Packaging container and vapor deposition system
By mixing the vapors of solid and liquid precursors in the packaging container, the problem of poor precursor transport stability during vapor deposition is solved, and a more uniform deposition layer quality and a longer precursor use cycle are achieved, thereby improving the machine's productivity.
Patent Information
- Application Number
- CN202421377189.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-17
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2034-06-17
AI Technical Summary
The prior art is difficult to effectively improve the transport stability of solid precursors during vapor deposition, resulting in uneven components, degradation of semiconductor layer mass, short period of replacement of precursors and waste of precursors.
A package container is designed, including a first cavity for filling the solid precursor and a second cavity for filling the liquid precursor, mixing the solid precursor vapor with the liquid precursor vapor through the first communication part, and the intake and outlet pipes are used to transport the carrier gas and the precursor vapor.
By mixing solid and liquid precursor vapors, the stability of the precursor is improved, the component uniformity of the vapor-phase deposition layer and the quality of the semiconductor layer are improved, the precursor usage cycle is extended, the precursor waste is reduced, and the machine's productivity is improved.