Anti-overflow solder paste carrying disc

Abstract

The utility model provides an anti-overflow solder paste carrying disc which comprises a base plate of a circular structure, a first baffle ring and a second baffle ring are arranged on the base plate, the first baffle ring and the second baffle ring are both of circular ring structures arranged in the circumferential direction of the base plate, the first baffle ring and the second baffle ring are coaxially arranged with the base plate, the first baffle ring is arranged on the outer side of the second baffle ring, and the second baffle ring is arranged on the outer side of the base plate. A first containing groove is formed by the distance between the first baffle ring and the second baffle ring and the base plate, a mounting table is arranged on the base plate, the mounting table and the base plate are coaxially arranged on the axis of the base plate, a second containing groove is formed by the distance between the mounting table and the second baffle ring, and solder paste is stored in the second containing groove. According to the anti-overflow solder paste carrying disc, the structure is simple, solder paste overflowing from the first storage groove is collected through the position of the first storage groove, the solder paste is effectively prevented from overflowing and dripping onto a product, and the machining quality of the product can be effectively guaranteed while the cleanliness of a working table is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of lamp strip production, in particular to an anti-overflow solder paste carrier. Background Art

[0002] In the manufacturing process of lighting strips, components need to be mounted on FPC pads and then fixed by high-temperature reflow. Solder paste connects components and FPC. There are currently two ways to attach solder paste to FPC pads, one is through steel screen printing, and the other is tinning with a nozzle. In the currently used nozzle tinning operation, a solder paste carrier is required to store the solder paste, and the nozzle then goes to the solder paste carrier to absorb the solder paste. However, when the scraper rolls over the solder paste carrier, the solder paste in the solder paste carrier is easy to overflow from the solder paste carrier, and the solder paste overflowing from the solder paste carrier is easy to fall onto the pressure plate cover or the product, affecting the subsequent processing quality of the product. Utility Model Content

[0003] The utility model aims to provide a solder paste carrier tray that prevents overflow, so as to solve the technical problems in the background technology.

[0004] In order to achieve the above-mentioned purpose, the utility model provides the following technical solutions:

[0005] A solder paste overflow prevention carrier comprises a chassis of a circular structure, wherein a first retaining ring and a second retaining ring are provided on the chassis, wherein the first retaining ring and the second retaining ring are both circular ring structures arranged along the circumferential direction of the chassis, wherein the first retaining ring and the second retaining ring are coaxially arranged with the chassis, wherein the first retaining ring is outside the second retaining ring, wherein the spacing between the first retaining ring and the second retaining ring and the chassis form a first storage groove, wherein a mounting platform is provided on the chassis, wherein the mounting platform is coaxially arranged with the chassis on the axis of the chassis, wherein the spacing between the mounting platform and the second retaining ring forms a second storage groove, wherein the solder paste is stored in the second storage groove.

[0006] The height of the first retaining ring is smaller than that of the second retaining ring, and the height difference between the first retaining ring and the second retaining ring is 2.5-5 mm.

[0007] The mounting platform has an opening at the top, a mounting cavity is arranged in the middle of the mounting platform, the height of the mounting platform is greater than the height of the second retaining ring, and the height difference between the second retaining ring and the mounting platform is 9-15 mm.

[0008] The chassis, the first retaining ring, the second retaining ring and the mounting platform are an integrated structure, and the chassis, the first retaining ring, the second retaining ring and the mounting platform are made of metal materials.

[0009] The thickness of the first retaining ring and the second retaining ring is 1-3 mm.

[0010] Compared with the prior art, the anti-overflow solder paste carrier of the present application has a simple structure and utilizes the position of the first storage slot to collect solder paste overflowing from the first storage slot, thereby effectively preventing the solder paste from overflowing and dripping onto the product, thereby ensuring the cleanliness of the work surface and effectively guaranteeing the processing quality of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 : A schematic diagram of the three-dimensional structure of the present application;

[0012] Figure 2 : A top view of the present application;

[0013] Figure 3 : Side view of the present application. DETAILED DESCRIPTION

[0014] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0015] Specific embodiment 1: Please refer to Figures 1 to 3 In an embodiment of the utility model, an anti-overflow solder paste carrier includes a circular structure chassis 1, a first retaining ring 2 and a second retaining ring 3 are provided on the chassis 1, the first retaining ring 2 and the second retaining ring 3 are both circular ring structures arranged along the circumferential direction of the chassis 1, the first retaining ring 2 and the second retaining ring 3 are coaxially arranged with the chassis 1, the first retaining ring 2 is outside the second retaining ring 3, that is, the outer diameter of the first retaining ring 2 is greater than the outer diameter of the second retaining ring 3, the distance between the first retaining ring 2 and the second retaining ring 3 forms a first storage groove 5 with the chassis 1, and a mounting platform 4 is provided on the chassis 1, the mounting platform 4 is coaxially arranged with the chassis 1 on the axis of the chassis 1, and the distance between the mounting platform 4 and the second retaining ring 3 forms a second storage groove 6, and the solder paste is stored in the second storage groove 6.

[0016] In the present application, the height of the first retaining ring 2 is smaller than the height of the second retaining ring 3, the height difference H1 between the first retaining ring 2 and the second retaining ring 3 is 2.5-5mm, and the thickness T1 of the first retaining ring 2 and the second retaining ring 3 is 1-3mm. In the present embodiment, the height difference H1 between the first retaining ring 2 and the second retaining ring 3 is 3mm, and the thickness T1 of the first retaining ring 2 and the second retaining ring 3 are both 1mm.

[0017] The mounting platform 4 has an opening at the top and a mounting cavity in the middle. The mounting platform 4 is used to mount and fix the solder paste carrier of the present application to the corresponding mounting seat on the machine. The height of the mounting platform 4 is greater than the height of the second retaining ring 3. The height difference H2 between the second retaining ring 3 and the mounting platform 4 is 9-15mm. In the present embodiment, the height difference H2 between the second retaining ring 3 and the mounting platform 4 is 10mm.

[0018] The chassis 1, the first retaining ring 2, the second retaining ring 3 and the mounting platform 4 are an integrated structure, and the chassis 1, the first retaining ring 2, the second retaining ring 3 and the mounting platform 4 are made of metal materials, such as lightweight aluminum alloy, copper alloy, zinc alloy and other materials.

[0019] Compared with the prior art, the anti-overflow solder paste carrier of the present application has a simple structure and utilizes the position of the first storage slot to collect solder paste overflowing from the first storage slot, thereby effectively preventing the solder paste from overflowing and dripping onto the product, thereby ensuring the cleanliness of the work surface and effectively guaranteeing the processing quality of the product.

[0020] It is obvious to those skilled in the art that the present invention is not limited to the details of the foregoing exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the foregoing description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0021] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. An anti-overflow solder paste carrier, characterized in that: A chassis including a circular structure is provided on the chassis, wherein a first retaining ring and a second retaining ring are provided on the chassis, wherein the first retaining ring and the second retaining ring are both circular ring structures provided along the circumferential direction of the chassis, wherein the first retaining ring and the second retaining ring are provided coaxially with the chassis, wherein the first retaining ring is provided on the outside of the second retaining ring, wherein the spacing between the first retaining ring and the second retaining ring and the chassis form a first storage groove, wherein a mounting platform is provided on the chassis, wherein the mounting platform is provided coaxially with the chassis on the axis of the chassis, wherein the spacing between the mounting platform and the second retaining ring forms a second storage groove, wherein solder paste is stored in the second storage groove.

2. The anti-overflow solder paste carrier according to claim 1, characterized in that: The height of the first retaining ring is smaller than that of the second retaining ring, and the height difference between the first retaining ring and the second retaining ring is 2.5-5 mm.

3. The anti-overflow solder paste carrier according to claim 2, characterized in that: The mounting platform has an opening at the top, a mounting cavity is arranged in the middle of the mounting platform, the height of the mounting platform is greater than the height of the second retaining ring, and the height difference between the second retaining ring and the mounting platform is 9-15 mm.

4. The anti-overflow solder paste carrier according to claim 3, characterized in that: The chassis, the first retaining ring, the second retaining ring and the mounting platform are an integrated structure, and the chassis, the first retaining ring, the second retaining ring and the mounting platform are made of metal materials.

5. The anti-overflow solder paste carrier according to claim 4, characterized in that: The thickness of the first retaining ring and the second retaining ring is 1-3 mm.

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