Ultra-wideband down-conversion single-bit front-end assembly

Abstract

The utility model discloses an ultra-wideband down-conversion single-bit front-end assembly, which comprises an upper amplification link, a lower amplification link and an output channel, the upper amplification link is formed by sequentially connecting a first amplifier, a second amplifier, a frequency converter, a filter, a third amplifier and a first fixed attenuation chip in series; the lower amplification link is formed by sequentially connecting a fourth amplifier, a second fixed attenuation chip and a fifth amplifier in series; the output channel is formed by sequentially connecting a sixth amplifier, a third fixed attenuation chip and a seventh amplifier in series; the upper amplification link and the lower amplification link are connected in parallel with the input end of the single-pole double-throw switch, and the output channel is connected with the output end of the single-pole double-throw switch. According to the utility model, the sensitivity and the receiving performance of the system are ensured; a multi-stage amplification mode is adopted in a channel, received signals are amplified, attenuation chips are cascaded between amplifiers at all stages, standing waves between the amplifiers are reduced, and the stability of the circuit is ensured; stray and harmonic signals can be suppressed, and the receiving performance of the assembly is ensured.

Description

Technical Field

[0001] The utility model relates to the field of microwave communication, in particular to an ultra-wideband down-conversion single-bit front-end component. Background Art

[0002] At present, millimeter wave communication plays an extremely important role in the field of military and commercial wireless communications. As an important part of the millimeter wave front end, the millimeter wave up and down conversion components are related to the performance of the entire system and play an extremely important role.

[0003] Since the gain in the frequency conversion components of the current down-conversion front end is very high, cascade amplifiers are required. The cascaded amplifiers will affect the stability of the amplifier chain operation; the amplifier gain will fluctuate at both high and low temperatures, and the cascaded amplifiers will further aggravate the gain fluctuations. Utility Model Content

[0004] The utility model aims to provide an ultra-wideband down-conversion single-bit front-end component with high stability and stable link gain.

[0005] The purpose of the utility model is achieved in this way: the up-amplification chain is composed of a first amplifier, a second amplifier, a frequency converter, a filter, a third amplifier, and a first fixed attenuation chip connected in series in sequence;

[0006] The down-amplification link is composed of a fourth amplifier, a second fixed attenuation chip, and a fifth amplifier connected in series in sequence;

[0007] The output channel is composed of a sixth amplifier, a third fixed attenuation chip, and a seventh amplifier connected in series in sequence;

[0008] The upper amplifying link and the lower amplifying link are connected in parallel to the input end of the single-pole double-throw switch, and the output channel is connected to the output end of the single-pole double-throw switch.

[0009] Preferably, a temperature compensator is provided between the output channel and the single-pole double-throw switch.

[0010] Preferably, when the up-amplification link input is 1-18 GHz, the output channel outputs 1-18 GHz.

[0011] Preferably, when the up-amplifier link input is 30-40 GHz, the output channel outputs 2-12 GHz.

[0012] Preferably, the first amplifier and the second amplifier are both ILA-1840D; the third amplifier, the fourth amplifier, the fifth amplifier, the sixth amplifier, and the seventh amplifier are all ILA-0118C.

[0013] Preferably, the inverter model is MM1-1044.

[0014] Preferably, the filter model is BPF0212.

[0015] Preferably, the first fixed attenuation chip, the second fixed attenuation chip and the third fixed attenuation chip are all IFA-02.

[0016] Compared with the prior art, the utility model is beneficial in that:

[0017] 1. The first stage of the amplification link uses a low-noise amplifier to reduce the noise coefficient of the entire link and ensure the sensitivity and receiving performance of the system;

[0018] 2. Use multi-stage amplification in the channel to amplify the received signal, cascade attenuation chips between amplifiers at each level to reduce standing waves between amplifiers and ensure the stability of the circuit;

[0019] 3. Add a temperature-compensated attenuator in the amplifier link to compensate for the gain fluctuations in the amplifier link;

[0020] 4. Use a single-pole double-throw switch between channels to segment the input ultra-wideband signal, perform frequency conversion processing, and output the signal within a specific frequency range;

[0021] 5. Add filters in the channel to suppress stray and harmonic signals to ensure the receiving performance of the components. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the process of the utility model. DETAILED DESCRIPTION

[0023] The following is a description of the implementation of the present invention by means of specific embodiments. People familiar with the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0024] It should be noted that in the description of the present utility model, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the utility model product is usually placed when in use, which are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third" and the like are only used to distinguish the description, and cannot be understood as indicating or implying relative importance. Terms such as "horizontal", "vertical", and "overhanging" do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0025] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] like Figure 1 As shown, an ultra-wideband down-conversion single-bit front-end component includes an up-amplification link, a down-amplification link, and an output channel;

[0027] The upper amplification link is composed of the first amplifier, the second amplifier, the frequency converter, the filter, the third amplifier, and the first fixed attenuation chip connected in series in sequence; the first stage of the amplification link adopts a low-noise amplifier to reduce the noise coefficient of the entire link and ensure the sensitivity and receiving performance of the system; a filter is added in the channel to suppress stray and harmonic signals to ensure the receiving performance of the component;

[0028] The down-amplification link is composed of the fourth amplifier, the second fixed attenuation chip, and the fifth amplifier connected in series in sequence; a multi-stage amplification method is adopted in the channel to amplify the received signal, and the attenuation chip is cascaded between the amplifiers at each stage to reduce the standing wave between the amplifiers;

[0029] The output channel is composed of the sixth amplifier, the third fixed attenuation chip, and the seventh amplifier connected in series in sequence; a multi-stage amplification method is adopted in the channel to amplify the received signal, and the attenuation chip is cascaded between the amplifiers at each stage to reduce the standing wave between the amplifiers;

[0030] The upper amplification link and the lower amplification link are connected in parallel to the input end of the single-pole double-throw switch, and the output channel is connected to the output end of the single-pole double-throw switch; a single-pole double-throw switch is used between the channels to segment the input ultra-wideband signal, perform frequency conversion processing, and output the signal within a specific frequency range.

[0031] A temperature compensator is provided between the output channel and the single-pole double-throw switch; a temperature-compensated attenuator is added in the amplifier link to compensate for gain fluctuations occurring in the amplifier link.

[0032] When the up-amplifier link input is 1-18 GHz, the output channel outputs 1-18 GHz.

[0033] The up-amplified link input is 30-40GHz, and the output channel outputs 2-12GHz.

[0034] The first amplifier and the second amplifier are both ILA-1840D; the third amplifier, the fourth amplifier, the fifth amplifier, the sixth amplifier, and the seventh amplifier are all ILA-0118C; the inverter model is MM1-1044; the filter model is BPF0212; the first fixed attenuation chip, the second fixed attenuation chip, and the third fixed attenuation chip are all IFA-02.

[0035] Therefore, the advantages of the utility model are as follows: the amplification link is composed of a multi-stage amplifier cascade, and the attenuation chip is cascaded between the amplifiers at each stage, which can not only reduce the standing wave between the amplifiers, but also protect the next stage amplifier, ensuring the stability of the amplification link; adding a temperature compensation attenuator in the amplification link can reduce the fluctuation of the link gain as much as possible at high and low temperatures, ensuring the consistency of the amplifier link working at different temperatures;

[0036] The technical indicators achieved by this circuit are:

[0037] 1. Channel gain: 60±2dB;

[0038] 2. Maximum output power of frequency conversion branch: ≤4dBm;

[0039] 3. In-band fluctuation: ≤±2dB;

[0040] 4. Out-of-band spurious suppression: ≥40dBc;

[0041] 5. In-band harmonic suppression: ≥10dBc;

[0042] The input frequency range of the utility model is: 1-18GHz (directly amplified after input), 30-40GHz (down-converted to 2-12GHz); the output frequency range is: 1-18GHz (input frequency 1-18GHz), 2-12GHz (input frequency 30-40GHz).

[0043] The above-described embodiments are merely descriptions of preferred implementations of the present invention, and are not intended to limit the concept and scope of the present invention. Without departing from the design concept of the present invention, various modifications and improvements made by ordinary personnel in the field to the technical solution of the present invention should fall within the protection scope of the present invention, and the technical contents of the present invention for protection have been fully recorded in the claims.

Claims

1. An ultra-wideband down-conversion single-bit front-end component, characterized in that: It includes an upper amplification link, a lower amplification link, and an output channel; it is characterized in that: The up-amplification chain is composed of a first amplifier, a second amplifier, a frequency converter, a filter, a third amplifier, and a first fixed attenuation chip connected in series in sequence; The down-amplification link is composed of a fourth amplifier, a second fixed attenuation chip, and a fifth amplifier connected in series in sequence; The output channel is composed of a sixth amplifier, a third fixed attenuation chip, and a seventh amplifier connected in series in sequence; The upper amplifying link and the lower amplifying link are connected in parallel to the input end of the single-pole double-throw switch ISW2, and the output channel is connected to the output end of the single-pole double-throw switch.

2. The ultra-wideband down-conversion single-bit front-end component according to claim 1, characterized in that: A temperature compensator is provided between the output channel and the single-pole double-throw switch.

3. The ultra-wideband down-conversion single-bit front-end component according to claim 1, characterized in that: When the up-amplification link inputs 1-18 GHz, the output channel outputs 1-18 GHz.

4. The ultra-wideband down-conversion single-bit front-end component according to claim 1, characterized in that: When the up-amplifier link input is 30-40 GHz, after frequency conversion, the output channel outputs 2-12 GHz.

5. The ultra-wideband down-conversion single-bit front-end component according to claim 1, characterized in that: The first amplifier and the second amplifier are both ILA-1840D; the third amplifier, the fourth amplifier, the fifth amplifier, the sixth amplifier, and the seventh amplifier are all ILA-0118C.

6. The ultra-wideband down-conversion single-bit front-end component according to claim 1, characterized in that: The inverter model is MM1-1044.

7. The ultra-wideband down-conversion single-bit front-end component according to claim 1, characterized in that: The filter model is BPF0212.

8. The ultra-wideband down-conversion single-bit front-end component according to claim 1, characterized in that: The first fixed attenuation chip, the second fixed attenuation chip and the third fixed attenuation chip are all IFA-02.

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