Piezoelectric sensor production line

Abstract

The utility model provides a piezoelectric sensor production line. The piezoelectric sensor production line comprises a first assembly station, a second assembly station, a third assembly station, a fourth assembly station and a conveying device, wherein the first assembly station, the second assembly station, the third assembly station and the fourth assembly station are sequentially arranged along a transmission direction; the first assembly station is used for feeding a back plate and a PCB (Printed Circuit Board) onto the carrying disc and respectively assembling and fixing the pressing sheets on the back plate and the PCB; the second assembly station is used for respectively assembling and fixing the back plate and the PCB which are provided with the pressing sheets with the electric connecting wire; the third assembly station is used for overturning the PCB assembled with the electric connecting wire and then assembling and fixing the PCB and the back plate assembled with the electric connecting wire to form an assembly component; and the fourth assembly station is used for assembling and fixing the assembly component and the contact pin to form the piezoelectric sensor, and testing and marking the piezoelectric sensor. According to the piezoelectric sensor production line, high-precision and automatic assembly and manufacturing of the piezoelectric sensor can be realized, so that the product quality and the working efficiency are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of product assembly and testing, and more specifically, to a piezoelectric sensor production line. Background Art

[0002] Piezoelectric sensor is a self-generating and electromechanical conversion sensor based on piezoelectric effect. Its sensitive element is made of piezoelectric material. Its working principle is that the surface of piezoelectric material generates charge after force is applied. This charge is amplified and converted into impedance by charge amplifier and measurement circuit to become an electrical output proportional to the external force. Piezoelectric sensor is used to measure force and non-electrical physical quantity that can be converted into electricity.

[0003] With the development of industrialization, the demand for piezoelectric sensors is increasing, and the requirements for production output and accuracy are getting higher and higher. Utility Model Content

[0004] In view of the above problems, the utility model provides a piezoelectric sensor production line that can achieve high-precision and automated assembly and manufacturing of piezoelectric sensors, thereby improving product quality and work efficiency.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] The utility model provides a piezoelectric sensor production line, which comprises a first assembly station, a second assembly station, a third assembly station and a fourth assembly station which are sequentially arranged along a transmission direction, and a conveying device for transmitting a carrier between each station; the first assembly station is used for feeding a back plate and a PCB board onto the carrier, and respectively assembling and fixing a pressing sheet on the back plate and the PCB board; the second assembly station is used for respectively assembling and fixing a back plate and a PCB board equipped with a pressing sheet with electrical connecting wires; the third assembly station is used for flipping the PCB board equipped with the electrical connecting wires and assembling and fixing it with the back plate equipped with the electrical connecting wires to form an assembly component; the fourth assembly station is used for assembling and fixing the assembly component with a pin to form a piezoelectric sensor, and testing and marking the piezoelectric sensor.

[0007] The preferred solution is that the first assembly station comprises a first loading device, a first glue dispensing device and a tablet pressing assembly device which are sequentially arranged along the carrier transmission direction;

[0008] The first loading device is used to load the back panel and PCB board onto the carrier plate on the conveying device; the first glue dispensing device is used to dispense glue on the surface of the back panel and PCB board and perform glue dispensing effect test; the tablet assembly device is used to load the tablet and crimp the tablet to the glue dispensing position of the back panel and PCB board.

[0009] Preferably, the first assembly station further comprises a first pressing plate installation device, a first heating and cooling device and a first pressing plate removal device which are sequentially arranged downstream of the tablet assembly device;

[0010] The first pressure plate installation device is used to press the plate to load the material and press the plate onto the carrier after passing through the tablet assembly device and lock it; the first heating and cooling device is used to heat and then cool the carrier on which the pressure plate is fixed; the first pressure plate removal device is used to remove the pressure plate on the carrier after passing through the first heating and cooling device.

[0011] The preferred solution is that the first loading device includes a backplane silo, a PCB board silo and a first conveying mechanism; the first conveying mechanism is configured to take the backplane from the backplane silo and convey it to the carrier, and take the PCB board from the PCB board silo and convey it to the carrier; the tablet assembly device includes a tablet silo and a second conveying mechanism; the second conveying mechanism is configured to take the tablet from the tablet silo and place the tablet at the glue dispensing position of the backplane and the PCB board.

[0012] The preferred solution is that the second assembly station includes a wire welding workbench, a second glue dispensing device and a glue curing device arranged in sequence along the carrier transmission direction;

[0013] The wire welding workbench is used for manually welding the backplane and the PCB board to the electrical connection wires respectively; the second glue dispensing device is used for dispensing UV glue on the backplane and the PCB board; the glue curing device is used for curing the UV glue on the backplane and the PCB board.

[0014] The preferred solution is that the third assembly station includes a flipping glue dispensing device and a backplane assembly device sequentially arranged along the carrier transmission direction;

[0015] The flipping and glue dispensing device is used to flip the PCB board equipped with electrical connecting wires and dispense glue on the PCB board; the backplane assembly device is used to pick up the backplane and press the backplane onto the PCB board to form an assembly component.

[0016] Preferably, the third assembly station further comprises a second pressing plate installation device, a second heating and cooling device and a second pressing plate removal device which are sequentially arranged downstream of the back plate assembly device;

[0017] The second pressure plate installation device is used to press the plate to load the material and press the plate onto the carrier after passing through the backplane assembly device and lock it; the second heating and cooling device is used to heat and then cool the carrier on which the pressure plate is fixed and the assembly components on the carrier; the second pressure plate removal device is used to remove the pressure plate on the carrier after passing through the second heating and cooling device.

[0018] The preferred solution is that the flipping and dispensing device includes a clamping module, a flipping module and a dispensing module; the clamping module is used to clamp the PCB board on the carrier and place it on the flipping module; the flipping module is used to fix the PCB board and flip it 180°; the dispensing module is used to dispense glue on the upward surface of the PCB board.

[0019] The preferred solution is that the fourth assembly station includes a pin installation device and a manual wire arrangement workbench sequentially arranged along the carrier transmission direction;

[0020] The pin installation device is used to assemble and fix the assembly component and the pin to form a piezoelectric sensor, and to test and laser code the piezoelectric sensor; the manual wire management workbench is used to manually manage the wires and apply RTV glue to the piezoelectric sensor.

[0021] A preferred solution is that the pin installation device includes a turntable for carrying a cache assembly component, a pin module, a test module and a transfer module arranged around the outside of the turntable; the pin module is used to assemble the pin on the assembly component to form a piezoelectric sensor; the test module is used to test and laser code the piezoelectric sensor; the transfer module is used to transfer the piezoelectric sensor after passing through the test module to a manual wire management workbench.

[0022] The beneficial effects of the utility model are:

[0023] The utility model realizes high-precision and automatic assembly and automatic detection of piezoelectric sensors through the cooperation of a first assembly station, a second assembly station, a third assembly station and a fourth assembly station arranged in sequence and a conveying device for transmitting the carrier between each station. The labor intensity is low, the production is stable, the detection result is accurate, the product yield is high, and the product quality is guaranteed. The entire production line realizes automatic assembly and testing of products, solves the impact of manual assembly, greatly saves labor costs, improves production efficiency, and meets the requirements for production output and precision. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The specific implementation of the utility model is further described in detail below with reference to the accompanying drawings.

[0025] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0026] Figure 2 It is a structural schematic diagram of the first assembly station of the utility model.

[0027] Figure 3 It is a structural schematic diagram of the second assembly station of the utility model.

[0028] Figure 4 It is a structural schematic diagram of the third assembly station of the utility model.

[0029] Figure 5 It is a structural schematic diagram of the fourth assembly station of the utility model.

[0030] Reference numerals:

[0031] 11. First feeding device; 12. First dispensing device; 121. Mobile module; 122. Dispensing valve; 123. Alignment camera; 124. Laser calibrator; 13. Tablet assembly device; 14. First pressing plate installation device; 15. First heating and cooling device; 16. First pressing plate removal device; 111. Back plate material bin; 112. PCB board material bin; 113. First transport mechanism; 131. Tablet material bin; 132. Second transport mechanism; 21. Wire welding workbench; 211. Back plate welding table; 212. PCB board welding table; 22. Second dispensing device; 23. Glue curing device; 231. UV curing device light box; 31. flip dispensing device; 32. back panel assembly device; 321. assembly robot; 33. second pressure plate installation device; 34. second heating and cooling device; 35. second pressure plate removal device; 41. pin installation device; 42. manual wiring workbench; 411. turntable, 412. pin module; 413. test module; 414. transfer module; 51. belt line; 52. lifting module; 53. four-axis robot module; 54. unloading tray; 6. carrier; 71. pressure plate transport locking mechanism; 72. pressure plate transport removal mechanism; 73. oven; 74. cooling furnace; 75. unloading carrier. DETAILED DESCRIPTION

[0032] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention.

[0033] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0034] Techniques and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the techniques and equipment should be considered part of the specification.

[0035] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0036] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0037] In order to solve the problems of complex manual operation, low safety, poor stability, low efficiency and poor precision in the production process of piezoelectric sensors, the utility model provides a piezoelectric sensor production line for assembling piezoelectric sensors, the piezoelectric sensor includes a back plate, a PCB board, a pressing sheet, an electrical connection line and a pin, combined with Figures 1 to 5 As shown, specifically, the piezoelectric sensor production line includes a first assembly station, a second assembly station, a third assembly station and a fourth assembly station arranged in sequence along a transmission direction and a conveying device for transferring the carrier 6 between each station; the first assembly station is used to feed the back plate and the PCB board onto the carrier 6, and to assemble and fix the pressing plate on the back plate and the PCB board respectively; the second assembly station is used to weld and fix the back plate and the PCB board equipped with the pressing plate to the electrical connecting wires respectively; the third assembly station is used to flip the PCB board welded with the electrical connecting wires and assemble and fix it to the back plate welded with the electrical connecting wires to form an assembly component; the fourth assembly station is used to assemble and fix the assembly component to the pins to form a piezoelectric sensor, and to test and mark the piezoelectric sensor. The above-mentioned transmission direction is the direction in which the conveying device conveys the carrier 6, specifically Figure 1 The horizontal arrow in the figure indicates the direction. This production line overcomes the problem that the existing technology cannot complete high-precision assembly and manufacturing, can reduce labor intensity, make production more stable, improve yield, and accurately detect results, and ensure product quality with high assembly precision; this utility model can improve the one-time success rate of piezoelectric sensor production, ensure production capacity, and has low requirements for personnel operation. The automatic calibration of the entire production line is stable and has a high success rate. The original production line with 18 people has saved 14 people through this automated production line.

[0038] In addition, due to the small size of the piezoelectric sensor product itself, the glue dispensing quantity and accuracy requirements are high, and the manual operation is unstable, which will lead to low production capacity and high cost. The production line provided by this application solves the above problems well by automating the assembly and detection of piezoelectric sensors and using a glue dispensing device to automatically dispense glue.

[0039] In a specific embodiment, the first assembly station includes a first loading device 11, a first glue dispensing device 12, and a tablet assembly device 13 which are sequentially arranged along the transmission direction of the carrier 6; the first loading device 11 is used to load the back panel and the PCB board onto the carrier 6 on the conveying device; the first glue dispensing device 12 is used to dispense glue on the upward surfaces of the back panel and the PCB board and perform a glue dispensing effect test; the tablet assembly device 13 is used to load the tablet and crimp the tablet at the glue dispensing position of the back panel and the PCB board.

[0040] Furthermore, the first assembly station also includes a first pressure plate installation device 14, a first heating and cooling device 15 and a first pressure plate removal device 16 which are arranged in sequence downstream of the tablet assembly device 13; the first pressure plate installation device 14 is used to press the plate material and press the plate onto the carrier 6 after passing through the tablet assembly device 13 and lock it. At this time, the pressure plate, the back plate and the PCB board are all pressed down and fixed between the pressure plate and the carrier 6; the first heating and cooling device 15 is used to first heat and then cool the carrier 6 to which the pressure plate is fixed; the first pressure plate removal device 16 is used to remove the pressure plate on the carrier 6 after passing through the first heating and cooling device 15.

[0041] More specifically, the first loading device 11 includes a backplane material bin 111, a PCB board material bin 112 and a first conveying mechanism 113; the first conveying mechanism 113 is configured to take the backplane from the backplane material bin 111 and convey it to the carrier 6, and take the PCB board from the PCB board material bin 112 and convey it to the carrier 6; the first dispensing device 12 includes a moving module 121 and a dispensing valve 122 configured at the moving end of the moving module 121, a positioning camera 123 and a laser calibrator 124, and a dispensing needle is set on the dispensing valve 122; the tablet assembly device 13 includes a tablet silo 131 and a second conveying mechanism 132; the second conveying mechanism 132 is configured to take the tablet from the tablet silo 131 and place the tablet at the dispensing position of the backplane and the PCB board.

[0042] When the carrier 6 is transported by the conveying device to the first loading device 11, the first loading device 11 loads the back panel and the PCB board from the back panel material bin 111 and the PCB board material bin 112 to the carrier 6 through the first conveying mechanism 113, and then the carrier 6 is transported to the first dispensing device 12. After reaching the position, the carrier 6 will be lifted by the lifting module to wait for the first dispensing device 12 to dispense glue. Before dispensing glue through the dispensing needle on the dispensing valve 122, it will first be photographed and positioned by the moving module 121 in cooperation with the alignment camera 123. After the alignment is completed, the back panel and the PCB board are respectively dispensed glue; after the dispensing glue is completed, the dispensing glue effect is detected by the alignment camera 123; then the carrier 6 is transported to the tablet assembly device 13, and the tablet on the tablet material bin 131 is placed on the back panel and the PCB board by the second conveying mechanism 132; the back panel and the PCB board with the tablet placed on them are transported to the first pressure plate installation device by the conveying device together with the carrier 6. 14 is used to fix the pressing plate on the carrier 6, and the pressing plate transporting and locking mechanism 71 takes out the pressing plate in the pressing plate bin and locks the pressing plate on the carrier 6 to form a fixed assembly; when the pressing plate and the carrier 6 are locked, the pressing piece, the back plate and the PCB board are all pressed down and fixed between the pressing plate and the carrier 6, and then the fixed assembly is transported to the first heating and cooling device 15 for heating and then cooling, and the fixed assembly will first enter the oven 73 for heating for a specified time and then be sent to the cooling furnace 74 for rapid cooling to ensure that the pressing piece is stably pasted on the back plate or the PCB board; after the heating and cooling are completed, the fixed assembly will be transported to the first pressing plate removal device 16 for pressing plate removal, and the pressing plate transporting and removal mechanism 72 will remove the pressing plate from the carrier 6 and transport it to the pressing plate bin; the above-mentioned first transport mechanism 113, moving module 121, second transport mechanism 132, pressing plate transporting and locking mechanism 71, pressing plate transporting and removal mechanism 72 can all be three-axis linear modules with clamps.

[0043] In a specific embodiment, the second assembly station includes a wire welding workbench 21, a second glue dispensing device 22 and a glue curing device 23 which are sequentially arranged along the transmission direction of the carrier 6; the wire welding workbench 21 is used to manually weld the backplane and the PCB board to the electrical connection wires respectively; the second glue dispensing device 22 is used to dispense UV glue on the backplane and the PCB board; the glue curing device 23 is used to cure the UV glue on the backplane and the PCB board; specifically, the backplane and the PCB board after the tabletting assembly are transported by the conveying device together with the carrier 6 to the wire welding workbench 21 of the second assembly station for manual welding of the electrical connection wires, and the wire welding workbench 21 includes two, wherein One is a backplane welding station 211, and the other is a PCB board welding station 212; after the welding is completed, the carrier plate 6 is transported to the second glue dispensing device 22 for UV glue dispensing. Before glue dispensing, visual positioning is required to ensure the accuracy of the glue dispensing position. After the glue dispensing is completed, the glue dispensing effect is detected. It should be noted that the glue output of the glue dispensing device must be calibrated before glue dispensing, and the glue dispensing needle is calibrated in conjunction with the laser calibrator. In this embodiment, the second glue dispensing device 22 has the same specific structure as the first glue dispensing device 12; after the UV glue is dispensing, the carrier plate 6 is transported to the UV curing light box 231 for UV glue curing, and the UV curing light box 231 adopts a black shielding cover.

[0044] In a specific embodiment, the third assembly station includes a flipping and gluing device 31 and a backplane assembly device 32 which are arranged in sequence along the transmission direction of the carrier 6; the flipping and gluing device 31 is used to flip the PCB board equipped with electrical connecting wires and dispense glue on the PCB board; the backplane assembly device 32 is used to pick up the backplane and press the backplane onto the PCB board to form an assembly component.

[0045] Furthermore, it also includes a second pressure plate installation device 33, a second heating and cooling device 34 and a second pressure plate removal device 35 which are arranged in sequence downstream of the back plate assembly device 32; the second pressure plate installation device 33 is used to press the plate material and press the plate onto the carrier 6 after passing through the back plate assembly device 32 and lock it. At this time, the assembly component is pressed down and fixed between the pressure plate and the carrier 6; the second heating and cooling device 34 is used to heat and then cool the carrier 6 fixed with the pressure plate; the second pressure plate removal device 35 is used to remove the pressure plate on the carrier 6 after passing through the second heating and cooling device 34.

[0046] Specifically, the flipping and dispensing device 31 includes a clamping module, a flipping module and a dispensing module. The clamping module and the flipping module can both be manipulators with corresponding functions. The structure of the dispensing module can be the same as that of the first dispensing device 12; the clamping module is used to clamp the PCB board on the carrier 6 and place it on the flipping module; the flipping module is used to fix the PCB board and flip it 180°; the dispensing module is used to dispense glue on the upward surface of the PCB board. More specifically, when the UV glue is cured, the carrier plate 6 is transported to the flipping glue dispensing device 31. After the carrier plate 6 is in place, it will be lifted into place by the lifting module. The clamping module clamps the PCB board on the carrier plate 6 and places it on the flipping module. The flipping module drives the PCB board to flip 180°. Then the clamping module takes the flipped PCB board from the flipping module and places it on the carrier plate 6. When all the PCB boards on the carrier plate 6 are flipped, the glue dispensing module starts to dispense glue on the PCB board. Before dispensing, it is necessary to use a positioning camera to perform visual positioning. After the dispensing is completed, the positioning camera is used to detect the dispensing effect. It should be noted that the glue output of the glue dispensing module needs to be calibrated before dispensing, and the laser calibrator is used to calibrate the position of the glue dispensing needle. After flipping and dispensing, the carrier plate 6 is transported to the backplane assembly device 32. The backplane assembly device 32 includes an assembly robot 3 21, the back panel is grabbed by the assembly robot 321 and fastened to the PCB board; then the assembly component is transported to the second pressure plate installation device 33 together with the carrier plate 6 by the conveying device to fix the pressure plate on the carrier plate, and the pressure plate transport and locking mechanism 71 takes out the pressure plate in the pressure plate material bin and locks the pressure plate on the carrier plate 6 to form a fixed component; when the pressure plate and the carrier plate 6 are locked, the assembly component is fixed between the pressure plate and the carrier plate 6, and then the fixed component is transported to the second heating and cooling device 34 for heating and then cooling, the fixed component will first enter the oven 73 for heating for a specified time and then be sent to the cooling furnace 74 for rapid cooling to ensure the fixation between the back panel and the PCB board; after cooling is completed, the fixed component will be transported to the second pressure plate removal device 35 for pressure plate removal, and the pressure plate transport and removal mechanism 72 will remove the pressure plate from the carrier plate 6 and transport the pressure plate to the pressure plate material bin. It should be noted that the carrier plate 6 of the present invention includes a first area for carrying a back plate and a second area for carrying a PCB board, and the pressure plate can directly cover the above two areas to provide downward pressure on the back plate and the PCB board.

[0047] In a specific embodiment, the fourth assembly station includes a pin installation device 41 and a manual wire management workbench 42 which are arranged in sequence along the transmission direction of the carrier 6; the pin installation device 41 is used to assemble and fix the assembly components and the pins to form a piezoelectric sensor, and to test and laser code the piezoelectric sensor; the manual wire management workbench 42 is used to manually manage the piezoelectric sensor and apply RTV glue.

[0048] Furthermore, the pin installation device 41 includes a turntable 411 for carrying a cache assembly component, a pin module 412, a test module 413 and a transfer module 414 arranged around the outside of the turntable 411; the pin module 412 is used to assemble the pins on the assembly component to form a piezoelectric sensor; the test module 413 is used to test and laser code the piezoelectric sensor; the transfer module 414 is used to transfer the piezoelectric sensor after passing the test module to the manual wiring workbench 42 for manual wiring, and the operator at the wiring workbench 42 will place the several piezoelectric sensors after wiring is completed on a unloading carrier 75 with multiple carrying positions, and unload them as a whole onto the unloading tray 54.

[0049] More specifically, the conveying device includes a belt line 51, a lifting module 52 located at the head end of the belt line 51 for transporting the carrier 6 to the belt line 51, and a four-axis robot module 53 located at the tail end of the belt line 51 for transferring the products of the third workstation to the fourth workstation; the four-axis robot module 53 clamps and flips the assembly component at the second pressure plate removal device 35 so that the PCB board faces upward and then transfers it to the turntable 411, and the assembly component on the turntable 411 is rotated to the pin module 412 for pin installation. After the pin is installed, the piezoelectric sensor is transferred to the test module 413 for testing and laser coding, and finally the piezoelectric sensor rotates with the turntable 411 to the transfer module 414, and the qualified products are transferred to the manual wiring workbench 42 by the transfer module 414, and the piezoelectric sensor is manually wired and coated with RTV glue by the operator and then unloaded to the unloading tray 54.

[0050] In summary, the utility model realizes high-precision and automated assembly and automatic detection of piezoelectric sensors through the cooperation of the first assembly station, the second assembly station, the third assembly station and the fourth assembly station arranged in sequence and the conveying device for transmitting the carrier between each station. The labor intensity is low, the production is stable, the detection results are accurate, the product yield is high, and the product quality is guaranteed; and the entire production line realizes automatic assembly and testing of products, which solves the impact of manual assembly, greatly saves labor costs, improves production efficiency, and meets the requirements for production output and precision.

[0051] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not limitations on the implementation methods of the present invention. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the implementation methods here. All obvious changes or modifications derived from the technical solution of the present invention are still within the scope of protection of the present invention.

Claims

1. A piezoelectric sensor production line, characterized in that: The piezoelectric sensor production line includes a first assembly station, a second assembly station, a third assembly station and a fourth assembly station arranged in sequence along a transmission direction and a conveying device for transferring a carrier between each station; the first assembly station is used to feed a back plate and a PCB board onto the carrier, and to assemble and fix the pressing sheet on the back plate and the PCB board respectively; the second assembly station is used to assemble and fix the back plate and the PCB board equipped with the pressing sheet to the electrical connecting wires respectively; the third assembly station is used to flip the PCB board equipped with the electrical connecting wires and assemble and fix it to the back plate equipped with the electrical connecting wires to form an assembly component; the fourth assembly station is used to assemble and fix the assembly component to the pins to form a piezoelectric sensor, and to test and mark the piezoelectric sensor.

2. The piezoelectric sensor production line according to claim 1, characterized in that: The first assembly station includes a first loading device, a first glue dispensing device and a tablet pressing assembly device which are sequentially arranged along the carrier transmission direction; The first loading device is used to load the back panel and PCB board onto the carrier plate on the conveying device; the first glue dispensing device is used to dispense glue on the surface of the back panel and PCB board and perform glue dispensing effect test; the tablet assembly device is used to load the tablet and crimp the tablet to the glue dispensing position of the back panel and PCB board.

3. The piezoelectric sensor production line according to claim 2, characterized in that: The first assembly station further comprises a first pressing plate installation device, a first heating and cooling device and a first pressing plate removal device which are sequentially arranged downstream of the tablet assembly device; The first pressure plate installation device is used to press the plate to load the material and press the plate onto the carrier after passing through the tablet assembly device and lock it; the first heating and cooling device is used to heat and then cool the carrier on which the pressure plate is fixed; the first pressure plate removal device is used to remove the pressure plate on the carrier after passing through the first heating and cooling device.

4. The piezoelectric sensor production line according to claim 2, characterized in that: The first loading device includes a backplane silo, a PCB board silo and a first conveying mechanism; the first conveying mechanism is configured to take the backplane from the backplane silo and convey it to the carrier, and take the PCB board from the PCB board silo and convey it to the carrier; the tablet assembly device includes a tablet silo and a second conveying mechanism; the second conveying mechanism is configured to take the tablet from the tablet silo and place the tablet at the glue dispensing position of the backplane and the PCB board.

5. The piezoelectric sensor production line according to claim 1, characterized in that: The second assembly station includes a wire welding table, a second glue dispensing device and a glue curing device arranged in sequence along the carrier transmission direction; The wire welding workbench is used for manually welding the backplane and the PCB board to the electrical connection wires respectively; the second glue dispensing device is used for dispensing UV glue on the backplane and the PCB board; the glue curing device is used for curing the UV glue on the backplane and the PCB board.

6. The piezoelectric sensor production line according to claim 1, characterized in that: The third assembly station includes a flipping glue dispensing device and a backplane assembly device which are sequentially arranged along the carrier transmission direction; The flipping and glue dispensing device is used to flip the PCB board equipped with electrical connecting wires and dispense glue on the PCB board; the backplane assembly device is used to pick up the backplane and press the backplane onto the PCB board to form an assembly component.

7. The piezoelectric sensor production line according to claim 6, characterized in that: The third assembly station further comprises a second pressing plate installation device, a second heating and cooling device and a second pressing plate removal device which are sequentially arranged downstream of the backplane assembly device; The second pressure plate installation device is used to press the plate to load the material and press the plate onto the carrier after passing through the backplane assembly device and lock it; the second heating and cooling device is used to heat and then cool the carrier on which the pressure plate is fixed and the assembly components on the carrier; the second pressure plate removal device is used to remove the pressure plate on the carrier after passing through the second heating and cooling device.

8. The piezoelectric sensor production line according to claim 6, characterized in that: The flipping and dispensing device includes a clamping module, a flipping module and a dispensing module; the clamping module is used to clamp the PCB board on the carrier and place it on the flipping module; the flipping module is used to fix the PCB board and flip it 180°; the dispensing module is used to dispense glue on the upward surface of the PCB board.

9. The piezoelectric sensor production line according to claim 1, characterized in that: The fourth assembly station includes a pin installation device and a manual wire arrangement workbench arranged in sequence along the carrier transmission direction; The pin installation device is used to assemble and fix the assembly component and the pin to form a piezoelectric sensor, and to test and laser code the piezoelectric sensor; the manual wire management workbench is used to manually manage the wires and apply RTV glue to the piezoelectric sensor.

10. The piezoelectric sensor production line according to claim 9, characterized in that: The pin installation device includes a turntable for carrying a cache assembly component, a pin module, a test module and a transfer module arranged around the outer side of the turntable; the pin module is used to assemble the pin on the assembly component to form a piezoelectric sensor; The test module is used to test and laser code the piezoelectric sensor; The transfer module is used to transfer the piezoelectric sensor after passing through the test module to the manual wiring workbench.

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