Multilayer printed circuit board

Abstract

The utility model relates to the technical field of circuit boards, in particular to a multilayer printed circuit board which comprises an installation mechanism, an insulation mechanism and a circuit mechanism, the insulation mechanism is located at the top end of the installation mechanism, the circuit mechanism is located at the top end of the installation mechanism, the installation mechanism comprises a supporting plate, and a heat absorption block is fixedly installed in the middle of the top end of the supporting plate. Supporting columns are fixedly installed at the four corners of the top end of the supporting plate, first hollow cushion blocks are fixedly installed at the top ends of the supporting columns, screw grooves are formed in the top ends of the supporting columns, screws are movably installed in the screw grooves, and second hollow cushion blocks are movably installed between the screws and the screw grooves. The circuit board can be protected through the first hollow cushion block and the second hollow cushion block, vibration buffering can be generated, vibration damage of an installation assembly is reduced, meanwhile, heat generated by the circuit board can be conducted and dissipated through the heat absorption block, installation gaps of the circuit board are increased through the supporting columns, and the heat dissipation rate is increased.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a multi-layer printed circuit board. Background Art

[0002] Circuit board is also called circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, etc. Circuit board makes circuit miniaturized and intuitive, and plays an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. Especially with the rapid development of electronic products today, the performance of multi-layer circuit boards has been greatly improved compared with single-layer circuit boards, so the use of multi-layer circuit boards is becoming more and more widespread.

[0003] As disclosed in the authorization announcement number CN218998358U, a multi-layer printed circuit board is disclosed, including a No. 1 circuit board, a No. 2 circuit board is installed on the upper end of the No. 1 circuit board, a No. 3 circuit board is installed on the lower end of the No. 1 circuit board, a heat dissipation device is installed on the lower end of the No. 3 circuit board, a support device is installed on the upper end of the No. 2 circuit board and the lower end of the No. 3 circuit board, the No. 1 circuit board, the No. 2 circuit board and the No. 3 circuit board are all installed with circuit layers on the upper ends, and an anti-bias device is installed on the left and right ends of the No. 1 circuit board. The multi-layer printed circuit board described in the utility model clamps and limits the circuit board by the clamping block on the anti-bias device, preventing the phenomenon of offset and misalignment of multiple circuit boards during bonding, thereby improving the quality of the multi-layer printed circuit board, improving the heat dissipation performance of the circuit board by the heat dissipation device, and strengthening the anti-bending property of the multi-layer circuit board by the support device, thereby reducing the possibility of bending of the multi-layer circuit board.

[0004] However, the existing circuit boards may break during installation due to excessive screw fixing force, thus causing damage. At the same time, when vibration occurs, the components on the circuit boards may become desoldered due to the inability to provide buffer. In addition, the heat generated by the circuit boards during operation cannot be dissipated in time, resulting in excessive heat at the welding points causing desoldering. Utility Model Content

[0005] The purpose of the utility model is to provide a multi-layer printed circuit board to solve the problems raised in the above background technology.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A multilayer printed circuit board comprises a mounting mechanism, an insulating mechanism and a line mechanism, wherein the insulating mechanism is located at the top of the mounting mechanism, and the line mechanism is located at the top of the mounting mechanism. The mounting mechanism comprises a support plate, wherein a mounting groove is provided at the top of the support plate, a heat absorbing block is fixedly installed at the middle of the top of the support plate, support columns are fixedly installed at the four corners of the top of the support plate, a first hollow pad is fixedly installed at the top of the support column, a screw groove is provided at the top of the support column, a screw is movably installed in the screw groove, and a second hollow pad is movably installed between the screw and the screw groove.

[0008] Preferably, the insulating mechanism comprises an insulating coating, four corners of the insulating coating are provided with first connecting holes, and a wire mesh is fixedly mounted on the top of the insulating coating.

[0009] Preferably, a component connection groove is opened in the wire mesh, a resistor block is fixedly installed in the wire mesh, and a welding point is fixedly installed in the wire mesh.

[0010] Preferably, the line mechanism comprises a first insulating plate, a second insulating plate and a third insulating plate, the first insulating plate, the second insulating plate and the third insulating plate are provided with second connecting holes, and the first insulating plate is fixedly mounted on the bottom end of the insulating coating.

[0011] Preferably, first copper component holes are fixedly installed on the first insulating plate, and first copper traces are fixedly installed between the first copper component holes.

[0012] Preferably, a second insulating plate is fixedly mounted on the bottom end of the first insulating plate, second copper component holes are fixedly mounted on the second insulating plate, and second copper traces are fixedly mounted between the second copper component holes.

[0013] Preferably, a third insulating plate is fixedly mounted on the bottom end of the second insulating plate, third copper component holes are fixedly mounted on the third insulating plate, and third copper traces are fixedly mounted between the third copper component holes.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] 1. A multilayer printed circuit board, through the first hollow pad and the second hollow pad, prevents the circuit board from being damaged by screws during installation, and buffers vibration conduction when vibration occurs, thereby reducing vibration damage to components installed on the circuit board and better protecting the circuit board components.

[0016] 2. A multilayer printed circuit board, through the heat absorbing block, after the circuit board is fixed, the heat generated during operation can be conducted and dissipated, and the installation gap of the circuit board is increased by the support column, thereby increasing the heat dissipation rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 It is a structural schematic diagram of the installation mechanism of the utility model;

[0019] Figure 3 It is a structural schematic diagram of the insulation mechanism of the utility model;

[0020] Figure 4 It is a structural schematic diagram of the circuit mechanism of the utility model.

[0021] In the figure: 101, installation mechanism; 102, insulation mechanism; 103, line mechanism; 104, support plate; 105, heat absorption block; 106, support column; 201, first hollow pad; 202, screw groove; 203, screw; 204, second hollow pad; 205, insulation coating; 206, first connection hole; 301, wire mesh; 302, component connection groove; 303, resistor block; 304, solder joint; 305, first insulating plate; 306, second connection hole; 401, first copper component hole; 402, first copper trace; 403, second insulating plate; 404, second copper component hole; 405, second copper trace; 406, third insulating plate; 501, third copper component hole; 502, third copper trace; 503, installation groove. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] See also Figure 1-Figure 4 As shown, a technical solution provided by the utility model:

[0024] A multilayer printed circuit board comprises a mounting mechanism 101, an insulating mechanism 102 and a line mechanism 103, wherein the insulating mechanism 102 is located at the top of the mounting mechanism 101, and the line mechanism 103 is located at the top of the mounting mechanism 101. The mounting mechanism 101 comprises a support plate 104, wherein a mounting groove 503 is provided at the top of the support plate 104, a heat absorbing block 105 is fixedly installed at the middle of the top of the support plate 104, support columns 106 are fixedly installed at the four corners of the top of the support plate 104, a first hollow pad 201 is fixedly installed at the top of the support column 106, a screw groove 202 is provided at the top of the support column 106, a screw 203 is movably installed in the screw groove 202, and a second hollow pad 204 is movably installed between the screw 203 and the screw groove 202.

[0025] Through the above scheme, the support plate can be fixed by the mounting groove, the heat of the circuit board can be absorbed and dissipated by the heat absorption block, and the first hollow pad and the second hollow pad can clamp the circuit board by passing the screws through the screw groove, and at the same time the circuit board can be fixed on the support column.

[0026] In this embodiment, preferably, the insulating mechanism 102 includes an insulating coating 205 , four corners of the insulating coating 205 are provided with first connection holes 206 , and a wire mesh 301 is fixedly mounted on the top of the insulating coating 205 .

[0027] According to the above solution, the insulating coating can be used for insulation when the components are connected, and the screw can be passed through the first connecting hole.

[0028] In this embodiment, preferably, a component connection groove 302 is opened in the wire mesh 301 , a resistor block 303 is fixedly installed in the wire mesh 301 , and a welding point 304 is fixedly installed in the wire mesh 301 .

[0029] Through the above scheme, the connection area of ​​the circuit board can be distinguished by the silk screen, the current can be controlled by the resistor block, and the components can be welded through the soldering points and the component connection grooves.

[0030] In this embodiment, preferably, the line mechanism 103 includes a first insulating plate 305 , a second insulating plate 403 and a third insulating plate 406 , and a second connecting hole 306 is opened on the first insulating plate 305 , the second insulating plate 403 and the third insulating plate 406 , and the first insulating plate 305 is fixedly installed at the bottom end of the insulating coating 205 .

[0031] Through the above scheme, the screw can be passed through the second connecting hole, and the first insulating plate, the second insulating plate and the third insulating plate can play the role of insulation and support, and the first insulating plate, the second insulating plate and the third insulating plate are connected in series to make the circuit board a multi-layer circuit board.

[0032] In this embodiment, preferably, first copper component holes 401 are fixedly installed on the first insulating plate 305 , and first copper traces 402 are fixedly installed between the first copper component holes 401 .

[0033] Through the above solution, the components can be connected through the first copper component holes, and the current can be transmitted through the first copper traces after the components are installed.

[0034] In this embodiment, preferably, a second insulating plate 403 is fixedly mounted on the bottom end of the first insulating plate 305 , second copper component holes 404 are fixedly mounted on the second insulating plate 403 , and second copper traces 405 are fixedly mounted between the second copper component holes 404 .

[0035] Through the above solution, the components can be connected through the second copper component holes, and the current can be transmitted through the second copper traces after the components are installed.

[0036] In this embodiment, preferably, a third insulating plate 406 is fixedly mounted on the bottom end of the second insulating plate 403 , third copper component holes 501 are fixedly mounted on the third insulating plate 406 , and third copper traces 502 are fixedly mounted between the third copper component holes 501 .

[0037] Through the above solution, the components can be connected through the third copper component holes, and the current can be transmitted through the third copper traces after the components are installed.

[0038] When a multilayer printed circuit board of the present embodiment is in use, the user solders and installs each component through the component connection groove 302 and the solder joint 304, and then fixes the support plate 104 through the installation groove 503 on the support plate 104, and then passes the screw 203 through the first connection hole 206 and the second connection hole 306 and movably installs them in the screw groove 202, so that the first hollow pad 201 and the second hollow pad 204 are clamped between the screw 203 and the support column 106, and the insulating coating 205 and the third insulating plate 406 are clamped and fixed. The first hollow pad 201 and the second hollow pad 204 prevent the circuit board from being damaged during installation, and when vibration occurs, the first hollow pad 201 and the second hollow pad 204 can buffer the vibration conduction, reduce the vibration damage of the components installed on the circuit board, and better protect the circuit board components. At the same time, after clamping, the heat generated by the circuit board during operation can be dissipated through the heat absorption block 105.

[0039] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A multilayer printed circuit board, characterized in that: The invention comprises a mounting mechanism (101), an insulating mechanism (102) and a line mechanism (103), wherein the insulating mechanism (102) is located at the top of the mounting mechanism (101), and the line mechanism (103) is located at the top of the mounting mechanism (101). The mounting mechanism (101) comprises a support plate (104), wherein a mounting groove (503) is provided at the top of the support plate (104), a heat absorbing block (105) is fixedly installed in the middle of the top of the support plate (104), support columns (106) are fixedly installed at the four corners of the top of the support plate (104), a first hollow cushion block (201) is fixedly installed at the top of the support column (106), a screw groove (202) is provided at the top of the support column (106), a screw (203) is movably installed in the screw groove (202), and a second hollow cushion block (204) is movably installed between the screw (203) and the screw groove (202).

2. A multilayer printed circuit board according to claim 1, characterized in that: The insulating mechanism (102) comprises an insulating coating (205), four corners of the insulating coating (205) are provided with first connection holes (206), and a wire mesh (301) is fixedly mounted on the top of the insulating coating (205).

3. A multilayer printed circuit board according to claim 2, characterized in that: A component connection groove (302) is provided in the wire mesh (301), a resistor block (303) is fixedly installed in the wire mesh (301), and a welding point (304) is fixedly installed in the wire mesh (301).

4. A multilayer printed circuit board according to claim 1, characterized in that: The line mechanism (103) comprises a first insulating plate (305), a second insulating plate (403) and a third insulating plate (406); a second connecting hole (306) is provided on the first insulating plate (305), the second insulating plate (403) and the third insulating plate (406); and the first insulating plate (305) is fixedly mounted on the bottom end of the insulating coating (205).

5. A multilayer printed circuit board according to claim 4, characterized in that: The first insulating plate (305) is fixedly mounted with first copper component holes (401), and first copper traces (402) are fixedly mounted between the first copper component holes (401).

6. A multilayer printed circuit board according to claim 5, characterized in that: A second insulating plate (403) is fixedly mounted on the bottom end of the first insulating plate (305), second copper component holes (404) are fixedly mounted on the second insulating plate (403), and second copper traces (405) are fixedly mounted between the second copper component holes (404).

7. A multilayer printed circuit board according to claim 6, characterized in that: A third insulating plate (406) is fixedly mounted on the bottom end of the second insulating plate (403), a third copper component hole (501) is fixedly mounted on the third insulating plate (406), and a third copper trace (502) is fixedly mounted between the third copper component holes (501).

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