Temperature control system, quantum calculation measurement and control system and quantum computer

Abstract

The utility model relates to the technical field of quantum computing, in particular to a temperature control system, a quantum computing measurement and control system and a quantum computer.The temperature control system is used for controlling the temperature of a radio frequency module and comprises constant temperature plates arranged on the upper surface of the radio frequency module and the lower surface of the radio frequency module; the thermal insulation material wraps the radio frequency module and the constant temperature plate in an attached mode; the temperature adjusting module penetrates through the thermal insulation material and is attached to the constant-temperature plate; and the temperature regulation control device is connected with the temperature regulation module and used for controlling the temperature regulation module to enable the temperature of the radio frequency module to be at the target temperature, and the temperature regulation control device controls the temperature regulation module according to the received real-time temperature. And enabling the temperature of the radio frequency module to be at the target temperature, thereby enabling the radio frequency module to output a radio frequency signal with stable phase difference.

Description

Technical Field

[0001] The present application relates to the field of quantum computing technology, and in particular to a temperature control system, a quantum computing measurement and control system, and a quantum computer. Background Art

[0002] The quantum control frequency of quantum computing measurement and control systems is generally between 4GHz and 8GHz. At present, the more mature frequency generation method is to mix the baseband signal through one or more RF modules to the range of 4GHz to 8GHz, and the RF transmission channel mixing uses RF signals. At the same time, the quantum measurement channel mixes the high-frequency signal and remixes it to the same frequency as the baseband signal before digital processing. The control and measurement of quantum bits will use the same RF signal. Therefore, the phase difference stability index of the RF signal directly determines the accuracy of the quantum measurement results.

[0003] Existing RF modules are greatly affected by the external ambient temperature. The rate of change of their phase difference with ambient temperature is 7° / ℃. The phase difference changes by more than 20° in a day. This indicator is basically unusable for quantum computing measurement and control systems. Therefore, how to ensure that the RF module is at a relatively stable temperature so that the phase difference of the RF signal output by the RF module is in a stable state is a technical problem that needs to be solved urgently. Utility Model Content

[0004] The purpose of the present application is to provide a temperature control system, a quantum computing measurement and control system and a quantum computer, which are used to solve the problem in the prior art that the RF module is greatly affected by the external ambient temperature, resulting in an unstable phase difference of the RF signal output by the RF module.

[0005] In order to solve the above technical problems, the present invention proposes a temperature control system for controlling the temperature of a radio frequency module, the system comprising:

[0006] Constant temperature plates, arranged on the upper and lower surfaces of the radio frequency module;

[0007] A heat-insulating material is provided to fit and wrap the radio frequency module and the constant temperature plate;

[0008] A temperature regulating module, which penetrates the thermal insulation material and is attached to the constant temperature plate;

[0009] The temperature adjustment control device is electrically connected to the temperature adjustment module and is used to control the temperature adjustment module so that the temperature of the radio frequency module is at a target temperature.

[0010] Optionally, the system further includes a metal box, and the radio frequency module is fixed inside the metal box.

[0011] Optionally, the number of the RF modules is at least two, and a heat conductive layer is provided between two adjacent RF modules.

[0012] Optionally, a heat-conducting layer is provided between the constant temperature plate and the upper surface of the radio frequency module, and the heat-conducting layer is provided between the constant temperature plate and the lower surface of the radio frequency module.

[0013] Optionally, the thermal insulation material includes polytetrafluoroethylene.

[0014] Optionally, a heat dissipation device is further included, and the heat dissipation device is arranged on the temperature adjustment module.

[0015] Optionally, the heat dissipation device includes a metal heat sink and multiple fans, the metal heat sink is bonded to the upper surface of the temperature adjustment module, the multiple fans are arranged on the metal heat sink, and the metal heat sink exchanges heat with the external environment through the multiple fans.

[0016] Optionally, the temperature adjustment control device includes a temperature sensor and a temperature controller;

[0017] The temperature sensor is arranged on the constant temperature plate and is used to collect the real-time temperature of the constant temperature plate;

[0018] The temperature controller is electrically connected to the temperature adjustment module and the temperature sensor, and is used to receive the real-time temperature and control the temperature adjustment module according to the received real-time temperature so that the temperature of the RF module is at the target temperature.

[0019] Based on the same inventive concept, the present application also proposes a quantum computing measurement and control system, including a temperature control system described in any one of the above-mentioned feature descriptions, through which the RF module outputs a RF signal with a stable phase difference.

[0020] Based on the same inventive concept, the present application also proposes a quantum computer, comprising a quantum computing measurement and control system and a quantum chip described in any one of the above-mentioned feature descriptions, wherein the quantum chip performs quantum operations based on the radio frequency signal output by the quantum computing measurement and control system.

[0021] Compared with the prior art, this application has the following beneficial effects:

[0022] The present application realizes temperature control of the RF module by means of a constant temperature plate, thermal insulation material, temperature adjustment module and temperature adjustment control device of the RF module device. The temperature adjustment control device controls the temperature adjustment module according to the received real-time temperature so that the temperature of the RF module is always at the target temperature, thereby enabling the RF module to output an RF signal with a stable phase difference. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of a temperature control system proposed in an embodiment of the utility model;

[0024] Figure 2 A detailed schematic diagram of a temperature control system proposed in an embodiment of the utility model;

[0025] Figure 3 A circuit schematic diagram of a temperature control system proposed in an embodiment of the utility model. DETAILED DESCRIPTION

[0026] The specific implementation of the present invention will be described in more detail below in conjunction with the schematic diagram. The advantages and features of the present invention will become clearer from the following description and claims. It should be noted that the drawings are all in a very simplified form and are not in exact proportions, and are only used to facilitate and clearly assist in explaining the purpose of the embodiments of the present invention.

[0027] In the description of the present invention, it is necessary to understand that the terms "center", "up", "down", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0028] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0029] Reference Figure 1 A schematic diagram of a temperature control system is proposed for this application, which is used to control the temperature of a radio frequency module 1. The system includes:

[0030] A constant temperature plate 2, arranged on the upper surface and the lower surface of the radio frequency module 1;

[0031] A heat-insulating material 3 is provided to fit and wrap the radio frequency module 1 and the constant temperature plate 2;

[0032] A temperature regulating module 4, which penetrates the thermal insulation material 3 and is attached to the constant temperature plate 2;

[0033] The temperature adjustment control device 5 is electrically connected to the temperature adjustment module 4 and is used to control the temperature adjustment module 4 so that the temperature of the RF module 1 is at a target temperature.

[0034] In an optional embodiment, a constant temperature plate 2 is provided on the upper surface of the RF module 1 and the lower surface of the RF module 1. At the same time, the heat preservation material 3 fits and wraps the RF module 1 and the constant temperature plate 2, so that the RF module 1 is in a closed and heat-insulated state, ensuring that the temperature of the RF module 1 is not lost. Then, the temperature sensor in the temperature control device is used to collect the real-time temperature of the constant temperature plate 2, and the temperature controller in the temperature control device 5 compares the real-time temperature with the target temperature. When the real-time temperature is lower than the target temperature, the temperature controller controls the temperature adjustment module 4 to heat up. Since the constant temperature plate 2 is provided on the upper surface and the lower surface of the RF module 1, the temperature of the constant temperature plate 2 is relatively stable. The lower surface of the RF module 1 can therefore be heat-conducted through the constant temperature plate 2 to raise the temperature of the RF module 1 under the constant temperature plate 2 to the target temperature; when the real-time temperature is lower than the target temperature, the temperature controller controls the temperature adjustment module 4 to cool, and heat-conducts through the constant temperature plate 2 to lower the temperature of the RF module 1 under the constant temperature plate 2 to the target temperature. The above method can realize high-precision temperature control of the RF module 1, so that the RF module 1 is always at the target temperature, thereby improving the phase difference stability of the RF signals emitted by each RF device in the RF module 1, wherein the temperature adjustment module 4 is TEC (Thermal Electron ic Cooler, semiconductor refrigerator).

[0035] In an optional embodiment, the constant temperature plate 2 arranged on the upper surface of the RF module 1 and the lower surface of the RF module 1 is not only used to ensure that the temperature of the RF module 1 is at the target temperature, but also ensures that the temperature of various RF cables inserted through the constant temperature plate is also at the target temperature, further improving the phase difference stability of the RF signals emitted by each RF device in the RF module 1.

[0036] Optionally, the system further includes a metal box, and the radio frequency module is fixed inside the metal box.

[0037] In an optional embodiment, the RF module 1 is fixed inside the metal box, the metal box is attached to the constant temperature plate 2, and the constant temperature plate 2 realizes heat conduction between the two RF modules 1 through the metal box, while ensuring that the temperature of the metal box is consistent with the temperature of the constant temperature plate. It should be noted that the number of metal boxes is set according to demand and there is no limit on the number here.

[0038] Optionally, the number of the RF modules 1 is at least two, and a heat-conducting layer is provided between two adjacent RF modules 1 .

[0039] In an optional embodiment, if Figure 1As shown, when the number of RF modules 1 is two, the two RF modules 1 are separately packaged by a metal box, and the two RF modules 1 are connected by an RF cable to realize signal transmission between the two RF modules 1. A thermal conductive layer is provided between the two RF modules 1 to make the thermal conductive layer fully contact with the two RF modules 1, thereby enhancing the heat conduction performance and making the temperatures of the two RF modules 1 basically consistent, further improving the phase difference stability of the RF signals emitted by each RF device in the RF module 1. Among them, the RF module 1 includes one or more RF modules, and the thermal conductive layer can be a thermal conductive silicon pad, or it can be a thermal conductive layer formed by other materials with good thermal conductivity, which is not limited here.

[0040] In an optional embodiment, in order to improve the thermal conductivity between the constant temperature plate 2 and the RF module 1, a thermal conductive layer is provided between the constant temperature plate 2 and the upper surface of the RF module 1, and the thermal conductive layer is provided between the constant temperature plate 2 and the lower surface of the RF module 1, so that the thermal conductive layer is in full contact with the two RF modules 1 and the constant temperature plate 2, thereby enhancing the heat conduction performance, making the temperatures of the constant temperature plate 2 and the two RF modules 1 basically consistent, and further improving the phase difference stability of the RF signals emitted by each RF device in the RF module 1.

[0041] Optionally, the thermal insulation material 3 includes polytetrafluoroethylene.

[0042] In an optional embodiment, the selection of the thermal insulation material 3 is not limited to polytetrafluoroethylene, and may also be other materials that can achieve a thermal insulation effect, which is not limited here.

[0043] Optionally, a heat dissipation device 6 is further included, and the heat dissipation device 6 is arranged on the temperature adjustment module 4.

[0044] In an optional embodiment, the heat dissipation device 6 includes a metal heat sink 60 and a plurality of fans 61. Figure 2 As shown, the metal heat sink 60 is attached to the upper surface of the temperature adjustment module 4, and the multiple fans 61 are arranged on the metal heat sink 60. The metal heat sink 60 exchanges heat with the external environment through the multiple fans, thereby ensuring that the temperature adjustment module 4 can operate normally.

[0045] Optionally, the temperature adjustment control device 5 includes a temperature sensor 50 and a temperature controller 51;

[0046] In an optional embodiment, Figure 2As shown, the temperature sensor 50 is arranged on the constant temperature plate 2, and is used to collect the real-time temperature of the constant temperature plate 2; the temperature controller 50 is electrically connected to the temperature adjustment module 4 and the temperature sensor 50, and is used to receive the real-time temperature, and control the temperature adjustment module 4 according to the received real-time temperature, so that the temperature of the RF module 1 is at the target temperature.

[0047] In an optional embodiment, taking the target temperature of 12°C as an example, when the temperature sensor 50 collects the real-time temperature of the constant temperature plate 2 as 10°C, at this time, the temperature sensor 50 will determine that the real-time temperature is lower than the target temperature, therefore, the temperature sensor 50 will send a heating control instruction to the temperature adjustment module 4, the temperature adjustment module 4 performs heating based on the heating control instruction, and makes the temperature of the RF module 1 at 12°C through the constant temperature plate 2, so as to ensure the phase difference stability of the RF signals emitted by each RF device in the RF module 1; similarly, when the temperature sensor 50 collects the real-time temperature of the constant temperature plate 2 as 15°C, at this time, the temperature sensor 50 will determine that the real-time temperature is higher than the target temperature, therefore, the temperature sensor 50 will send a cooling control instruction to the temperature adjustment module 4, the temperature adjustment module 4 performs cooling based on the cooling control instruction, and makes the temperature of the RF module 1 at 12°C through the constant temperature plate 2, so as to ensure the phase difference stability of the RF signals emitted by each RF device in the RF module 1.

[0048] In an optional embodiment, Figure 3 As shown, the power supply 7 is electrically connected to the fan 61 in the heat dissipation device 6 and the temperature controller 51 , and the temperature controller 51 is electrically connected to the temperature adjustment module 4 and the temperature sensor 50 . When the temperature control system is running, the fan 61 is always in normal working state, the temperature sensor 50 collects the real-time temperature of the constant temperature plate 2, and transmits the real-time temperature information to the temperature controller 51, the temperature controller 51 compares the real-time temperature with the target temperature of the RF component 1, when the real-time temperature is lower than the target temperature, the temperature controller 51 controls the temperature adjustment module 4 to heat, since the constant temperature plate 2 is arranged on the upper surface of the RF module 1 and the lower surface of the RF module 1, therefore, heat conduction can be performed through the constant temperature plate 2, so that the temperature of the RF module 1 under the constant temperature plate 2 rises to the target temperature; when the real-time temperature is lower than the target temperature, the temperature controller 51 controls the temperature adjustment module 4 to cool, and heat conduction is performed through the constant temperature plate 2, so that the temperature of the RF module 1 under the constant temperature plate 2 drops to the target temperature, and the above method is used to realize high-precision temperature control of the RF module 1, so that the RF module 1 is always at the target temperature, thereby improving the phase difference stability of the RF signals emitted by each RF device in the RF module 1.

[0049] In an optional embodiment, the temperature control system in the present application can be applied not only to the RF module 1, but also to the temperature control of other types of chassis, which will not be described in detail here.

[0050] The present application realizes temperature control of the RF module 1 by installing a constant temperature plate 2, a thermal insulation material 3, a temperature adjustment module 4 and a temperature adjustment control device 5 on the RF module 1. The temperature adjustment control device 5 controls the temperature adjustment module 4 according to the received real-time temperature, so that the temperature of the RF module 1 is always at the target temperature, so that the RF module 1 outputs a RF signal with a stable phase difference.

[0051] Based on the same inventive concept, this embodiment also proposes a quantum computing measurement and control system, including a temperature control system described in any one of the above-mentioned feature descriptions, through which the RF module outputs a RF signal with a stable phase difference.

[0052] Based on the same inventive concept, this embodiment also provides a quantum computer, which includes a quantum chip and the quantum computing measurement and control system as described above, wherein the quantum computing measurement and control system is connected to the quantum chip via a signal transmission line; wherein a plurality of quantum bits are arranged on the quantum chip, and the quantum computing measurement and control system enables the radio frequency module to output a radio frequency signal with a stable phase difference through the temperature control system, which is input to the corresponding quantum bit through the signal transmission line, and the quantum bit performs quantum operations based on the radio frequency signal.

[0053] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example" or "specific example" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification.

[0054] The above are only preferred embodiments of the present application and do not have any limiting effect on the present application. Any technical personnel in the relevant technical field, without departing from the scope of the technical solution of the present application, may make any form of equivalent replacement or modification to the technical solution and technical content disclosed in the present application, which shall be deemed as the content of the technical solution of the present application and still fall within the protection scope of the present application.

Claims

1. A temperature control system, characterized in that: Used to control the temperature of a radio frequency module, the system comprises: Constant temperature plates, arranged on the upper and lower surfaces of the radio frequency module; A heat-insulating material is provided to fit and wrap the radio frequency module and the constant temperature plate; A temperature regulating module, which penetrates the thermal insulation material and is attached to the constant temperature plate; The temperature adjustment control device is electrically connected to the temperature adjustment module and is used to control the temperature adjustment module so that the temperature of the radio frequency module is at a target temperature.

2. The system according to claim 1, characterized in that The system also includes a metal box, and the radio frequency module is fixed inside the metal box.

3. The system according to claim 2, characterized in that The number of the RF modules is at least two, and a heat-conducting layer is provided between two adjacent RF modules.

4. The system according to claim 1, characterized in that A heat-conducting layer is provided between the constant temperature plate and the upper surface of the radio frequency module, and the heat-conducting layer is provided between the constant temperature plate and the lower surface of the radio frequency module.

5. The system according to claim 1, wherein: The thermal insulation material comprises polytetrafluoroethylene.

6. The system according to claim 1, characterized in that It also includes a heat dissipation device, which is arranged on the temperature adjustment module.

7. The system according to claim 6, characterized in that The heat dissipation device includes a metal heat sink and a plurality of fans. The metal heat sink is attached to the upper surface of the temperature adjustment module. The plurality of fans are arranged on the metal heat sink. The metal heat sink performs heat exchange with the external environment through the plurality of fans.

8. The system of claim 1, wherein: The temperature adjustment control device includes a temperature sensor and a temperature controller; The temperature sensor is arranged on the constant temperature plate and is used to collect the real-time temperature of the constant temperature plate; The temperature controller is electrically connected to the temperature adjustment module and the temperature sensor, and is used to receive the real-time temperature and control the temperature adjustment module according to the received real-time temperature so that the temperature of the RF module is at the target temperature.

9. A quantum computing measurement and control system, characterized in that: It comprises a temperature control system and a radio frequency module as described in any one of claims 1 to 8, wherein the temperature control system enables the radio frequency module to output a radio frequency signal with a stable phase difference.

10. A quantum computer, characterized in that: It includes the quantum computing measurement and control system and quantum chip as described in claim 9, and the quantum chip performs quantum calculations based on the radio frequency signal output by the quantum computing measurement and control system.

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