Wafer automatic deviation correction rotary clamping device

Abstract

The utility model relates to the technical field of semiconductor wafers, and provides a wafer automatic deviation correction rotary clamping device, which comprises a hollow rotating shaft, a driving mechanism, a transmission mechanism and a carrying disc, and the carrying disc is provided with a clamping mechanism for clamping a wafer. The clamping mechanism comprises a plurality of limiting modules connected to the carrying disc in a sliding mode. The multiple limiting modules are arranged along the axis of the hollow rotating shaft in a circumferential array mode. The limiting module comprises a sliding block connected to the carrying disc in a sliding mode, a limiting column arranged on the sliding block and a deviation rectifying assembly arranged on the carrying disc. The top ends of the limiting columns are provided with protrusions, and the protrusions of the multiple limiting columns are matched to abut against the periphery of the wafer. And the deviation rectifying assembly is used for keeping the stress of the wafer uniform. The device is compact in structure and convenient to manufacture, can still keep the stability of clamping a wafer under high-speed rotation, can also realize multi-degree-of-freedom adjustment, and can realize actions such as automatic deviation correction, clamping, rotation, lifting and the like.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafers, in particular to an automatic wafer deviation-correcting rotating clamping device. Background Art

[0002] In the semiconductor wafer production process, wafers often need to be handled, transported, and processed. Accurate positioning and reliable fixation of wafers in these operations are crucial to ensure the economy and stability of subsequent processes. Improper operation may lead to various abnormalities in subsequent processes. However, there is currently a lack of devices on the market that have automatic correction, clamping, rotation, and lifting functions. When rotating at high speeds, if the rotating device lacks automatic correction function, the wafer rotation will be unstable. In addition, most of the devices on the market are bloated and require a lot of manual operation.

[0003] CN201310525986.X discloses a wafer holding table device for clamping wafers, comprising a telescopic cylinder, a connecting rod, a hollow shaft motor, a wafer holding table body and a movable post, wherein the wafer holding table body is connected to the output end of the hollow shaft motor, a wafer to be clamped is placed on the wafer holding table body, a plurality of movable posts are evenly hinged along the circumference of the wafer holding table body, one end of each movable post is connected to the telescopic cylinder through a connecting rod, and the other end of each movable post is a free end for clamping the wafer; the wafer holding table body drives the wafer to rotate through the hollow shaft motor, and the movable post rotates in the direction of the wafer through the drive of the telescopic cylinder, thereby clamping the wafer in a rotating state. The device realizes the opening and closing of the movable post by driving the connecting rod through the cylinder, realizes the clamping and releasing action of the wafer, and can not only realize clamping when the wafer is in a high-speed rotating state, but also can process the front and back sides of the wafer at the same time. However, due to its structural limitations, the use of a connecting rod structure to drive the movable blocking column to clamp the wafer is actually to use a cylinder to increase the force of clamping the wafer. This method may damage the wafer due to unstable pressure of the cylinder, which is particularly obvious under high-speed rotation, and the centrifugal force may cause the wafer to deviate from its position.

[0004] Based on this, the technical problem to be solved in this case is: how to solve the problem of unstable wafer clamping during high-speed rotation. Utility Model Content

[0005] In order to solve the above technical problems, the utility model provides a wafer automatic deviation correction and rotation clamping device, which has a compact structure and is easy to manufacture. It can still maintain the stability of the wafer under high-speed rotation, and can also achieve adjustment of multiple degrees of freedom, and can realize automatic deviation correction, clamping, rotation, lifting and other actions.

[0006] The technical solution of the utility model is:

[0007] A wafer automatic deflection correction rotary clamping device comprises a hollow rotating shaft, a driving mechanism and a transmission mechanism. The driving mechanism is connected to the transmission mechanism and is used to drive the hollow rotating shaft to rotate around its own axis. The wafer automatic deflection correction rotary clamping device also comprises a carrier coaxially arranged with the hollow rotating shaft, and the carrier is provided with a clamping mechanism for clamping the wafer; the clamping mechanism comprises a plurality of limit modules slidably connected to the carrier; the plurality of limit modules are arranged in a circular array along the axis of the hollow rotating shaft; the limit module comprises a slider slidably connected to the carrier, a limit column arranged on the slider, and a deflection correction component arranged on the carrier; the top of the limit column is provided with a protrusion, and the protrusions of the plurality of limit columns cooperate to press the outer periphery of the wafer; the deflection correction component is used to keep the force on the wafer uniform.

[0008] In the above-mentioned wafer automatic deviation correction and rotation clamping device, the deviation correction component includes a spring and an adjusting stud; one end of the spring is connected to the slider, and the other end of the spring is connected to the adjusting stud; the adjusting stud is arranged on the carrier and adjusted along the axial direction of the carrier.

[0009] In the above-mentioned wafer automatic deviation correction and rotation clamping device, the driving mechanism includes a motor, a driving wheel, and a driven wheel; the motor and the driving wheel are arranged away from the hollow rotating shaft; the driven wheel is sleeved on the hollow rotating shaft; the driving wheel and the driven wheel are connected by belt drive.

[0010] In the above-mentioned wafer automatic deviation correction and rotation clamping device, the transmission mechanism includes a first rolling bearing, an axial locking nut, a first duplex bearing, a second duplex bearing, and a second rolling bearing arranged in sequence; sleeves are provided between the axial locking nut and the first duplex bearing, and between the first duplex bearing and the second duplex bearing.

[0011] In the above-mentioned wafer automatic deviation correction and rotation clamping device, the first duplex bearings are paired duplex ball bearings.

[0012] In the above-mentioned wafer automatic deviation correction and rotation clamping device, the second duplex bearings are double-linked angular contact ball bearings in back-to-back pairs.

[0013] In the above-mentioned wafer automatic deviation correction and rotation clamping device, the transmission mechanism also includes a sealing assembly; the sealing assembly includes a protective shell and a sealing cover; the protective shell surrounds the rest of the transmission mechanism in a non-contact manner; the sealing cover is sleeved on the axis of the hollow rotating shaft and tightened against the protective shell.

[0014] In the above-mentioned wafer automatic deflection correction and rotary clamping device, the wafer automatic deflection correction and rotary clamping device also includes a lifting mechanism, which includes a lifting rod, a power module, and a locking module; the lifting rod is arranged in a hollow rotating shaft, and the top of the lifting rod is provided with a disc wedged with multiple sliders; the power module is used to drive the lifting rod to move up and down along the axis of the hollow rotating shaft; the locking module is fixed on an external fixed bracket and is used to limit the up and down movement distance of the lifting rod.

[0015] In the above-mentioned wafer automatic deviation correction and rotation clamping device, a bearing spacer is arranged between the lifting rod and the hollow rotating shaft.

[0016] In the above-mentioned wafer automatic deflection correction and rotation clamping device, the wafer automatic deflection correction and rotation clamping device also includes a lifting mechanism, and the lifting mechanism includes a fixed frame and a movable frame; the movable frame is slidably connected to the fixed frame; the driving mechanism, transmission mechanism, and lifting mechanism are all fixedly connected to the movable frame.

[0017] One of the above technical solutions of the utility model has at least one of the following advantages or beneficial effects:

[0018] The clamping mechanism of the utility model is composed of multiple limit modules, and the multiple limit modules can be adjusted independently. During use, they can cope with the problem of deviation of the hollow shaft. In addition to the function of clamping the wafer through the slider and the limit column, the limit module can also keep the force of the wafer uniform under high-speed rotation through the correction component, thereby improving the processing quality of the wafer. In addition, although the structural design of the utility model is simple, it has the characteristics of high transmission efficiency and good stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the internal structure of Example 1 of the utility model;

[0020] Figure 2 It is a top view of embodiment 1 of the utility model;

[0021] Figure 3 This is a schematic diagram of the operation of the lifting mechanism of Example 1 of the utility model. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] Example 1

[0024] See also Figures 1 to 3 , a wafer automatic deflection correction rotary clamping device, comprising a hollow shaft 1, a driving mechanism 2, and a transmission mechanism 3, wherein the driving mechanism 2 is transmission-connected to the transmission mechanism 3 and is used to drive the hollow shaft 1 to rotate around its own axis, the wafer automatic deflection correction rotary clamping device also includes a carrier 6 coaxially arranged with the hollow shaft 1, and the carrier 6 is provided with a clamping mechanism 4 for clamping the wafer; the clamping mechanism 4 includes 8 limit modules 41 slidably connected to the carrier 6; the 8 limit modules 41 are arranged in a circular array along the axis of the hollow shaft 1; the limit module 41 includes a slider 411 slidably connected to the carrier 6, a limit column 42 arranged on the slider 411, and a deflection correction component 43 arranged on the carrier 6; the top of the limit column 42 is provided with a protrusion 421, and the protrusions 421 of the 8 limit columns 42 cooperate to press the outer periphery of the wafer; the deflection correction component 43 is used to keep the force on the wafer uniform.

[0025] The clamping mechanism 4 of the present embodiment is composed of a plurality of limit modules 41, and the eight limit modules 41 can be independently adjusted, so as to cope with the problem of deviation of the hollow rotating shaft 1 during use. In addition to the function of clamping the wafer through the slider 411 and the limit column 42, the limit module 41 can also maintain uniform force on the wafer under high-speed rotation through the correction component 43, thereby improving the processing quality of the wafer. In addition, although the structural design of the present embodiment is simple, it has the characteristics of high transmission efficiency and good stability.

[0026] In this embodiment, specifically, the correction component 43 includes a spring 431 and an adjusting stud 432; one end of the spring 431 is connected to the slider 411, and the other end of the spring 431 is connected to the adjusting stud 432; the adjusting stud 432 is arranged on the carrier 6 and adjusted along the axial direction of the carrier 6.

[0027] More specifically, eight cover plates 61 are further disposed on the carrier plate 6 , and the slider 411 slides in the gaps between adjacent cover plates 61 .

[0028] Under the above-mentioned structural features, the staff changes the pressure of the spring 431 on the slider 411 by controlling the position of the adjusting stud 432. In actual work, the pressure should be changed by the properties of the wafer and is also related to the rotation speed of the processing technology. It can expand the application range of the device and enable the wafer to remain stably clamped under high-speed rotation.

[0029] As a preferred embodiment of the present invention, the driving mechanism 2 includes a motor 21, a driving wheel 22, and a driven wheel 23; the motor 21 and the driving wheel 22 are arranged away from the hollow rotating shaft 1; the driven wheel 23 is sleeved on the hollow rotating shaft 1; the driving wheel 22 and the driven wheel 23 are connected by belt drive.

[0030] The above-mentioned preference is a common technology in this field, so it will not be expanded too much. Of course, this embodiment adopts this driving mode to ensure the degree of synchronization of the transmission.

[0031] As another preferred embodiment of the present invention, the transmission mechanism 3 includes a first rolling bearing 31, an axial locking nut 32, a first duplex bearing 33, a second duplex bearing 34, and a second rolling bearing 35 arranged in sequence; a sleeve 36 is provided between the axial locking nut 32 and the first duplex bearing 33, and between the first duplex bearing 33 and the second duplex bearing 34.

[0032] Under the above-mentioned preference, each component of the transmission mechanism 3 can ensure the rigidity and strength of the device during high-speed rotation operation.

[0033] In a further preferred embodiment, the first duplex bearings 33 are paired duplex ball bearings.

[0034] In a further preferred embodiment, the second duplex bearings 34 are back-to-back duplex angular contact ball bearings.

[0035] The above design can bear radial loads and axial loads in two directions, and the distance between the action points is large, which can increase the moment load.

[0036] In this embodiment, in order to protect the transmission mechanism 3 and extend its service life, the transmission mechanism 3 also includes a sealing assembly 37; the sealing assembly 37 includes a protective shell 371 and a sealing cover 372; the protective shell 371 surrounds the rest of the transmission mechanism 3 in a non-contact manner; the sealing cover 372 is sleeved on the axis of the hollow shaft 1 and is tightened against the protective shell 371.

[0037] It should be noted that this embodiment only provides one protection method, and there are other sealing methods in the technical field.

[0038] In actual application, the wafer automatic deviation correction and rotation clamping device also includes a lifting mechanism 5, which includes a lifting rod 51, a power module 52, and a locking module 53; the lifting rod 51 is arranged in the hollow rotating shaft 1, and the top of the lifting rod 51 is provided with a disc 54 wedged with multiple sliders 411; the power module 52 is used to drive the lifting rod 51 to move up and down along the axis of the hollow rotating shaft 1; the locking module 53 is fixed on the external fixed bracket and is used to limit the up and down movement distance of the lifting rod 51.

[0039] In this embodiment, a limit nut 511 is provided on the lifting rod 51, and the moving distance of the limit nut 511 is limited in the locking module 53, thereby achieving the purpose of limiting the up and down movement distance of the lifting rod 51. In actual work, when the lifting rod 51 moves upward under the drive of the power module 52, the multiple sliders 411 of the disc 54 are wedged to cause the slider 411 to move away from the center of the circle, thereby releasing the workpiece. Conversely, when the lifting rod 51 moves downward, it returns to the state of clamping the workpiece.

[0040] In order to limit the influence of the hollow rotating shaft 1 on the lifting mechanism 5 through the bearing, a bearing spacer 55 is arranged between the lifting rod 51 and the hollow rotating shaft 1 .

[0041] In this embodiment, reference Figure 3 The wafer automatic deviation correction and rotation clamping device also includes a lifting mechanism 7, which includes a fixed frame 71 and a movable frame 72; the movable frame 72 is slidably connected to the fixed frame 71; the driving mechanism 2, the transmission mechanism 3, and the lifting mechanism 5 are all fixedly connected to the movable frame 72.

[0042] The purpose of the above design is to increase the degree of freedom of the device so that the device can move forward and backward along the axis of the hollow shaft 1, and the side entry expands the application range of the device.

[0043] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A wafer automatic deflection correction rotating clamping device, comprising a hollow shaft, a driving mechanism, and a transmission mechanism, wherein the driving mechanism is connected to the transmission mechanism and is used to drive the hollow shaft to rotate around its own axis, characterized in that: The wafer automatic deviation-correcting rotating clamping device also includes a carrier coaxially arranged with the hollow rotating shaft, and a clamping mechanism for clamping the wafer is provided on the carrier; the clamping mechanism includes a plurality of limit modules slidably connected to the carrier; the plurality of limit modules are arranged in a circular array along the axis of the hollow rotating shaft; the limit module includes a slider slidably connected to the carrier, a limit column arranged on the slider, and a deviation-correcting assembly arranged on the carrier; a protrusion is provided on the top of the limit column, and the protrusions of the plurality of limit columns cooperate to tighten the outer circumference of the wafer; the deviation-correcting assembly is used to keep the force on the wafer uniform.

2. The wafer automatic deflection correction rotating clamping device according to claim 1 is characterized in that: The deviation correction component comprises a spring and an adjusting stud; one end of the spring is connected to the slider, and the other end of the spring is connected to the adjusting stud; the adjusting stud is arranged on the carrier and is adjusted along the axial direction of the carrier.

3. The wafer automatic deflection correction rotating clamping device according to claim 1 is characterized in that: The driving mechanism comprises a motor, a driving wheel and a driven wheel; the motor and the driving wheel are arranged away from the hollow rotating shaft; the driven wheel is sleeved on the hollow rotating shaft; the driving wheel and the driven wheel are connected by belt transmission.

4. The wafer automatic deflection correction rotating clamping device according to claim 1, characterized in that: The transmission mechanism comprises a first rolling bearing, an axial locking nut, a first duplex bearing, a second duplex bearing and a second rolling bearing which are arranged in sequence; a sleeve is provided between the axial locking nut and the first duplex bearing and between the first duplex bearing and the second duplex bearing.

5. The wafer automatic deflection correction rotating clamping device according to claim 4 is characterized in that: The first duplex bearings are paired duplex ball bearings.

6. The wafer automatic deflection correction rotating clamping device according to claim 4, characterized in that: The second duplex bearings are duplex angular contact ball bearings in back-to-back pairs.

7. The wafer automatic deflection correction rotating clamping device according to claim 4 is characterized in that: The transmission mechanism also includes a sealing component; the sealing component includes a protective shell and a sealing cover; the protective shell surrounds the rest of the transmission mechanism in a non-contact manner; the sealing cover is sleeved on the axis of the hollow shaft and is tightly pressed against the protective shell.

8. The wafer automatic deflection correction rotating clamping device according to claim 1, characterized in that: The wafer automatic deviation correction and rotation clamping device also includes a lifting mechanism, which includes a lifting rod, a power module, and a locking module; the lifting rod is arranged in a hollow rotating shaft, and a disc wedged with multiple sliders is provided on the top of the lifting rod; the power module is used to drive the lifting rod to move up and down along the axis of the hollow rotating shaft; the locking module is fixed on an external fixed bracket and is used to limit the up and down movement distance of the lifting rod.

9. The wafer automatic deflection correction rotating clamping device according to claim 8, characterized in that: A bearing spacer is arranged between the lifting rod and the hollow rotating shaft.

10. The wafer automatic deflection correction rotating clamping device according to claim 9, characterized in that: The wafer automatic deflection correction and rotation clamping device also includes a lifting mechanism, which includes a fixed frame and a movable frame; the movable frame is slidably connected to the fixed frame; the driving mechanism, transmission mechanism, and lifting mechanism are all fixedly connected to the movable frame.

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