Semiconductor dispensing machine

Abstract

The utility model discloses a semiconductor dispenser which comprises a rack, a dispensing mechanism and a moving mechanism, the rack comprises a base and a support frame arranged on the base, the dispensing mechanism comprises a glue storage container, a dispensing head and a glue outlet control system, the dispensing head is communicated with the glue storage container through a pipeline, and the moving mechanism is arranged on the support frame. The glue dispensing head comprises a needle head seat and at least one glue dispensing needle head arranged on the needle head seat, a channel communicated with the at least one glue dispensing needle head is arranged in the needle head seat, and the same side of the needle head seat and the at least one glue dispensing needle head is further connected with height limiting pieces of different specifications corresponding to semiconductor chips. The height limiting piece protrudes out of the at least one dispensing needle head, the formed height difference is larger than the height of the semiconductor chip, and for the dispensing procedure after ball bonding of semiconductor packaging, the abnormity that the semiconductor chip is crushed, silicon is broken, and electric leakage is caused due to the fact that the dispensing needle head descends to the surface of the semiconductor chip by too low pressure can be completely eradicated.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a semiconductor glue dispensing machine. Background Art

[0002] In the existing semiconductor device manufacturing process, it is usually necessary to perform glue dispensing on the semiconductor chip, that is, using glue dispensing equipment to drop modified epoxy resin molecules on the semiconductor chip to cover the chip, bonding wires and pads. For example, by lowering the glue dispensing device to a set height above the chip, the glue is dripped onto the chip surface through the glue dispensing head. Under the action of surface tension, the glue covers the chip surface, thereby isolating the chip surface from the outside world.

[0003] The main way for existing dispensing devices to achieve semiconductor chip dispensing is to drive the dispensing head up and down through a screw rod or an eccentric wheel. The dispensing head of the dispensing device can detect the height difference by surface recognition. However, in the actual production process, deviations or vibrations are prone to occur, resulting in increased deviations, which in turn causes the dispensing head to drop too low to crush the surface of the semiconductor chip, causing the semiconductor chip to be crushed, silicon to break, leakage, and other abnormalities, resulting in batch defects of products and damage to fixture components, seriously affecting production yield and efficiency. Utility Model Content

[0004] The utility model aims to overcome the problems in the prior art that a dispensing head drops too low to press on the surface of a semiconductor chip, causing the semiconductor chip to be crushed, silicon to break, leakage, and the like, and discloses a semiconductor dispensing machine.

[0005] In order to achieve the above-mentioned purpose and other purposes, the utility model discloses a semiconductor dispensing machine, including: a frame, a dispensing mechanism, and a moving mechanism, the frame including a base and a support frame arranged on the base, the dispensing mechanism including a glue storage container, a dispensing head, and a glue output control system, the dispensing head is connected to the glue storage container through a pipeline, the dispensing head includes a needle seat and at least one dispensing needle arranged on the needle seat, the needle seat is provided with a channel communicating with the at least one dispensing needle, and the needle seat is also connected to the same side of the at least one dispensing needle with different specifications corresponding to the semiconductor chip, the height limiting member protrudes from the at least one dispensing needle and the height difference formed is greater than the height of the semiconductor chip.

[0006] As an implementation method, the needle seat has a first external thread section with external threads, and the height limiting member has a thread section corresponding to the first external thread section and formed with internal threads, and the internal threads of the height limiting member are screwed together with the external threads of the first external thread section in the needle seat.

[0007] As an implementable embodiment, the height limiting member is connected to the needle seat via a first complementary connection structure, and the first complementary connection structure includes an interlocking structure, a tenon structure, a lacing structure, an inter-attractive structure, or a buckle structure.

[0008] As an implementable embodiment, the height limiting member is a U-shaped structure having two height limiting parts arranged opposite to each other.

[0009] As an implementable embodiment, the height limiting member is a cylindrical structure having a circular height limiting portion or two arc-shaped height limiting portions arranged opposite to each other.

[0010] As an implementation method, the needle seat has a second external thread section formed with an external thread, and the needle seat is connected to the moving mechanism via the second external thread section.

[0011] As an implementable embodiment, the needle seat is connected to the moving mechanism via a second complementary connection structure.

[0012] As an implementable embodiment, the second complementary connection structure includes an interlocking structure, a tenon structure, a lacing structure, an inter-attractive structure, or a buckle structure.

[0013] As an implementable embodiment, the moving mechanism includes an up-and-down lifting mechanism, a rotating lifting mechanism, or a three-dimensional moving mechanism.

[0014] The beneficial effects of the utility model: the utility model discloses a semiconductor dispensing machine, in which the dispensing head comprises a needle seat, a dispensing needle, and a height limiting part on the same side as the dispensing needle, wherein the height limiting part protrudes from the dispensing needle and the height difference formed is greater than the height of the semiconductor chip. For the dispensing process after ball welding of semiconductor packaging, it can prevent the dispensing needle from descending too low and pressing the surface of the semiconductor chip to cause abnormalities such as the semiconductor chip being crushed, broken silicon, and leakage. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 Shown is an overall schematic diagram of a semiconductor dispensing machine according to an embodiment of the present invention.

[0016] Figure 2 Shown is an overall cross-sectional view of a semiconductor dispensing machine according to an embodiment of the present invention.

[0017] Figure 3 Shown is a schematic diagram of an exploded view of a semiconductor dispensing machine according to an embodiment of the present invention.

[0018] Figure 4 Shown is an exploded cross-sectional view of a semiconductor dispensing machine according to an embodiment of the present invention.

[0019] Figure 5Shown is a schematic diagram of the application of a semiconductor dispensing machine according to an embodiment of the present invention. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] For ease of description, spatially relative terms such as "under", "below", "below", "above", "on", "upper", etc. may be used herein to describe the relationship of an element or feature to other elements or features as shown in the drawings. It should be understood that the spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation shown in the drawings. For example, if the device in the drawings is turned over, the elements described as being "under" or "beneath" other elements or features will be oriented "above" the other elements or features. Therefore, the term "under" can include both above and below orientations.

[0022] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0023] As mentioned in the background technology, in the prior art, during the process of driving the dispensing head of the dispensing device to descend, due to certain deviations or sensor errors, the dispensing head may descend too low to press the surface of the semiconductor chip, causing abnormalities such as the semiconductor chip being crushed, broken silicon, leakage, etc., resulting in poor product batches and damage to fixture parts, seriously affecting production yield and efficiency. In view of this, the utility model proposes a semiconductor dispensing machine, which structurally transforms the existing dispensing head and sets a height limiter on the same side of the dispensing needle, wherein the height limiter protrudes from the dispensing needle and the height difference formed is greater than the height of the semiconductor chip. In this way, during the dispensing process after ball welding of the semiconductor package, the height limiter can be made to contact the semiconductor chip before the dispensing needle, ensuring that the dispensing needle will not press on the semiconductor surface when it descends, preventing abnormal situations such as the semiconductor chip being crushed, broken silicon, leakage, etc., thereby improving production yield and efficiency.

[0024] The utility model discloses a semiconductor glue dispensing machine, which comprises a frame, a glue dispensing mechanism and a moving mechanism.

[0025] The frame includes a base and a support frame arranged on the base. The support frame is a frame structure arranged by plugging, locking, welding, etc. In some embodiments, the support frame may include a plurality of support columns and a top frame. For example, three support columns are fixedly connected to the triangular positions of the upper end surface of the base or four support columns are fixedly connected to the four corners of the upper end surface of the base. The lengths of these three columns or four columns are equal to form a support plane by their top ends, and the top frame can be arranged on the formed support plane. The number and structure of the support columns and the structure of the top frame are not limited thereto. In other embodiments, different changes can still be made according to actual production needs.

[0026] The glue dispensing mechanism comprises a glue storage container, a glue dispensing head, and a glue dispensing control system.

[0027] The glue storage container is used to store glue. In some embodiments, the glue storage container may be, for example, a glue storage barrel. The glue storage barrel may adopt a cylindrical structure. The top of the glue storage barrel may be provided with an opening for introducing glue. The opening may be covered by a lid. The bottom of the glue storage barrel may be provided with a glue outlet hole.

[0028] The dispensing head is connected to the glue storage container through a pipeline. In some embodiments, the dispensing head can be connected to the glue outlet of the glue storage barrel through a hose. The dispensing head can include a needle seat and at least one dispensing needle disposed on the needle seat.

[0029] See also Figures 1 to 5, which is a schematic diagram of the structure of the dispensing head in one embodiment. As shown in the figure, the dispensing head may include a needle seat 11 and at least one dispensing needle 12 disposed on the needle seat 11. In this embodiment, one dispensing needle 12 is used as an example for description, but it is not limited to this. In other embodiments, the number of dispensing needles 12 may also be multiple.

[0030] The dispensing needle 12 is mounted on the needle seat 11. The needle seat 11 is a hollow structure, and a channel communicating with the dispensing needle 12 is provided therein. In some embodiments, the dispensing needle 12 is fixedly disposed on the needle seat 11 or is integrally formed with the needle seat 11. In some embodiments, the dispensing needle 12 is detachably mounted on the needle seat 11, for example, the dispensing needle 12 is screwed to the needle seat 11. In this way, dispensing needles 12 of different specifications can be replaced according to the requirements of the semiconductor chip or the dispensing process, for example, dispensing needles 12 of different sizes (different apertures in the needle) and / or different lengths can be replaced.

[0031] A height limiting member 13 is also connected to the same side of the needle seat 11 as the at least one dispensing needle 12. In some embodiments, one end of the needle seat 11 on the same side as the installed dispensing needle 12 (for example, can be called the lower side) has a first external thread segment 111 formed with an external thread, and the height limiting member 13 has a thread segment 131 corresponding to the first external thread segment 111 and formed with an internal thread, and the internal thread of the thread segment 131 in the height limiting member 13 is screwed with the external thread of the first external thread segment 111 in the needle seat 11. In this way, height limiting members 13 of different specifications can be replaced according to the requirements of the semiconductor chip or the dispensing process. In other embodiments, the height limiting member 13 can also be connected to the needle seat 11 in other ways. For example, the height limiting member is connected to the needle seat through a first complementary connection structure, and the first complementary connection structure includes but is not limited to an interlocking structure, a tenon structure, a lacing structure, a mutual suction structure, or a buckle structure.

[0032] The height limiting member 13 protrudes from the dispensing needle 12 and the height difference formed by the two is greater than the height of the semiconductor chip. In the embodiment shown in the figure, the height limiting member 13 can be, for example, a U-shaped structure, wherein the middle part is a portion for connecting with the needle seat 11, and the middle part extends to form two limiting portions 132, which are arranged oppositely, and the limiting portion 132 is a plate-like structure. The height of the limiting portion 132 is greater than the dispensing needle 12, and the width between the two limiting portions 132 is related to the different packaging of the semiconductor chip. After the limiting member 13 is installed on the needle seat 11, the height limiting member 13 protrudes from the dispensing needle 12 and the height difference formed by the two is greater than the height of the semiconductor chip. Therefore, for semiconductor chips of different thicknesses, different height limiting members 13 can be installed. That is, by installing height limiting members of different widths, it can be applied to different semiconductor chip packages, and by installing limiting members of different heights, it can be applied to semiconductor chips of different thicknesses. In other embodiments, the limiter may be, for example, a cylindrical structure having a circular height limiting portion or two arc-shaped height limiting portions arranged opposite to each other, and the height of the two arc-shaped height limiting portions is greater than that of the dispensing needle, which should have a similar effect.

[0033] The needle seat 11 is connected to the moving mechanism. The moving mechanism is used to drive the dispensing head to move, wherein moving the dispensing head at least includes driving the dispensing head to move up and down in the up and down directions. Therefore, in some embodiments, the moving mechanism may be, for example, an up and down lifting mechanism, which may include a servo motor, a lifting screw, a lifting guide rod, and a movable mounting plate, etc. The lifting screw and the lifting guide rod are arranged up and down and pass through the movable mounting plate, the mounting plate is screwed to the lifting screw, the servo motor is associated with the lifting screw, and the needle seat of the dispensing head is arranged on the movable mounting plate. In actual application, the lifting screw associated with the servo motor is driven to rotate to drive the movable mounting plate and the dispensing head thereon to move up and down along the lifting guide rod. Of course, the up and down lifting mechanism may also use other components.

[0034] In addition, in other embodiments, the moving mechanism may also be a rotating lifting mechanism, a three-dimensional moving mechanism or other types of moving mechanisms. The rotating lifting mechanism can drive the connected dispensing head to rotate (rotate within a set angle range or rotate in all directions) and move up and down. The three-dimensional moving mechanism can drive the connected dispensing head to move in a horizontal plane and move up and down.

[0035] As shown in the figure, the other side of the needle seat 11 (for example, it can be called the upper side) has a second external thread section 112 formed with an external thread, and the relevant parts of the mobile mechanism (for example, the movable mounting plate) are provided with corresponding screw holes, and the needle seat 11 can be connected to the mobile mechanism through the second external thread section 112. In other embodiments, the needle seat can also be connected to the mobile mechanism in other ways. For example, the needle seat is connected to the mobile mechanism through a second complementary connection structure, and the second complementary connection structure includes an interlocking structure, a tenon structure, a lacing structure, a mutual suction structure, or a buckle structure.

[0036] When using the semiconductor dispensing machine of the utility model, if Figure 5 As shown, the semiconductor chip 2 is arranged on the frame 3; according to the specifications of the semiconductor chip (such as width and height) and the requirements of the dispensing process, the corresponding limiter 13 is installed on the needle seat 11, so that the installed limiter 13 protrudes from the dispensing needle 12 and the height difference formed is greater than the height of the semiconductor chip 2; the dispensing head 1 (including the needle seat 11, the dispensing needle 12, and the limiter 13) is driven downward by a moving mechanism. Since the limiter 13 protrudes from the dispensing needle 12, the limiter 13 first contacts the frame 3, which can prevent the dispensing head 1 (such as the dispensing needle 12) from further descending, ensuring that the height difference between the dispensing needle 12 and the frame 3 is greater than the height of the semiconductor chip 2, thereby preventing the product from being crushed, broken silicon, leakage, and other abnormalities caused by improper height of the dispensing needle 12.

[0037] The semiconductor glue dispensing machine disclosed by the utility model comprises a frame, a glue dispensing mechanism, and a mobile mechanism glue dispensing head, wherein the glue dispensing head in the glue dispensing mechanism comprises a needle seat, a glue dispensing needle, and a height limiting member on the same side as the glue dispensing needle, the height limiting member protrudes from the glue dispensing needle and the height difference formed is greater than the height of the semiconductor chip, and for the glue dispensing process after ball welding of semiconductor packaging, it can prevent the glue dispensing needle from descending too low to the surface of the semiconductor chip and causing abnormalities such as the semiconductor chip being crushed, broken silicon, and leakage.

[0038] Although the utility model has been disclosed as above in the form of a preferred embodiment, it is not intended to limit the utility model. Any technical personnel in this field can make possible changes and modifications to the technical solution of the utility model by using the methods and technical contents disclosed above without departing from the spirit and scope of the utility model. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the utility model without departing from the content of the technical solution of the utility model are within the protection scope of the technical solution of the utility model.

Claims

1. A semiconductor dispensing machine, characterized in that: include: A frame, a dispensing mechanism, and a moving mechanism, wherein the frame includes a base and a support frame arranged on the base, the dispensing mechanism includes a glue storage container, a dispensing head, and a glue output control system, the dispensing head is connected to the glue storage container through a pipeline, the dispensing head includes a needle seat and at least one dispensing needle arranged on the needle seat, the needle seat is provided with a channel communicating with the at least one dispensing needle, and the needle seat is also connected to a height limiting member of different specifications corresponding to the semiconductor chip on the same side as the at least one dispensing needle, the height limiting member protrudes from the at least one dispensing needle and the height difference formed is greater than the height of the semiconductor chip.

2. The semiconductor dispensing machine according to claim 1, characterized in that: The needle seat has a first external thread section with external threads, the height limiting member has a thread section corresponding to the first external thread section and formed with internal threads, and the internal threads of the height limiting member are screwed together with the external threads of the first external thread section in the needle seat.

3. The semiconductor dispensing machine according to claim 1, characterized in that: The height limiting member is connected to the needle seat via a first complementary connection structure, wherein the first complementary connection structure comprises an interlocking structure, a tenon structure, a lacing structure, a mutual suction structure, or a buckle structure.

4. The semiconductor dispensing machine according to claim 2 or 3, characterized in that: The height limiting member is a U-shaped structure, and has two height limiting parts arranged opposite to each other.

5. The semiconductor dispensing machine according to claim 2 or 3, characterized in that: The height limiting member is a cylindrical structure, having a circular height limiting portion or two arc-shaped height limiting portions arranged opposite to each other.

6. The semiconductor dispensing machine according to claim 1, 2 or 3, characterized in that: The needle seat has a second external thread section formed with external threads, and the needle seat is connected to the moving mechanism through the second external thread section.

7. The semiconductor dispensing machine according to claim 1, characterized in that: The needle seat is connected to the moving mechanism via a second complementary connection structure.

8. The semiconductor dispensing machine according to claim 7, characterized in that: The second complementary connection structure includes an interlocking structure, a tenon structure, a lacing structure, an inter-attractive structure, or a buckle structure.

9. The semiconductor dispensing machine according to claim 1, characterized in that: The moving mechanism includes an up-and-down lifting mechanism, a rotating lifting mechanism, or a three-dimensional moving mechanism.

Images