Packaging structure of metal sheet and lead frame
By setting a plurality of first pressure points and packaging structures on the metal sheet and setting adjacent pressure points in dislocation to isolate the conduction gap, the problem of short circuit in the electrical connection after the secondary injection molding of the copper sheet is solved, and the stability and reliability of the electrical connection are achieved.
Patent Information
- Application Number
- CN202420339220.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-23
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2034-02-23
AI Technical Summary
In the prior art, copper sheets have electrical connection short circuits due to gap paths after secondary injection molding, and the existing improvement methods cannot 100% avoid the occurrence of short circuits.
By providing a plurality of metal sheets, each of which is provided with a plurality of first pressure points, the first packaging structure and the second packaging structure are covered on the surface of the metal sheet, and two adjacent first pressure points are arranged in the length direction of the metal sheet to physically isolate the conduction gap between the two metal sheets.
It effectively avoids the short circuit of the electrical path and improves the stability and reliability of the electrical connection.
Smart Images
Figure CN222619744U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of lead frames, in particular to a metal sheet packaging structure and a lead frame. Background Art
[0002] Compared with the conventional controllers that use conventional connectors to realize the information exchange between the printed circuit board assembly (PCBA) and the external circuit, some controller products, such as connector products designed with lead frames, have functions similar to conventional connectors, but their structures are more flexible and easy to realize electrical connection in a relatively limited space. Therefore, this type of electrical connector is widely used.
[0003] The lead frame in the electrical connector is the chip carrier of the integrated circuit. It is a key structural component that uses bonding materials (gold wire, aluminum wire, copper wire) to achieve electrical connection between the internal circuit lead end of the chip and the external lead to form an electrical circuit. It serves as a bridge to connect with external wires. Lead frames are required in most semiconductor integrated blocks and are an important basic material in the electronic information industry. Figures 1 to 3 As shown, Figure 1 It is a schematic diagram of the structure of the copper sheet; Figure 2 It is a schematic diagram of the first plastic packaging structure part of the first injection molding; Figure 3 The second plastic package structure diagram of the second injection molding is shown in FIG. The conventional lead frame usually consists of three parts, including: Figure 1 The metal sheet shown (for example, copper sheet 10), Figure 2 The first plastic package structure 20 shown in FIG. Figure 3 The second plastic package structure 30 is shown. The production process of the lead frame is as follows Figures 1 to 3 As described above, the copper sheet 10 is first produced by stamping. Then, the ejector system is pressed against the first pressure point structure 21, and the copper sheet 10 is once injection molded to form a copper sheet 10. Figure 2 Finally, the ejector pins in the ejector pin system are pressed against the second pressure point structure 22 to perform a second plastic sealing on the copper sheet 10 to form a first plastic sealing structure 20 as shown. Figure 3 The second plastic encapsulation structure 30 is shown. Thus, the copper sheet 10 can be fixed inside the first plastic encapsulation structure 20 and the second plastic encapsulation structure 30. The copper sheet 10 is subjected to two injection moldings because there are many thin and long copper sheets 10 in the product, and these copper sheets 10 cannot be effectively fixed during one injection molding process. Therefore, if only one injection molding is used, the position of the copper sheet 10 in the product cannot be guaranteed. Therefore, two injection moldings are required to fix the copper sheet 10 in sections to meet the size requirements of the product.
[0004] However, during the secondary injection molding process, since the bonding force between the first molded structure 20 and the second molded structure 30 is very weak, a crack such as the following is usually formed at the junction of the first molded structure 20 and the second molded structure 30 when the product is off the production line. Figure 4 Or Figure 5 The gap 40 shown in FIG. 1 may be produced during the injection molding warm-pressing process. Figure 4 Or Figure 5 The gap 40 is shown. Due to the existence of the gap 40, when the product is in use, due to the presence of humidity and chemical media in the medium, and the voltage difference between the two copper sheets, the copper ions in the copper sheets will precipitate in the environment of humidity and chemical media, and migrate along the gap in the negative direction of the electric field, eventually causing the electrical connection to form a short circuit.
[0005] In order to solve the above-mentioned technical problems, the following methods are usually used for improvement in the prior art. One way is to improve the injection molding process. For example, the Plasma process is usually used to process the product after the first injection molding to improve its adhesion with the secondary injection molding plastic. The second way is to add some fuse ribs to the product after the first injection molding to improve the bonding effect. The third way is to avoid short circuits in electrical connections by extending the gap path. However, none of the above methods can 100% prevent the occurrence of short circuits, and there are many uncontrollable factors in the design, and the requirements for process stability are also very high. Using materials with lower melting points or adding Plasma equipment will increase new costs and are not economical.
[0006] Therefore, the existing technical solutions still cannot solve the short circuit problem of electrical connection caused by the gap path between the copper sheets after the secondary injection molding.
[0007] It should be noted that the information disclosed in the background technology section of the utility model is only intended to deepen the understanding of the general background technology of the utility model, and should not be regarded as an admission or suggestion in any form that the information constitutes prior art already known to those skilled in the art. Utility Model Content
[0008] The utility model aims to provide a metal sheet packaging structure and a lead frame to solve the technical problem of electrical connection short circuit caused by gap paths between copper sheets after secondary injection molding during packaging of existing copper sheets.
[0009] In order to solve the above technical problems, the utility model provides a metal sheet packaging structure, comprising:
[0010] A plurality of metal sheets, each of which is provided with a plurality of first pressure points;
[0011] A first packaging structure;
[0012] A second packaging structure, wherein the first packaging structure and the second packaging structure are coated on the surface of the metal sheet;
[0013] Wherein, along the length direction of the metal sheet, two adjacent first pressure points located on different metal sheets are staggered.
[0014] Preferably, the first packaging structure has a plurality of second pressure point structures reserved, and the second packaging structure is coated on one side of the first packaging structure except the second pressure point structures, so as to coat the metal sheet inside the first packaging structure and the second packaging structure.
[0015] Preferably, the first packaging structure forms a corresponding first pressure point area at the position of the first pressure point, and the second packaging structure is covered in the first pressure point area.
[0016] Preferably, a length of the first pressing point area extending along a width direction of the metal sheet is greater than a width of the metal sheet.
[0017] Preferably, a central axis of the metal sheet coincides with a central axis of the first pressure point area.
[0018] Preferably, a central axis of the metal sheet does not coincide with a central axis of the first pressure point area.
[0019] Preferably, a thickness of the first packaging structure in the first pressing point region is greater than a thickness of the second packaging structure in the first pressing point region.
[0020] Preferably, the thickness of the first packaging structure in the first pressing point area is equal to the thickness of the second packaging structure in the first pressing point area.
[0021] Preferably, a thickness of the first packaging structure in the first pressing point region is smaller than a thickness of the second packaging structure in the first pressing point region.
[0022] Preferably, the first packaging structure and the second packaging structure are both resin film layers.
[0023] Based on the same utility model concept, the utility model also provides a lead frame, including the packaging structure of the above-mentioned metal sheet.
[0024] Compared with the prior art, the metal sheet packaging structure of the utility model has the following advantages:
[0025] The utility model is provided with a plurality of metal sheets, each of which is provided with a plurality of first pressure points; a first packaging structure; a second packaging structure, wherein the first packaging structure and the second packaging structure are coated on the surface of the metal sheet; wherein, along the length direction of the metal sheet, two adjacent first pressure points located on different metal sheets are staggered. Thus, after the improvement of the packaging structure of the metal sheet provided by the utility model, during a single injection molding process, the pressure point of the mold skips the middle copper sheet, and along the length direction of the copper sheet, the stamped copper sheet is pressed at intervals, and the pressure points of the middle copper sheet and the two adjacent copper sheets are staggered to physically isolate the conductive gap between the two copper sheets inside the plastic, thereby avoiding a short circuit in the electrical path.
[0026] The lead frame provided by the utility model and the metal sheet packaging structure provided by the utility model belong to the same utility model concept, therefore, the lead frame provided by the utility model at least has all the advantages of the metal sheet packaging structure provided by the utility model, which will not be repeated here. Furthermore, since the lead frame provided by the utility model includes the metal sheet packaging structure, it can avoid the situation of short circuit in electrical connection, therefore, the lead frame provided by the utility model can also avoid the situation of short circuit in electrical connection. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] Figure 1 is a schematic diagram of a copper sheet in an embodiment of the utility model;
[0028] Figure 2 It is a partial schematic diagram of the first plastic packaging structure in one embodiment of the utility model;
[0029] Figure 3 It is a schematic diagram of the second plastic packaging structure in one embodiment of the utility model;
[0030] Figure 4 This is a schematic diagram of a structure in which a gap exists between the first plastic packaging structure and the second plastic packaging structure in one embodiment of the utility model;
[0031] Figure 5 This is another structural schematic diagram of a gap between the first plastic packaging structure and the second plastic packaging structure in one embodiment of the utility model;
[0032] Figure 6 This is a positional relationship diagram between the first pressure point structure and the copper sheet in an embodiment of the utility model;
[0033] Figure 7 This is a schematic diagram of the structure of the copper sheet after secondary injection molding in one embodiment of the utility model;
[0034] Figure 8 yes Figure 7 Sectional view at AA in the middle;
[0035] Fig. 9 yes Figure 7 Sectional view at the middle BB;
[0036] Fig.10 This is a schematic diagram of a first packaging structure after one-time injection molding in another embodiment of the utility model;
[0037] Fig.11 is a schematic diagram of a second packaging structure after secondary injection molding in another embodiment of the utility model;
[0038] In the figure,
[0039] 10-copper sheet; 20-first plastic sealing structure;
[0040] 21-first pressure point structure; 22-second pressure point structure;
[0041] 30-second plastic sealing structure; 40-gap;
[0042] 50- extension part; 100- metal sheet;
[0043] 110-first pressure point; 200-first packaging structure;
[0044] 210 - first pressure point area; 300 - second packaging structure. DETAILED DESCRIPTION
[0045] In order to make the purpose, advantages and features of the utility model clearer, the packaging structure and lead frame of the metal sheet proposed by the utility model are further described in detail in combination with the drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the utility model. It should be understood that the drawings in the specification do not necessarily show the specific structure of the utility model in proportion, and the illustrative features used to illustrate certain principles of the utility model in the drawings in the specification will also adopt a slightly simplified drawing method. The specific design features of the utility model disclosed herein include, for example, specific dimensions, directions, positions and shapes, which will be determined in part by the specific application and use environment. And, in the embodiments described below, sometimes the same figure mark is used in common between different drawings to represent the same part or the part with the same function, and its repeated description is omitted. In this specification, similar numbers and letters are used to represent similar items, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.
[0046] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0047] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.
[0048] It should be noted that the packaging structure of the metal sheet is not only applicable to lead frames, but also applicable to other electronic components that require packaging of metal sheets or metal sheets, such as integrated circuit chips.
[0049] Ginseng Figure 10 to Figure 11 A specific embodiment of a metal sheet packaging structure disclosed. The metal sheet packaging structure includes: a plurality of metal sheets 100, each of which is provided with a plurality of first pressure points 110; a first packaging structure 200; a second packaging structure 300, wherein the first packaging structure 200 and the second packaging structure 300 are coated on the surface of the metal sheet 100; wherein, along the length direction of the metal sheet 100 (i.e., Fig.10 The first pressing points 110 located on two adjacent metal sheets 100 are staggered.
[0050] Ginseng Figure 6 As shown, for the packaging of the copper sheet 10 in the traditional lead frame, during the first injection molding process of the copper sheet 10, the ejector pins in the ejector pin system respectively press the first pressure point structures 21 on the two adjacent copper sheets 10, that is, the ejector pins respectively press half of the two adjacent copper sheets 10, so there is still a gap path between the two copper sheets 10 after the second injection molding, causing an electrical short circuit.
[0051] However, this embodiment staggers two adjacent first pressure points 110 on different metal sheets 100 so that the copper sheets 10 covered by the second packaging structure 300 can be independent of each other, thereby physically isolating the conduction between the two metal sheets 100 inside the first packaging structure 200 and the second packaging structure 300, thereby avoiding a short circuit in the metal sheet 100 in the lead frame.
[0052] The metal sheet 100 may be a copper metal sheet or a copper alloy sheet, for example, a copper-nickel alloy, a copper-chromium alloy, or other copper alloys. In this embodiment, the copper sheet 10 is used as an example for description. It should also be noted that the elongated copper sheet 10 in this embodiment is a plate-like structure.
[0053] Exemplarily, the first packaging structure 200 reserves a plurality of second pressure point structures 22 , and the second packaging structure 300 is coated on one side of the first packaging structure 200 except the second pressure point structures 22 to coat the metal sheet 100 inside the first packaging structure 200 and the second packaging structure 300 .
[0054] Specifically, refer to Figure 2 As shown, after the first injection molding is completed, a plurality of second pressure point structures 22 are reserved in the first packaging structure 200. During the secondary injection molding, the ejector pins in the ejector pin system are pressed at the position of the second pressure point structure 22 to perform secondary injection molding on the copper sheet 10 to form the second packaging structure 300. The second pressure point structure 22 is a columnar structure. There is a groove between the columnar structure and the first packaging structure 200. During the secondary injection molding, the molten resin is filled into the groove so that the surface of the second packaging structure 300 and the end of the columnar structure are in the same plane.
[0055] Exemplarily, the first packaging structure 200 forms a corresponding first pressure point area 210 at the position of the first pressure point 110, and the second packaging structure 300 is coated on the first pressure point area 210. The first pressure point area 210 is along the width direction of the metal sheet 100 (ie, Fig.10 The length of the direction of the arrow Y in the middle) (i.e., Fig.10 The width of m in the figure is greater than the width of the metal sheet 100 (ie, Fig.10 The width of n in ).
[0056] Specifically, refer to Fig.10 and Fig.11 As shown, the central axis q of the first pressure point structure 110 may or may not coincide with the central axis q of the first pressure point region 210. Fig.10The first pressure points 110 located on two adjacent metal sheets 100 are staggered. The area of the first pressure point region 210 is larger than the area of the exposed copper sheet 10 at the location of the first pressure point 110. Any two first pressure point regions 210 are prevented from overlapping, so that different first pressure point regions 210 are independent of each other. Thus, the gap between the two copper sheets 10 that are conductive can be physically isolated from appearing inside the first packaging structure 200 and the second packaging structure 300.
[0057] Among them, the first packaging structure 200 and the second packaging structure 300 can be the same plastic layer or different plastic layers. As long as they can encapsulate the copper sheet 10, in this embodiment, it is preferred that the first packaging structure 200 and the second packaging structure 300 are both resin film layers.
[0058] The first pressing point area 210 can be in any shape such as a circle or a square. Here, there is no specific requirement for the shape of the first pressing point area 210. In order to facilitate the secondary plastic sealing of the first pressing point area 210, preferably, the first pressing point structure 110 and the first pressing point area 210 are square.
[0059] Exemplarily, the thickness of the first encapsulation structure 200 in the first pressure point region 210 is greater than or equal to the thickness of the second encapsulation structure 300 in the first pressure point region 210 .
[0060] Specifically, refer to Figure 10 to Figure 11 As shown, the thickness of the first encapsulation structure 200 in the first pressure point area 210 can be greater than the thickness of the second encapsulation structure 300 filled in the first pressure point area 210, or can be equal to the thickness of the second encapsulation structure 300 filled in the first pressure point area 210. Of course, the thickness of the first encapsulation structure 200 in the first pressure point area 210 can also be less than the thickness of the second encapsulation structure 300 filled in the first pressure point area 210. Preferably, the thickness of the first encapsulation structure 200 in the first pressure point area 210 is greater than or equal to the thickness of the second encapsulation structure 300 filled in the first pressure point area 210. After the packaging structure of the metal sheet in this embodiment is improved, in a one-time injection molding process, the pressure point of the mold skips the middle copper sheet 10, and along the length direction of the copper sheet 10, that is, Fig.10 In the middle Y direction, the stamped copper sheet 10 is pressed at intervals, and the middle copper sheet 10 is misaligned with the pressure points of the two adjacent copper sheets 10 in the X direction, and the thickness of the first packaging structure 200 of the first injection molding around the copper sheet 10 is greater than or equal to the thickness of the second packaging structure 300 of the second injection molding, so as to physically isolate the conductive gap between the two copper sheets 10 inside the plastic package, thereby avoiding a short circuit in the electrical path.
[0061] It should be noted that, according to the length of the copper sheet 10, the copper sheet 10 can be subjected to multiple injection moldings in a segmented manner to form the first packaging structure 200. Accordingly, the copper sheet 10 subjected to multiple primary plastic moldings is subjected to multiple secondary plastic moldings to form the second packaging structure 300, so that the copper sheet 10 can be fixed.
[0062] This embodiment also discloses a lead frame, including the packaging structure of the metal sheet mentioned above.
[0063] The lead frame provided in this embodiment and the packaging structure of the metal sheet provided in this embodiment belong to the same utility model concept, therefore, the lead frame provided in this embodiment has at least all the advantages of the packaging structure of the metal sheet provided in this embodiment, which will not be repeated here. Furthermore, since the lead frame provided in this embodiment includes the packaging structure of the metal sheet, it can avoid the situation that the electrical connection has a short circuit, therefore, the lead frame provided in this embodiment can also avoid the situation that the electrical connection has a short circuit.
[0064] In summary, the above embodiments provide detailed descriptions of the packaging structure of the metal sheet and the different configurations of the lead frame. Of course, the above description is only a description of the preferred embodiments of the utility model, and is not any limitation to the scope of the utility model. The utility model includes but is not limited to the configurations listed in the above implementations. Those skilled in the art can draw inferences based on the contents of the above embodiments. Any changes and modifications made by ordinary technicians in the field of the utility model based on the above disclosure are within the scope of protection of the claims.
Claims
1. A metal sheet packaging structure, characterized in that: include: A plurality of metal sheets, each of which is provided with a plurality of first pressure points; A first packaging structure; A second packaging structure, wherein the first packaging structure and the second packaging structure are coated on the surface of the metal sheet; Wherein, along the length direction of the metal sheet, two adjacent first pressure points located on different metal sheets are staggered.
2. The metal sheet packaging structure according to claim 1, characterized in that: The first packaging structure forms a corresponding first pressure point area at the position of the first pressure point, and the second packaging structure covers the first pressure point area.
3. The metal sheet packaging structure according to claim 1, characterized in that: The first packaging structure is reserved with a plurality of second pressure point structures, and the second packaging structure is coated on one side of the first packaging structure except the second pressure point structure, so as to coat the metal sheet inside the first packaging structure and the second packaging structure.
4. The metal sheet packaging structure according to claim 2, characterized in that: The length of the first pressing point area extending along the width direction of the metal sheet is greater than the width of the metal sheet.
5. The metal sheet packaging structure according to claim 2, characterized in that: The central axis of the metal sheet coincides with the central axis of the first pressure point area.
6. The metal sheet packaging structure according to claim 2, characterized in that: The central axis of the metal sheet does not coincide with the central axis of the first pressure point area.
7. The metal sheet packaging structure according to claim 2, characterized in that: The thickness of the first packaging structure in the first pressing point region is greater than, or equal to, the thickness of the second packaging structure in the first pressing point region.
8. The metal sheet packaging structure according to claim 2, characterized in that: The thickness of the first packaging structure in the first pressing point area is less than the thickness of the second packaging structure in the first pressing point area.
9. The metal sheet packaging structure according to any one of claims 1 to 8, characterized in that: The first packaging structure and the second packaging structure are both resin film layers.
10. A lead frame, characterized in that: include: The packaging structure of the metal sheet as claimed in any one of claims 1 to 9.