Mobile phone mainboard and mobile phone

Abstract

The utility model provides a mobile phone mainboard and a mobile phone, and relates to the technical field of mobile phone accessories, the mobile phone mainboard comprises a mainboard body, the front surface of the mainboard body is provided with a sim card mounting seat, a radio frequency power amplifier shielding case, a capacitor group shielding case and a main chip shielding case; a first assembly hole, a second assembly hole and a third assembly hole are formed in the lower side of the mainboard body, the first assembly hole is formed in the lower left corner area of the mainboard body, the second assembly hole is formed in the lower right corner area of the mainboard body, and the third assembly hole is formed between the first assembly hole and the second assembly hole and corresponds to the edge position of the right side of the sim card installation base. The first assembly hole and the second assembly hole are located in the two corner areas, and the third assembly hole is formed between the first assembly hole and the second assembly hole, corresponds to the edge position of the right side of the sim card mounting seat, and just corresponds to the midpoint position of stress on the two sides of the mobile phone mainboard, so that the stress layout is reasonable; and the phenomenon of warping of the middle area of the mobile phone mainboard is not easy to occur.

Description

Technical Field

[0001] The utility model relates to the technical field of mobile phone accessories, in particular to a mobile phone mainboard and a mobile phone. Background Art

[0002] With the development of intelligent communication technology, smart phones have become an indispensable communication tool for people's lives due to their powerful functions. Smart phones include a mobile phone motherboard assembled in a mobile phone shell. In order to realize the various functions of smart phones, the mobile phone motherboard integrates electronic components such as a SIM card mounting seat, a radio frequency amplifier screen module, a capacitor group, and a main chip, and is assembled and fixed through assembly holes and a mobile phone shell.

[0003] In order to make the assembly stress in the mobile phone motherboard more balanced and avoid the seesaw phenomenon in the middle area of ​​the mobile phone motherboard, thereby avoiding damage to components and improving the reliability of the mobile phone motherboard.

[0004] A mobile phone mainboard and mobile phone with reasonable stress distribution and less prone to seesaw in the middle area of ​​the mobile phone mainboard need to be designed. Summary of the invention

[0005] The purpose of the utility model is to provide a mobile phone motherboard and a mobile phone in view of the defects and shortcomings of the prior art, so as to solve at least one of the above-mentioned technical problems, and the utility model has the advantages of reasonable stress layout and the middle area of ​​the mobile phone motherboard is not prone to seesaw phenomenon.

[0006] To achieve the above-mentioned purpose, the utility model provides a mobile phone mainboard on one hand, comprising: a mainboard body;

[0007] The front of the mainboard body is provided with a SIM card mounting seat, a radio frequency amplifier shielding cover, a capacitor group shielding cover and a main chip shielding cover; the SIM card mounting seat is arranged on the left side of the front of the mainboard body, the radio frequency amplifier shielding cover is arranged on the upper side of the SIM card mounting seat, the capacitor group shielding cover is arranged on the lower side of the SIM card mounting seat, and the main chip shielding cover is arranged on the left side of the SIM card mounting seat;

[0008] The lower side of the mainboard body is provided with a first assembly hole, a second assembly hole and a third assembly hole, the first assembly hole is arranged in the lower left corner area of ​​the mainboard body, the second assembly hole is arranged in the lower right corner area of ​​the mainboard body, and the third assembly hole is arranged between the first assembly hole and the second assembly hole and corresponds to the right edge position of the SIM card mounting seat.

[0009] Optionally, viewed from the front of the mainboard body, the center lengths of the first assembly hole, the second assembly hole and the third assembly hole are 1.10 mm to 2.10 mm from the lower side of the mainboard body, the center length of the first assembly hole is 4.60 mm to 5.60 mm from the left side of the mainboard body, the center length of the second assembly hole is 59.80 mm to 60.80 mm from the center length of the first assembly hole, and the center length of the third assembly hole is 37.50 mm to 38.50 mm from the center length of the second assembly hole.

[0010] Optionally, viewed from the front of the main board body, a fourth assembly hole is disposed at the upper left corner of the main board body, and the length of the center of the fourth assembly hole from the lower side of the main board body is 38.10 mm to 39.10 mm; a fifth assembly hole is disposed at the upper right corner of the main board body, and the length of the center of the fifth assembly hole from the lower side of the main board body is 25.60 mm to 26.60 mm.

[0011] Optionally, a sixth assembly hole is arranged between the first assembly hole and the fourth assembly hole, and the sixth assembly hole is configured at the lower side of the SIM card mounting seat.

[0012] Optionally, the distance between the center of the sixth assembly hole and the lower side of the main board body is 7.50 mm to 8.50 mm.

[0013] Optionally, a seventh assembly hole is arranged between the second assembly hole and the fifth assembly hole, the centers of the second assembly hole, the fifth assembly hole and the seventh assembly hole are collinear, and the length of the second assembly hole from the center of the hole and the center of the seventh assembly hole is 22.00 mm to 23.00 mm.

[0014] Optionally, the upper side of the main board body is configured with a first installation area for assembling electronic components, and the back side of the main board body is configured with at least one of a light sensing connector, a flash contact spring assembly, an auxiliary camera connector and a breathing light connector at a position corresponding to the first installation area.

[0015] Optionally, viewed from the back of the main board body, the lower side of the main board body is configured with at least one of a fingerprint connector, a small screen connector, and a battery connector.

[0016] Optionally, a third reserved position for avoiding the installation of a front camera is further provided on the right side of the second installation protrusion. Another aspect of the utility model provides a mobile phone, comprising a mobile phone body and the mobile phone motherboard as described above, wherein the mobile phone motherboard is installed in the mobile phone body.

[0017] Compared with the prior art, the advantages of this application are:

[0018] After the SIM card mounting seat, RF power amplifier shielding cover, capacitor group shielding cover and main chip shielding cover are arranged on the front of the mainboard body, the first assembly hole and the second assembly hole are located in two corner areas, and the third assembly hole is configured between the first assembly hole and the second assembly hole and corresponds to the right edge position of the SIM card mounting seat, which just corresponds to the midpoint position of the stress on both sides of the mobile phone mainboard. In this way, the assembly stress of the mobile phone mainboard can be more balanced, avoiding the seesaw phenomenon in the middle area of ​​the mobile phone mainboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0020] Figure 1 This is a schematic structural diagram of the back side of the mobile phone motherboard according to an embodiment of the utility model;

[0021] Figure 2 This is a schematic diagram of the structure of the front side of the mobile phone motherboard according to an embodiment of the utility model;

[0022] Figure 3 This is a schematic structural diagram of the back side of the mobile phone motherboard according to an embodiment of the utility model;

[0023] Figure 4 This is a schematic diagram of the structure of the front side of the mobile phone motherboard according to an embodiment of the utility model;

[0024] Figure 5 This is a schematic diagram of the structure of the back of the mobile phone motherboard equipped with a rear camera in an embodiment of the utility model;

[0025] Figure 6 This is a schematic diagram of the structure of the front of the mobile phone motherboard equipped with a rear camera in an embodiment of the utility model;

[0026] Figure 7 This is a schematic diagram of the structure of the front side of the mobile phone after removing the mobile phone shell in the embodiment of the utility model;

[0027] Figure 8 This is a schematic diagram of the rear view structure of a mobile phone 1 according to an embodiment of the utility model;

[0028] Fig. 9 This is a schematic diagram of the rear view structure of the second mobile phone according to the embodiment of the utility model;

[0029] Fig.10 This is a schematic diagram of the rear view structure of the mobile phone 3 in the embodiment of the utility model;

[0030] Fig.11 It is a structural schematic diagram of a two-in-one FPC line of a screen and a sub-board in an embodiment of the utility model.

[0031] Description of Reference Numerals

[0032] 1000- mobile phone;

[0033] 100-mobile phone motherboard;

[0034] 1-main board body; 11-left side; 121-first horizontal section; 122-first vertical section; 123-second horizontal section; 124-second vertical section; 125-third horizontal section; a-notch; 13-first mounting protrusion; 14-second mounting protrusion; 141-right side; 15-third mounting protrusion;

[0035] 2-Vice board;

[0036] e1-first assembly hole; e2-second assembly hole; e3-third assembly hole; e4-fourth assembly hole; e5-fifth assembly hole; e6-sixth assembly hole; e7-seventh assembly hole;

[0037] B-first installation area; 131-left edge;

[0038] C-second installation area;

[0039] D-third installation area; 5-screen plus sub-board connector; 6-fingerprint connector; 7-small screen connector; 8-battery connector; 4-battery pad; 9-screen plus sub-board two-in-one FPC line;

[0040] E-fourth installation area;

[0041] A-first reserved position; F-second reserved position; G-third reserved position;

[0042] 31-SIM card mounting seat; 32-RF power amplifier shielding cover; 33-capacitor group shielding cover; 34-main chip shielding cover; 35-rear camera connector; 36-first antenna shrapnel; 37-second antenna shrapnel; 38-infrared remote control light; 39-headphone seat; 30-power on and volume adjustment connection shrapnel;

[0043] 41-power management shield; 42-RF shield; 43-GPS shield; 44-light sensing connector; 45-flash contact shrapnel assembly; 46-auxiliary camera connector; 47-breathing light connector;

[0044] 200-mobile phone body; 210-mobile phone housing; 220-battery; 230-rear camera; 231-main camera; 232-auxiliary camera; 240-button; 250-flash;

[0045] H1 - length of the main board body; H2 - length of the first horizontal section; H3 - length of the first vertical section; H4 - length of the second horizontal section; H5 - length of the second vertical section; H6 - length of the third horizontal section; H7 - length of the right side edge of the second mounting protrusion; H8 - length of the left edge of the first mounting area; H9 - length of the first reserved position. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0047] It should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", "back", "side", "circumferential" and the like in the present invention indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present invention. In addition, the words "first", "second" and the like are only used to distinguish multiple components or structures with the same or similar structures, and do not represent any special limitation on the setting order or connection relationship.

[0048] Please refer to Figures 7 to 10 On the one hand, the embodiment of the utility model provides a mobile phone 1000, including: a mobile phone body 200 and a mobile phone motherboard 100, and the mobile phone motherboard 100 is assembled in the mobile phone body 200. The mobile phone body 200 generally includes a mobile phone housing 210, a battery 220, a display screen (not shown in the figure), a rear camera 230, a front camera (not shown in the figure), a button 240, an input and output interface (not shown in the figure), etc. assembled on the mobile phone housing 210. The battery 220, the display screen, the rear camera 230, the front camera, the button 240, the input and output interface, etc. are usually connected to the mobile phone motherboard 100 through an FPC. The mobile phone body 200 is a prior art, so it will not be expanded here. The specific structure and shape of the mobile phone motherboard 100 are described in detail below.

[0049] Please refer to Figures 1 to 11On the other hand, the embodiment of the utility model provides a mobile phone motherboard 100, including a motherboard body 1. When viewed from the front of the motherboard body 1, the upper side of the motherboard body 1 is configured with a first installation area B for assembling electronic components, the middle position on the left side of the motherboard body 1 is configured with a second installation area C for assembling a SIM card holder, the lower side of the motherboard body 1 is configured with a third installation area D for configuring a circuit interface, the upper right position of the motherboard body 1 is configured with a fourth installation area E for assembling electronic components, and a first reserved position A for avoiding the assembly of a main camera 231 is formed on the upper side of the motherboard body 1 and between the first installation area B and the fourth installation area E.

[0050] In this way, the various components can be compactly arranged in the first installation area B, the second installation area C, the third installation area D and the fourth installation area E of the mobile phone motherboard 100, and the first reserved position A can avoid the assembly of the main camera 231. Therefore, it has the advantage of reasonable layout and will not interfere with the assembly of the main camera 231 in the rear camera 230 of the mobile phone.

[0051] In order to make the mobile phone motherboard 100 compatible with a variety of different camera layouts, preferably, please refer to Figures 1 to 7 , from the back of the main board body 1, the main board body 1 has a left side 11 and a first upper side, the first reserved position A is defined by the first upper side of the main board body 1, the extension line of the left side 11 of the main board body 1 and the left edge 131 of the first installation area B, and is used to avoid the installation of the main camera 231; the length of the first reserved position A is 38.50mm to 40.50mm; and the first upper side has a downwardly configured notch a. It can be understood that in order to improve space utilization, the first reserved position A can also be used to avoid the installation of the front camera, part of the auxiliary camera 232, the flash 250, and the sub-board 2, and no specific restrictions are made here.

[0052] Taking Apple 15Pro as an example, please refer to Figure 1 , Figure 3 , Figure 5 and Figure 8 , the upper left camera can be selected as the main camera 231, and the lower left camera and the right camera can be selected as the auxiliary cameras 232. In this way, the main camera 231 can be configured at the upper left position of the notch a of the first reserved position A, and the right auxiliary camera 232 can be configured at the upper position of the notch a of the first reserved position A.

[0053] Take realme 12 Pro as an example, please refer to Figure 1 , Figure 3 and Fig. 9 , the upper left camera can be selected as the main camera 231, and the remaining cameras can be selected as auxiliary cameras 232. In this way, the main camera 231 can be configured corresponding to the position of the notch a of the first reserved position A.

[0054] Taking OPPO's FindX7UItra as an example, please refer to Figure 1 , Figure 3 and Fig.10 , the upper camera can be selected as the main camera 231, and the remaining cameras can be selected as auxiliary cameras 232. In this way, the main camera 231 can be configured at the upper right position of the notch a of the first reserved position A.

[0055] A similar layout may also be used for the appearance layout of the rear camera 230 of other models of mobile phones 1000, so no further details will be given here.

[0056] Since the first reserved position A is defined by the first upper side edge of the mainboard body 1, the extension line of the left side edge 11 of the mainboard body 1 and the left side edge 131 of the first installation area B, the length of the first reserved position A is 38.50mm to 40.50mm; and the first upper side edge has a downwardly configured recess a, in this way, the mobile phone mainboard 100 can be equipped with a main camera 231 at the recess a position of the first reserved position A, the upper left position of the recess a of the first reserved position A, and the upper right position of the recess a of the first reserved position A, and an auxiliary camera 232 can be installed at other positions, thereby making it compatible with a variety of different camera layouts.

[0057] Optionally, in this embodiment, the length of the first reserved position A is 39.50 mm. Of course, in other embodiments, the length of the first reserved position A may also be 38.50 mm, 38.60 mm, 40.10 mm, or 40.50 mm, as long as it is between 38.50 mm and 40.50 mm.

[0058] Optionally, see Figure 3 In this embodiment, the first upper side of the mainboard body 1 includes a first transverse section 121, a first vertical section 122, a second transverse section 123, a second vertical section 124 and a third transverse section 125 which are connected in sequence, wherein the first vertical section 122, the second transverse section 123 and the second vertical section 124 form the above-mentioned notch a, and the end of the third transverse section 125 away from the second vertical section 124 is connected to the left edge 131 of the first installation area B. In this embodiment, the first transverse section 121, the second transverse section 123 and / or the third transverse section 125 can be horizontal or have a certain inclination; the first vertical section 122 and / or the second vertical section 124 can be vertical or have a certain inclination, which is not specifically limited here. Preferably, the first transverse section 121 is higher than the third transverse section 125.

[0059] In order to further improve the space utilization of the mobile phone mainboard 100, optionally, please refer to Figure 1 and Figure 3In this embodiment, viewed from the back of the mainboard body 1, the fourth mounting area E includes a second mounting protrusion 14 for configuring the first antenna spring 36; wherein the second mounting protrusion 14 is configured on the left side of the first reserved position A, and the right side edge 141 of the second mounting protrusion 14 is connected to an end of the first upper side away from the first mounting area B; specifically, the right side edge 141 of the second mounting protrusion 14 is connected to an end of the first horizontal segment 121 away from the first vertical segment 122.

[0060] Preferably, the first mounting area B includes a first mounting protrusion 13 vertically arranged on the upper side of the mainboard body 1, and the upper side of the mainboard body 1 also includes a third mounting protrusion 15. The third mounting protrusion 15 is arranged on the right side of the first mounting protrusion 13, and the third mounting protrusion 15 and the first mounting protrusion 13 form a second reserved position F, and the second reserved position F can be used to avoid the assembly of the earphone socket 39. In this way, the overall height of the mobile phone mainboard 100 can be reduced. Preferably, the edges of the mobile phone mainboard 100 are excessively rounded to remove sharp corners and burrs to avoid scratches. At the same time, the tip stress of the mobile phone mainboard 100 can be removed to reduce the damage of the mobile phone mainboard 100 caused by bumps and fatigue.

[0061] The specific size of the mobile phone motherboard 100 can be set according to the specific model of the mobile phone 1000. Preferably, please refer to Figure 4In this embodiment, the length H1 of the mainboard body 1 is 68.30 mm; of course, in other embodiments, the length H1 of the mainboard body 1 may also be 66.2 mm, 67.9 mm, 68.9 mm, 69.3 mm, as long as it is between 66.2 mm and 69.3 mm. The length H2 of the first transverse section 121 is 14.00 mm; of course, in other embodiments, the length H2 of the first transverse section 121 may also be 13.00 mm, 13.80 mm, 13.90 mm, 14.20 mm, 14.50 mm, 15.00 mm, as long as it is between 13.00 mm and 15.00 mm. The length H3 of the first vertical section 122 is 10.50 mm; of course, in other embodiments, the length H3 of the first vertical section 122 may also be 9.50 mm, 10.20 mm, 11.10 mm, 11.50 mm, as long as it is between 9.50 mm and 11.50 mm. The length H4 of the second transverse section 123 is 16.50 mm; of course, in other embodiments, the length H4 of the second transverse section 123 may also be 15.68 mm, 15.50 mm, 16.40 mm, 16.60 mm, 16.70 mm, 17.50 mm, as long as it is between 15.50 mm and 17.50 mm. The length H5 of the second vertical section 124 is 8.20 mm. Of course, in other embodiments, the length H5 of the second vertical section 124 can also be 7.20 mm, 8.08 mm, 8.15 mm, 8.38 mm, 8.58 mm, 9.20 mm, as long as it is between 7.20 mm and 9.20 mm. The length H6 of the third transverse section 125 is 4.80 mm. Of course, in other embodiments, the length H6 of the third transverse section 125 can also be 3.80 mm, 4.66 mm, 4.76 mm, 4.86 mm, 4.96 mm, 5.80 mm, as long as it is between 3.80 mm and 5.80 mm. The length H7 of the right side 141 of the second mounting protrusion 14 is 6.00 mm. Of course, in other embodiments, the length H7 of the right side 141 of the second mounting protrusion 14 can also be 5.00 mm, 5.80 mm, 5.90 mm, 6.10, 6.20, 7.00, as long as it is between 5.00 mm and 7.00 mm. The length H8 of the left side edge 131 of the first mounting area B is 22.70 mm. Of course, in other embodiments, the length H8 of the left side edge 131 of the first mounting area B can also be 21.70 mm, 21.97 mm, 22.50 mm, 22.96 mm, 23.36 mm, 23.70 mm, as long as it is between 21.70 mm and 23.70 mm.

[0062] Optionally, see Figure 3In the present embodiment, the shape of the notch a is a square. Of course, in other embodiments, the shape of the notch a is a square or may be an arcuate or inverted trapezoidal shape.

[0063] Optionally, at least one of a light sensing connector 44 , a flash contact spring assembly 45 , an auxiliary camera connector 46 and a breathing light connector 47 is configured at a position corresponding to the first installation area B on the back side of the mainboard body 1 .

[0064] In order to improve the space utilization of the first mounting protrusion 13 in the mobile phone mainboard 100 and reduce the size of the mobile phone mainboard 100, preferably, please refer to Figure 1 and Figure 3 In this embodiment, a light sensing connector 44, a flash contact spring assembly 45, an auxiliary camera connector 46 and a breathing light connector 47 are arranged at a position corresponding to the first installation area B on the back side of the mainboard body 1; wherein, the light sensing connector 44 is arranged in the middle of the first installation protrusion 13, the flash contact spring assembly 45 is arranged at the lower side of the light sensing connector 44, the auxiliary camera connector 46 is arranged at the lower side of the flash contact spring assembly 45, and the breathing light connector 47 is arranged on the right side of the auxiliary camera connector 46.

[0065] In this way, after the mobile phone mainboard 100 is configured with a large-sized first reserved position A and the second reserved position F is placed, the light sensing connector 44, the flash contact spring assembly 45, the auxiliary camera connector 46 and the breathing light connector 47 are cleverly arranged in the narrow space of the first installation area B, which can reduce the size of the entire mobile phone mainboard 100 and make the space utilization rate of the mobile phone mainboard 100 higher.

[0066] For details, please refer to Figure 1 and Figure 3In this embodiment, the distance between the center of the optical connector 44 and the upper side of the first mounting protrusion 13 is 8.70 mm. Of course, in other embodiments, the distance between the center of the optical connector 44 and the upper side of the first mounting protrusion 13 may also be 8.20 mm, 8.47 mm, 8.67 mm, 8.74 mm, 8.94 mm, or 9.20 mm, as long as it is between 8.20 mm and 9.20 mm; and the distance between the right side of the optical connector 44 and the right side edge of the main body 1 is 24.70 mm. Of course, in other embodiments, the distance between the right side of the optical connector 44 and the right side edge of the main body 1 may also be 24.20 mm, 24.37 mm, 25.00 mm, or 26.70 mm. 5.20mm, as long as it is between 24.20mm and 25.20mm; the length of the center of the flash contact spring assembly 45 from the upper side of the first mounting protrusion 13 is 14.90mm. Of course, in other embodiments, the length of the center of the flash contact spring assembly 45 from the upper side of the first mounting protrusion 13 can also be 14.40mm, 14.66mm, 15.25mm, 15.40mm, as long as it is between 14.40mm and 15.40mm; the length of the right side of the flash contact spring assembly 45 from the right edge of the mainboard body 1 is 25.80mm. Of course, in other embodiments, the right side of the flash contact spring assembly 45 is 25.80mm from the right edge of the mainboard body 1. The length can also be 25.30mm, 25.50mm, 26.19mm, or 26.30mm; as long as it is between 25.30mm and 26.30mm; the length from the center of the auxiliary camera connector 46 to the upper side of the first mounting protrusion 13 is 19.80mm. Of course, in other embodiments, the length from the center of the auxiliary camera connector 46 to the upper side of the first mounting protrusion 13 can also be 19.30mm, 19.51mm, 20.19mm, or 20.30mm; as long as it is between 19.30mm and 20.30mm; the length from the right side of the auxiliary camera connector 46 to the right edge of the mainboard body 1 is 23.80mm. Of course, in other embodiments, the auxiliary camera connector 46 is 23.80mm long. The distance between the right side of the camera connector 46 and the right side edge of the mainboard body 1 can also be 23.30mm, 23.41mm, 24.09mm, or 24.20mm, as long as it is between 23.30mm and 24.20mm; the distance between the center of the breathing light connector 47 and the upper side of the first mounting protrusion 13 is 20.30mm. Of course, in other embodiments, the distance between the center of the breathing light connector 47 and the upper side of the first mounting protrusion 13 can also be 19.80mm, 19.99mm, 20.62mm, or 21.80mm, as long as it is between 19.80mm and 20.80mm; the distance between the right side of the breathing light connector 47 and the right side edge of the mainboard body 1 is 20.00mm.

[0067] Of course, in other embodiments, the length of the right side of the breathing light connector 47 from the right edge of the mainboard body 1 can also be 19.50mm, 19.50mm, or 20.50mm, as long as it is between 19.50mm and 20.50mm.

[0068] In order to improve the space utilization of the mobile phone mainboard 100 and reduce the size of the mobile phone mainboard 100, optionally, please refer to Figure 2 , Figure 4 and Figure 6 In this embodiment, the front of the mainboard body 1 is provided with a sim card mounting seat 31, a radio frequency amplifier shielding cover 32, a capacitor group shielding cover 33, a main chip shielding cover 34, a rear camera connector 35, a first antenna shrapnel 36, a second antenna shrapnel 37, and an infrared remote control light 38; wherein the sim card mounting seat 31 is arranged in the second mounting area C, the radio frequency amplifier shielding cover 32 is arranged on the upper side of the sim card mounting seat 31, the capacitor group shielding cover 33 is arranged on the lower side of the sim card mounting seat 31, and the main chip shielding cover 34 is arranged on the left side of the sim card mounting seat 31; the rear camera connector 35 is arranged on the upper side of the main chip shielding cover 34 and is located in the fourth mounting area E. The first antenna shrapnel 36 is arranged on the second mounting protrusion 14, the second antenna shrapnel 37 is arranged on the third mounting protrusion 15, and the infrared remote control light 38 is arranged on the first mounting protrusion 13.

[0069] Specifically, in the present embodiment, the length of the right frame of the SIM card mounting seat 31 from the side of the mainboard body 1 away from the main chip shielding cover 34 is 28.20mm. Of course, in other embodiments, the length of the right frame of the SIM card mounting seat 31 from the side of the mainboard body 1 away from the main chip shielding cover 34 may also be 27.70mm, 27.80mm, 28.60mm, 28.70mm; as long as it is between 27.70mm and 28.70mm; the length of the lower frame of the SIM card mounting seat 31 from the lower side of the mainboard body 1 is 10.70mm. Of course, in other embodiments, the length of the lower frame of the SIM card mounting seat 31 from the lower side of the mainboard body 1 may also be 10.20mm, 10.57mm, 10.94mm, 11.20mm, as long as it is between 10.20mm and 11.20mm.

[0070] In this way, after the outline of the mobile phone motherboard 100 is determined, the SIM card mounting seat 31 is arranged in the second mounting area C, and electronic components such as the RF power amplifier chip (hidden under the RF power amplifier shielding cover 32), the capacitor group (hidden under the capacitor group shielding cover 33), the main chip (hidden under the main chip shielding cover 34) and the rear camera connector 35 can be arranged on the upper and lower right sides of the SIM card mounting seat 31, so that the space utilization rate of the mobile phone motherboard 100 is high.

[0071] Similarly, preferably, please refer to Figure 2 and Figure 4 In this embodiment, a power management shielding cover 41, a radio frequency shielding cover 42 and a GPS shielding cover 43 are arranged on the back of the mainboard body 1. The radio frequency shielding cover 42 is arranged on the right side of the breathing light connector 47, the power management shielding cover 41 is arranged on the lower side of the auxiliary camera connector 46, and the GPS shielding cover 43 is arranged on the upper left of the power management shielding cover 41. In this embodiment, the radio frequency chip (hidden under the radio frequency shielding cover 42) and the GPS chip, which are easy to generate heat and consume a lot of power, are placed (hidden under the GPS shielding cover 43) on the back of the mainboard body 1, which is beneficial to the heat dissipation of the mainboard body 1, so as to reduce the heating problem of the mobile phone 1000.

[0072] In order to further improve the space utilization, reduce the FPC cable of a sub-board 2, and thus reduce the production cost, preferably, please refer to Figure 1 , Figure 3 , Figure 5 and Fig.11 In the present embodiment, the third mounting area D is provided with a screen plus sub-board connector 5, and the length from the center of the screen plus sub-board connector 5 to the right edge of the main board body 1 is 12.40 mm. Of course, in other embodiments, the length from the center of the screen plus sub-board connector 5 to the right edge of the main board body 1 may also be 11.90 mm, 12.11 mm, 12.79 mm, 12.90 mm, as long as it is between 11.90 mm and 12.90 mm; and the length from the center of the screen plus sub-board connector 5 to the lower side of the main board body 1 is 2.00 mm. Of course, in other embodiments, the length from the center of the screen plus sub-board connector 5 to the lower side of the main board body 1 may also be 1.50 mm, 1.95 mm, 2.05 mm, 2.50 mm, as long as it is between 1.50 mm and 2.50 mm. The screen plus sub-board connector 5 in this embodiment is connected to the display screen and the sub-board 2 respectively through the screen plus sub-board two-in-one FPC line 9. The screen plus sub-board two-in-one FPC line 9 in this embodiment is L-shaped.

[0073] Since the screen connector and the sub-board connector are improved into a screen plus sub-board connector 5 in the third installation area D, the length of the center of the screen plus sub-board connector 5 from the right edge of the main board body 1 is 11.90mm to 12.90mm, and the length of the center of the screen plus sub-board connector 5 from the lower side of the main board body 1 is 1.50mm to 2.50mm; in this way, more other electronic components can be arranged in the third installation area D, so that the space utilization rate of the mobile phone main board 100 is higher and the layout is more reasonable; in addition, this solution only needs to use a screen plus sub-board two-in-one FPC line 9 to realize the connection between the display screen and the sub-board 2; therefore, the production cost of the entire mobile phone 1000 can be reduced.

[0074] Preferably, in the present embodiment, in the third installation area D, the left side of the screen plus sub-board connector 5 is also sequentially configured with a fingerprint connector 6, a small screen connector 7 and a battery connector 8; the length of the left frame of the fingerprint connector 6 from the left frame of the mainboard body 1 is 4.00 mm. Of course, in other embodiments, the length of the left frame of the fingerprint connector 6 from the left frame of the mainboard body 1 can also be 3.50 mm, 3.90 mm, 4.10 mm, 4.50 mm, as long as it is between 3.50 mm and 4.50 mm. The length of the left frame of the small screen connector 7 from the left frame of the mainboard body 1 is 21.80 mm. Of course, in other embodiments, the length of the left frame of the small screen connector 7 from the left frame of the mainboard body 1 can also be 21.30 mm, 21.61 mm, 22.09 mm, 22.30 mm, as long as it is between 21.30 mm and 22.30 mm. The length of the left frame of the battery connector 8 from the left frame of the mainboard body 1 is 42.2mm. Of course, in other embodiments, the length of the left frame of the battery connector 8 from the left frame of the mainboard body 1 can also be 41.70mm, 41.90mm, 42.30mm, or 42.70mm, as long as it is between 41.70mm and 42.70mm.

[0075] Optionally, the centers of the fingerprint connector 6, the small screen connector 7, the battery connector 8 and the screen plus sub-board connector 5 are in a common line. Optionally, a battery pad 4 is also configured between the small screen connector 7 and the battery connector 8.

[0076] Optionally, see Figure 2 and Figure 4In this embodiment, the fourth mounting area E is provided with a rear camera connector 35, and the length of the lower frame of the rear camera connector 35 from the lower side of the main board body 1 is 26.40 mm. Of course, in other embodiments, the length of the lower frame of the rear camera connector from the lower side of the main board body 1 can also be 25.90, 26.08, 26.32, or 26.90 mm, as long as it is between 25.90 and 26.90 mm; the length of the right frame of the rear camera connector 35 from the right side of the main board body 1 is 5.40 mm. Of course, in other embodiments, the length of the right frame of the rear camera connector 35 from the right side of the main board body 1 can also be 4.90, 4.92, or 5.

[0077] 23mm, 5.90mm, as long as it is between 4.90mm and 5.90mm.

[0078] Since the fourth installation area E is configured at the upper right position of the main board body 1, the fourth installation area E includes a second installation protrusion 14 for configuring the first antenna shrapnel 36, and the fourth installation area E is equipped with a rear camera connector 35, and the length of the lower frame of the rear camera connector 35 from the lower side of the main board body 1 is 25.90mm to 26.90mm, and the length of the right frame of the rear camera connector 35 from the right side of the main board body 1 is 4.90mm to 5.90mm. That is, the first antenna shrapnel 36 and the rear camera connector 35 are configured in the corner area of ​​the main board body 1. In this way, it is convenient for the main board body 1 to reasonably arrange the SIM card mounting seat 31, the RF power amplifier shielding cover 32, the capacitor group shielding cover 33 and the main chip shielding cover 34, so that it has the advantages of reasonable layout and high space utilization.

[0079] Optionally, a power on and volume adjustment connecting spring 30 is disposed at the right edge of the mainboard body 1 .

[0080] In order to stably assemble the mobile phone motherboard 100 in the mobile phone housing 210, it is usually necessary to set assembly holes at the edge of the mobile phone motherboard 100, especially at the four corners of the mobile phone motherboard 100, and set studs (not shown in the figure) at the positions corresponding to the assembly holes on the inner side of the mobile phone housing 210, and fix the mobile phone motherboard 100 in the mobile phone housing 210 through threaded fasteners (not shown in the figure). In order to make the assembly stress of the mobile phone motherboard 100 more balanced and avoid the phenomenon of seesaw in the middle area of ​​the mobile phone motherboard 100, so as to improve the reliability of the mobile phone motherboard 100, preferably, please refer to Figure 2 and Figure 6In this embodiment, the fourth mounting area E is configured with a first assembly hole e1, a second assembly hole e2 and a third assembly hole e3. The first assembly hole e1 is configured in the lower left corner area of ​​the mainboard body 1, the second assembly hole e2 is configured in the lower right corner area of ​​the mainboard body 1, and the third assembly hole e3 is configured between the first assembly hole e1 and the second assembly hole e2, and corresponds to the right edge position of the SIM card mounting seat 31.

[0081] After the SIM card mounting seat 31, the RF power amplifier shielding cover 32, the capacitor group shielding cover 33 and the main chip shielding cover 34 are arranged on the front of the mainboard body 1, the first assembly hole e1 and the second assembly hole e2 are located in the two corner areas, and the third assembly hole e3 is configured between the first assembly hole e1 and the second assembly hole e2, and corresponds to the right edge position of the SIM card mounting seat 31, which just corresponds to the midpoint position of the stress on both sides of the mobile phone mainboard 100. In this way, the assembly stress of the mobile phone mainboard 100 can be more balanced, avoiding the seesaw phenomenon in the middle area of ​​the mobile phone mainboard 100.

[0082] Specifically, viewed from the front of the main board body 1, the length of the center of the first assembly hole e1, the second assembly hole e2 and the third assembly hole e3 from the lower side of the main board body 1 is 1.6 mm. Of course, in other embodiments, the length of the center of the first assembly hole e1, the second assembly hole e2 and the third assembly hole e3 from the lower side of the main board body 1 can also be 1.10 mm, 1.62 mm, 1.98 mm, 2.10 mm, as long as it is between 1.10 mm and 2.10 mm. The length of the center of the first assembly hole e1 from the left side of the main body 1 is 5.1 mm. Of course, in other embodiments, the length of the center of the first assembly hole e1 from the left side of the main body 1 can also be 4.60 mm, 4.95 mm, 5.26 mm, or 5.60 mm, as long as it is between 4.60 mm and 5.60 mm; the length of the center of the second assembly hole e2 from the center of the first assembly hole e1 is 60.30 mm. Of course, in other embodiments, the length of the center of the second assembly hole e2 from the center of the first assembly hole e1 is 60.30 mm. The length can also be 59.80mm, 60.20mm, 60.50mm, 60.80mm, as long as it is between 59.80mm and 60.80mm; the length from the center of the third assembly hole e3 to the center of the second assembly hole e2 is 38.0mm. Of course, in other embodiments, the length from the center of the third assembly hole e3 to the center of the second assembly hole e2 can also be 37.50mm, 37.90mm, 38.20mm, 38.50mm, as long as it is between 37.50mm and 38.50mm.

[0083] For further information, please refer to Figure 6In the present embodiment, viewed from the front of the mainboard body 1, a fourth assembly hole e4 is further configured at the upper left corner of the mainboard body 1, and the length of the hole center of the fourth assembly hole e4 from the lower side of the mainboard body 1 is 38.6 mm. Of course, in other embodiments, the length of the hole center of the fourth assembly hole e4 from the lower side of the mainboard body 1 may also be 38.10 mm, 38.50 mm, 38.80 mm, or 39.10 mm; as long as it is between 38.10 mm and 39.10 mm; a fifth assembly hole e5 is further configured at the upper right corner of the mainboard body 1, and the length of the hole center of the fifth assembly hole e5 from the lower side of the mainboard body 1 is 26.10 mm. Of course, in other embodiments, the length of the hole center of the fifth assembly hole e5 from the lower side of the mainboard body 1 may also be 25.60 mm, 25.90 mm, 26.10 mm, or 26.60 mm, as long as it is between 25.60 mm and 26.60 mm.

[0084] Furthermore, in this embodiment, a sixth assembly hole e6 is arranged between the first assembly hole e1 and the fourth assembly hole e4, and the sixth assembly hole e6 is configured at the lower side of the SIM card mounting seat 31. The length of the sixth assembly hole e6 from the center of the hole to the lower side of the mainboard body 1 is 8 mm. Of course, in other embodiments, the length of the sixth assembly hole e6 from the center of the hole to the lower side of the mainboard body 1 can also be 7.5 mm, 7.8 mm, 8.2 mm, 8.5 mm, as long as it is between 7.50 mm and 8.50 mm.

[0085] Furthermore, in the present embodiment, a seventh assembly hole e7 is arranged between the second assembly hole e2 and the fifth assembly hole e5, the centers of the second assembly hole e2, the fifth assembly hole e5 and the seventh assembly hole e7 are collinear, and the length of the second assembly hole e2 from the center of the hole and the center of the seventh assembly hole e7 is 22.50 mm. Of course, in other embodiments, the length of the second assembly hole e2 from the center of the hole and the center of the seventh assembly hole e7 may also be 22.00 mm, 22.38 mm, 22.83 mm, or 23.00 mm, as long as it is between 22.00 mm and 23.00 mm.

[0086] Optionally, in this embodiment, the first assembly hole e1, the second assembly hole e2 and the third assembly hole e3 are all round holes.

[0087] Optionally, see Figure 1 In this embodiment, a third reserved position G for avoiding the installation of the front camera is also provided on the right side of the third mounting protrusion 15.

[0088] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A mobile phone motherboard, comprising a motherboard body (1); characterized in that: The front of the mainboard body (1) is provided with a SIM card mounting seat (31), a radio frequency power amplifier shielding cover (32), a capacitor group shielding cover (33) and a main chip shielding cover (34); the SIM card mounting seat (31) is arranged on the left side of the front of the mainboard body (1), the radio frequency power amplifier shielding cover (32) is arranged on the upper side of the SIM card mounting seat (31), the capacitor group shielding cover (33) is arranged on the lower side of the SIM card mounting seat (31), and the main chip shielding cover (34) is arranged on the left side of the SIM card mounting seat (31); The lower side of the mainboard body (1) is provided with a first assembly hole (e1), a second assembly hole (e2) and a third assembly hole (e3); the first assembly hole (e1) is arranged at the lower left corner area of ​​the mainboard body (1); the second assembly hole (e2) is arranged at the lower right corner area of ​​the mainboard body (1); and the third assembly hole (e3) is arranged between the first assembly hole (e1) and the second assembly hole (e2) and corresponds to the right edge position of the SIM card mounting seat (31).

2. The mobile phone motherboard according to claim 1, characterized in that: When viewed from the front of the main board body (1), the distance between the centers of the first assembly hole (e1), the second assembly hole (e2) and the third assembly hole (e3) to the lower side of the main board body (1) is 1.10 mm to 2.10 mm, the distance between the center of the first assembly hole (e1) and the left side of the main board body (1) is 4.60 mm to 5.60 mm, the distance between the center of the second assembly hole (e2) and the center of the first assembly hole (e1) is 59.80 mm to 60.80 mm, and the distance between the center of the third assembly hole (e3) and the center of the second assembly hole (e2) is 37.50 mm to 38.50 mm.

3. The mobile phone motherboard as claimed in claim 2, characterized in that: When viewed from the front of the main board body (1), a fourth assembly hole (e4) is disposed at the upper left corner of the main board body (1), and the distance between the center of the fourth assembly hole (e4) and the lower side edge of the main board body (1) is 38.10 mm to 39.10 mm; a fifth assembly hole (e5) is disposed at the upper right corner of the main board body (1), and the distance between the center of the fifth assembly hole (e5) and the lower side edge of the main board body (1) is 25.60 mm to 26.60 mm.

4. The mobile phone motherboard as claimed in claim 3, characterized in that: A sixth assembly hole (e6) is also arranged between the first assembly hole (e1) and the fourth assembly hole (e4), and the sixth assembly hole (e6) is configured at the lower side of the SIM card mounting seat (31).

5. The mobile phone motherboard as claimed in claim 4, characterized in that: The distance between the center of the sixth assembly hole (e6) and the lower side of the main board body (1) is 7.50 mm to 8.50 mm.

6. The mobile phone motherboard as claimed in claim 4, characterized in that: A seventh assembly hole (e7) is also arranged between the second assembly hole and the fifth assembly hole (e5); the centers of the second assembly hole, the fifth assembly hole and the seventh assembly hole (e7) are collinear, and the length of the second assembly hole (e2) from the center of the hole and the center of the seventh assembly hole (e7) is 22.00 mm to 23.00 mm.

7. The mobile phone motherboard according to claim 6, characterized in that: The upper side of the mainboard body (1) is provided with a first mounting area (B) for assembling electronic components, and the back side of the mainboard body (1) is provided with at least one of a light sensing connector (44), a flash contact spring assembly (45), an auxiliary camera connector (46) and a breathing light connector (47) at a position corresponding to the first mounting area (B).

8. The mobile phone motherboard according to claim 7, characterized in that: When viewed from the back of the main board body (1), at least one of a fingerprint connector (6), a small screen connector (7), and a battery connector (8) is disposed on the lower side of the main board body (1).

9. The mobile phone motherboard according to claim 1, characterized in that: A third reserved position (G) for accommodating the front camera assembly is also provided on the right side of the second mounting protrusion (14).

10. A mobile phone, characterized in that: It comprises a mobile phone body (200) and a mobile phone mainboard as claimed in any one of claims 1 to 9, wherein the mobile phone mainboard is assembled in the mobile phone body (200).

Images