Reinforcing liquid crystal module back plate

By setting a pressure relief groove on the side of the transition surface of the concave area of ​​the back plate of the liquid crystal module and the platform area, the problem of rebound deformation of the back plate after stamping is solved, and the flatness and yield of the back plate are improved.

CN222636427UActive Publication Date: 2025-03-18SHANG HAI TAI HUI YE JING XIAN SHI QI JIAN YOU XIAN GONG SI
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Patent Information

Application Number
CN202420863719.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-24
Publication Date
2025-03-18
Estimated Expiration
2034-04-24

AI Technical Summary

Technical Problem

The existing LCD module back plate rebounds and deformation after stamping due to stress release, resulting in low yield and high scrap rate, especially in plate types above 65 inches.

Method used

Pressure relief grooves are provided on the side of the transition surface of the inward concave area of ​​the back plate and the platform area to release the local concentrated stress generated by the transition surface during the stamping process and improve the flatness of the back plate.

Benefits of technology

By setting up a pressure relief groove, stress is effectively released, the rebound deformation of the back plate is reduced, the flatness of the back plate is improved, the yield rate is improved and the waste rate is reduced.

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Abstract

The utility model discloses a reinforcing liquid crystal module back plate which is characterized in that concave areas which are concave downwards relative to a platform area are arranged on the back plate in a staggered mode, the concave areas and the platform area are in smooth transition connection through a transition face, and the reinforcing liquid crystal module back plate further comprises a pressure relief groove formed in the side portion of the transition face. The pressure relief groove is located on one side close to the platform area. The reinforced pressure relief groove is formed in the transition face side of the concave area and the platform area, local concentrated stress generated in the stamping process of the transition face is released, and the flatness of the back plate is improved.
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Description

Technical Field

[0001] The utility model relates to the field of liquid crystal template backplanes, in particular to a reinforced liquid crystal module backplane. Background Art

[0002] Figure 1 An existing LCD module backplane is shown. Since the LCD panel of a TV is relatively large, a plurality of interlaced concave and convex platform areas 10 and concave areas 20 are provided on the backplane to prevent deformation after punching. However, in actual applications, a small number of products, especially those with a size of more than 65 inches and a concave and convex area stretching depth greater than 1 mm, still have the problem of springback deformation caused by stress release after the punch load is removed, so that the yield rate can only be maintained at about 90%, and the scrap rate is relatively high.

[0003] Since the LCD panel itself has no tensile properties, it mainly relies on a metal back plate as a skeleton to support it so that it can be unfolded flat in a vertical state. If the metal back plate is deformed, the LCD panel will be distorted synchronously, resulting in different angles between various points on the LCD panel and the audience's line of sight, causing shadows in the viewing image. Utility Model Content

[0004] In order to overcome the above-mentioned defects of the prior art, the purpose of the utility model is to provide a reinforced liquid crystal module backplane to achieve the purpose of eliminating the rebound deformation of the large-sized backplane.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0006] A reinforced liquid crystal module backplane, on which concave areas that are sunken downward relative to a platform area are staggered, the concave areas and the platform area are smoothly transitioned to each other via a transition surface, and also includes a pressure relief groove arranged on the side of the transition surface, the pressure relief groove is located on a side close to the platform area.

[0007] Furthermore, the depth of the pressure relief groove ranges from 0.2 mm to 0.3 mm.

[0008] Furthermore, the cross-section of the pressure relief groove is rectangular.

[0009] Furthermore, the size of the back panel is less than or equal to 65 inches.

[0010] Furthermore, the size of the back panel is between 65 inches and 75 inches.

[0011] Furthermore, the height difference between the concave area and the platform area is at least 1 mm.

[0012] Furthermore, the platform area includes an outer platform enclosed in a rectangular shape to form an outer edge portion of the back plate.

[0013] Furthermore, it also includes a middle platform located in the middle of the back plate, and the concave area is located between the middle platform and the outer platform.

[0014] Furthermore, the concave area includes a first concave area arranged on the upper side of the middle platform and a second concave area arranged on the lower side of the middle platform respectively, and the height difference between the first concave area and the second concave area is 1 mm.

[0015] The beneficial effects of the utility model are:

[0016] The utility model provides a reinforced liquid crystal module back plate, in which a reinforced pressure relief groove is arranged on the transition surface side between the concave area and the platform area, so as to release the local concentrated stress generated on the transition surface during the stamping process and improve the flatness of the back plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.

[0018] Figure 1 It is a schematic diagram of the prior art.

[0019] Figure 2 It is a structural schematic diagram of the utility model.

[0020] Figure 3 It is a schematic diagram of the layout of the pressure relief grooves.

[0021] Figure 4 yes Figure 3 A partial enlarged view of point B.

[0022] Figure 5 yes Figure 4 AA section view. DETAILED DESCRIPTION

[0023] In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "inside", "outside", etc. are based on the directions or positional relationships shown in the accompanying drawings. The above description is simplified for the convenience of describing the present invention, and does not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, it should not be understood as a limitation on the present invention.

[0024] In the specification, when an element is referred to as being “on,” “fixed” to, “connected to,” “engaged to,” or the like, the element may be directly on, fixed to, connected to, engaged to, or contacting the other element, or intervening elements may be present.

[0025] It is to be understood that although the terms "first", "second", etc. may be used herein to describe different elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. Therefore, a first element may be referred to as a second element without departing from the teachings of the present application.

[0026] The following will describe exemplary embodiments of the present application with reference to the accompanying drawings. However, it should be understood that the present application can be presented in a variety of different ways and is not limited to the embodiments described below. It should also be understood that the embodiments disclosed herein can be combined in various ways to provide more additional embodiments. In all drawings, the same reference numerals represent the same or functionally identical elements.

[0027] Figure 2 An existing liquid crystal module backplane structure is shown. The rectangular backplane is surrounded by a left platform 21, a lower platform 22, an upper platform 23 and a right platform 24 in a plane view. A first middle platform 25 and a second middle platform 26 are arranged in the middle of the backplane. A first concave area 11 is arranged between the first middle platform 25 and the second middle platform 26 and the left platform 21, the upper platform 23 and the right platform 24, and a second concave area 11 is arranged between the first middle platform 25 and the second middle platform 26 and the lower platform 22. The liquid crystal module is mainly supported by the first middle platform 25 and the second middle platform 26 on the back thereof. Since there is an electrical component at the bottom of the liquid crystal module, the concave depth of the second concave area 11 is greater than that of the first concave area 11.

[0028] Figures 3 to 5The structure of the junction between the concave area and the platform area is shown. There is a transition surface 31 with a gentle transition connection between the first concave area 11 and the left platform 21. Since the first concave area 11 has a larger stretchability than the left platform 21, and the height difference is 1 mm, local stress concentration will occur on the transition surface 31 during the stretching process. After the punch load is removed, stress release will occur, causing the back plate to deform. Specifically, the stretchability of the transition surface 31 on the side close to the concave area is greater than that on the side close to the platform area, so the stress on the side close to the platform area is more concentrated. By adding a pressure relief groove 32 on the side of the transition surface 31 close to the platform area, that is, adding a punch structure for extruding the material on the periphery of the punch, the material is forced to flow into the pressure relief groove 32 to release the stress on the side close to the platform area, so that the flatness of the 65-inch back plate with a thickness of 1 mm can be controlled within 0.5 mm, and the flatness of the 65 to 75-inch back plate can be controlled within 0.8 mm. In order to facilitate the processing and design of the mold, the cross-section of the pressure relief groove 32 is set to a rectangular shape with a depth of 1 mm. Specifically, Figure 3 As shown in the orange shaded area in the figure, the pressure relief groove 32 is arranged along the transition surface 31 at the line connection between the concave area and the platform area. For the convenience of description, only the structure between the first concave area 11 and the left platform 21 is shown above.

Claims

1. A reinforced liquid crystal module backplane, wherein the backplane is staggered with concave areas that are sunken downward relative to the platform area, and the concave areas are smoothly connected to the platform area by a transition surface, characterized in that: It also includes a pressure relief groove arranged on the side of the transition surface, and the pressure relief groove is located on a side close to the platform area.

2. The reinforced liquid crystal module backplane according to claim 1, characterized in that: The depth of the pressure relief groove ranges from 0.2 mm to 0.3 mm.

3. The reinforced liquid crystal module backplane according to claim 2, characterized in that: The cross section of the pressure relief groove is rectangular.

4. The reinforced liquid crystal module backplane according to claim 1, characterized in that: The size of the back panel is less than or equal to 65 inches.

5. The reinforced liquid crystal module backplane according to claim 1, characterized in that: The size of the back panel is between 65 inches and 75 inches.

6. The reinforced liquid crystal module backplane according to claim 1, characterized in that: The height difference between the concave area and the platform area is at least 1 mm.

7. A reinforced liquid crystal module backplane according to any one of claims 1 to 6, characterized in that: The platform area includes an outer platform which is enclosed in a rectangular shape and constitutes an outer edge portion of the back plate.

8. The reinforced liquid crystal module backplane according to claim 7, characterized in that: It also includes a middle platform located in the middle of the back plate, and the concave area is located between the middle platform and the outer platform.

9. The reinforced liquid crystal module backplane according to claim 8, characterized in that: The concave area includes a first concave area arranged on the upper side of the middle platform and a second concave area arranged on the lower side of the middle platform respectively, and the height difference between the first concave area and the second concave area is 1 mm.