Driving substrate heat dissipation structure

Abstract

The utility model provides a heat dissipation structure of a driving substrate, which comprises the components of a driving substrate which is provided with more than one high-power component and is provided with a hollow area corresponding to each high-power component; and the radiator is arranged below the driving substrate and comprises a radiating fin and a fan, a heat conduction boss is arranged corresponding to each hollow area, and the heat conduction bosses are connected with the high-power components through heat conduction paste or heat conduction silicone grease in a sticking manner. According to the utility model, the high-power device is directly radiated through the heat conduction boss of the radiator, so that the heat conductivity is better. As the driving substrate made of the glass fiber epoxy resin material adopts a direct hollowing mode, the substrate production does not have complicated procedures, the production is simple, and the cost is low. The heat-conducting boss of the radiator is machined by a die or a machine tool, the process is simple, and the production cost is low.

Description

Technical Field

[0001] The utility model relates to the technical field of automobile lamps, in particular to a driving substrate heat dissipation structure. Background Art

[0002] As the integration of automotive lights becomes higher and higher, the power of LEDs becomes higher and higher. How to dissipate heat has become a problem that needs to be solved for high-power LED driver substrates. The current mainstream heat dissipation method is to change the substrate material, from FR4 glass fiber epoxy resin substrate to aluminum substrate or copper substrate, and then fix the radiator on the aluminum substrate or copper substrate. Or embed an aluminum block or copper block in the middle of the FR4 glass fiber epoxy resin substrate, and the heat dissipation aluminum block or copper block is used to dissipate heat for the LED, and then install the driver board embedded in the heat dissipation block on a larger heat dissipation block to dissipate heat for the LED. The above aluminum substrate or copper substrate heat dissipation method, due to the high price of aluminum substrate and copper substrate, leads to high material cost, and the circuit board cannot be designed as a multi-layer board, which has great limitations in circuit design. The method of embedding aluminum or copper blocks in FR4 has a complex processing technology and high cost, and since devices such as LEDs need to be SMT (Surface Mounted Technology) or wave soldering, it is impossible to apply thermal conductive silicone grease, resulting in a gap between the device and the embedded copper block, and the thermal conductivity is affected. Utility Model Content

[0003] In order to solve the above-mentioned defects of the prior art, the utility model provides a driving substrate heat dissipation structure.

[0004] The utility model provides a driving substrate heat dissipation structure, comprising:

[0005] A driving substrate, on which one or more high-power components are arranged, and a hollowed-out area is provided corresponding to each of the high-power components;

[0006] The heat sink is arranged below the driving substrate, and includes a heat sink and a fan. A heat-conducting boss is arranged corresponding to each of the hollowed-out areas. The heat-conducting boss is connected to the high-power components by means of thermal paste or thermal grease.

[0007] Preferably, the driving substrate is made of glass fiber epoxy resin, and the number of wiring layers is a single-layer board, a double-layer board or a multi-layer board.

[0008] Preferably, the glass fiber epoxy resin material is any one of FR1 to FR4.

[0009] Preferably, the size of the hollowed-out area matches the package size of the corresponding high-power component.

[0010] Preferably, the height of the thermally conductive boss on the heat sink is consistent with the thickness of the driving substrate, and the size of the thermally conductive boss matches the hollowed-out area. When the heat sink is assembled and connected to the driving substrate, the thermally conductive boss is located exactly in the hollowed-out area.

[0011] Preferably, the heat sink is made of a heat dissipation material, and the heat dissipation material is an alloy, aluminum or copper.

[0012] Preferably, the fan on the heat sink is powered by a power supply on the driving substrate or externally powered.

[0013] Preferably, the heat sink adopts a multi-layer sheet structure or a tubular structure, and air circulation channels are provided between the heat sinks to achieve air circulation and increase the heat dissipation effect.

[0014] Preferably, the high-power component is an LED or a MOS.

[0015] The utility model has the following beneficial effects:

[0016] The heat dissipation structure of the driving substrate of the utility model hollows out the area of ​​the high-power device on the driving substrate, and designs a heat-conducting boss of a corresponding size according to the size of the hollowed-out substrate in the design of the heat sink, and the surface of the heat-conducting boss is coated with thermal grease. During assembly, the thermal-conducting boss is embedded in the hollowed-out area of ​​the substrate together with the surface thermal-conducting silicone grease and connected to the high-power LED device. The thickness of the thermal-conducting boss is consistent with the thickness of the substrate, ensuring that the heat dissipation device and the thermal-conducting boss fit tightly to achieve the effect of heat dissipation of the FR4 driving substrate. Since the high-power device of the utility model directly dissipates heat through the thermal-conducting boss of the heat sink, the thermal conductivity is better. Since the FR4 material driving substrate adopts the direct hollowing method, the production of the substrate does not require complicated processes, and the production is simple and low in cost. The thermal-conducting boss of the radiator is processed by a mold or a machine tool, and the process is simple and the production cost is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 An exploded view of a heat dissipation structure of a driving substrate according to a preferred embodiment of the utility model.

[0018] Figure 2 This is an assembly diagram of a drive substrate heat dissipation structure according to a preferred embodiment of the utility model. DETAILED DESCRIPTION

[0019] The following will illustrate the implementation methods of the utility model in conjunction with the drawings in the specification. It should be noted that the implementation methods involved in this specification are not exhaustive and do not represent the only implementation methods of the utility model. The following corresponding embodiments are only for the purpose of clearly illustrating the utility model content of the utility model patent, and are not intended to limit its implementation methods. For ordinary technicians in this field, different forms of changes and modifications can be made on the basis of the description of these embodiments. All obvious changes or modifications that belong to the technical concept and utility model content of the utility model are also within the scope of protection of the utility model.

[0020] like Figures 1-2 As shown, a driving substrate heat dissipation structure of a preferred embodiment of the utility model includes: a driving substrate 2 and a heat sink 6. A high-power component 1 is arranged on the driving substrate 2, and a hollow area 4 is provided corresponding to the high-power component 1. That is, the hollow area 4 is directly below the high-power component 1. The size of the hollow area 4 matches the corresponding package size of the high-power component 1. The high-power component 1 is soldered on the driving substrate 2 by SMT. Preferably, the high-power component 1 can be an LED or a MOS. In other embodiments, there can be multiple high-power components 1.

[0021] In each preferred embodiment, the driving substrate 2 is made of glass fiber epoxy resin, and the number of wiring layers is single-layer board, double-layer board or multi-layer board. More preferably, the glass fiber epoxy resin material is any one of FR1 to FR4.

[0022] In each preferred embodiment, the heat sink 6 is arranged below the driving substrate 2, including a heat sink 8 and a fan 9, and a heat-conducting boss 7 is arranged corresponding to each of the hollowed-out areas 4, and the heat-conducting boss 7 is connected to the high-power component 1 by pasting with thermal paste 5. In another preferred embodiment, the heat-conducting boss 7 and the high-power component 1 can also be connected by pasting with thermal grease. Preferably, the height of the heat-conducting boss 7 on the heat sink 6 is consistent with the thickness of the driving substrate 2, and the size of the heat-conducting boss 7 matches the hollowed-out area 4. When the heat sink 6 is assembled and connected to the driving substrate 2, the heat-conducting boss 7 is located exactly in the hollowed-out area 4. The material of the heat-conducting boss 7 is preferably alloy, aluminum or copper. Preferably, the heat sink 6 is fixedly connected to the driving substrate 2 by the driving plate screws 3.

[0023] Preferably, the heat sink 6 is made of a heat dissipation material, and the heat dissipation material is an alloy, aluminum or copper. The fan 9 on the heat sink 6 is powered by a power supply on the drive substrate 2 or an external power supply. The fan 9 is fixed to the heat sink 6 by a fan screw 10. The heat sink 8 is a multi-layer sheet structure or a tubular structure, and there are air circulation channels between the heat sinks 8 to achieve air circulation and increase the heat dissipation effect.

[0024] When the driver substrate (high-power LED driver substrate) 2 is working, most of the heat generated by the LED is quickly transferred to the thermal paste 5 by itself, and then directly transferred to the thermal boss 7 of the heat sink 6. A small part of the heat generated by the LED is transferred to the heat sink 6 through the FR4 material substrate of the driver substrate 2. The heat from the thermal boss 7 and the heat sink 6 is transferred to the heat sink 8. The high-power LED driver substrate 2 supplies power to the fan 9 on the heat sink 8, and the fan 9 starts to work to generate convection in the surrounding air. The convective airflow continuously takes away the heat on the heat sink 8, and finally the heat generated by the high-power LED driver substrate 2 and the heat dissipated reach a thermal equilibrium state.

[0025] In each preferred embodiment, the utility model optimizes the PCB LAYOUT routing mode on the basis of the existing high-power LED driver substrate using FR1 to FR4 substrates to avoid routing in the substrate area below the high-power device.

[0026] The utility model hollows out a substrate where a high-power device of a driving substrate is mounted in a PCB design, and designs a heat-conducting boss on a radiator, wherein the heat-conducting boss is embedded in the hollowed-out area of ​​the substrate, and the heat-conducting boss is connected to the high-power device through thermal grease, so that the heat generated by high-power devices such as LEDs is directly transferred to the heat-conducting boss of the radiator through the thermal grease pasted on the bottom for heat dissipation.

[0027] The thermal conductivity of glass fiber epoxy resins such as FR4 is about 0.2-0.8W / (mk), and the thermal conductivity of copper is 400W / (mk). The main components of the driver substrate are glass fiber epoxy resin and copper composite. According to industry experience, the thermal conductivity of the driver substrate in the plane direction is 10-45W / (mk), and the thermal conductivity in the vertical direction is 0.3W / (mk). The utility model combines the existing glass fiber epoxy resin boards such as FR1 and FR4 with aluminum or copper radiators by opening and embedding. The heat in the vertical direction of the driver substrate is directly conducted to the radiator through thermal grease. Its thermal conductivity is about 2-3W / (mk), which greatly increases the thermal conductivity effect.

[0028] Furthermore, the present invention does not require a special heat sink embedding process for glass fiber boards such as FR1 and FR4, nor does it require replacing the driver substrate with a metal substrate to meet the heat dissipation requirements of the LED. The present invention not only takes into account the multi-layer wiring requirements of glass fiber substrates such as FR1 to FR4, but can also directly transfer the heat of high-power devices to the metal heat sink, and then dissipate the heat through the heat sink fins and fans of the heat sink. There are no special processing requirements for material production, and the material cost is lower. In addition, because the LED directly contacts the heat sink through the heat conduction boss of the heat sink, there is no problem of poor contact between the heat sink and the LED caused by the method of embedding the substrate into the heat sink. The present invention can be filled with thermal grease, and the heat conduction effect in the vertical direction is better.

[0029] Obviously, those skilled in the art should realize that the above embodiments are only used to illustrate the present invention, and are not used to limit the present invention. As long as they are within the spirit of the present invention, any changes or modifications to the above embodiments will fall within the scope of the claims of the present invention.

Claims

1. A drive substrate heat dissipation structure, characterized in that: include: A driving substrate, on which one or more high-power components are arranged, and a hollowed-out area is provided corresponding to each of the high-power components; The heat sink is arranged below the driving substrate, and includes a heat sink and a fan. A heat-conducting boss is arranged corresponding to each of the hollowed-out areas. The heat-conducting boss is connected to the high-power components by means of thermal paste or thermal grease.

2. The drive substrate heat dissipation structure according to claim 1, characterized in that: The driving substrate is made of glass fiber epoxy resin, and the number of wiring layers is a single-layer board, a double-layer board or a multi-layer board.

3. The drive substrate heat dissipation structure according to claim 2, characterized in that: The glass fiber epoxy resin material is any one of FR1 to FR4.

4. The drive substrate heat dissipation structure according to claim 1, characterized in that: The size of the hollowed-out area matches the packaging size of the corresponding high-power component.

5. The drive substrate heat dissipation structure according to claim 4, characterized in that: The height of the heat-conducting boss on the heat sink is consistent with the thickness of the driving substrate, and the size of the heat-conducting boss matches the hollow area. When the heat sink is assembled and connected with the driving substrate, the heat-conducting boss is located exactly in the hollow area.

6. The drive substrate heat dissipation structure according to claim 1, characterized in that: The heat sink is made of heat dissipation material, and the heat dissipation material is alloy, aluminum or copper.

7. The drive substrate heat dissipation structure according to claim 1, characterized in that: The fan on the radiator is powered by a power supply on the driving substrate or externally powered.

8. The drive substrate heat dissipation structure according to claim 1, characterized in that: The heat sink adopts a multi-layer sheet structure or a tubular structure, and air circulation channels are provided between the heat sinks to achieve air circulation and increase the heat dissipation effect.

9. The drive substrate heat dissipation structure according to claim 1, characterized in that: High power components are LED or MOS.

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