Correcting tool for wafer measuring machine
By setting a circular positioning origin and auxiliary positioning ring tool on the positioning surface of the sapphire wafer, the problem of inaccurate position alignment in semiconductor wafer processing is solved, accurate center alignment and correction are achieved, and the accuracy and consistency of measurement are improved.
CN222652082UActive Publication Date: 2025-03-21YUANSHAN ADVANCED MATERIAL TECH INC
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Patent Information
- Application Number
- CN202421819661.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-30
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2034-07-30
AI Technical Summary
Technical Problem
During semiconductor wafer processing, it is difficult for the prior art to achieve accurate wafer position alignment, resulting in process abnormalities and inaccurate measurement.
Method used
Design a wafer measurement machine correction tool, including setting a circular positioning origin and multiple auxiliary positioning rings on the positioning surface of the sapphire wafer, and achieving accurate center alignment and correction through these positioning structures.
Benefits of technology
The tooling can achieve convenient and accurate center alignment during wafer processing, reduce the disadvantages caused by center alignment errors, and ensure the accurate alignment and repeatability of the measured position.
✦ Generated by Eureka AI based on patent content.
Abstract
The utility model discloses a wafer measuring machine table correction tool which comprises a sapphire wafer, the diameter of the sapphire wafer is 100 mm, the length of a single flat edge of the sapphire wafer is 34 mm, the sapphire wafer is provided with a positioning surface, the center position of the positioning surface is provided with a circular positioning original point with the diameter being 1 mm, and the diameter of the circular positioning original point is 1 mm. A plurality of first auxiliary positioning circular rings are arranged on the outer side of the positioning original point at intervals of 2 mm, and the width of each first auxiliary positioning circular ring is 1 mm. According to the wafer measuring machine table correction tool, center alignment can be conveniently and accurately carried out in the wafer machining process, the wafer machining machine table is corrected, and badness caused by center alignment errors in the wafer machining process can be effectively reduced.
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