Chip conversion assembly and cartridge assembly

Abstract

The utility model provides a chip conversion assembly used for being detachably installed in an imaging device provided with electrodes, the imaging device is used for containing a box provided with at least one electric contact part, and the imaging device and the box establish communication connection through the chip conversion assembly. The chip conversion assembly comprises a supporting piece and a conversion piece, the conversion piece is supported by the supporting piece, the supporting piece is used for enabling the chip conversion assembly to be installed in the imaging equipment, and the conversion piece is used for electrically connecting the electric contact part and the electrode; the chip conversion assembly and the box are separately arranged, and the chip conversion assembly can be independently assembled in the imaging equipment; the conversion piece comprises a first contact part and a second contact part, and the second contact part can move relative to the imaging equipment along with at least one part of the box, so that a forcing force for forcing the chip end to have a trend of moving towards the electric contact part and forcing the electrode end to have a trend of moving towards the electrode is generated.

Description

Technical Field

[0001] The utility model relates to the field of electronic photographic imaging, in particular to a chip conversion component detachably installed in an electronic photographic imaging device and a box component having the chip conversion component. Background Art

[0002] The processing box can be installed to the imaging device in a detachable manner. The processing box includes at least a developing box and a drum box. The developing box includes a developing roller rotatably arranged therein; the drum box includes a photosensitive drum rotatably arranged therein; the developing roller is used to supply the developer in the developing box to the photosensitive drum.

[0003] The developing box is also provided with a chip for storing developing box parameter information. The chip includes at least an electrical contact portion, and the developing box establishes a communication connection with the imaging device through the electrical contact portion.

[0004] During the operation of the imaging device, there will be residual developer on the surface of the photosensitive drum. In order to ensure the imaging quality, the surface of the photosensitive drum needs to be cleaned when the imaging device is not imaging. Therefore, the developing roller and the photosensitive drum need to be converted from a close state to a separated state, that is, the developing box and the drum box need to be separated from each other, at least one of the developing box and the drum box will move, and the chip in the chip assembly needs to keep in contact with the imaging device at all times, so that the imaging device will not report an error.

[0005] In the prior art, on the one hand, the chip is fixedly set on the developing box. During the separation process of the developing box and the drum box, the chip is easily affected by the separation process, and the chip and the imaging device are prone to poor contact or disconnection, so that the imaging device will report an error.

[0006] Second, as Figure 1 As shown, in the prior art, the electrical contact portion of the chip directly forms electrical contact with the electrode 91 in the imaging device, and the arrangement of the electrical contact portion must be consistent with the arrangement of the electrodes in the imaging device. This arrangement limits the position and size of the chip, especially when the electrodes are arranged closely. This has certain requirements for the size design of the chip, which increases the difficulty of chip manufacturing. Utility Model Content

[0007] The chip conversion assembly and box assembly provided by the utility model can at least solve one of the above technical problems.

[0008] A chip conversion assembly is detachably mounted in an imaging device provided with electrodes, wherein the imaging device is used to accommodate a cartridge having at least one electrical contact portion, and the imaging device and the cartridge establish a communication connection via the chip conversion assembly;

[0009] The chip conversion assembly includes a support member and a conversion member. The conversion member is supported by the support member. The support member is used to enable the chip conversion assembly to be installed in the imaging device. The conversion member is used to electrically connect the electrical contact part and the electrode. The chip conversion assembly is separately arranged from the box, and the chip conversion assembly can be independently assembled in the imaging device.

[0010] The conversion member is made of a conductive material, and includes a first contact portion, a second contact portion and a second connecting portion for electrically connecting the first contact portion and the second contact portion, the first contact portion is used to electrically contact the electrode, the second contact portion is used to electrically contact the electrical contact portion, and the second contact portion is capable of following at least a portion of the box to move relative to the imaging device.

[0011] At least one of the second contact portion and the second connecting portion is movable relative to the first contact portion; the second contact portion is bent relative to the second connecting portion to form a variable angle therebetween; and the second connecting portion is configured as a telescopic member or an elastic member.

[0012] The support member includes at least a base and a supporting portion. The base is used to enable the chip conversion assembly to be installed in the imaging device. The conversion member is supported by the supporting portion. The supporting portion is provided with a chip end and an electrode end. The first contact portion is provided at the electrode end, the second contact portion is provided at the chip end, and the base is connected to the chip end.

[0013] The chip conversion assembly further includes a first connecting portion, through which the chip end and the electrode end are fixedly connected.

[0014] The chip end and the electrode end are separately provided, and the chip end is movably connected to the electrode end.

[0015] The chip conversion assembly further comprises an elastic member, which is used to force the chip end and the electrode end to move away from each other; the elastic member is configured as a compression spring, and the elastic member is located between the chip end and the electrode end.

[0016] The cartridge assembly includes a cartridge and a chip conversion assembly, wherein the cartridge includes at least one of a developing cartridge and a drum cartridge, and at least one of the developing cartridge and the drum cartridge is provided with an electrical contact portion;

[0017] The developing cartridge includes a developing cartridge housing for accommodating a developer and a developing roller rotatably disposed in the developing cartridge housing;

[0018] The drum cartridge includes a drum casing and a photosensitive drum rotatably disposed in the drum casing, and the developing roller is used to supply developer to the photosensitive drum;

[0019] The chip conversion assembly is used to electrically connect the electrical contacts and the electrodes.

[0020] At least one of the second contact portion, the elastic member and the second connecting portion in the chip conversion assembly provided by the present invention can undergo elastic deformation to generate a pushing force, and the pushing force is used to force the chip end to have a tendency to move toward the chip / electrical contact portion, and the electrode end to have a tendency to move toward the electrode. Therefore, in the process of the developing roller and the photosensitive drum separating from each other and contacting again after separation, the electrical contact portion can always maintain electrical contact with the second contact portion, thereby avoiding the situation where the imaging device reports an error due to the electrical contact portion being out of contact with the second contact portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the contact between the electrical contact portion and the electrode in the prior art.

[0022] Figure 2A This is an exploded view of the processing box and the chip involved in the utility model.

[0023] Figure 2B This is a three-dimensional diagram of the chip involved in the present invention after being installed in the processing box.

[0024] Figure 3 It is a three-dimensional diagram of the electrode assembly involved in the present utility model.

[0025] Figure 4A It is a three-dimensional diagram of the chip conversion assembly involved in the first embodiment of the present invention.

[0026] Figure 4B This is an exploded view of the chip conversion assembly involved in the first embodiment of the present invention.

[0027] Figure 5 It is a three-dimensional diagram of the electrode assembly and the chip conversion assembly involved in the first embodiment of the present invention after being combined.

[0028] Figure 6 It is a three-dimensional diagram of the processing box assembly and the electrode assembly involved in the first embodiment of the present invention after being combined.

[0029] Figure 7A It is a plan view of the chip conversion assembly, chip, and electrode assembly involved in the first embodiment of the present invention after being combined and cut along the front-to-back direction during development by an imaging device.

[0030] Figure 7B It is a plan view of the chip conversion assembly, chip, and electrode assembly involved in the first embodiment of the present invention, cut along the front-to-back direction when the imaging device is performing a cleaning operation after being combined.

[0031] Figure 8A It is a plan view of the chip conversion assembly, chip, and electrode assembly involved in the second embodiment of the present invention after being combined and cut along the front-to-back direction during development by an imaging device.

[0032] Figure 8B It is a plan view of the chip conversion assembly, chip, and electrode assembly involved in the second embodiment of the present invention, cut along the front-to-back direction when the imaging device is performing a cleaning operation after being combined.

[0033] Figure 9 It is a plan view of the chip conversion assembly, chip, and electrode assembly involved in the third embodiment of the present invention after being combined and cut along the front-to-back direction during development by an imaging device.

[0034] Figure 10 It is a schematic diagram of the electrical contact portion of the present invention forming electrical contact with the electrode through the chip conversion component. DETAILED DESCRIPTION

[0035] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0036] like Figure 2A and Figure 2B As shown, the processing box 100 includes at least one of a developer box 10 and a drum box 20, and the processing box can be simply referred to as a "box", the developer box 10 includes a developer box shell 11 and a developer roller 12 rotatably arranged in the developer box shell 11, and the developer roller 12 rotates around a rotation axis M; the drum box 20 includes a drum shell 21 and a photosensitive drum 22 rotatably arranged in the drum shell 21, and the photosensitive drum 22 rotates around a rotation axis parallel to the rotation axis M; the surface of the photosensitive drum 22 is used to form an electrostatic latent image, and the developer roller 12 is used to supply developer to the photosensitive drum 22 so that the electrostatic latent image on the surface of the photosensitive drum 22 is developed; the developer box shell 11 and the drum shell 21 can be collectively referred to as a box shell, and the developer roller 12 and the photosensitive drum 22 can be collectively referred to as a rotating member.

[0037] In order to avoid damage to the developing roller 12 and the photosensitive drum 22 due to long-term contact and to extend the service life of the developing roller 12 and the photosensitive drum 22, when the imaging device is not developing, the developing box 10 and the drum box 20 will move relative to each other. Specifically, at least one of the developing box 10 and the drum box 20 can move relative to the imaging device, and the developing roller 12 and the photosensitive drum 22 are transformed from a state of being close to each other to a state of being separated from each other, and remain in a state of being separated from each other.

[0038] The processing box 100 also includes a chip for storing parameter information of the processing box 100. The chip includes a substrate 220 and at least one electrical contact portion 221. The electrical contact portion 221 is used to form electrical contact with the imaging device. Optionally, the electrical contact portion 221 is located on the substrate 220, and the substrate 220 is mounted on the chip mounting portion 30.

[0039] For the convenience of the following description, the direction parallel to the direction in which the rotation axis M extends is defined as the left-right direction, the direction intersecting the left-right direction is defined as the front-back direction, the developing roller 12 is located at the front end of the developing housing 11, and the direction intersecting both the left-right direction and the front-back direction is defined as the up-down direction; preferably, the left-right direction, the up-down direction and the front-back direction are perpendicular to each other; the direction of the imaging device is consistent with the direction of the processing box 100.

[0040] The processing box 100 is also provided with a driving force receiving member and at least one end cover, which is fixedly connected to the box body. The driving force receiving member is used to receive driving force from the imaging device. Along the left and right directions, an end cover 40 in the processing box 100 is arranged on the same side as the driving force receiving member.

[0041] At least one of the developer box 10 and the drum box 20 is provided with a chip mounting portion 30, at least the electrical contact portion 221 is supported by the chip mounting portion 30, and the chip mounting portion 30 is arranged to be fixed relative to the developer box housing 11 / drum housing 21 / end cover 40, so that the electrical contact portion 221 is also fixed relative to the developer box housing 11 / drum housing 21 / end cover. Optionally, the chip mounting portion 30 is located at the end of the processing box 100.

[0042] In some embodiments, the chip mounting portion 30 is integrally formed with the box housing / end cover 40 , which can reduce the number of parts of the box and the number of assembly steps.

[0043] In some embodiments, the chip mounting portion 30 is separately provided from the box shell / end cover 40, and the chip mounting portion 30 can be fixedly mounted on the developer box shell 11 / drum shell 12 indirectly or directly, so that the installation position of the chip mounting portion 30 can have more options during design.

[0044] like Figure 3 As shown, the imaging device has an electrode assembly for forming electrical contact with the chip, the electrode assembly includes an electrode mounting portion 90 and at least one electrode 91, the electrode 91 is mounted in the electrode mounting portion 90, the electrode mounting portion 90 is provided with a mounting groove 92 and a first side wall 93 and a second side wall 94 adjacent to the mounting groove 92, the first side wall 93 and the second side wall 94 are arranged opposite to each other, preferably, the electrode 91 is arranged on the first side wall 93 or the second side wall 94, and the electrode 91 is used to form electrical contact with the electrical contact portion 221.

[0045] In order to ensure that the chip always maintains a communication connection with the imaging device during the separation process of the developing box 10 and the drum box 20, that is, during the separation process of the developing roller 12 and the photosensitive drum 22, the utility model provides a chip conversion component 300 as described below, and the chip conversion component 300 can be installed to the imaging device in a detachable manner separately. At the same time, the chip conversion component 300 is independent of the box 100, and the box 100 establishes a communication connection with the imaging device through the chip conversion component.

[0046] When the chip conversion assembly 300 and the box 100 are both installed in the imaging device, during the relative movement of the developing box 10 and the drum box 20, or in other words, during the separation of the developing roller 12 and the photosensitive drum 22, the portion of the chip conversion assembly 300 used for electrical contact with the electrical contact portion 221 can follow at least a portion of the box 100 to move relative to the imaging device. Specifically, the portion that is in electrical contact with the electrical contact portion 221 moves together with the developing box 10 / drum box 20, so that a stable electrical connection is formed between the electrical contact portion 221 and the electrode 91.

[0047] The combination formed by the box 100 and the chip conversion assembly 300 can be called a box assembly. The following is a detailed description taking the chip installed in the developer box 10 as an example. At this time, the box assembly includes the developer box 10 and the chip conversion assembly 300.

[0048] [Example 1]

[0049] like Figure 4A 、 Figure 4B 、 Figure 5 and Figure 6 As shown, in this embodiment, the chip conversion assembly 300 includes a support member 310 and a conversion member 320. The conversion member 320 is supported by the support member 310. The support member 310 is also used for positioning in the imaging device. The conversion member 320 is used to electrically connect the electrical contact portion 221 and the electrode 91.

[0050] The support member 310 includes a base and a supporting portion. The supporting portion is used to support the conversion member 320. The base is used to install the chip conversion assembly 300 in the imaging device. In this embodiment, the base and the supporting portion are integrally arranged, and at least a portion of the base overlaps with at least a portion of the supporting portion.

[0051] The supporting portion includes a first portion 315 , a second portion 313 and a first connecting portion 318 . The first portion 315 and the second portion 313 are connected via the first connecting portion 318 . The connection may be a movable connection or a fixed connection.

[0052] Optionally, the base includes a housing cavity 314 for accommodating at least the chip. Preferably, at least a portion of the chip and a portion of the conversion member 320 are accommodated by the housing cavity 314, so that the conversion member 320 and the electrical contact portion 221 can form electrical contact in the housing cavity 314, which is conducive to ensuring stable electrical contact between the two; the base also includes a first side plate 311, a second side plate 312 and a third side plate 316, and the first side plate 311, the second side plate 312 and the third side plate 316 enclose the housing cavity 314, and the second side plate 312 is located between the first side plate 311 and the third side plate 316. Along the arrangement direction of the base and the support portion, compared with the first side plate 311, the third side plate 316 is closer to the support portion. Therefore, the third side plate 316 can serve as a part of the support portion. As shown in the figure, the third side plate 316 is arranged on the second portion 313 of the support portion; in some embodiments, the third side plate 316 overlaps with the second portion 313.

[0053] In some embodiments, only one of the first side plate 311 and the second side plate 312 may be provided, which can reduce the number of components of the chip conversion assembly 300 and save costs.

[0054] In some embodiments, the third side plate 316 can also be set on the first part 315 of the support part, and the first side plate 311 can also be set on the second part 313 of the support part. The first contact part 321 of the conversion part 320 is still supported by the first part 315, and the second contact part 322 is still supported by the second part 313. The second contact part 322 / the second connecting part 323 forms an electrical contact with the electrical contact part, which can reduce the size of the support part.

[0055] The conversion member 320 is made of a conductive material and includes a first contact portion 321 for electrically contacting / connecting to the electrode 91 and a second contact portion 322 for electrically contacting / connecting to the electrical contact portion 221; in the conversion member 320 involved in this embodiment, at least the second contact portion 322 can be displaced relative to the first contact portion 321.

[0056] The first contact portion 321 is supported by the first part 315. Along the arrangement direction of the first part 315 and the second part 313, the end where the first part 315 is located can be called the electrode end 319 of the chip conversion component 300; the second contact portion 322 is supported by the second part 313, and the end where the second part 313 is located can be called the chip end 317 of the chip conversion component 300; in other words, the first contact portion 321 is set at the electrode end 319, and the second contact portion 322 is set at the chip end 317.

[0057] The conversion member 320 further includes a second connecting portion 323 , through which the first contact portion 321 and the second contact portion 322 are electrically connected. The conversion member 320 is configured as an integral or split body.

[0058] In some embodiments, the second connection portion 323 can also be displaced relative to the first contact portion 321; when the conversion member 320 is provided as an integral part, the second connection portion 323 can be provided with multiple folds so that the second connection portion 323 can be displaced relative to the first contact portion 321; when the conversion member 320 is provided as a separate body, through the second connection portion 323, the second contact portion 322 can follow the second connection portion 323 to expand and contract relative to the first contact portion 321, or the second connection portion 323 can be provided as an elastic member.

[0059] In this embodiment, the conversion member 320 is formed as a conductive sheet, and at least the second contact portion 322 is movable relative to the first contact portion 321; optionally, the second contact portion 322 is configured to be bent relative to the second connecting portion 323, forming a variable angle between the second contact portion 322 and the second connecting portion 323.

[0060] When the image forming apparatus is developing, the developing roller 12 and the photosensitive drum 22 are in contact with each other. Figure 7A As shown, the second contact portion 322 and the second connecting portion 323 form an angle A1. At this time, the second contact portion 322 and the electrical contact portion 221 are squeezed against each other, so that the second contact portion 322 is in an elastic deformation state; Figure 7B As shown, when the imaging device performs a cleaning operation on the photosensitive drum 12, at least one of the developing box 10 and the drum box 20 moves, and the two separate from each other, thereby causing the developing roller 12 and the photosensitive drum 22 to transition from a state of mutual contact to a state of mutual separation, and the chip will also move with the developing box 10 or the drum box 20.

[0061] When the developing roller 12 and the photosensitive drum 22 are separated from each other, the second contact portion 322 forms an angle A2 with the second connecting portion 323, and the angle A2 is greater than the angle A1. During the change of the angle, or in other words, during the separation of the developing roller 12 and the photosensitive drum 22, the first pushing force released by the second contact portion 322 causes the second contact portion 322 to move relative to the imaging device along with the box shell, that is, the second contact portion 322 moves along with the developing box 10, so that the second contact portion 322 does not move relative to the box shell, and the first pushing force enables the electrical contact portion 221 and the second contact portion 322 to maintain stable electrical contact at all times. Furthermore, the first pushing force can also allow the first contact portion 321 to have a tendency to move toward the electrode 91, so that the electrical contact between the first contact portion 321 and the electrode 91 is tighter, thereby ensuring that the processing box 100 and the imaging device always maintain a communication connection.

[0062] In the above process, since the second contact portion 322 and the electrical contact portion 221 are accommodated in the accommodating cavity 314, the first forced thrust generated by the angle change will not cause the chip conversion assembly 300 to displace in the front-to-back direction in the mounting groove 92. The second contact portion 322 can be stably supported by the second part 313, thereby, the second contact portion 322 and the electrical contact portion 221 can maintain stable electrical contact.

[0063] [Example 2]

[0064] This embodiment is described only with respect to the differences from the first embodiment.

[0065] like Figure 8A and Figure 8B As shown, in this embodiment, the first part 315 and the second part 313 of the support part are separately arranged, and the electrode end 319 and the chip end 317 / accommodating cavity 314 are also separately arranged, and the first contact part 321 and the second contact part 322 are still connected through the second connecting part 323, and the second connecting part 323 is movable relative to the first contact part 321, and the second connecting part 323 is set to be a flexible body, such as: a wire; in this way, the second connecting part 323 will be able to move relative to the first contact part 321 or the second contact part 322, and the first contact part 321 and the second contact part 322 are movably connected through the second connecting part 323, and the second connecting part 323 is set to be a flexible body, which is conducive to improving the design freedom and installation freedom of the entire chip conversion component 300.

[0066] Optionally, the chip conversion assembly 300 is also provided with an elastic member 330, which can force the electrode end 319 and the chip end 317 to move away from each other. Specifically, the elastic member 330 makes the chip end 317 tend to move toward the chip / electrical contact portion 221, and the electrode end 319 tends to move toward the electrode 91.

[0067] In some embodiments, the elastic member 330 is located between the electrode end 319 and the chip end 317. Optionally, the electrode end 319 is connected to the chip end 317 / the accommodating chamber 314 via the elastic member 330. When the developing roller 12 and the photosensitive drum 22 contact each other, the elastic member 330 is compressed. During the process of separation between the developing roller 12 and the photosensitive drum 22, the second urging force released by the elastic member 330 causes the second contact portion 322 to move with the cartridge housing relative to the imaging device. That is, the second contact portion 322 moves with the developing cartridge 10. As a result, the second contact portion 322 can always maintain electrical contact with the electrical contact portion 221. At the same time, the second urging force also tends to cause the first contact portion 321 to move toward the electrode 91. In this way, the first contact portion 321 can also always maintain electrical contact with the electrode 91. For example, the elastic member is configured as a compression spring, sponge, rubber block, etc.

[0068] Optionally, at least a portion of the second connecting portion 323 can also be displaced in the front-to-back direction and generate a third thrust parallel to the front-to-back direction, so as to further ensure that the first contact portion 321 can always maintain electrical contact with the electrode 91, and the second contact portion 322 can always maintain electrical contact with the electrical contact portion 221. At this time, the elastic member 330 can be omitted.

[0069] According to the above records, in the chip conversion component 300, setting the second connecting part 323 to be able to generate displacement in the front-to-back direction can be regarded as the first design, and setting the elastic member 330 can be regarded as the second design. At least one of the first design and the second design can achieve the purpose of forcing the electrode end 319 and the chip end 317 to move away from each other, so that the chip end 317 has a tendency to move toward the chip / electrical contact part 221, and the electrode end 319 has a tendency to move toward the electrode 91.

[0070] According to the inventive concept of the present utility model, in the front-to-back direction, at least one of the second connecting portion 323 and the elastic member 330 can be deformed, and the force generated by the deformation can make the base and the support portion move away from each other, that is, in the front-to-back direction, a part of the chip conversion component 300 can be displaced; or, in other words, a part of the chip conversion component 300 can move forward and backward, specifically, the second part 313 of the support portion moves backward together with the second contact portion 322, so that the second contact portion 322 can be more stably supported by the second part 313, further ensuring stable electrical contact between the second contact portion 322 and the electrical contact portion 221.

[0071] Optionally, the second connecting portion 323 may be configured as a telescopic member or an elastic member.

[0072] In some embodiments, before the developing roller 12 and the photosensitive drum 22 are separated from each other, at least one of the electrode end 319 and the chip end 317 is not in contact with the elastic member 330, or the elastic member 330 is arranged between the electrode end 319 and the chip end 317 through other components. As long as the elastic member 330 generates force under the action of external force, the force can force the electrode end 319 and the chip end 317 to move away from each other. Such an arrangement can extend the service life of the elastic member 330.

[0073] In some embodiments, the elastic member 330 can also be configured as a tension spring, and at least one tension spring is provided in the chip conversion assembly 300. Optionally, the tension spring is located between the second part 313 and the imaging device, and the tension released by the tension spring causes the second part 313 to have a tendency to move backward; preferably, the chip conversion assembly 300 can also be provided with another tension spring, specifically, the tension spring is located between the first part 315 and the imaging device, and the tension released by the tension spring causes the first part 315 to have a tendency to move forward.

[0074] [Example 3]

[0075] This embodiment only describes the differences from the first and second embodiments.

[0076] like Figure 9 As shown, in this embodiment, the position of the electrode 91 in the imaging device is different from the position of the electrode 91 in Example 1 and Example 2. In Example 1 and Example 2, the electrode 91 faces backward, that is, the electrode 91 is located on the second side wall 94, that is, the position of the electrode 91 is located in front of the chip electrical contact portion 221. In this embodiment, the electrode 91 faces downward, that is, the electrode 91 is located at the upper end of the electrode mounting portion 90, that is, the position of the electrode 91 is located above the chip electrical contact portion 221.

[0077] The first contact portion 321 and the second contact portion 322 are still electrically connected through the second connecting portion 323 which is configured as a flexible member, so that the position of the first contact portion 321 can change according to the position of the electrode 91, ensuring that the first contact portion 321 and the electrode 91 can form a stable electrical contact; optionally, the electrode end 319 is connected to the base through an elastic member 330, and the elastic member 330 can be used to support the electrode end 319 and force the electrode end 319 to approach the electrode 91.

[0078] By providing the elastic member 330 and the flexible member, the position of the electrode 91 in the imaging device is no longer restricted. It is only necessary to ensure that the first contact portion 321 in the chip conversion assembly 300 forms a stable electrical contact with the electrode 91 .

[0079] By providing the elastic member 330 and the flexible member, the position of the chip / chip mounting portion 30 in the processing box 100 is no longer restricted. Specifically, the position of the electrical contact portion 221 is no longer restricted. For example, the electrical contact portion 221 can be provided in the middle of the box shell or at the other end of the box shell, as long as the second contact portion 322 in the chip conversion assembly 300 forms a stable electrical contact with the electrical contact portion 221.

[0080] The chip conversion assembly 300 described above is applicable to a first imaging device capable of accommodating a first cartridge. For the first cartridge, when the imaging device is not developing, the developing roller 12 and the photosensitive drum 22 need to be separated from each other. However, according to the inventive concept of the present utility model, the chip conversion assembly 300 is also applicable to a second imaging device capable of accommodating a second cartridge. For the second cartridge, when the imaging device is not developing, the developing roller 12 and the photosensitive drum 22 do not need to be separated from each other. The cartridge assembly including the chip conversion assembly 300 and the second cartridge can achieve at least one of the second, third and fourth aspects of the following beneficial effects.

[0081] [Beneficial Effects]

[0082] The chip conversion assembly 300 and the box assembly provided by the present invention have the following advantages compared with the prior art:

[0083] On the first aspect, the utility model provides a chip conversion assembly 300 independent of the processing box 100, and at least one of the second contact portion 322, the elastic member 330 and the second connecting portion 323 in the chip conversion assembly 300 can undergo elastic deformation to generate a pushing force, and the pushing force is used to force the chip end 317 to have a tendency to move toward the chip / electrical contact portion 221, and the electrode end 319 to have a tendency to move toward the electrode 91. Therefore, in the process of the developing roller 12 and the photosensitive drum 22 separating from each other and contacting again after separation, the electrical contact portion 221 can always maintain electrical contact with the second contact portion 322, thereby avoiding the situation where the imaging device reports an error due to the electrical contact portion 221 being out of contact with the second contact portion 322.

[0084] Secondly, when the chip switching assembly 300 and the cartridge 100 are installed in an imaging device, the chip switching assembly 300 can keep the electrical contact portion 221 electrically connected to the electrode 91 when the cartridge 100 / imaging device is impacted.

[0085] Thirdly, as Figure 10 As shown, in the present invention, the imaging device and the chip establish a communication connection through the chip conversion component 300. Through the chip conversion component 300, the position of the electrode 91 in the imaging device is no longer restricted, which can increase the diversity of the design of the position of the electrode 91 in the imaging device, which is conducive to improving the design freedom of the imaging device.

[0086] Fourthly, similarly Figure 10 As shown, the imaging device and the chip establish a communication connection through the chip conversion component 300. Through the chip conversion component 300, the arrangement and size of the electrical contact part 221 are no longer restricted by the position and size of the electrode 91 in the imaging device. The electrical contact part 221 can be set at a more suitable position according to the design requirements of the box 100. The multiple electrical contact parts 221 can be set separately or in a centralized manner, which is conducive to improving the design freedom of the box 100.

Claims

1. A chip conversion assembly, which is detachably mounted in an imaging device provided with electrodes, the imaging device being used to accommodate a cartridge having at least one electrical contact, the imaging device and the cartridge establishing a communication connection via the chip conversion assembly; The chip conversion assembly includes a support member and a conversion member, the conversion member is supported by the support member, the support member is used to enable the chip conversion assembly to be installed in the imaging device, and the conversion member is used to electrically connect the electrical contact portion and the electrode; It is characterized in that The chip conversion component is separately arranged from the box, and the chip conversion component can be independently assembled in the imaging device.

2. The chip conversion assembly according to claim 1, characterized in that: The conversion member is made of a conductive material, and includes a first contact portion, a second contact portion, and a second connecting portion for electrically connecting the first contact portion and the second contact portion, wherein the first contact portion is used to electrically contact the electrode, the second contact portion is used to electrically contact the electrical contact portion, and the second contact portion is capable of following at least a portion of the box to move relative to the imaging device.

3. The chip conversion assembly according to claim 2, characterized in that: At least one of the second contact portion and the second connecting portion is movable relative to the first contact portion.

4. The chip conversion assembly according to claim 3, characterized in that: The second contact portion is bent relative to the second connecting portion to form a variable angle between the two.

5. The chip conversion assembly according to claim 3, characterized in that: The second connection portion is configured as a telescopic member or an elastic member.

6. The chip conversion assembly according to claim 2, characterized in that: The support member includes at least a base and a supporting portion, the base is used to enable the chip conversion assembly to be installed in the imaging device, the conversion member is supported by the supporting portion, the supporting portion is provided with a chip end and an electrode end, the first contact portion is provided at the electrode end, the second contact portion is provided at the chip end, and the base is connected to the chip end.

7. The chip conversion assembly according to claim 6, characterized in that: The chip conversion assembly also includes a first connecting portion, and the chip end and the electrode end are fixedly connected via the first connecting portion.

8. The chip conversion assembly according to claim 6, characterized in that: The chip end and the electrode end are separately arranged, and the chip end is movably connected with the electrode end.

9. The chip conversion assembly according to claim 8, characterized in that: The chip conversion assembly further comprises an elastic member, which is used for forcing the chip end and the electrode end to move away from each other.

10. The chip conversion assembly according to claim 9, characterized in that: The elastic member is configured as a compression spring and is located between the chip end and the electrode end.

11. A box assembly, comprising a box and a chip conversion assembly according to any one of claims 1 to 10, characterized in that: The box includes at least one of a developing box and a drum box, and at least one of the developing box and the drum box is provided with an electrical contact portion; The developing cartridge includes a developing cartridge housing for accommodating a developer and a developing roller rotatably disposed in the developing cartridge housing; The drum cartridge includes a drum casing and a photosensitive drum rotatably disposed in the drum casing, and a developing roller is used to supply a developer to the photosensitive drum; The chip conversion assembly is used to electrically connect the electrical contacts and the electrodes.

Images