Carbon oil button circuit board
By setting carbon arc blocks next to the carbon dots of the carbon oil key circuit board and leaving gaps therein, the copper wire is set in the gap, and the problem of short circuit caused by contact between the copper wire and the carbon oil mechanism is solved, and resource conservation and production efficiency are improved.
Patent Information
- Application Number
- CN202420859206.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-24
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2034-04-24
AI Technical Summary
When producing carbon oil key circuit boards, in order to prevent the copper wire from contacting with the carbon oil mechanism and causing a short circuit, it is necessary to print insulating oil on the lower surface of the carbon oil mechanism, resulting in waste of resources.
A carbon oil key circuit board is designed, by setting the first and second carbon arc blocks next to the carbon dots and leaving a gap between them, the copper wire is arranged in the gap to prevent the copper wire from contacting the carbon oil mechanism, so as to eliminate the need for printing insulating oil.
Insulation between the copper wire and the carbon oil mechanism is realized, insulating oil materials are saved, and production efficiency is improved.
Smart Images
Figure CN222621264U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of circuit boards, in particular to a carbon oil key circuit board. Background Art
[0002] Circuit boards are boards used to support electronic components and provide circuits to connect them. Circuit boards can be divided into three categories according to the number of layers: single-sided boards, double-sided boards and multi-layer circuit boards. Carbon oil key circuit boards are mostly single-sided boards. In the process of manufacturing carbon oil key circuit boards, the carbon oil mechanism set outside the central carbon point is a closed ring. When a copper wire is led out from the central carbon point, in order to prevent the copper wire from contacting the carbon oil mechanism and causing a short circuit, a layer of insulating oil needs to be printed on the lower surface of the carbon oil mechanism for insulation, which requires additional insulating oil materials.
[0003] In view of the above-mentioned related technologies, it is urgent to design and develop a carbon oil key circuit board, which can achieve insulation between the copper wire and the carbon oil mechanism without printing insulating oil on the lower surface of the carbon oil mechanism, thereby saving resources. Utility Model Content
[0004] In order to achieve insulation between the copper wire and the carbon oil mechanism without printing insulating oil on the lower surface of the carbon oil mechanism, the present application provides a carbon oil key circuit board.
[0005] The carbon ink key circuit board provided in this application adopts the following technical solution:
[0006] A carbon-oil key circuit board comprises carbon dots, a carbon-oil mechanism disposed next to the carbon dots, and copper wires connected to the carbon dots, wherein the carbon dots are disposed on the circuit board, the carbon-oil mechanism comprises a first carbon arc block disposed next to the carbon dots and a second carbon arc block disposed next to the carbon dots, a gap is left between the first carbon arc block and the second carbon arc block, and the copper wire is disposed in the gap.
[0007] By adopting the above technical solution, the carbon dots are arranged on the circuit board, the first carbon arc block is arranged next to the carbon dots, the second carbon arc block is arranged next to the carbon dots, a gap is left between the first carbon arc block and the second carbon arc block, the copper wire is connected to the carbon dots, the copper wire is arranged in the gap, and the copper wire does not pass through the first carbon arc block and the second carbon arc block. There is no need to print insulating oil on the bottom surface of the first carbon arc block and the second carbon arc block, so as to achieve insulation between the copper wire and the carbon oil mechanism and save resources.
[0008] Preferably, a solder resist layer is provided on the surface of the circuit board, and the carbon dots, the first carbon arc blocks, the second carbon arc blocks and the copper wires are all provided on the solder resist layer.
[0009] By adopting the above technical solution, a solder resist oil layer is provided on the surface of the circuit board, and the carbon dots, the first carbon arc block, the second carbon arc block and the copper wires are all arranged on the solder resist oil layer to prevent the circuit from short circuiting and protect the stability and reliability of the circuit.
[0010] Preferably, a tin layer is sprayed on the carbon dots.
[0011] By adopting the above technical solution, a tin layer is sprayed on the carbon dots, which is convenient for welding circuit components.
[0012] Preferably, a dry film layer is provided on the circuit board, the dry film layer is provided on the solder resist oil layer, the dry film layer is provided on the first carbon arc block, the dry film layer is provided on the second carbon arc block, and the dry film layer is a polyethylene protective film.
[0013] By adopting the above technical solution, a dry film layer is arranged on the circuit board, the dry film layer is arranged on the solder resist oil layer, the dry film layer is arranged on the first carbon arc block, and the dry film layer is arranged on the second carbon arc block. The dry film layer is a polyethylene protective film, which can isolate oxygen and protect the circuit board from mechanical scratches.
[0014] Preferably, a first protective layer is provided on the dry film layer, and the first protective layer is a rosin water coating.
[0015] By adopting the above technical solution, a first protective layer is provided on the dry film layer. The first protective layer is a rosin water coating. The rosin water can prevent the carbon film from being heated, thereby increasing the service life of the circuit board.
[0016] Preferably, positioning holes are provided on the circuit board.
[0017] By adopting the above technical solution, positioning holes are opened on the circuit board, which is convenient for positioning the circuit board during the welding process.
[0018] Preferably, an insulating layer is applied on the bottom surface of the circuit board.
[0019] By adopting the above technical solution, an insulating layer is applied to the bottom surface of the circuit board, thereby further improving the insulation effect of the circuit board.
[0020] Preferably, a second protective layer is applied on the bottom surface of the insulating layer, and the second protective layer is a rosin water coating.
[0021] By adopting the above technical solution, a second protective layer is coated on the bottom surface of the insulating layer, and the second protective layer is a rosin water coating, which further improves the heat insulation effect of the circuit board, thereby further improving the service life of the circuit board.
[0022] In summary, the present application includes at least one of the following beneficial technical effects:
[0023] 1. The carbon dot is arranged on the circuit board, the first carbon arc block is arranged next to the carbon dot, the second carbon arc block is arranged next to the carbon dot, a gap is left between the first carbon arc block and the second carbon arc block, the copper wire is connected to the carbon dot, the copper wire is arranged in the gap, and the copper wire does not pass through the first carbon arc block and the second carbon arc block, so there is no need to print insulating oil on the bottom surface of the first carbon arc block and the second carbon arc block, so as to achieve insulation between the copper wire and the carbon oil mechanism, thereby saving resources;
[0024] 2. A dry film layer is provided on the circuit board, the dry film layer is provided on the solder resist oil layer, the dry film layer is provided on the first carbon arc block, the dry film layer is provided on the second carbon arc block, and the dry film layer is a polyethylene protective film, which can isolate oxygen and protect the circuit board from mechanical scratches;
[0025] 3. A first protective layer is provided on the dry film layer. The first protective layer is a rosin water coating. The rosin water can prevent the carbon film from being heated, thereby increasing the service life of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 It is a schematic diagram of the overall structure of the carbon oil key circuit board in the embodiment of the present application.
[0027] Figure 2 It is a cross-sectional view of a circuit board in an embodiment of the present application.
[0028] Description of reference numerals:
[0029] 1. Carbon dots; 11. Tin layer; 2. Carbon oil structure; 21. First carbon arc block; 22. Second carbon arc block; 3. Copper wire; 4. Circuit board; 41. Solder resist layer; 42. Dry film layer; 43. First protective layer; 44. Insulation layer; 45. Second protective layer. DETAILED DESCRIPTION
[0030] The following is combined with Figure 1-2 This application is described in further detail.
[0031] The present application embodiment discloses a carbon oil key circuit board, referring to Figure 1 and Figure 2 As shown, the carbon oil key circuit board includes carbon dots 1, a carbon oil mechanism 2, a copper wire 3 and a circuit board 4. The circuit board 4 is horizontally arranged, and the length direction of the circuit board 4 is parallel to the ground.
[0032] Reference Figure 1 and Figure 2 As shown, a solder resist layer 41 is provided on the top surface of the circuit board 4 , and the solder resist layer 41 covers the top surface of the circuit board 4 to prevent short circuits in the circuit and protect the stability and reliability of the circuit.
[0033] Reference Figure 1 and Figure 2As shown, there are six carbon dots 1, which are equally divided into two groups. The two groups of carbon dots 1 are symmetrical about the center line in the width direction of the top surface of the circuit board 4. The three carbon dots 1 in each group are evenly distributed at equal distances along the length direction of the circuit board 4. The carbon dots 1 are horizontally arranged on the solder resist oil layer 41, and the carbon dots 1 are cylindrical.
[0034] Reference Figure 1 and Figure 2 As shown, there are six groups of carbon oil mechanisms 2, and the six groups of carbon oil mechanisms 2 correspond one to one to the six carbon points 1. The carbon oil mechanisms 2 include a first carbon arc block 21 and a second carbon arc block 22. The first carbon arc block 21 is arranged next to the carbon point 1, and the second carbon arc block 22 is arranged next to the carbon point 1. The first carbon arc block 21 and the second carbon arc block 22 are symmetrical about the axial direction of the carbon point 1, and a gap is left between the first carbon arc block 21 and the second carbon arc block 22. The first carbon arc block 21 and the second carbon arc block 22 are both horizontally arranged on the solder resist oil layer 41.
[0035] Reference Figure 1 and Figure 2 As shown, there are six copper wires 3, and the six copper wires 3 correspond to the six carbon dots 1 one by one. The copper wires 3 are connected to the carbon dots 1, and the copper wires 3 are arranged in the gap between the first carbon arc block 21 and the second carbon arc block 22. The copper wires 3 do not pass through the first carbon arc block 21 and the second carbon arc block 22, so there is no need to print insulating oil on the bottom surface of the first carbon arc block 21 and the second carbon arc block 22, so as to achieve insulation between the copper wires 3 and the carbon oil mechanism 2, thereby saving resources.
[0036] Reference Figure 1 and Figure 2 As shown, a tin layer 11 is sprayed on the carbon dots 1 to facilitate welding of circuit components.
[0037] Reference Figure 1 and Figure 2 As shown, a dry film layer 42 is provided on the circuit board 4, and the dry film layer 42 is provided on the top surface of the solder resist oil layer 41. The dry film layer 42 is wrapped on the outer surface of the first carbon arc block 21, and the dry film layer 42 is wrapped on the outer surface of the second carbon arc block 22. The dry film layer 42 is a polyethylene protective film, which can isolate oxygen and protect the circuit board 4 from mechanical scratches.
[0038] Reference Figure 1 and Figure 2 As shown, a first protective layer 43 is disposed on the dry film layer 42 . The first protective layer 43 is a rosin water coating. The rosin water can prevent the carbon film from being heated, thereby increasing the service life of the circuit board 4 .
[0039] Reference Figure 1 and Figure 2 As shown, an insulating layer 44 is applied to the bottom surface of the circuit board 4 to further improve the insulation effect of the circuit board 4 .
[0040] Reference Figure 1 and Figure 2 As shown, a second protective layer 45 is coated on the bottom surface of the insulating layer 44 . The second protective layer 45 is a rosin water coating, which further improves the heat insulation effect of the circuit board 4 , thereby further improving the service life of the circuit board 4 .
[0041] Reference Figure 1 As shown, positioning holes are provided on the circuit board 4 to facilitate positioning of the circuit board 4 during the welding process.
[0042] The implementation principle of a carbon ink key circuit board 4 in the embodiment of the present application is:
[0043] The carbon dot 1 is arranged on the circuit board 4, the first carbon arc block 21 is arranged next to the carbon dot 1, the second carbon arc block 22 is arranged next to the carbon dot 1, a gap is left between the first carbon arc block 21 and the second carbon arc block 22, the copper wire 3 is connected to the carbon dot 1, the copper wire 3 is arranged in the gap, and the copper wire 3 does not pass through the first carbon arc block 21 and the second carbon arc block 22, so there is no need to print insulating oil on the bottom surface of the first carbon arc block 21 and the second carbon arc block 22, so as to achieve insulation between the copper wire 3 and the carbon oil mechanism 2, thereby saving resources.
[0044] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.
Claims
1. A carbon oil key circuit board, comprising a carbon dot (1), a carbon oil mechanism (2) arranged next to the carbon dot (1), and a copper wire (3) connected to the carbon dot (1), characterized in that: The carbon dot (1) is arranged on a circuit board (4), and the carbon oil mechanism (2) comprises a first carbon arc block (21) arranged next to the carbon dot (1) and a second carbon arc block (22) arranged next to the carbon dot (1), a gap is left between the first carbon arc block (21) and the second carbon arc block (22), and the copper wire (3) is arranged in the gap.
2. A carbon ink key circuit board according to claim 1, characterized in that: A solder resist layer (41) is provided on the surface of the circuit board (4), and the carbon dots (1), the first carbon arc blocks (21), the second carbon arc blocks (22) and the copper wires (3) are all provided on the solder resist layer (41).
3. A carbon ink key circuit board according to claim 2, characterized in that: A tin layer (11) is sprayed onto the carbon dots (1).
4. A carbon ink key circuit board according to claim 3, characterized in that: A dry film layer (42) is provided on the circuit board (4), the dry film layer (42) is provided on the solder resist layer (41), the dry film layer (42) is provided on the first carbon arc block (21), the dry film layer (42) is provided on the second carbon arc block (22), and the dry film layer (42) is a polyethylene protective film.
5. A carbon ink key circuit board according to claim 4, characterized in that: A first protective layer (43) is provided on the dry film layer (42), and the first protective layer (43) is a rosin water coating.
6. The carbon ink key circuit board according to claim 1, characterized in that: The circuit board (4) is provided with positioning holes.
7. The carbon ink key circuit board according to claim 1, characterized in that: The bottom surface of the circuit board (4) is coated with an insulating layer (44).
8. The carbon ink key circuit board according to claim 7, characterized in that: A second protective layer (45) is applied on the bottom surface of the insulating layer (44), and the second protective layer (45) is a rosin water coating.