Power punch structure of semiconductor trimming and forming equipment
By using a pressing mechanism in the power punch structure of the semiconductor rib cutting molding equipment, including a guide column, a buffer spring and an extrusion column, the problem of curling during the rib cutting process is solved and the effect of rib cutting molding is improved.
Patent Information
- Application Number
- CN202421091791.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-20
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2034-05-20
AI Technical Summary
During the semiconductor rib cutting process, the power punch is prone to curling edges, affecting the rib cutting effect.
A power punch structure of semiconductor rib cutting molding equipment is designed, and a compression mechanism includes a guide column, a buffer spring and an extrusion column. Through the cooperation of the guide column and the limiting plate, the buffer spring is driven to extrude to ensure that the cutting mold and the part to be cut are completely pressed and fixed.
It effectively avoids the generation of curled edges, improves the effect of rib molding, and ensures the integrity and accuracy of the edge cutting process.
Smart Images
Figure CN222643111U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor molding, in particular to a power punch structure of semiconductor rib cutting and molding equipment. Background Art
[0002] In the production process of semiconductors, it is necessary to cut and shape the semiconductor wafers after packaging, so as to remove the extra pins on the outer edge of the semiconductor wafers. In this process, stamping is required, and the punch is used to drive the punch to cut and shape the semiconductor wafers on the die to achieve the effect of trimming. In this process, when the power punch directly cuts the semiconductor wafers on the cutting and shaping mold, curling is easily generated, which affects the cutting effect. Utility Model Content
[0003] The utility model aims to solve the problems in the prior art and proposes a power punch structure for semiconductor rib cutting and forming equipment.
[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0005] A power punch structure of semiconductor rib cutting and forming equipment includes a frame, the upper end of the frame is connected to a driving component, the lower end of the frame is connected to a punch mechanism, the punch mechanism includes a shell and a rib cutting mold installed at the lower end of the shell; a cavity with an opening facing downward is provided inside the shell; a clamping mechanism is connected in the cavity; the clamping mechanism includes a guide column and a buffer spring sleeved on the guide column; an extrusion column is slidably connected to the lower end of the guide column; the side wall of the extrusion column is in contact with the inner wall of the cavity; and the bottom end height of the extrusion column is less than the bottom end height of the rib cutting mold; the upper end of the buffer spring abuts against the top of the cavity; the lower end of the buffer spring abuts against the upper end of the extrusion column.
[0006] Preferably, the upper end of the guide column is fixedly connected to the upper end of the cavity; the lower end of the guide column is fixedly connected to a limiting plate; a limiting groove matching the limiting plate is provided on the inner side of the extrusion column; the limiting plate is arranged in the limiting groove and is slidably connected to the inner wall of the limiting groove.
[0007] Preferably, the height of the limiting groove is greater than the length of the guide column.
[0008] Preferably, the distance from the upper end of the extrusion column to the upper end of the cavity is greater than the difference in height between the bottom end of the extrusion column and the bottom end of the rib cutting mold.
[0009] Preferably, two load-bearing plates are fixedly connected to the upper end of the shell; the two load-bearing plates are symmetrically arranged at the upper end of the shell; and the load-bearing plates are fixedly connected to the frame.
[0010] Preferably, a rubber layer is connected to the lower end of the extrusion column.
[0011] Compared with the prior art, the utility model provides a power punch structure of a semiconductor rib cutting and forming device, which has the following beneficial effects:
[0012] The power punch structure of the semiconductor rib cutting and forming equipment drives the stamping mechanism and the buffer mechanism to move downward at the same time by starting the driving component. The lower end of the extrusion column first contacts the workpiece to be cut, and can press and fix the workpiece to be cut. At the same time, the driving component drives the stamping mechanism to continue pressing down, and the guide column slides downward on the inner wall of the limiting groove through the limiting plate, which can drive the buffer spring to squeeze until the rib cutting mold at the lower end of the stamping mechanism is squeezed with the workpiece to be cut, completing the rib cutting process, that is, the workpiece to be cut is completely pressed and fixed during cutting, which can avoid the generation of curling and increase the rib cutting and forming effect.
[0013] The parts not involved in the device are the same as those in the prior art or can be implemented by using the prior art. The utility model has a simple structure and is easy to operate. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a structural schematic diagram of the utility model;
[0015] Figure 2 It is a partial structural schematic diagram of the utility model;
[0016] Figure 3 It is a front cross-sectional view of the utility model;
[0017] Figure 4 It is a front cross-sectional view of the utility model when cutting tendons.
[0018] In the figure: 10 frame, 11 driving component, 12 load-bearing plate, 20 punch mechanism, 21 shell, 22 rib cutting die, 23 cavity, 30 clamping mechanism, 31 guide column, 32 buffer spring, 33 extrusion column, 34 limit plate, 35 limit groove, 40 rubber layer. DETAILED DESCRIPTION
[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.
[0020] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.
[0021] Reference Figure 1-4 A power punch structure of semiconductor rib cutting and forming equipment includes a frame 10, a driving component 11 is connected to the upper end of the frame 10, a punch mechanism 20 is connected to the lower end of the frame 10, and the punch mechanism 20 includes a shell 21 and a rib cutting mold 22 installed at the lower end of the shell 21; a cavity 23 with an opening facing downward is provided inside the shell 21; a clamping mechanism 30 is connected inside the cavity 23; the clamping mechanism 30 includes a guide column 31 and a buffer spring 32 sleeved on the guide column 31; the lower end of the guide column 31 is slidably connected to an extrusion column 33; the lower end of the extrusion column 33 is connected to a rubber layer 40 to avoid wear on the original semiconductor sheet during extrusion.
[0022] The side wall of the extrusion column 33 fits with the inner wall of the cavity 23; and the bottom end height of the extrusion column 33 is less than the bottom end height of the rib cutting mold 22; the upper end of the guide column 31 is fixedly connected to the upper end of the cavity 23; the lower end of the guide column 31 is fixedly connected to the limiting plate 34; the inner side of the extrusion column 33 is provided with a limiting groove 35 matching the limiting plate 34; the limiting plate 34 is arranged in the limiting groove 35 and is slidably connected to the inner wall of the limiting groove 35; the upper end of the buffer spring 32 abuts against the top of the cavity 23; the lower end of the buffer spring 32 abuts against the upper end of the extrusion column 33.
[0023] The height of the limit groove 35 is greater than the length of the guide column 31, ensuring that the guide column 31 can slide downward; the distance from the upper end of the extrusion column 33 to the upper end of the cavity 23 is greater than the difference in height between the bottom end of the extrusion column 33 and the bottom end of the rib cutting mold 22, so that the bottom ends of the rib cutting molds 22 at both ends can cut the ribs when the extrusion column 33 is extruded.
[0024] During use, the driving component 11 is started to drive the stamping mechanism 20 and the buffer mechanism 30 to move downward at the same time until the lower end of the extrusion column 33 contacts the workpiece to be cut. The driving component 11 drives the stamping mechanism 20 to continue to press down, and the guide column 31 slides downward on the inner wall of the limiting groove 35 through the limiting plate 34, and drives the buffer spring 32 to extrude and reduce shock until the rib cutting die 22 at the lower end of the stamping mechanism 20 is squeezed with the workpiece to be cut. After the rib cutting is completed, the stamping mechanism 20 is driven to move upward by the driving component 11, and the guide column 31 slides upward on the inner wall of the limiting groove 35 through the limiting plate 34, and the buffer spring 32 is restored until the limiting plate 34 moves to the uppermost end of the limiting groove 35 and drives the extrusion column 33 at the lower end to move upward, completing the rib cutting process.
[0025] Two load-bearing plates 12 are fixedly connected to the upper end of the shell 21; the two load-bearing plates 12 are symmetrically arranged at the upper end of the shell 21; and the load-bearing plates 12 are fixedly connected to the frame 10. By arranging the load-bearing plates 12, the two ends of the stamping mechanism 20 are evenly stressed, thereby increasing the stress on the rib cutting mold 22 at the lower end of the stamping mechanism 20.
[0026] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A power punch structure of a semiconductor cutting and forming device, comprising a frame (10), the upper end of the frame (10) is connected to a driving component (11), and the lower end of the frame (10) is connected to a punch mechanism (20), characterized in that: The punch mechanism (20) comprises a shell (21) and a rib cutting die (22) mounted at the lower end of the shell (21); a cavity (23) with an opening facing downward is provided inside the shell (21); a clamping mechanism (30) is connected inside the cavity (23); the clamping mechanism (30) comprises a guide column (31) and a buffer spring (32) sleeved on the guide column (31); a pressing column (33) is slidably connected to the lower end of the guide column (31); the side wall of the pressing column (33) is in contact with the inner wall of the cavity (23); and the bottom end height of the pressing column (33) is less than the bottom end height of the rib cutting die (22); the upper end of the buffer spring (32) is in contact with the top of the cavity (23); and the lower end of the buffer spring (32) is in contact with the upper end of the pressing column (33).
2. The power punch structure of semiconductor cutting and forming equipment according to claim 1, characterized in that: The upper end of the guide column (31) is fixedly connected to the upper end of the cavity (23); the lower end of the guide column (31) is fixedly connected to a limiting plate (34); a limiting groove (35) matching the limiting plate (34) is provided on the inner side of the extrusion column (33); the limiting plate (34) is arranged in the limiting groove (35) and is slidably connected to the inner wall of the limiting groove (35).
3. The power punch structure of semiconductor cutting and forming equipment according to claim 2, characterized in that: The height of the limiting groove (35) is greater than the length of the guide column (31).
4. The power punch structure of semiconductor cutting and forming equipment according to claim 1, characterized in that: The distance from the upper end of the extrusion column (33) to the upper end of the cavity (23) is greater than the height difference between the bottom end of the extrusion column (33) and the bottom end of the rib cutting die (22).
5. The power punch structure of semiconductor cutting and forming equipment according to claim 1, characterized in that: Two load-bearing plates (12) are fixedly connected to the upper end of the shell (21); the two load-bearing plates (12) are symmetrically arranged on the upper end of the shell (21); and the load-bearing plates (12) are fixedly connected to the frame (10).
6. The power punch structure of semiconductor cutting and forming equipment according to claim 1, characterized in that: The lower end of the extrusion column (33) is connected to a rubber layer (40).