Integrated laser diode

Abstract

The utility model discloses an integrated laser diode, relates to the field of integrated diodes, and solves the problem that a semiconductor chip seat in a conventional device is easy to be damaged in a long-time working state due to the fact that a heat dissipation assembly is not arranged so as to influence the subsequent work, and adopts the following scheme that the integrated laser diode comprises a tube seat and a pin part, a semiconductor chip seat and a radiating seat are arranged on the tube seat; a main body of the heat dissipation part is an annular heat conduction ring, a heat conduction pin is fixedly connected to the inner side wall of the heat conduction ring, and a heat dissipation clamp is fixedly installed on the outer wall of the heat conduction ring; according to the integrated laser diode, through the arrangement of the heat dissipation part on the top side of the tube seat, when the semiconductor chip seat works to generate heat, the heat conduction pin tightly attached to the semiconductor chip seat in the heat dissipation part is matched with the heat conduction ring to conduct the heat to the heat dissipation card on the outer side, so that the contact area between the heat dissipation part and airflow on the outer side is increased; and the outside air flow is used for taking away the heat conducted from the heat dissipation card, so that the corresponding heat dissipation effect on the semiconductor chip seat is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated diodes, in particular to an integrated laser diode. Background Art

[0002] With the continuous improvement of the collimation of the output beam of single laser diodes in recent years, single laser diodes have been widely used in processing, production, medical treatment and other fields;

[0003] After searching, the application with patent number CN202121357764.8 discloses an integrated laser diode. The purpose of the utility model is to provide an integrated laser diode with high power, high collimation and high spot quality, including a tube seat, a tube cap, multiple chips and a heat sink for dissipating heat to the chip, a hole is opened on the tube cap, and a light-transmitting mirror is fixedly installed in the hole, and also includes a bare fiber fixedly installed in the tube cap and located between the chip and the light-transmitting mirror, the axial direction of the bare fiber is perpendicular to the light-emitting direction of the chip, and the light-transmitting mirror is a meniscus spherical lens whose concave direction is the light-emitting direction of the chip, and the meniscus spherical lens corresponds to the position of the bare fiber, thereby forming a Qiming lens group, and a first gap is provided between the bare fiber and the chip, so that the light-emitting point of the chip and the Qiming point of the Qiming lens group are located at the same point;

[0004] The above application document, by setting up a lens group consisting of a meniscus spherical lens and an arcuate convex lens, can make the light-emitting point of the semiconductor chip and the luminous point of the luminous lens group be located at the same point. When current flows through the semiconductor chip in the existing laser diode, heat will be generated. Especially when working for a long time, since the lens barrel is assembled in a surrounding manner, the ambient temperature around the semiconductor chip will be high after working for a long time, which can easily affect its normal operation.

[0005] Therefore, we propose an integrated laser diode. Utility Model Content

[0006] In view of the deficiencies of the prior art, the utility model provides an integrated laser diode, which solves the problem that the semiconductor chip seat in the prior device is easily damaged due to the lack of a heat dissipation component during long-term operation, which affects subsequent work.

[0007] To achieve the above purpose, the utility model is implemented by the following technical solutions: an integrated laser diode, including a tube seat and a pin portion assembled on the bottom side thereof, a semiconductor chip seat connected to the pin portion is fixedly mounted on the tube seat, a lens barrel portion is arranged on the outer side of the semiconductor chip seat, and a lens portion is fixedly mounted on the top of the lens barrel portion;

[0008] A heat dissipation part is fixedly mounted in the lens barrel;

[0009] The main body of the heat dissipation part is a ring-shaped heat-conducting ring, a heat-conducting pin is fixedly connected to the inner wall of the heat-conducting ring, and a heat dissipation card is fixedly installed on the outer wall of the heat-conducting ring.

[0010] Preferably, ten groups of heat-conducting pins distributed in a ring shape are fixedly mounted on the inner side wall of the heat-conducting ring;

[0011] The arrangement of multiple groups of heat-conducting pins can conduct heat outward from different positions on the semiconductor chip seat, thereby ensuring high efficiency of heat dissipation.

[0012] Preferably, the heat-conducting pin is an L-shaped pin, and the inner side wall of the heat-conducting pin is closely attached to the semiconductor chip seat;

[0013] The shape of the heat-conducting pins can not only contact the top surface of the semiconductor chip seat, but also contact the side wall of the semiconductor chip seat, so that the heat can be efficiently conducted away and the heat dissipation effect can be ensured.

[0014] Preferably, six groups of heat dissipation cards distributed in a ring are fixedly mounted on the outer wall of the heat-conducting ring, and the heat dissipation cards are table-shaped frame cards;

[0015] The heat dissipation card is shaped so that both inner walls thereof are in contact with the airflow outside, thereby ensuring the heat dissipation effect.

[0016] Preferably, the lens barrel portion is composed of an end ring portion on the bottom side, a heat dissipation portion at the center and a top ring portion on the top side, and both the end ring portion and the top ring portion are fixedly sleeved with the heat dissipation portion by a heat insulating tape sleeve.

[0017] The utility model provides an integrated laser diode. It has the following beneficial effects:

[0018] The integrated laser diode has a heat dissipation part in the lens barrel part on the top side of the tube seat. When the semiconductor chip seat generates heat during operation, the heat-conducting pins in the heat dissipation part that are closely attached to the semiconductor chip seat cooperate with the heat-conducting ring to conduct the heat to the heat dissipation card on the outside, thereby increasing the contact area between the heat dissipation pin and the outside airflow. The heat conducted from the heat dissipation card is taken away by the outside airflow, thereby achieving the effect of corresponding heat dissipation of the semiconductor chip seat. This solves the problem in the existing device that the semiconductor chip seat is easily damaged in a long-term working state due to the lack of a heat dissipation component, which affects subsequent work. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of the utility model;

[0020] Figure 2 It is a schematic diagram of the structure of the inner side of the utility model;

[0021] Figure 3 It is a structural schematic diagram of the heat dissipation part of the utility model.

[0022] In the figure: 1. tube seat; 2. pin part; 3. lens barrel part; 4. lens part; 5. heat dissipation part; 51. thermal conductive ring; 52. heat dissipation card; 53. thermal conductive pin; 6. semiconductor chip seat. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figure 1-3 The embodiment of the utility model provides a technical solution: an integrated laser diode, comprising a tube seat 1 and a pin portion 2 assembled on the bottom side thereof, a semiconductor chip seat 6 connected to the pin portion 2 is fixedly mounted on the tube seat 1, a lens barrel portion 3 is arranged on the outer side of the semiconductor chip seat 6, and a lens portion 4 is fixedly mounted on the top of the lens barrel portion 3; a heat dissipation portion 5 is fixedly sleeved in the lens barrel portion 3; the main body of the heat dissipation portion 5 is a ring-shaped heat conduction ring 51, a heat conduction pin 53 is fixedly connected to the inner side wall of the heat conduction ring 51, and a heat dissipation card 52 is fixedly mounted on the outer wall of the heat conduction ring 51;

[0025] Among them, the integrated laser diode, through the setting of the heat dissipation part 5 in the lens barrel part 3 on the top side of the tube seat 1, when the semiconductor chip seat 6 generates heat during operation, the heat-conducting pins 53 in the heat dissipation part 5 that are tightly attached to the semiconductor chip seat 6 cooperate with the heat-conducting ring 51 to conduct the heat to the outer heat dissipation card 52, thereby increasing its contact area with the outer airflow, and using the outer airflow to take away the heat derived from the heat dissipation card 52, thereby achieving the effect of corresponding heat dissipation of the semiconductor chip seat 6, solving the problem that the semiconductor chip seat 6 in the existing device is easily damaged due to the lack of a heat dissipation component, which affects subsequent work after long-term operation.

[0026] Embodiment 2:

[0027] Ten groups of heat-conducting pins 53 distributed in a ring shape are fixedly mounted on the inner side wall of the heat-conducting ring 51 ; wherein, the arrangement of multiple groups of heat-conducting pins 53 can conduct heat outwards from different positions on the semiconductor chip seat 6 , thereby ensuring efficient heat dissipation.

[0028] The thermal conductive pin 53 is an L-shaped pin, and the inner side wall of the thermal conductive pin 53 is tightly attached to the semiconductor chip seat 6; wherein, the shape of the thermal conductive pin 53 can not only contact the top surface of the semiconductor chip seat 6, but also contact the side wall of the semiconductor chip seat 6, so that the heat can be efficiently extracted and the heat dissipation effect can be ensured.

[0029] Six groups of heat dissipation cards 52 are fixedly mounted on the outer wall of the heat-conducting ring 51 and are distributed in a ring shape. The heat dissipation cards 52 are table-shaped frame cards. The shape of the heat dissipation cards 52 enables both inner walls to contact with the airflow outside, thereby ensuring the heat dissipation effect.

[0030] The lens barrel portion 3 is composed of an end ring portion at the bottom side, a heat dissipation portion 5 at the center and a top ring portion at the top side thereof, and both the end ring portion and the top ring portion are fixedly mounted on the heat dissipation portion 5 by a heat insulating tape sleeve.

[0031] The working principle and use process of the utility model are as follows: when the device is required to work, the components are assembled and put into operation. When the semiconductor chip seat 6 generates heat during operation, the heat-conducting pins 53 on the inner side of the heat dissipation part 5 contact it, and the heat on the semiconductor chip seat 6 is conducted to the heat dissipation card 52 through the heat-conducting ring 51. The shape of the heat dissipation card 52 enables both the inner and outer walls to contact the outer airflow, thereby ensuring the heat dissipation effect.

[0032] The above shows and describes the basic principles and main features of the utility model and the advantages of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is limited by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims. Any figure mark in the claims should not be regarded as limiting the claims involved.

[0033] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. An integrated laser diode, comprising a tube seat (1) and a pin portion (2) mounted on the bottom side thereof, a semiconductor chip seat (6) connected to the pin portion (2) being fixedly mounted on the tube seat (1), a lens barrel portion (3) being arranged on the outer side of the semiconductor chip seat (6), and a lens portion (4) being fixedly mounted on the top of the lens barrel portion (3); Features: A heat dissipation portion (5) is fixedly mounted in the lens barrel portion (3); The main body of the heat dissipation part (5) is a ring-shaped heat-conducting ring (51), a heat-conducting pin (53) is fixedly connected to the inner wall of the heat-conducting ring (51), and a heat dissipation card (52) is fixedly installed on the outer wall of the heat-conducting ring (51).

2. An integrated laser diode according to claim 1, characterized in that: Ten groups of heat-conducting pins (53) distributed in a ring shape are fixedly mounted on the inner side wall of the heat-conducting ring (51).

3. The integrated laser diode according to claim 1, characterized in that: The heat-conducting pin (53) is an L-shaped pin, and the inner side wall of the heat-conducting pin (53) is tightly attached to the semiconductor chip seat (6).

4. The integrated laser diode according to claim 1, characterized in that: Six groups of heat dissipation cards (52) distributed in a ring shape are fixedly mounted on the outer wall of the heat-conducting ring (51), and the heat dissipation cards (52) are table-shaped frame cards.

5. The integrated laser diode according to claim 1, characterized in that: The lens barrel portion (3) is composed of an end ring portion on the bottom side, a heat dissipation portion (5) at the center, and a top ring portion on the top side, and both the end ring portion and the top ring portion are fixedly sleeved on the heat dissipation portion (5) by means of a heat insulating tape sleeve.

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