Silicon wafer supporting device of gluing machine

Abstract

According to the technical scheme, the silicon wafer supporting device is characterized in that the silicon wafer supporting device comprises a base, two supports are arranged on the top face of the base, and placing grooves are formed in the top faces of the supports; the adjusting assembly is arranged on the top face of the base and used for adjusting the position of the support, the adjusting assembly comprises two moving grooves, the two moving grooves are both formed in the top face of the base, a base is fixedly installed on the bottom face of the support, a moving block is fixedly installed on the bottom face of the base, and the moving block is fixedly installed on the top face of the base. Through the mutual cooperation effect of the base, the supports, the containing grooves, the moving grooves, the base, the moving blocks, positioning grooves, threaded rods, first threaded holes and limiting holes, the effect of adjusting the positions of the two supports is achieved; and the silicon wafers with different sizes can be conveniently extruded and limited by a worker for gluing after being placed.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafers, in particular to a silicon wafer supporting device of a glue coating machine. Background Art

[0002] Uncut single crystal silicon material is a thin round piece called a wafer, which is the raw material of the semiconductor industry. After cutting, it is called a silicon wafer. Various semiconductor devices can be made by photolithography, ion implantation and other methods.

[0003] In the prior art, since silicon wafers need to be supported during the glue coating process, and there are many types and sizes of silicon wafers, when multiple silicon wafers need to be glued, the size of the support is difficult to adjust and it may be necessary to replace supports of different sizes, which in turn affects the glue coating efficiency of the silicon wafers. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a silicon wafer supporting device for a glue coating machine, which solves the problem that since silicon wafers need to be supported during the glue coating process, there are many types and sizes of silicon wafers. When multiple silicon wafers need to be glued, the size of the supports is difficult to adjust and supports of different sizes may need to be replaced, which in turn affects the glue coating efficiency of the silicon wafers.

[0005] The above technical objectives of the utility model are achieved through the following technical solutions:

[0006] 7. The swiftly and minutely adjusting device for a wood-planer as claimed in claim 1, wherein said adjusting base is provided with two supports on the top surface of said base, and said support is provided with a placing groove; and said adjusting component is arranged on said top surface of said base for adjusting the position of said support. said adjusting component comprises two movable grooves, both of said movable grooves are arranged on the top surface of said base, and a base is fixedly installed on the bottom surface of said support, and a movable block is fixedly installed on the bottom surface of said base, said movable block is movably sleeved with the inside of said movable groove, a positioning groove is provided on one side of said movable groove, a threaded rod is movably sleeved on the inner circular wall surface of said positioning groove, a first threaded hole is provided on one side of said movable block, and the inner circular wall surface of said first threaded hole is threadedly connected with the outer circular wall surface of said threaded rod, and limiting holes are respectively provided on both sides of said base, said limiting holes are connected with said movable groove, and the inner circular wall surface of said limiting hole is movably sleeved with the outer circular wall surface of said threaded rod.

[0007] In order to achieve a better limiting effect on the silicon wafer placed in the placement groove, as a silicon wafer supporting device of a glue coating machine of the utility model, it is preferred that two extrusion blocks are respectively arranged inside the two placement grooves, and two springs are fixedly installed on the inner circular wall surface of the placement groove, and the springs are fixedly installed on one side of the extrusion block.

[0008] In order to squeeze and limit the silicon wafer placed in the placement groove, as a silicon wafer supporting device of a glue coating machine of the utility model, it is preferred that a second threaded hole is opened on the inner circular wall surface of the placement groove, and a positioning bolt is threadedly connected to the inner circular wall surface of the second threaded hole.

[0009] In order to prevent the positioning bolts from causing wear and scratches on the silicon wafer when limiting the silicon wafer, as a silicon wafer supporting device of a glue coating machine of the utility model, preferably, a gasket is fixedly installed on one end of the positioning bolt.

[0010] In order to make the threaded rod more stable when rotating in the movable groove, as a silicon wafer supporting device of a glue coating machine of the utility model, it is preferred that the inner circular wall surface of the positioning groove is fixedly sleeved with a bearing, and the inner ring of the bearing is fixedly sleeved with the outer circular wall surface of the threaded rod.

[0011] In order to prevent the base from shaking when sliding on the base, as a silicon wafer supporting device of a glue coating machine of the utility model, it is preferred that two limit blocks are fixedly installed on the bottom surface of the base, and a plurality of limit grooves are opened on the top surface of the base, and the interior of the limit grooves is movably connected with the limit blocks.

[0012] In summary, the utility model mainly has the following beneficial effects:

[0013] Through the mutual cooperation of the set base, support, placement groove, moving groove, pedestal, moving block, positioning groove, threaded rod, first threaded hole and limit hole, the effect of position adjustment of the two supports is achieved, which is convenient for the staff to squeeze the limit and apply glue after the silicon wafers of different sizes are placed. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0015] Figure 2 It is a schematic diagram of the base structure of the utility model;

[0016] Figure 3 It is a schematic diagram of the support structure of the utility model;

[0017] Figure 4 yes Figure 2 Schematic diagram of the local structure of A.

[0018] Figure numerals: 1. base; 2. support; 3. placement groove; 4. base; 5. moving block; 6. moving groove; 7. positioning groove; 8. threaded rod; 9. first threaded hole; 10. limiting hole; 11. extrusion block; 12. spring; 13. second threaded hole; 14. positioning bolt; 15. gasket; 16. bearing; 17. limiting groove; 18. limiting block. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] Embodiment 1

[0021] refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 A silicon wafer supporting device for a glue coating machine comprises a base 1, wherein the top surface of the base 1 is provided with two supports 2, the top surface of the support 2 is provided with a placement groove 3, the top surface of the base 1 is provided with an adjustment component for adjusting the position of the support 2, the adjustment component comprises two moving grooves 6, both of which are provided on the top surface of the base 1, a base 4 is fixedly installed on the bottom surface of the support 2, a moving block 5 is fixedly installed on the bottom surface of the base 4, the moving block 5 is movably sleeved with the inside of the moving groove 6, a positioning groove 7 is provided on one side of the moving groove 6, a threaded rod 8 is movably sleeved on the inner circular wall surface of the positioning groove 7, a first threaded hole 9 is provided on one side of the moving block 5, the inner circular wall surface of the first threaded hole 9 is threadedly connected with the outer circular wall surface of the threaded rod 8, limiting holes 10 are respectively provided on both sides of the base 1, the limiting holes 10 are connected with the moving groove 6, and the inner circular wall surface of the limiting hole 10 is connected with the inner circular wall surface of the limiting hole 10. The outer cylindrical wall of the threaded rod 8 is movably sleeved through the support 2 provided. When the staff needs to apply glue to the silicon wafer, the staff turns the threaded rod 8 to make the threaded rod 8 rotate and rotate in the first threaded hole 9 to make the moving block 5 move in the moving groove 6, and then the moving block 5 drives the base 4 and drives the support 2 to move, and then preliminarily adjusts the positions of the two supports 2. At this time, the staff places the silicon wafer in the placement groove 3, and then the staff turns the threaded rod 8 again to make the threaded rod 8 rotate in the first threaded hole 9 and then drives the moving block 5 to move in the moving groove 6 and then drives the two supports 2 to move relative to each other to squeeze and limit the silicon wafer placed in the placement groove 3, thereby achieving the effect of adjusting the position of the two supports 2, which is convenient for the staff to apply glue after squeezing and limiting the silicon wafers of different sizes.

[0022] Embodiment 2

[0023] Based on the above embodiment 1, reference Figure 2 , Figure 3 and Figure 4Two extrusion blocks 11 are respectively arranged inside the two placement grooves 3. Two springs 12 are fixedly installed on the inner circular wall surface of the placement groove 3. The spring 12 is fixedly installed on one side of the extrusion block 11. Through the arrangement of 11, when the staff places the silicon wafer in the placement groove 3, the spring 12 rebounds after being squeezed, so that the extrusion block 11 moves to squeeze and limit the silicon wafer, thereby achieving a better limiting effect on the silicon wafer placed in the placement groove 3. A second threaded hole 13 is opened on the inner circular wall surface of the placement groove 3. The inner circular wall surface of the second threaded hole 13 is threadedly connected with a positioning bolt 14. When the silicon wafer is placed in the placement groove 3, the staff rotates the positioning bolt 14 so that the positioning bolt 14 is rotated into the second threaded hole 13 and then into the placement groove 3 to squeeze and limit the silicon wafer placed in the placement groove 3. A gasket 15 is fixedly installed at one end of the positioning bolt 14, and a bearing 16 is fixedly sleeved on the inner circular wall of the positioning groove 7. The inner ring of the bearing 16 is fixedly sleeved on the outer circular wall of the threaded rod 8. Two limit blocks 18 are fixedly installed on the bottom surface of the base 4, and a plurality of limit grooves 17 are opened on the top surface of the base 1. The inner part of the limit groove 17 is movably sleeved with the limit block 18.

[0024] Working principle: Please refer to Figure 1-Figure 4 As shown, through the support 2 that is set, when the staff needs to apply glue to the silicon wafer, the staff turns the threaded rod 8 to make the threaded rod 8 rotate and rotate in the first threaded hole 9 to make the moving block 5 move in the moving groove 6, and then the moving block 5 drives the base 4 and drives the support 2 to move, and then the positions of the two supports 2 are preliminarily adjusted. At this time, the staff places the silicon wafer in the placement groove 3, and then the staff turns the threaded rod 8 again to make the threaded rod 8 rotate in the first threaded hole 9 and then drives the moving block 5 to move in the moving groove 6 and then drives the two supports 2 to move relative to each other to squeeze and limit the silicon wafer placed in the placement groove 3, thereby achieving the effect of adjusting the position of the two supports 2, which is convenient for the staff to apply glue after squeezing and limiting the silicon wafers of different sizes.

[0025] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer supporting device for a glue coating machine, characterized in that: include: A base (1), wherein two supports (2) are arranged on the top surface of the base (1), and a placement groove (3) is provided on the top surface of the supports (2); An adjustment component, the adjustment component is arranged on the top surface of the base (1) and is used to adjust the position of the support (2), the adjustment component comprising: two movable grooves (6), the two movable grooves (6) are both opened on the top surface of the base (1), the bottom surface of the support (2) is fixedly mounted with a base (4), the bottom surface of the base (4) is fixedly mounted with a movable block (5), the movable block (5) is movably sleeved inside the movable groove (6), and one side of the movable groove (6) is opened A positioning groove (7) is provided, and a threaded rod (8) is movably sleeved on the inner circular wall surface of the positioning groove (7); a first threaded hole (9) is provided on one side of the moving block (5); the inner circular wall surface of the first threaded hole (9) is threadedly connected to the outer circular wall surface of the threaded rod (8); limiting holes (10) are respectively provided on both sides of the base (1); the limiting holes (10) are connected to the moving groove (6); and the inner circular wall surface of the limiting hole (10) is movably sleeved on the outer circular wall surface of the threaded rod (8).

2. The silicon wafer supporting device of a glue coating machine according to claim 1, characterized in that: Two extrusion blocks (11) are respectively arranged inside the two placement grooves (3), and two springs (12) are fixedly installed on the inner circular wall surface of the placement groove (3), and the spring (12) is fixedly installed on one side of the extrusion block (11).

3. The silicon wafer supporting device of a glue coating machine according to claim 1, characterized in that: The inner circular wall surface of the placement groove (3) is provided with a second threaded hole (13), and the inner circular wall surface of the second threaded hole (13) is threadedly connected with a positioning bolt (14).

4. The silicon wafer supporting device of the glue coating machine according to claim 3, characterized in that: A gasket (15) is fixedly mounted on one end of the positioning bolt (14).

5. The silicon wafer supporting device of a glue coating machine according to claim 1, characterized in that: A bearing (16) is fixedly sleeved on the inner circular wall surface of the positioning groove (7), and an inner ring of the bearing (16) is fixedly sleeved on the outer circular wall surface of the threaded rod (8).

6. The silicon wafer supporting device of a glue coating machine according to claim 1, characterized in that: Two limit blocks (18) are fixedly mounted on the bottom surface of the base (4), and a plurality of limit grooves (17) are provided on the top surface of the base (1), wherein the interior of the limit grooves (17) is movably sleeved with the limit blocks (18).

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