Bernoulli chuck of wafer

Abstract

The utility model relates to the technical field of semiconductor equipment, in particular to a Bernoulli chuck of a wafer, which comprises a chuck arranged along the horizontal direction; the wafer supporting seat is positioned above the chuck, and a wafer is supported on the wafer supporting seat; the lifting mechanism is arranged between the chuck and the wafer supporting seat in the vertical direction, and the lifting mechanism is used for pushing the wafer supporting seat to be away from the chuck when the wafer is taken and placed. The device has the beneficial effects that the wafer supporting seat is arranged on the chuck and used for controlling the height of the wafer, and the lifting mechanism is arranged below the wafer supporting seat. When the wafer needs to be taken and placed, the lifting mechanism can push the wafer supporting seat to be away from the chuck, so that the gap between the wafer and the chuck is increased, and the wafer can be conveniently taken and placed by a manipulator. When adsorption is needed, the lifting mechanism is lowered to control the distance so as to meet the requirement of Bernoulli adsorption.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a Bernoulli chuck of a wafer. Background Art

[0002] In the field of semiconductor equipment technology, the wafer fixture (chuck for short) at the processing position of the equipment is a very critical device. The difficulty and action flow of the wafer fixture to fix the wafer directly determine the processing stability and efficiency of the wafer processing equipment. At present, the wafer fixture chuck mainly has mechanical clamping method and Bernoulli method. Among them, the Bernoulli chuck has several gas nozzles distributed on its upper surface, which adsorb the wafer by spraying gas and generating negative pressure based on the Bernoulli principle.

[0003] In the prior art, there is a technical solution that uses a Bernoulli principle chuck to fix the wafer during processing. For example, Chinese patent CN202311593057.2 discloses a wafer holding device based on a Bernoulli chuck, including: a chuck, whose top surface is formed with an annular adsorption area; a rotating assembly, which is arranged below the chuck, and the rotating assembly is provided with an air inlet channel for providing airflow to the chuck to form an annular adsorption area, and the rotating assembly is provided with an air outlet channel; a through hole connected to the air outlet channel is provided in the middle of the chuck; a detection module is used to obtain a first flow rate of gas in the through hole and a second flow rate of gas in the air outlet channel away from one end of the through hole, and to determine whether the rotating assembly leaks when the chuck clamps the wafer at a preset gap distance under a preset gas flow rate. The negative pressure in each part of the annular adsorption area is balanced to provide a stable adsorption force for the wafer; the detection module can monitor the gas flow rate and adaptively adjust the gas supply flow rate to ensure stable clamping of the wafer and uniformity of etching, prevent the solution from contaminating the edge of the wafer, and improve the etching quality.

[0004] However, in the actual implementation process, the researchers found that since this type of chuck usually uses the Bernoulli adsorption principle to adsorb the wafer, it is necessary to control the distance between the wafer and the through hole within a small range to form a local high-speed airflow area. This small distance results in the wafer being close to the chuck, making it inconvenient for the robot to pick up and place. Utility Model Content

[0005] In view of the above problems existing in the prior art, a Bernoulli chuck for a wafer is now provided.

[0006] The specific technical solutions are as follows:

[0007] A Bernoulli chuck for a wafer, comprising:

[0008] A chuck, wherein the chuck is arranged in a horizontal direction;

[0009] A wafer support seat, the wafer support seat is located above the chuck, and the wafer is supported on the wafer support seat;

[0010] A lifting mechanism is disposed vertically between the chuck and the wafer support seat, and is used to push the wafer support seat away from the chuck when taking or placing the wafer.

[0011] On the other hand, the lifting mechanism comprises:

[0012] A pushing device, the bottom of which is mounted on a base inside the chuck, and the top of a push rod of the pushing device is connected to the wafer supporting seat.

[0013] On the other hand, a bellows is sleeved on the outer side of the push rod;

[0014] The bottom of the bellows is connected to the driving part of the pushing device, and the top of the bellows is connected to the top of the push rod.

[0015] On the other hand, the pushing device is provided with a lifting motor and a power supply battery;

[0016] The power supply end of the lifting motor is connected to the positive and negative output ends of the power supply battery;

[0017] The control end of the lifting motor is connected to an external communication cable.

[0018] On the other hand, the plurality of communication cables are directed from the pushing device toward the center of the chuck and are led out from the center of the chuck.

[0019] On the other hand, the bottom of the pushing device is fixed on the base through a quick release device.

[0020] On the other hand, the upper surface of the chuck is provided with a plurality of gas nozzles;

[0021] The plurality of gas nozzles are distributed on the chuck according to a first preset circular ring;

[0022] The wafer support seat is arranged on the first preset circular ring with a spacing from the gas nozzle.

[0023] On the other hand, when the wafer support is retracted, the first height of the wafer support matches the target interval at which the gas nozzle generates a Bernoulli adsorption effect on the wafer.

[0024] On the other hand, a levelness detection device is provided on the outer side of the chuck;

[0025] The level detection device includes a transmitting device and a receiving device;

[0026] The transmitting device and the receiving device are respectively arranged on two sides of the chuck along the diameter direction of the chuck.

[0027] The above technical solution has the following advantages or beneficial effects:

[0028] In order to solve the problem of inconvenient wafer chuck taking and placing in the prior art, in this solution, a wafer support seat is provided on the chuck to control the height of the wafer, and a lifting mechanism is provided under the wafer support seat. When the wafer needs to be taken and placed, the lifting mechanism can push the wafer support seat away from the chuck, thereby increasing the gap between the wafer and the chuck, making it easier for the robot to take and place the wafer. When adsorption is required, the lifting mechanism is lowered to control the distance to meet the requirements of Bernoulli adsorption. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The embodiments of the present invention will be described more fully with reference to the attached drawings, which are however only used for illustration and description and are not intended to limit the scope of the present invention.

[0030] Figure 1 It is an overall schematic diagram of an embodiment of the utility model;

[0031] Figure 2A This is a schematic diagram of the lifting mechanism in the embodiment of the utility model;

[0032] Figure 2B This is a schematic diagram of the retraction of the lifting mechanism in the embodiment of the utility model;

[0033] Figure 3 This is a schematic diagram of a communication cable in an embodiment of the utility model;

[0034] Figure 4 It is a schematic diagram of a levelness detection device in an embodiment of the utility model. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0036] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0037] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0038] The utility model includes:

[0039] A Bernoulli chuck for a wafer, such as Figure 1 As shown, including:

[0040] Chuck 1, chuck 1 is arranged in a horizontal direction;

[0041] A wafer support seat 2, the wafer support seat 2 is located above the chuck, and a wafer is supported on the wafer support seat 2;

[0042] The lifting mechanism 3 is disposed between the chuck 1 and the wafer support seat 2 in the vertical direction. The lifting mechanism 3 is used to push the wafer support seat 2 away from the chuck when taking or placing the wafer.

[0043] Specifically, for the Bernoulli chuck in the prior art, the gap between the wafer and the chuck is usually small, which leads to the problem of inconvenience in wafer placement. In this regard, in the present embodiment, a plurality of wafer support seats 2 are distributed on the chuck 1 arranged in the horizontal direction. The wafer support seat 2 can control the height of the wafer relative to the chuck 1 during the falling process of the wafer, so as to meet the spacing for forming the Bernoulli effect. At the same time, corresponding lifting mechanisms 3 are also respectively arranged under the wafer support seat 2. The lifting mechanism 3 can be lifted and lowered according to the control signal input from the outside, so that when the wafer needs to be taken and placed, the wafer support seat 2 is pushed to move upward, so as to be away from the chuck 1, so as to facilitate the wafer placement; when the wafer needs to be adsorbed, the lifting mechanism 3 is lowered to meet the requirements of Bernoulli adsorption.

[0044] In one embodiment, Figure 2A and Figure 2B As shown, the lifting mechanism 3 includes:

[0045] The pushing device 31 has its bottom installed on a base inside the chuck 1 , and its top connected to the wafer support seat 2 is a push rod 32 of the pushing device 31 .

[0046] Specifically, in order to push the wafer support 2 away from the chuck 1, in this embodiment, a pushing device 31 is provided in the lifting mechanism 3. The pushing device 31 is vertically arranged on a base inside the chuck 1. The pushing device 31 includes a push rod 32 that can move up and down, and the top of the push rod 32 is connected to the wafer support 2. The pushing device 31 adjusts the height of the wafer support 2 by changing the extension or shortening of the push rod 32. Figure 2A The lifting mechanism 3 is in the raised state. Figure 2B The lifting mechanism 3 is in the lowered state.

[0047] In one embodiment, a bellows 33 is sleeved on the outer side of the push rod 32;

[0048] The bottom of the bellows 33 is connected to the driving part of the pushing device 31 , and the top of the bellows 33 is connected to the top of the push rod 32 .

[0049] Specifically, considering that the chuck 1 may have the problem of corresponding etching liquid and processing gas entering during the subsequent wafer processing, in order to avoid damage to the push rod 32 and the inside of the pushing device 31, resulting in the problem of inability to accurately lift and lower, in this embodiment, a bellows 33 is sleeved on the outside of the push rod 32, the bottom of the bellows 33 is connected to the driving part of the pushing device 31, and the top of the bellows 33 is connected to the top of the push rod 32. As the push rod 32 is extended and retracted, the length of the bellows 33 also changes, thereby wrapping the outside of the push rod 32 to prevent liquid from seeping in.

[0050] In one embodiment, a lifting motor and a power supply battery are provided in the pushing device 31;

[0051] The power supply end of the lifting motor is connected to the positive and negative output ends of the power supply battery;

[0052] The control end of the lifting motor is connected to an external communication cable 4.

[0053] Specifically, in order to realize modular transformation on the original structure of the chuck 1, in this embodiment, a power supply battery is arranged in the pushing device 31, which can power the lifting motor to promote the lifting of the push rod 32; at the same time, the lifting motor is connected to an external communication cable through a communication interface, so as to receive an input control signal for lifting. The above arrangement makes it possible to install the pushing device 31 on the chuck 1 only by arranging a communication cable, thereby improving the universality of the device.

[0054] In one embodiment, Figure 3 As shown, the self-propelling devices 31 of the multiple-strand communication cables 4 are respectively directed toward the center of the chuck 1 and are led out from the center of the chuck 1 .

[0055] Specifically, in order to achieve a better layout effect, in this embodiment, after setting up multiple sets of lifting mechanisms 3, the led-out communication cables 4 are introduced into the center of the chuck 1 according to the radial direction of the chuck 1, and then led out through the center of the chuck 1 below, thereby achieving a better wiring effect.

[0056] In one embodiment, the bottom of the pushing device 31 is fixed to the base through a quick release device.

[0057] Specifically, in order to achieve rapid modification of the original chuck 1 structure in a modular manner, in this embodiment, a corresponding quick-release device is pre-arranged on the base. Subsequently, during the installation of the lifting mechanism 3, the bottom of the pushing device 31 is fixed to the base through the quick-release device. During subsequent maintenance, the lifting mechanism 3 can be quickly removed through the quick-release device to facilitate maintenance.

[0058] In one embodiment, the upper surface of the chuck 1 is provided with a plurality of gas nozzles;

[0059] A plurality of gas nozzles are distributed on the chuck according to a first preset circular ring;

[0060] The wafer support seat 2 is arranged on the first preset circular ring with a spacing from the gas nozzle.

[0061] Specifically, in order to achieve a better support effect for the wafer, in this embodiment, a first preset circular ring that can be used to adsorb the wafer is pre-determined on the chuck 1, and a plurality of gas nozzles are arranged around the first preset circular ring. The gas nozzle is used to allow high-speed airflow to flow out, thereby forming a Bernoulli adsorption effect at the bottom of the wafer. On this basis, by selecting to set a plurality of wafer support seats 2 on the first preset circular ring and spaced apart from the gas nozzles, a better support effect can be achieved.

[0062] In one embodiment, when the wafer support 2 is retracted, the first height of the wafer support 2 matches the target interval at which the gas nozzle generates a Bernoulli adsorption effect on the wafer.

[0063] Specifically, in order to achieve a better effect of wafer processing and placement, in this embodiment, the height of the wafer support seat 2 and the height of the lifting mechanism 3 are also controlled. For example, the interval required for the gas nozzle to produce the Bernoulli effect is L1, so when the lifting mechanism 3 retracts the wafer support seat 2, the total height of the lifting mechanism 3 and the wafer support seat 2 in the retracted state is also L1; in order to achieve a better effect of wafer placement, when the push rod 31 of the lifting mechanism 3 is raised, the total height of the lifting mechanism 3 and the wafer support seat 2 in the raised state should be L2, corresponding to the height required for the robot to pick up and place the wafer.

[0064] In one embodiment, Figure 4 As shown, a levelness detection device 5 is provided on the outer side of the chuck 1;

[0065] The levelness detection device 5 comprises a transmitting device 51 and a receiving device 52;

[0066] The transmitting device 51 and the receiving device 52 are respectively arranged on both sides of the chuck along the diameter direction of the chuck.

[0067] Specifically, in order to achieve a better processing effect, in this embodiment, a level detection device 5 is also arranged outside the chuck, and the level detection device 5 includes a transmitter 51 and a receiver 52 arranged opposite to each other, and the transmitter 51 triggers the corresponding receiver in the receiver 52 by emitting infrared rays; when there is a receiver that is not triggered normally, it indicates that the wafer is tilted and blocks the transmission path. This judgment method itself is a prior art.

[0068] The above are only preferred embodiments of the present invention, and do not limit the implementation mode and protection scope of the present invention. Those skilled in the art should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A Bernoulli chuck for a wafer, characterized in that: include: A chuck, wherein the chuck is arranged in a horizontal direction; A wafer support seat, the wafer support seat is located above the chuck, and the wafer is supported on the wafer support seat; A lifting mechanism, the lifting mechanism is arranged between the chuck and the wafer support seat in the vertical direction, and the lifting mechanism is used to push the wafer support seat away from the chuck when taking and placing the wafer; the lifting mechanism includes: A pushing device, the bottom of which is mounted on a base inside the chuck, and the top of a push rod of the pushing device is connected to the wafer support seat; The outer side of the push rod is sleeved with a bellows; The bottom of the bellows is connected to the driving part of the pushing device, and the top of the bellows is connected to the top of the push rod.

2. The Bernoulli chuck according to claim 1, characterized in that: The pushing device is provided with a lifting motor and a power supply battery; The power supply end of the lifting motor is connected to the positive and negative output ends of the power supply battery; The control end of the lifting motor is connected to an external communication cable.

3. The Bernoulli chuck according to claim 2, characterized in that: The plurality of communication cables are directed from the pushing device to the center of the chuck respectively, and are led out from the center of the chuck.

4. The Bernoulli chuck according to claim 1, characterized in that: The bottom of the pushing device is fixed on the base through a quick release device.

5. The Bernoulli chuck according to claim 1, characterized in that: The upper surface of the chuck is provided with a plurality of gas nozzles; The plurality of gas nozzles are distributed on the chuck according to a first preset circular ring; The wafer support seat is arranged on the first preset circular ring with a spacing from the gas nozzle.

6. The Bernoulli chuck according to claim 5, characterized in that: When the wafer support seat is retracted, the first height of the wafer support seat matches the target interval at which the gas nozzle generates a Bernoulli adsorption effect on the wafer.

7. The Bernoulli chuck according to claim 1, characterized in that: A levelness detection device is provided on the outer side of the chuck; The level detection device includes a transmitting device and a receiving device; The transmitting device and the receiving device are respectively arranged on two sides of the chuck along the diameter direction of the chuck.

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