Multi-motor variable frequency driving device

Abstract

The utility model provides a multi-motor variable frequency driving device. The multi-motor variable-frequency driving device comprises a multi-layer printed circuit board which comprises a first wiring layer and a second wiring layer and is provided with a first side and a second side which are adjacent to each other and a third side and a fourth side which are adjacent to each other; the input rectification module is arranged at a position close to the first side; the PFC module is arranged at a position close to the second side and is connected with the input rectification module through a second wiring layer; the flat wave module is arranged at a position far away from the input rectification module and close to the second side, and is connected with the PFC module through a first wiring layer and a second wiring layer; and the plurality of driving modules are arranged at positions close to the input rectification module and the fourth side, and are connected with the flat wave module through the second wiring layer. The multi-motor variable frequency driving device designed by the scheme of the utility model can greatly reduce the space occupied by electric control, can also reduce the wiring harness connection and communication interference between boards, and reduces the production difficulty.

Description

Technical Field

[0001] The utility model relates to the technical field of circuits, in particular to a multi-motor variable frequency drive device. Background Art

[0002] Frequency conversion equipment has been widely used in the field of household appliances, especially in the field of air conditioning. "Frequency conversion air conditioner" has become the main energy-saving force in the air conditioning industry. The models of air conditioner outdoor units are mainly single-fan models and dual-fan models. For these two models, the current mainstream solutions in the market are: compressor drive board + independent fan drive board, that is, the physical combination of a single drive board. This solution has a large number of frequency conversion modules. Since each drive board must communicate with the main control board, there are many communication lines and they are susceptible to interference; the increase in connecting harnesses makes production difficult, inefficient, and difficult to maintain; the fan drive board needs to add a heat sink on the front, and the heat is retained inside the box, which increases the difficulty of box heat dissipation and affects the overall heat dissipation effect. Moreover, the external inductors and independent fan boards currently used in the market are difficult to achieve miniaturization and lightweight development of the electric control box. Utility Model Content

[0003] One purpose of the utility model is to provide a multi-motor variable frequency drive device.

[0004] A further purpose of the utility model is to significantly reduce the space occupied by the electric control and realize the miniaturization design of the electric control box.

[0005] A further purpose of the utility model is to reduce the wiring harness connection and communication interference between boards and reduce the production difficulty.

[0006] In particular, the utility model provides a multi-motor variable frequency drive device, comprising:

[0007] A multilayer printed circuit board comprises a first wiring layer and a second wiring layer, and has a first side and a second side adjacent to each other and a third side and a fourth side adjacent to each other, wherein the third side is opposite to the first side and the fourth side is opposite to the second side;

[0008] An input rectifier module is disposed near the first side and configured to convert an input AC signal into a DC signal;

[0009] A PFC module is arranged at a position close to the second side, connected to the input rectifier module through the second wiring layer, and configured to receive a DC signal from the input rectifier module and convert the DC signal into a PFC voltage signal;

[0010] The smoothing module is arranged at a position far away from the input rectifier module and close to the second side, connected to the PFC module through the first wiring layer and the second wiring layer respectively, and configured to receive the PFC voltage signal from the PFC module;

[0011] A plurality of driving modules are arranged near the input rectifier module and near the fourth side, connected to the smoothing module through the second wiring layer, and configured to use the output signal of the smoothing module to drive the respective motors.

[0012] Optionally, a communication control module is further included, which is arranged near the smoothing module and the driving module and near the third side, and is connected to the smoothing module through the first wiring layer and the second wiring layer respectively.

[0013] Optionally, the input rectifier module includes:

[0014] A power input port is arranged near the angle between the first side and the fourth side;

[0015] A filter component is disposed at a position close to the first side and connected to the power input port through the first wiring layer, and is configured to filter the AC signal emitted by the power input port;

[0016] The relay is arranged at a position close to the first side and connected to the filter component through the first wiring layer;

[0017] The rectifier bridge is arranged near the relay and is respectively connected to the filter component and the relay through the first wiring layer.

[0018] Optionally, the PFC module includes:

[0019] A high-frequency inductor is arranged at an angle between the first side and the second side and is connected to the rectifier bridge through the second wiring layer;

[0020] The power switch device is arranged at a position close to the second side and is connected to the high-frequency inductor through the first wiring layer and the second wiring layer respectively.

[0021] Optionally, the plurality of driver modules include:

[0022] Two fan drives are arranged between the input rectifier module and the communication control module and close to the edge of the fourth side of the multilayer printed circuit board;

[0023] The compressor drive is arranged between the input rectifier module and the communication control module, and is close to the positions of the two fan drives.

[0024] Optionally, the wave smoothing module includes:

[0025] A first electrolytic capacitor is arranged at a position close to the PFC module and close to the second side, connected to the compressor driver through the first output port on the second routing layer, connected to the two fan drivers through the second output ports on the second routing layer, connected to the compressor driver and the two fan drivers through the grounding ports on the second routing layer, and the grounding port is arranged between the first output port and the second output port;

[0026] The second electrolytic capacitor is arranged at a position close to the communication control module and close to the second side, and is connected to the communication control module through the first wiring layer and the second wiring layer respectively.

[0027] Optionally, the communication control module includes:

[0028] A switching power supply is arranged at a position close to the second electrolytic capacitor and close to the third side, and is connected to the second electrolytic capacitor through the first wiring layer and the second wiring layer respectively;

[0029] A communication component is arranged at a position close to the angle between the third side and the fourth side;

[0030] The MCU is arranged between the switching power supply and the communication component and close to the third side, and is connected to the communication component through the second wiring layer.

[0031] Optionally, the switching power supply comprises:

[0032] The first weak current power supply pin is connected to the MCU through the second wiring layer;

[0033] The second weak current power supply pin is connected to the power switch device through the first wiring layer;

[0034] The third weak-current power supply pin is arranged between the first weak-current power supply pin and the second weak-current power supply pin, and is respectively connected to the compressor drive and two fan drives after reaching the first routing layer through preset vias on the second routing layer. The preset vias are arranged between the compressor drive and the MCU.

[0035] Optionally, the MCU is connected to the power switch device through the first wiring layer, and is configured to send a driving signal to the power switch device and receive a sampling signal from the power switch device.

[0036] Optionally, the MCU is respectively connected to the press drive and the two fan drives through the first routing layer, and is configured to send drive signals to the press drive and the two fan drives and receive sampling signals from the press drive and the two fan drives.

[0037] The utility model discloses a multi-motor variable frequency drive device, comprising a multi-layer printed circuit board, comprising a first wiring layer and a second wiring layer, and having adjacent first and second sides and adjacent third and fourth sides, wherein the third side is opposite to the first side, and the fourth side is opposite to the second side; an input rectifier module, arranged at a position close to the first side, and configured to convert an input AC signal into a DC signal; a PFC module, arranged at a position close to the second side, connected to the input rectifier module through the second wiring layer, configured to receive a DC signal from the input rectifier module, and convert the DC signal into a PFC voltage signal; a smoothing module, arranged at a position away from the input rectifier module and close to the second side, connected to the PFC module through the first wiring layer and the second wiring layer, respectively, and configured to receive a PFC voltage signal from the PFC module; and a plurality of drive modules, arranged at a position close to the input rectifier module and close to the fourth side, connected to the smoothing module through the second wiring layer, and configured to use the output signal of the smoothing module to drive their respective motors. The multi-motor variable frequency drive device designed in this way can significantly reduce the space occupied by the electronic control, realize the miniaturization design of the electronic control box, and also reduce the wiring harness connection and communication interference between boards, thereby reducing the difficulty of production.

[0038] Based on the detailed description of the specific embodiments of the present invention in combination with the accompanying drawings below, those skilled in the art will become more aware of the above and other purposes, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0040] Figure 1 It is a schematic diagram of the overall layout of a multi-motor variable frequency drive device according to an embodiment of the utility model.

[0041] Figure 2 It is a schematic diagram of the layout scheme of the first wiring layer of a multi-motor variable frequency drive device according to an embodiment of the utility model.

[0042] Figure 3 It is a schematic diagram of the layout scheme of the second wiring layer of a multi-motor variable frequency drive device according to an embodiment of the utility model. DETAILED DESCRIPTION

[0043] It should be understood by those skilled in the art that the embodiments described below are only a part of the embodiments of the present invention, rather than all the embodiments of the present invention, and the embodiments are intended to explain the technical principles of the present invention, rather than to limit the protection scope of the present invention. Based on the embodiments provided by the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should still fall within the protection scope of the present invention.

[0044] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "upper", "lower", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0045] Furthermore, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, an indirect connection through an intermediate medium, or the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0046] Figure 1 1 is a schematic diagram of the overall layout of a multi-motor variable frequency drive device according to an embodiment of the utility model. In order to more clearly illustrate the positional relationship of different components in this embodiment, the directions shown by the arrows outside the box are specially set, and those skilled in the art can adjust them according to actual conditions while ensuring that the relative positional relationship of each component in the multi-motor variable frequency drive device 100 remains unchanged.

[0047] In the multi-motor variable frequency drive device 100 of the present embodiment, it can generally include: an input rectifier module 110, a PFC module 120, a smoothing module 130, multiple drive modules 140 and a communication control module 150, which are jointly arranged in a multi-layer printed circuit board and integratedly designed, so that a single chip can drive a compressor and two fans at the same time, and can greatly reduce the space occupied by the electronic control, realize the miniaturization design of the electronic control box, reduce the connection of wire harnesses between boards and communication interference, reduce the difficulty of production, improve production efficiency, and facilitate after-sales maintenance.

[0048] Specifically, the multilayer printed circuit board includes a first wiring layer and a second wiring layer, and has adjacent first and second sides and adjacent third and fourth sides, wherein the third side is opposite to the first side, and the fourth side is opposite to the second side.

[0049] In some optional embodiments, a printed circuit board (PCB) is a type of circuit board widely used in the electronics industry. It achieves a higher component density and more complex wiring capabilities than single-layer or double-layer circuit boards by stacking multiple conductive layers and insulating layers together. The design of a multilayer board allows more functions to be integrated in a limited space, and is suitable for complex electronic devices that require advanced interconnection and signal integrity control. In this embodiment, two layers of a multilayer printed circuit board are selected to apply the layout scheme of the utility model. The specific number of layers of the multilayer printed circuit board is not specifically limited, as long as there are a first routing layer and a second routing layer. Those skilled in the art can determine the specific number of layers of the printed circuit board according to actual conditions.

[0050] The high-voltage part generally includes: an input rectifier module 110 , a PFC module 120 , a smoothing module 130 and a plurality of drive modules 140 .

[0051] The input rectifier module 110 is generally disposed near the first side and is configured to convert an input AC signal into a DC signal.

[0052] In some optional embodiments, the input rectifier module 110 may generally include: a power input port 111, which is arranged at the angle between the first side and the fourth side; a filter component 112, which is arranged at a position close to the first side and connected to the power input port 111 through the first wiring layer, and is configured to filter the AC signal emitted by the power input port 111; a relay 113, which is arranged at a position close to the first side and connected to the filter component 112 through the first wiring layer; a rectifier bridge 114, which is arranged at a position close to the relay 113 and connected to the filter component 112 and the relay 113 through the first wiring layer. Among them, the power input port 111 is generally used to input two AC signals, and the filter component 112 is connected adjacent to it, and its main function is to allow signals within a specific frequency range to pass through, while suppressing or greatly attenuating (or completely blocking) other frequency components. The relay 113 and the rectifier bridge 114 are connected adjacent to the filter component 112, wherein the rectifier bridge 114 is arranged on the side of the relay 113 opposite to the first side, and its main function is to convert the AC signal input from the power input port 111 into a DC signal. Compared with other components in the input rectifier module 110, such as Figure 3As shown, the rectifier bridge 114 is connected to the PFC module 120 through the second wiring layer to avoid signal interference.

[0053] The PFC module 120 is generally disposed near the second side, connected to the input rectifier module 110 through the second wiring layer, and configured to receive a DC signal from the input rectifier module 110 and convert the DC signal into a PFC voltage signal.

[0054] In some optional embodiments, the PFC module 120 may generally include: a high-frequency inductor 121, which is arranged at an angle between the first side and the second side and connected to the rectifier bridge 114 through the second wiring layer; a power switch device 122, which is arranged at a position close to the second side and connected to the high-frequency inductor 121 through the first wiring layer and the second wiring layer. Figure 1 As shown, the high-frequency inductor 121 is arranged on the left side of the input rectifier module 110, and the power switch device 122 is arranged below the high-frequency inductor 121. Among them, the high-frequency inductor 121 is generally arranged at the angle close to the first side and the second side, and is mainly used to process and control the AC current of the high-frequency signal, and the power switch device 122 is generally adjacent to the high-frequency inductor 121 and close to the second side. The power switch device 122 can generally include an IGBT (Insulated Gate Bipolar Transistor, insulated gate bipolar transistor, referred to as IGBT) and a FRD (Fast Recovery Diode, fast recovery diode, referred to as FRD), and the above devices can be used to realize the output rectification of the inverter in the high-frequency circuit of the utility model. Those skilled in the art can select the specific device of the power switch device 122 according to actual conditions.

[0055] The smoothing module 130 is generally arranged at a position far away from the input rectifier module 110 and close to the second side, and is connected to the PFC module 120 through the first wiring layer and the second wiring layer respectively, and is configured to receive the PFC voltage signal from the PFC module 120. The smoothing module 130 is generally used to stabilize the current or voltage in the circuit. In this embodiment, after receiving the PFC voltage signal from the PFC module 120, it controls it, thereby stabilizing the output of the inverter.

[0056] The plurality of driving modules 140 are generally arranged near the input rectifier module 110 and near the fourth side, connected to the smoothing module 130 through the second wiring layer, and configured to use the output signal of the smoothing module 130 to drive their respective motors.

[0057] In some optional embodiments, the plurality of drive modules 140 may generally include: two fan drives, which are arranged between the input rectifier module 110 and the communication control module 150 and close to the edge of the board on the fourth side of the multilayer printed circuit board; and a press drive 143, which is arranged between the input rectifier module 110 and the communication control module 150 and close to the positions of the two fan drives. In some optional embodiments, the two fan drives may be divided into an upper fan drive 141 and a lower fan drive 142, and are arranged sequentially from top to bottom on the edge of the board on the fourth side.

[0058] The smoothing module 130 may generally include: a first electrolytic capacitor 131, which is arranged near the PFC module 120 and near the second side, connected to the compressor driver 143 through the first output port on the second routing layer, respectively connected to the two fan drivers through the second output ports on the second routing layer, respectively connected to the compressor driver 143 and the two fan drivers through the grounding port on the second routing layer, and the grounding port is arranged between the first output port and the second output port; a second electrolytic capacitor 132, which is arranged near the communication control module 150 and near the second side, and respectively connected to the communication control module 150 through the first routing layer and the second routing layer. Figure 1 As shown, on the right side of the first electrolytic capacitor 131, from top to bottom, there are the first output port, the ground port, and the second output port. The first electrolytic capacitor 131 is selected to separate the first output port and the second output port from the compressor drive 143 and the fan drive to avoid affecting the fan when the compressor is turned on, and placing the fan drive at the edge of the board can avoid the power ground, thereby reducing the interference between the two. In addition, the ground port is also in the second wiring layer and is set between the first output port and the second output port. The path of the ground wire is cleverly used to isolate the power lines of the compressor and the fan, and the interference between the first output port and the second output port can be isolated at the same time during the subsequent connection and use.

[0059] The weak current part generally includes: a communication control module 150, which is arranged near the smoothing module 130 and the driving module 140 and near the third side, and is connected to the smoothing module 130 through the first wiring layer and the second wiring layer respectively.

[0060] The communication control module 150 may generally include: a switching power supply 151, which is arranged near the second electrolytic capacitor 132 and near the third side, and is connected to the second electrolytic capacitor 132 through the first routing layer and the second routing layer respectively; a communication component 153, which is arranged near the angle between the third side and the fourth side; and an MCU 152, which is arranged between the switching power supply 151 and the communication component 153 and near the third side, and is connected to the communication component 153 through the second routing layer. The communication component 153 is arranged at the angle position to avoid interference from strong electric signals, and the first routing layer around the MCU 152 is all signal lines, so the MCU 152 and the communication component 153 are routed in the second routing layer to avoid communication failures caused by interference of the communication component 153.

[0061] Among them, the switching power supply 151 can generally include: a first weak power supply pin, connected to the MCU152 through the second wiring layer; a second weak power supply pin, connected to the power switch device 122 through the first wiring layer; a third weak power supply pin, arranged between the first weak power supply pin and the second weak power supply pin, and connected to the compressor drive 143 and two fan drives respectively after the second wiring layer reaches the first wiring layer through the preset via hole, and the preset via hole is arranged between the compressor drive 143 and the MCU152. In this embodiment, the three ports from bottom to top on the right side of the switching power supply 151 are respectively the first weak power supply pin, the third weak power supply pin and the second weak power supply pin. Due to the integrated layout design of the utility model, and most of them are strong electric signals, weak electric signals are more susceptible to interference. Therefore, in the switching power supply 151 part, it is selected to separate the driving power supplies of the power switch device 122 and the multiple driving modules 140 for wiring connection, so as to avoid mutual interference between the compressor side and the fan side of the multiple driving modules 140 when the PFC module 120 is turned on.

[0062] In some optional embodiments, specific measures to avoid mutual interference may be that when the power switching device 122 is an IGBT, a 15V power supply can be selected to be led out from the second weak-current power supply pin through the first routing layer and connected to the IGBT gate drive circuit; at the same time, a 15V power supply can be selected to be led out from the third weak-current power supply pin through the second routing layer and reach the first routing layer through a preset via and then connected to the compressor drive 143 and the two fan drives respectively, thereby avoiding mutual interference between the two.

[0063] In addition, in addition to the power signal, the most important are the drive signal and the sampling signal. Therefore, in some optional embodiments, a double interlaced method is adopted, and the MCU152 is connected to the power switch device 122 through the first wiring layer, and is configured to send a drive signal to the power switch device 122 and receive a sampling signal from the power switch device 122. In this way, interference with strong electric signals can be avoided. In the layout scheme of this embodiment, the right side of the power switch device 122 is viewed from bottom to top: the first line represents the 15V power line of the switching power supply 151 and the PFC module 120; the second line represents the line used by the power switch device 122 to send the sampling signal ADC1 (Analog-to-Digital Converter, analog-to-digital conversion, referred to as ADC) to the MCU152; the third line represents the line used by the power switch device 122 to send the sampling signal ADC2 to the MCU152; the fourth line represents the line used by the MCU152 to send the drive signal P1 to the power switch device 122; the fifth line represents the line used by the MCU152 to send the drive signal P2 to the power switch device 122.

[0064] Similarly, MCU152 is connected to the compressor driver 143 and the two fan drivers through the first wiring layer, and is configured to send drive signals to the compressor driver 143 and the two fan drivers and receive sampling signals from the compressor driver 143 and the two fan drivers. In some optional embodiments, the specific layout scheme for signal communication can be as follows: Figure 1 As shown, the specific layout of MCU152 and press driver 143 from left to right along the bottom of press driver 143 are: the first is the line where the switching power supply 151 is converted from the second wiring layer to the first wiring layer through a preset via; the second to fourth are the lines where MCU152 sends drive signals P3, P4, and P5 to the press driver 143; the rightmost one is the line used by the press driver 143 to send the sampling signal ADC3 to MCU152.

[0065] The lines between MCU152 and the lower fan driver 142 are: looking from top to bottom from the left side of the lower fan driver 142, the first line represents the line where the switching power supply 151 is converted from the second routing layer to the first routing layer through the preset via; the second line represents the line where the lower fan driver 142 sends the drive signal ADC5 to MCU152; the third to fifth lines are respectively the lines where MCU152 sends the drive signals P6, P7, and P8 to the lower fan driver 142.

[0066] The lines between MCU152 and the upper fan driver 141 are: looking from top to bottom from the left side of the upper fan driver 141, the first to third lines are the lines for MCU152 to send drive signals P9, P10, and P11 to the upper fan driver 141; the fourth line represents the line for the upper fan driver 141 to send drive signal ADC4 to MCU152; the fifth line represents the line for the switching power supply 151 to be converted from the second routing layer to the first routing layer through the preset via.

[0067] Through the layout scheme of the multi-motor variable frequency drive device 100 of the utility model, the six circuit parts of filtering, smoothing, PFC, compressor drive 143, and two fan drives can be integrated into one, and a single chip can be used to drive a compressor and two fans at the same time. Through this innovative layout design, the interference between different signals can be reduced, and the problems of complex structure and difficult manufacturing of the traditional distributed layout are solved. The number, size and manufacturing cost of the variable frequency drive boards are effectively reduced, the space utilization rate is improved, and after-sales maintenance is facilitated, which promotes the integration and miniaturization of the variable frequency drive boards.

[0068] In order to more clearly distinguish the routing differences between the first routing layer and the second routing layer in the utility model, the circuits in the first routing layer of the multilayer printed circuit board are as follows: Figure 2 As shown, the lines in the second routing layer are as follows Figure 3 As shown, Figure 2 It is a schematic diagram of the layout scheme of the first wiring layer of the multi-motor variable frequency drive device 100 according to an embodiment of the utility model. Figure 3 It is a schematic diagram of the layout scheme of the second wiring layer of the multi-motor variable frequency drive device 100 according to an embodiment of the utility model.

[0069] Depend on Figure 2 It can be seen that in the input rectifier module 110, the power input port 111 is arranged at the angle between the first side and the fourth side; the filter component 112 is arranged at a position close to the first side, and is connected to the power input port 111 through the first routing layer; the relay 113 is arranged at a position close to the first side, and is connected to the filter component 112 through the first routing layer; the rectifier bridge 114 is arranged at a position close to the relay 113, and is respectively connected to the filter component 112 and the relay 113 through the first routing layer.

[0070] In the PFC module 120, the high-frequency inductor 121 is arranged at the angle between the first side and the second side, the power switch device 122 is arranged at a position close to the second side, and one side of the high-frequency inductor 121 and the power switch device 122 is connected through the first routing layer.

[0071] In the smoothing module 130, the first electrolytic capacitor 131 is arranged near the PFC module 120 and near the second side, and one side is connected to the power switch device 122 through the first wiring layer. The second electrolytic capacitor 132 is arranged near the communication control module 150 and near the second side, and one side is connected to the switch power supply 151 in the communication control module 150 through the first wiring layer.

[0072] In the communication control module 150, the second weak power pin of the switching power supply 151 is connected to the power switch device 122 through the first wiring layer. The MCU 152 is connected to the power switch device 122 through the first wiring layer, and is configured to send a drive signal to the power switch device 122 and receive a sampling signal from the power switch device 122. In this way, interference with strong power signals can be avoided.

[0073] Similarly, MCU152 is connected to the compressor driver 143 and the two fan drivers respectively through the first wiring layer, and is configured to send drive signals to the compressor driver 143 and the two fan drivers and receive sampling signals from the compressor driver 143 and the two fan drivers.

[0074] Looking from bottom to top on the right side of the power switch device 122: the first line represents the 15V power supply routing of the switching power supply 151 and the PFC module 120; the second line represents the line used by the power switch device 122 to send the sampling signal ADC1 to the MCU152; the third line represents the line used by the power switch device 122 to send the sampling signal ADC2 to the MCU152; the fourth line represents the line used by the MCU152 to send the driving signal P1 to the power switch device 122; the fifth line represents the line used by the MCU152 to send the driving signal P2 to the power switch device 122.

[0075] The specific layout scheme for the communication between the MCU 152 and the compressor driver 143 and the two fan driver signals through the first wiring layer can be as follows: Figure 2 As shown, the specific layout of MCU152 and press driver 143 from left to right along the bottom of press driver 143 are: the first is the line where the switching power supply 151 is converted from the second wiring layer to the first wiring layer through a preset via; the second to fourth are the lines where MCU152 sends drive signals P3, P4, and P5 to the press driver 143; the rightmost one is the line used by the press driver 143 to send the sampling signal ADC3 to MCU152.

[0076] The lines between MCU152 and the lower fan driver 142 are: looking from top to bottom from the left side of the lower fan driver 142, the first line represents the line where the switching power supply 151 is converted from the second routing layer to the first routing layer through the preset via; the second line represents the line where the lower fan driver 142 sends the drive signal ADC5 to MCU152; the third to fifth lines are respectively the lines where MCU152 sends the drive signals P6, P7, and P8 to the lower fan driver 142.

[0077] The lines between MCU152 and the upper fan driver 141 are: looking from top to bottom from the left side of the upper fan driver 141, the first to third lines are the lines for MCU152 to send drive signals P9, P10, and P11 to the upper fan driver 141; the fourth line represents the line for the upper fan driver 141 to send drive signal ADC4 to MCU152; the fifth line represents the line for the switching power supply 151 to be converted from the second routing layer to the first routing layer through the preset via.

[0078] Depend on Figure 3 It can be seen that the rectifier bridge 114 is connected to the high-frequency inductor 121 through the second wiring layer, thereby sending a rectified DC signal to the high-frequency inductor 121. One side of the high-frequency inductor 121 is connected to the power switch device 122 through the second wiring layer.

[0079] In the smoothing module 130 , the first electrolytic capacitor 131 is disposed close to the PFC module 120 and close to the second side, and one side thereof is connected to the power switch device 122 through the second wiring layer.

[0080] The second electrolytic capacitor 132 is disposed near the communication control module 150 and near the second side, and one side is connected to the switch power supply 151 in the communication control module 150 through the second wiring layer. On the right side of the first electrolytic capacitor 131, from top to bottom, there are the first output port, the ground port, and the second output port.

[0081] The MCU 152 is connected to the communication component 153 through two lines on the second wiring layer to achieve signal exchange.

[0082] At this point, those skilled in the art should recognize that, although multiple exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications that conform to the principles of the present invention can still be directly determined or derived from the contents disclosed in the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.

Claims

1. A multi-motor variable frequency drive device, characterized in that: include: A multilayer printed circuit board, comprising a first wiring layer and a second wiring layer, and having adjacent first and second sides and adjacent third and fourth sides, wherein the third side is opposite to the first side, and the fourth side is opposite to the second side; An input rectifier module, disposed near the first side and configured to convert an input AC signal into a DC signal; A PFC module is arranged at a position close to the second side, connected to the input rectifier module through the second wiring layer, and configured to receive the DC signal from the input rectifier module and convert the DC signal into a PFC voltage signal; a smoothing module, arranged at a position away from the input rectifier module and close to the second side, connected to the PFC module through the first routing layer and the second routing layer respectively, and configured to receive the PFC voltage signal from the PFC module; A plurality of driving modules are arranged near the input rectifier module and near the fourth side, connected to the smoothing module through the second wiring layer, and configured to use the output signal of the smoothing module to drive their respective motors.

2. The multi-motor variable frequency drive device according to claim 1, characterized in that: Also includes: The communication control module is arranged at a position close to the smoothing module and the driving module and close to the third side, and is connected to the smoothing module through the first wiring layer and the second wiring layer respectively.

3. The multi-motor variable frequency drive device according to claim 2, characterized in that: The input rectifier module comprises: A power input port is arranged near the angle between the first side and the fourth side; a filter component, disposed at a position close to the first side and connected to the power input port through the first wiring layer, and configured to filter the AC signal emitted by the power input port; a relay, arranged at a position close to the first side and connected to the filtering component through the first wiring layer; A rectifier bridge is arranged at a position close to the relay and is respectively connected to the filter component and the relay through the first wiring layer.

4. The multi-motor variable frequency drive device according to claim 3, characterized in that: The PFC module comprises: A high-frequency inductor is arranged at an angle between the first side and the second side and connected to the rectifier bridge through the second wiring layer; The power switch device is arranged at a position close to the second side and is connected to the high-frequency inductor through the first wiring layer and the second wiring layer respectively.

5. The multi-motor variable frequency drive device according to claim 4, characterized in that: The plurality of driving modules include: Two fan drives are arranged between the input rectifier module and the communication control module and close to the edge of the fourth side of the multilayer printed circuit board; The compressor drive is arranged between the input rectifier module and the communication control module and close to the positions of the two fan drives.

6. The multi-motor variable frequency drive device according to claim 5, characterized in that: The smoothing module comprises: a first electrolytic capacitor, arranged at a position close to the PFC module and close to the second side, connected to the compressor driver through a first output port on the second wiring layer, respectively connected to the two fan drivers through second output ports on the second wiring layer, respectively connected to the compressor driver and the two fan drivers through ground ports on the second wiring layer, and the ground port is arranged between the first output port and the second output port; The second electrolytic capacitor is arranged at a position close to the communication control module and close to the second side, and is connected to the communication control module through the first wiring layer and the second wiring layer respectively.

7. The multi-motor variable frequency drive device according to claim 6, characterized in that: The communication control module comprises: A switching power supply is arranged at a position close to the second electrolytic capacitor and close to the third side, and is connected to the second electrolytic capacitor through the first wiring layer and the second wiring layer respectively; A communication component is arranged at a position close to the angle between the third side and the fourth side; The MCU is arranged between the switching power supply and the communication component and close to the third side, and is connected to the communication component through the second wiring layer.

8. The multi-motor variable frequency drive device according to claim 7, characterized in that: The switching power supply comprises: A first weak current power supply pin is connected to the MCU through the second wiring layer; A second weak-current power supply pin is connected to the power switch device through the first wiring layer; The third weak-current power supply pin is arranged between the first weak-current power supply pin and the second weak-current power supply pin, and is respectively connected to the compressor drive and the two fan drives after the second routing layer reaches the first routing layer through a preset via hole, and the preset via hole is arranged between the compressor drive and the MCU.

9. The multi-motor variable frequency drive device according to claim 7, characterized in that: The MCU is connected to the power switch device through the first wiring layer, and is configured to send a driving signal to the power switch device and receive a sampling signal from the power switch device.

10. The multi-motor variable frequency drive device according to claim 7, characterized in that: The MCU is respectively connected to the press driver and the two fan drivers through the first wiring layer, and is configured to send drive signals to the press driver and the two fan drivers and receive sampling signals from the press driver and the two fan drivers.

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