly 5 is provided in the driving mechanism 1 for detecting the bonding force. The pressure detection assembly 5 includes a pressure sensor 51 and a pressure head 52. The pressure head 52 is fixedly arranged between the main shaft 12 and the coupling 15 along the axial direction. The pressure sensor 51 is electrically connected to the pressure head 52 to detect the pressure between the main shaft 12 and the coupling. Since the main shaft 12 can transmit axial force, the pressure sensor 51 can detect the bonding force of the pressurizing part 2213 on the chip.

[0052] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with this technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the scope of protection of the present invention. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is limited by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims in the present invention.

Claims

1. A chip thermal compression bonding device, characterized in that: include: A driving mechanism (1) comprises a housing (11) and a main shaft (12), wherein the main shaft (12) is rotatably connected to the housing (11); A hot pressing mechanism (2) is detachably connected to the end of the main shaft (12); the hot pressing mechanism (2) is connected to the main shaft (12) along the axial direction to form a first channel (13); the hot pressing mechanism (2) includes a heat dissipation component (21) and a heating component (22) along the axial direction; the first channel (13) sequentially connects the heat dissipation component (21) and the heating component (22); and the end of the heating component (22) is used for adsorbing the chip; The protection mechanism (3) is provided with a plurality of second channels (33) therein, wherein the input end of the second channel (33) is used to introduce protection gas, and the output end of the second channel (33) is arranged toward the hot pressing mechanism (2) to output the protection gas to the chip and cool the hot pressing mechanism (2).

2. A chip thermal compression bonding device according to claim 1, characterized in that: The heat dissipation component (21) comprises a base (211) and a conduit (212); the conduit (212) is supported in the base (211); the conduit (212) connects the main shaft (12) and the heating component (22) along the axial direction; the base (211) comprises heat dissipation holes (2112) and a heat dissipation space (2111); the conduit (212) is located in the heat dissipation space (2111); and a plurality of the heat dissipation holes (2112) connect the heat dissipation space (2111) and the outside.

3. A chip thermal compression bonding device according to claim 2, characterized in that: The output end of the second channel (33) is arranged axially, and the heat dissipation hole (2112) is arranged radially, and the gas path of the output end of the second channel (33) intersects with the gas path of the heat dissipation hole (2112) to accelerate the airflow exchange between the heat dissipation space (2111) and the outside.

4. A chip thermal compression bonding device according to claim 2, characterized in that: The heating component (22) comprises a hot nozzle (221) and a heat insulating member (222); the hot nozzle (221) is detachably connected to the heat insulating member (222); the hot nozzle (221) is heated by a heating plate; the hot nozzle (221) is connected to the conduit (212) in the heat insulating member (222); the heat insulating member (222) is fixed to the bottom of the base (211); the heat insulating member (222) blocks the base (211) from contacting the hot nozzle (221) so as to block heat from being radiated toward the base (211).

5. A chip thermal compression bonding device according to claim 4, characterized in that: The hot nozzle (221) is partially protruded from the thermal insulation member (222), and the hot nozzle (221) includes a connecting portion (2211), a supporting portion (2212) and a pressurizing portion (2213) in sequence along the axial direction, the connecting portion (2211) is detachably connected to the thermal insulation member (222) and is in communication with the conduit (212), the supporting portion (2212) is in contact with the bottom of the thermal insulation member (222), and the pressurizing portion (2213) protrudes from the bottom surface of the supporting portion (2212).

6. The chip thermal compression bonding device according to claim 1, characterized in that: The housing (11) is provided with a retaining ring (41), the retaining ring (41) is fixedly connected to the main shaft (12), the retaining ring (41) is limitedly built into the housing (11) along the axis, the main shaft (12) drives the retaining ring (41) to rotate relative to the housing (11), and the housing (11) and the main shaft (12) are both radially sealed with the housing (11).

7. The chip thermal compression bonding device according to claim 1, characterized in that: The housing (11) is fixedly provided with a drive motor (14), the output shaft of the drive motor (14) being arranged along the axial direction, the output shaft of the drive motor (14) being fixedly connected to one end of the main shaft (12), the drive motor (14) driving the main shaft (12) to rotate, and the main shaft (12) driving the hot pressing mechanism (2) to rotate.

8. The chip thermal compression bonding device according to claim 7, characterized in that: A pressure head (52) is provided between the main shaft (12) and the driving motor (14), and a pressure sensor (51) is fixedly provided on the housing (11). The pressure sensor (51) is electrically connected to the pressure head (52) to detect the bonding force on the chip.

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