Chip radiator compatible with natural cooling system and multi-fan radiating system

Abstract

The utility model discloses a chip radiator compatible with natural cooling and a multi-fan heat radiation system, which comprises a heat radiation shell, a natural heat radiation structure and a multi-fan heat radiation system are respectively arranged on the heat radiation shell, the natural heat radiation structure is used for radiating heat through natural air convection under a low-power working condition, and the multi-fan heat radiation system is used for radiating heat through natural air convection under a low-power working condition. The multi-fan heat dissipation system is used for conducting heat dissipation through active air supply under the medium-high power working condition and the maximum power working condition, and the natural heat dissipation structure comprises a first groove formed in one side of the upper surface of the heat dissipation shell and a third groove formed in the other side of the upper surface of the heat dissipation shell. The heat dissipation module can be compatible with natural heat dissipation or multi-mode fan heat dissipation, facilitates flexible heat dissipation according to different intensity power working conditions, is good in heat dissipation effect and high in reliability, can meet heat dissipation power curves in different heat dissipation modes, achieves rapid upgrading and iteration of different power chips, shortens product development time, and improves product development efficiency. And meanwhile, energy is saved to a certain extent through selection of multiple heat dissipation modes.

Description

Technical Field

[0001] The utility model relates to the technical field of chip radiators, in particular to a chip radiator compatible with natural cooling and multi-fan heat dissipation systems. Background Art

[0002] Currently, the power of chips is getting higher and higher, and the working power can be adjusted under different working conditions. From the perspective of energy saving, it is necessary to be able to independently select the heat dissipation method under different working powers.

[0003] Currently, most similar products use natural cooling without fans, which results in high chip temperature when operating in high-power mode. The system automatically reduces the workload, and the high temperature increases the chip resistance and energy loss. Utility Model Content

[0004] The purpose of the utility model is to provide a chip heat sink compatible with natural cooling and multi-fan heat dissipation systems to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A chip heat sink compatible with natural cooling and a multi-fan heat dissipation system comprises a heat dissipation shell, on which a natural heat dissipation structure and a multi-fan heat dissipation system are respectively arranged. The natural heat dissipation structure is used to dissipate heat by natural air convection under low power conditions, and the multi-fan heat dissipation system is used to dissipate heat by active air supply under medium and high power conditions and maximum power conditions.

[0007] As a further solution of the utility model: the natural heat dissipation structure includes a first groove arranged on one side of the upper surface of the heat dissipation shell, and a third groove located on the other side of the upper surface of the heat dissipation shell, and the first groove is provided with a plurality of first heat dissipation fins distributed at equal intervals, and the third groove is provided with a plurality of third heat dissipation fins distributed at equal intervals.

[0008] As a further solution of the utility model: the multi-fan cooling system includes two groups of vertical fan cooling structures and one group of horizontal fan cooling structures, the horizontal fan cooling structure and one of the vertical fan cooling structures are located in the same cooling channel, and the other vertical fan cooling structure is located on the back of the cooling shell.

[0009] As a further solution of the utility model: the vertical fan heat dissipation structure includes a first vertical fan and a second vertical fan, the upper surface of the heat dissipation shell is provided with a second groove on one side of the first groove, the upper surface of the second groove is provided with a plurality of second heat dissipation fins distributed at equal intervals, the first vertical fan is arranged at the front end of the second heat dissipation fins and is fixedly connected to the bottom inner wall of the second groove, the bottom of the heat dissipation shell is provided with a fourth groove away from one end of the first groove, a plurality of fourth heat dissipation fins distributed at equal intervals are arranged in the fourth groove, a rectangular opening is provided on the surface of the fourth heat dissipation fins, and the second vertical fan is installed at the rectangular opening.

[0010] As a further solution of the utility model: the horizontal fan heat dissipation structure includes a horizontal fan, the upper surface of the second heat dissipation fin teeth is provided with a circular opening, and the horizontal fan is installed inside the circular opening.

[0011] As a further solution of the utility model: a cover plate is arranged on the front side of the heat dissipation shell, and a chip heating surface in contact with the chip is arranged at the bottom of the heat dissipation shell at the bottom of the second groove.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] The utility model is compatible with natural heat dissipation or multi-mode fan heat dissipation, which is convenient for flexible heat dissipation according to different intensity power conditions. It not only has good heat dissipation effect and strong reliability, but also can meet the heat dissipation power curve under different heat dissipation modes, realize the rapid upgrade and iteration of different power chips, shorten product development time, and save energy to a certain extent through the selection of multiple heat dissipation modes. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 The schematic diagram is a structural diagram of a chip heat sink that is compatible with natural cooling and multi-fan cooling systems.

[0015] Figure 2 The present invention is a schematic diagram of the water level structure of the heat dissipation shell in a chip heat sink that is compatible with natural cooling and multi-fan heat dissipation systems.

[0016] Figure 3 The schematic diagram of the structure from another perspective of the heat dissipation shell in a chip heat sink that is compatible with natural cooling and multi-fan heat dissipation systems.

[0017] In the figure: 1. heat dissipation shell; 2. natural heat dissipation structure; 3. multi-fan heat dissipation system; 4. cover plate; 5. first groove; 6. first heat dissipation fin; 7. second groove; 8. second heat dissipation fin; 9. third groove; 10. third heat dissipation fin; 11. fourth groove; 12. fourth heat dissipation fin; 13. first vertical fan; 14. circular opening; 15. horizontal fan; 16. rectangular opening; 17. second vertical fan; 18. chip heating surface. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] See also Figures 1 to 3 In an embodiment of the utility model, a chip heat sink compatible with natural cooling and multi-fan heat dissipation systems includes a heat dissipation shell 1, which is made of an aluminum profile. A natural heat dissipation structure 2 and a multi-fan heat dissipation system 3 are respectively arranged on the heat dissipation shell 1. The natural heat dissipation structure 2 is used to dissipate heat through natural air convection under low power conditions. The natural heat dissipation structure 2 includes a first groove 5 arranged on one side of the upper surface of the heat dissipation shell 1, and a third groove 9 located on the other side of the upper surface of the heat dissipation shell 1. A plurality of first heat dissipation fins 6 distributed at equal intervals are arranged in the first groove 5, and a plurality of third heat dissipation fins 10 distributed at equal intervals are arranged in the third groove 9. Under medium power conditions, the heat on the chip is brought to the surrounding air through air convection by relying on the first heat dissipation fins 6 and the third heat dissipation fins 10 on the aluminum profile, ensuring that the maximum temperature of the aluminum heat dissipation shell and the ambient temperature have a contrast difference of less than 20°C.

[0020] The multi-fan cooling system 3 is used for cooling by active air supply under medium and high power conditions and maximum power conditions. The multi-fan cooling system 3 includes two groups of vertical fan cooling structures and one group of horizontal fan cooling structures. The horizontal fan cooling structure and one of the vertical fan cooling structures are in the same cooling channel. The other vertical fan cooling structure is on the back of the cooling shell 1. The vertical fan cooling structure includes a first vertical fan 13 and a second vertical fan 17. The upper surface of the cooling shell 1 is provided with a second groove 7 on one side of the first groove 5. The upper surface of the second groove 7 is provided with a plurality of second cooling fins 8 distributed at equal intervals. The first vertical fan 13 is provided at the front end of the second cooling fins 8 and is fixedly connected to the bottom inner wall of the second groove 7. The bottom of the cooling shell 1 away from the first groove 5 is provided with a fourth groove 11. The fourth groove 11 is provided with a plurality of fourth cooling fins 12 distributed at equal intervals. The surface of the fourth cooling fins 12 is provided with a rectangular opening 16. The fan 17 is installed at the rectangular opening 16. Under medium and high power conditions, a single vertical variable frequency speed-regulating fan is used to accelerate the air flow of the second heat dissipation fins 8 and the fourth heat dissipation fins 12, and the heat on the aluminum heat dissipation shell is quickly convected to the air, so that even under medium and high power conditions, the maximum temperature of the aluminum heat dissipation shell and the ambient temperature difference are still maintained at less than 20°C. A top cover plate (not shown) is provided at the top of the second groove 7. The top cover plate, the second heat dissipation fins 8 and the heat dissipation shell 1 form an air duct of the fan. A certain wind pressure is formed in the fin channel through the air volume of the fan, and the heat of the heat dissipation fins is quickly driven into the airflow of the fan. The horizontal fan heat dissipation structure includes a horizontal fan 15. The upper surface of the second heat dissipation fin 8 is provided with a circular opening 14. The horizontal fan 15 is installed inside the circular opening 14. Under maximum power conditions, the turbulence of the airflow is accelerated by the combination of the vertical fan and the horizontal fan, and the heat of the chip and the heat dissipation aluminum shell is quickly transferred to the environment through air convection.

[0021] A cover plate 4 is disposed on the front side of the heat dissipation housing 1 , and a chip heating surface 18 in contact with the chip is disposed at the bottom of the heat dissipation housing 1 at the bottom of the second groove 7 .

[0022] The working principle of the utility model is:

[0023] The utility model pre-sets three fan positions in an aluminum shell with natural heat dissipation, and can meet the heat dissipation power curve under different heat dissipation modes, thereby realizing rapid upgrade and iteration of different power chips, shortening product development time, and saving energy to a certain extent through the selection of multiple heat dissipation modes.

[0024] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A chip heat sink compatible with natural cooling and multi-fan cooling system, characterized in that: It comprises a heat dissipation shell (1), on which a natural heat dissipation structure (2) and a multi-fan heat dissipation system (3) are respectively arranged; wherein: The natural heat dissipation structure (2) is used to dissipate heat through natural air convection under low power conditions; The multi-fan heat dissipation system (3) is used to dissipate heat by actively supplying air under medium-high power conditions and maximum power conditions; The natural heat dissipation structure (2) comprises a first groove (5) arranged on one side of the upper surface of the heat dissipation shell (1), wherein a plurality of first heat dissipation fins (6) distributed at equal intervals are arranged in the first groove (5); The multi-fan heat dissipation system (3) comprises two sets of vertical fan heat dissipation structures and one set of horizontal fan heat dissipation structure; wherein: The horizontal fan heat dissipation structure and one of the vertical fan heat dissipation structures are located in the same heat dissipation channel, and the other vertical fan heat dissipation structure is located at the back of the heat dissipation shell (1).

2. A chip heat sink compatible with natural cooling and multi-fan cooling system according to claim 1, characterized in that: The vertical fan heat dissipation structure comprises a first vertical fan (13) and a second vertical fan (17); the upper surface of the heat dissipation shell (1) is provided with a second groove (7) located on one side of the first groove (5); the upper surface of the second groove (7) is provided with a plurality of second heat dissipation fins (8) distributed at equal intervals; the first vertical fan (13) is arranged at the front end of the second heat dissipation fins (8) and is fixedly connected to the bottom inner wall of the second groove (7); the bottom of the heat dissipation shell (1) away from the first groove (5) is provided with a fourth groove (11); a plurality of fourth heat dissipation fins (12) distributed at equal intervals are provided in the fourth groove (11); a rectangular opening (16) is provided on the surface of the fourth heat dissipation fins (12); and the second vertical fan (17) is installed at the rectangular opening (16).

3. The chip heat sink compatible with natural cooling and multi-fan cooling system according to claim 2, characterized in that: The horizontal fan heat dissipation structure comprises a horizontal fan (15); the upper surface of the second heat dissipation fin teeth (8) is provided with a circular opening (14); and the horizontal fan (15) is installed inside the circular opening (14).

4. The chip heat sink compatible with natural cooling and multi-fan cooling system according to claim 2, characterized in that: A cover plate (4) is provided on the front side of the heat dissipation shell (1), and a chip heating surface (18) in contact with the chip is provided at the bottom of the heat dissipation shell (1) located at the bottom of the second groove (7).

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