Device for collecting polishing chippings of diamond sawtooth-shaped micro-cutting blade

By designing a diamond serrated micro-cut blade polishing debris collection device including a vacuum pump, chip suction port and collection box, the problem of debris splash affecting the effect during the polishing process is solved, and automatic debris collection is achieved to ensure optimization of polishing effect.

CN222627288UActive Publication Date: 2025-03-18SHENZHEN SANHUI HARD PRECISE TOOLS CO LTD
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Patent Information

Application Number
CN202420391933.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-02-29
Publication Date
2025-03-18
Estimated Expiration
2034-02-28

AI Technical Summary

Technical Problem

When polishing and grinding a diamond serrated micro-cutting blade with a polishing device, the splash of debris will stick to the blade if it is not cleaned in time, affecting the polishing effect.

Method used

A collection device including a device body, a first bracket, a polishing knife bracket, a turntable, a polishing disc, a second bracket, a first fixing block, a baffle, a second fixing block, a rotating ball, a chip suction port, a chip suction tube, a vacuum pump and a collection box are designed. Through the action of a vacuum pump, the chips absorb the debris from the surface of the polishing disk and collect them into the collection box through the chips.

Benefits of technology

It realizes automatic collection of debris during the polishing process to prevent debris from adhering to the blade, ensuring optimization of polishing effect, and through the design of the visual port and handle, it is convenient for users to clean up debris in the collection box.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of blade outer surface polishing devices, in particular to a collecting device for diamond sawtooth-shaped micro-cutting blade polishing chippings, which comprises a device body, a first support and a polishing cutter support, the top of the device body is fixedly connected with the first support, one side of the first support is rotatably connected with a second support, and the other side of the first support is rotatably connected with the polishing cutter support. A polishing cutter support is arranged behind the second support, the top of the device body is rotationally connected with a rotating disc, a polishing disc is arranged at the top of the rotating disc, a first fixing block is tightly attached to one side of the second support, a baffle is fixedly connected to one side of the first fixing block, and a second fixing block is fixedly connected to the inner side of the baffle. According to the polishing device, a scrap collecting device is arranged on the polishing device, so that the purpose of polishing and collecting scraps at the same time is achieved, and the scraps are prevented from being adhered to the surface of a blade to affect the polishing effect.
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Description

Technical Field

[0001] The utility model relates to the technical field of blade outer surface polishing devices, in particular to a device for collecting polishing debris of a diamond sawtooth micro-cutting blade. Background Art

[0002] Diamond serrated micro-cutting blades are cut and polished from large-sized diamond single crystals. They have excellent wear resistance and high hardness and can be used in high-speed cutting, grinding, polishing and other processing processes. Diamond serrated micro-cutting blades are usually polished using polishing devices.

[0003] When the polishing device is polishing a diamond blade, the rapid rotation of the grinding blade causes the generated debris to splash. If it is not cleaned in time, it will adhere to the blade and affect the polishing effect. Therefore, a device for collecting polishing debris of a diamond serrated micro-cutting blade is proposed to solve the above problem. Utility Model Content

[0004] The utility model aims to provide a device for collecting polishing debris of a diamond sawtooth micro-cutting blade, so as to solve the problem that the polishing effect is affected by the splashing of the debris.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A device for collecting polishing debris of a diamond serrated micro-cutting blade comprises a device body, a first bracket and a polishing knife bracket, the top of the device body is fixedly connected to the first bracket, one side of the first bracket is rotatably connected to the second bracket, a polishing knife bracket is provided behind the second bracket, the top of the device body is rotatably connected to a turntable, the top of the turntable is provided with a polishing disk, one side of the second bracket is tightly fitted with a first fixed block, one side of the first fixed block is fixedly connected to a baffle, the inner side of the baffle is fixedly connected to a second fixed block, the second fixed block is rotatably connected to a rotating ball, one end of the rotating ball is fixedly connected to a chip suction port, one side of the chip suction port is connected to a chip suction pipe, one end of the chip suction pipe is connected to a collection box, one side of the collection box is connected to a vacuum pump, one side of the first fixed block is fixedly connected to a limiting block, and the top of the second bracket is provided with a bolt.

[0007] Preferably, the first brackets are arranged in groups of two on the front and rear sides of the second bracket, and the polishing knife bracket fits tightly against one of the polishing plates.

[0008] Preferably, there are five polishing discs, and the surfaces of the polishing discs are concave and the middle is convex.

[0009] Preferably, the baffle is arranged in an arc shape, and the baffle is arranged above the polishing disc.

[0010] Preferably, a handle is fixedly connected to the top of the collection box, and a viewing port is provided on the surface of the collection box.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] In the utility model, the diamond serrated micro-cutting blade to be polished is placed in the recess of the polishing disc through the device main body, the first bracket, the polishing knife bracket, the turntable, the polishing disc and the second bracket, which play a limiting role. Then the device main body is started, the second bracket rotates, driving the polishing knife bracket and the polishing disc to fit closely, and the polishing knife rotates in the polishing knife bracket to polish the diamond blade. Through the first fixed block, the baffle plate, the second fixed block, the rotating ball, the chip suction port, the chip suction pipe, the vacuum pump and the collection box, during the polishing process, the vacuum pump is started, and the chip suction port sucks the chips on the surface of the polishing disc into the chip suction pipe until it is in the collection box, so as to achieve the purpose of collecting chips while polishing without affecting the polishing effect. Through the provided handle and the visual port, the user can judge the degree of chip accumulation in the visual port and discharge the chips in the collection box. Through the provided limit block, the bolt and the second bracket, the user rotates the bolt until it is taken out, and the collection device can be disassembled and maintained as a whole. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0014] Figure 2 For this utility model Figure 1 A schematic diagram of the structure at A;

[0015] Figure 3 It is a schematic diagram of the structure of the main body 1 of the device of the utility model from a top view.

[0016] In the figure: 1. device body; 2. first bracket; 3. polishing knife bracket; 4. turntable; 5. polishing disc; 6. first fixed block; 7. baffle; 8. second fixed block; 9. rotating ball; 10. chip suction port; 11. chip suction pipe; 12. vacuum pump; 13. collection box; 14. handle; 15. viewing port; 16. limit block; 17. bolt; 18. second bracket. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0018] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0019] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0020] See also Figure 1-3 , the utility model provides a technical solution:

[0021] A device for collecting polishing debris of a diamond sawtooth micro-cutting blade comprises a device body 1, a first bracket 2 and a polishing knife bracket 3, wherein the first bracket 2 is fixedly connected to the top of the device body 1, one side of the first bracket 2 is rotatably connected to the second bracket 18, the polishing knife bracket 3 is arranged behind the second bracket 18, the top of the device body 1 is rotatably connected to a turntable 4, the top of the turntable 4 is provided with a polishing disk 5, one side of the second bracket 18 is tightly fitted with a first fixed block 6, one side of the first fixed block 6 is fixedly connected to a baffle 7, the inner side of the baffle 7 is fixedly connected to a second fixed block 6, and the second fixed block 6 is fixedly connected to the inner side of the baffle 7. The fixed block 8 is provided with a rotating ball 9 rotatably connected inside the second fixed block 8, one end of the rotating ball 9 is fixedly connected with a chip suction port 10, one side of the chip suction port 10 is connected with a chip suction pipe 11, one end of the chip suction pipe 11 is connected with a collecting box 13, one side of the collecting box 13 is connected with a vacuum pump 12, one side of the first fixed block 6 is fixedly connected with a limiting block 16, and a bolt 17 is provided on the top of the second bracket 18. By setting a device for collecting debris on the polishing device, the purpose of polishing and collecting debris is achieved, so that the debris will not stick to the surface of the blade and affect the polishing effect.

[0022] Two first brackets 2 are arranged in a group on the front and rear sides of the second bracket 18, and the polishing knife bracket 3 is tightly fitted with one of the polishing discs 5, which is convenient for polishing the diamond blade; there are five polishing discs 5, and the surface of the polishing disc 5 is concave and the middle is convex, which is convenient for positioning the diamond blade; the baffle 7 is arranged in an arc shape, and the baffle 7 is arranged above the polishing disc 5 to shield the generated debris; a handle 14 is fixedly connected to the top of the collection box 13, and a visual port 15 is provided on the surface of the collection box 13, which is convenient for cleaning the debris inside the collection box 13.

[0023] Working process: During the operation of the equipment, the external power supply is energized. When the diamond serrated micro-cutting blade outer surface polishing device is used, first place the device body 1 in a suitable position, and place the diamond blade in the depression of the polishing disk 5 to play a limiting role. Then start the device body 1, and the second bracket 18 rotates, driving the polishing knife bracket 3 and the polishing disk 5 to fit closely. The polishing knife rotates in the polishing knife bracket 3 to polish the surface of the diamond blade. During the polishing process, start the vacuum pump 12, and rotate the handheld chip suction port 10 to drive the rotating ball 9 to rotate in the second fixed block 8. Adjust the angle of the chip suction port 10. After adjusting to the appropriate position, the debris generated on the surface of the diamond blade during polishing is sucked into the chip suction pipe 11 until it is sucked into the collection box 13, so as to achieve polishing while For the purpose of collecting debris, after polishing a diamond blade, the turntable 4 rotates, and the next polishing disc 5 is rotated to the bottom of the polishing knife bracket 3 to polish the next diamond blade. After long-term use, the user judges the degree of debris accumulation at the visual port 15, and pulls out the drawer in the collection box 13 by holding the handle 14 to discharge the debris in the collection box 13. When the polishing device and the debris collecting device are used up, the user rotates the bolt 17 until it is taken out, and then holds the second fixed block 8 to move right until the limit block 16 leaves the second bracket 18. The collection device can be disassembled and maintained as a whole. By setting the debris collecting device on the polishing device, the purpose of polishing and collecting debris is achieved, so that the debris will not stick to the blade surface and affect the polishing effect.

[0024] The contents not described in detail in this specification belong to the prior art known to the professional and technical personnel in this field. The standard parts used in this utility model can be purchased from the market, and the special-shaped parts can be customized according to the description and the drawings. The specific connection methods of each part adopt the conventional means such as bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt the conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here.

[0025] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A device for collecting polishing debris of a diamond sawtooth micro-cutting blade, comprising a device body (1), a first bracket (2) and a polishing blade bracket (3), characterized in that: The top of the device body (1) is fixedly connected to a first bracket (2), one side of the first bracket (2) is rotatably connected to a second bracket (18), a polishing knife bracket (3) is provided behind the second bracket (18), the top of the device body (1) is rotatably connected to a turntable (4), a polishing disc (5) is provided on the top of the turntable (4), a first fixed block (6) is tightly attached to one side of the second bracket (18), one side of the first fixed block (6) is fixedly connected to a baffle (7), and the inner side of the baffle (7) is fixed A second fixed block (8) is fixedly connected, a rotating ball (9) is rotatably connected inside the second fixed block (8), one end of the rotating ball (9) is fixedly connected to a chip suction port (10), one side of the chip suction port (10) is connected to a chip suction pipe (11), one end of the chip suction pipe (11) is connected to a collection box (13), one side of the collection box (13) is connected to a vacuum pump (12), one side of the first fixed block (6) is fixedly connected to a limiting block (16), and a bolt (17) is provided on the top of the second bracket (18).

2. The device for collecting polishing debris of a diamond serrated micro-cutting blade according to claim 1, characterized in that: The first brackets (2) are arranged in groups of two on the front and rear sides of the second bracket (18), and the polishing knife bracket (3) is tightly fitted to one of the polishing discs (5).

3. The device for collecting polishing debris of a diamond serrated micro-cutting blade according to claim 1, characterized in that: There are five polishing discs (5) in total, and the surfaces of the polishing discs (5) are concavely arranged and the middle is convexly arranged.

4. The device for collecting polishing debris of a diamond serrated micro-cutting blade according to claim 1, characterized in that: The baffle (7) is arranged in an arc shape, and the baffle (7) is arranged above the polishing disc (5).

5. The device for collecting polishing debris of a diamond serrated micro-cutting blade according to claim 1, characterized in that: A handle (14) is fixedly connected to the top of the collection box (13), and a viewing port (15) is provided on the surface of the collection box (13).