Light source assembly and projection device

Abstract

The utility model provides a light source assembly and a projection device, the light source assembly comprises a laser unit, the laser unit comprises a laser and a laser adapter plate, the laser is connected with the laser adapter plate, the laser comprises a laser chip and a laser driving plate, and the laser chip is used for receiving a driving signal of the laser driving plate and emitting a laser beam; the laser driving plate is arranged on the laser adapter plate, and the laser adapter plate surrounds at least the peripheral side of the laser driving plate; and the temperature detection unit comprises a temperature sensor, and the temperature sensor is attached to the laser driving plate and is used for detecting the temperature of the laser chip. The temperature detection accuracy can be improved, in addition, the production and assembly efficiency is improved, and the whole mechanism line is simplified.

Description

Technical Field

[0001] The present application relates to the field of projection technology, and in particular to a light source assembly and a projection device. Background Art

[0002] With the continuous development of society, people's pursuits are also changing, and projection devices are increasingly used in people's work and life. Projection devices mainly include light sources, optical machine systems and lenses.

[0003] At present, the projection device contains heating elements such as laser units (light sources) and main control chips on the main control circuit board. These devices require strict temperature control and generally adopt heat dissipation solutions such as air cooling or water cooling. In terms of light sources, the laser temperature is detected by fixing a lead NTC on the laser unit.

[0004] However, when using screw-fixed lead NTC, the thermal resistance from NTC to the laser is affected by factors such as the fixing angle, screw torque, and contact flatness. The thermal resistance consistency is poor, resulting in low temperature detection accuracy. Utility Model Content

[0005] The main purpose of the present application is to provide a light source assembly and a projection device, which can improve the accuracy of temperature detection, and also improve the production and assembly efficiency, thereby simplifying the overall machine line.

[0006] To achieve the above objectives, in a first aspect, the present application provides a light source assembly, including:

[0007] A laser unit, the laser unit includes a laser and a laser adapter board, the laser is connected to the laser adapter board, the laser includes a laser chip and a laser driver board, the laser chip is used to receive a driving signal from the laser driver board to emit a laser beam, the laser driver board is arranged on the laser adapter board, and the laser adapter board is arranged around at least one peripheral side of the laser driver board;

[0008] The temperature detection unit includes a temperature sensor, which is attached to the laser driving board and is used to detect the temperature of the laser chip.

[0009] The beneficial effects of the present application are: by attaching a temperature sensor, i.e., a SMD NTC, on the laser driver board, compared with the existing screw-fixed lead NTC, the thermal resistance from the NTC to the laser driver board is affected by factors such as the fixing angle, screw torque, and contact flatness, and the thermal resistance consistency is poor, resulting in inaccurate temperature detection. The SMD NTC setting method of the present application is closer to the laser chip, which can improve the accuracy of temperature detection and facilitate system design and expansion. In addition, there is no need for an external ambient temperature detection NTC and an external laser NTC, eliminating the connector of the temperature detection NTC, eliminating the lead NTC or NTC components and connecting wires, eliminating the operation of assembling the NTC, improving production and assembly efficiency, simplifying the entire machine line, and facilitating stacking design optimization.

[0010] Based on the above technical solution, the present application can also be improved as follows.

[0011] In some optional embodiments, it further includes a tube shell, which is arranged on the laser driving board, and the laser chip is located in the tube shell;

[0012] A first soldering pad and a plurality of second soldering pads are arranged on the laser driving board;

[0013] The temperature sensor is electrically connected to the first pad, and is located between the laser chip and the first pad, and is located on a side close to the laser chip, and the laser chip is electrically connected to the second pad.

[0014] In some optional embodiments, the laser chip has a plurality of first electrical connection sites, and the plurality of first electrical connection sites are electrically connected to the same second pad; or,

[0015] The laser chip has a plurality of second electrical connection positions, and the plurality of second electrical connection positions are electrically connected to the same second bonding pad.

[0016] In some optional embodiments, there is at least one laser chip, the at least one laser chip includes a first laser chip and a second laser chip, the tube shell includes a first tube shell and a second tube shell, the first laser chip is located in the first tube shell, and the second laser chip is located in the second tube shell;

[0017] The first laser chip and the second laser chip are arranged in a spaced relationship along a first direction, and the first laser chip and the second laser chip extend along a second direction;

[0018] There is an angle between the first direction and the second direction.

[0019] In some optional embodiments, the temperature sensor is located between the first laser chip and the second laser chip, so that the distance between the first laser chip and the temperature sensor and the distance between the second laser chip and the temperature sensor are the same;

[0020] When the first electrical connection points of multiple laser chips are electrically connected to the same second pad, or the second electrical connection points of multiple laser chips are electrically connected to the same second pad, the first pad and the multiple second pads are all located at one end of the laser driving board.

[0021] In some optional embodiments, the temperature sensor is attached to the middle of the laser driving board and is located between the side wall of the first laser chip and the side wall of the second laser chip;

[0022] In the first direction, a distance between a side wall of the first laser chip and a side wall of the temperature sensor facing the first laser chip and a distance between a side wall of the second laser chip and a side wall of the temperature sensor facing the second laser chip are the same.

[0023] In some optional embodiments, the temperature sensor is attached to one end of the laser driving board and is located between the end of the first laser chip and the end of the second laser chip;

[0024] In the second direction, the distance between the end of the first laser chip and the side wall of the temperature sensor facing the first laser chip and the distance between the end of the second laser chip and the side wall of the temperature sensor facing the second laser chip are the same.

[0025] In some optional embodiments, there is at least one temperature sensor, the at least one temperature sensor includes a first temperature sensor and a second temperature sensor, the first temperature sensor is located on a side of the first laser chip away from the second laser chip, and the first temperature sensor is used to detect the temperature of the first laser chip;

[0026] The second temperature sensor is located on a side of the second laser chip away from the first laser chip, and is used to detect the temperature of the second laser chip.

[0027] In a second aspect, the present application also provides a light source assembly, including:

[0028] The laser comprises a laser chip and a laser driving board, and the laser chip is used to receive a driving signal from the laser driving board to emit a laser beam;

[0029] Temperature sensor: The temperature sensor is attached to the laser driver board to detect the temperature of the laser chip.

[0030] On the third aspect, the present application also provides a projection device, including an optical machine, a lens and the above-mentioned light source assembly, the optical machine is used to receive the light beam emitted by the light source assembly, the lens is arranged on the optical machine, and the lens will image based on the light beam processed by the optical machine.

[0031] The present application provides a light source assembly and a projection device, wherein the projection device includes an optical machine, a lens, and the above-mentioned light source assembly, wherein the optical machine is used to receive a light beam emitted by the light source assembly, the lens is arranged on the optical machine, and the lens will image based on the light beam processed by the optical machine; wherein the light source assembly includes: a laser unit, wherein the laser unit includes a laser and a laser adapter board, wherein the laser is connected to the laser adapter board, wherein the laser includes a laser chip and a laser driver board, wherein the laser chip is used to receive a driving signal from the laser driver board to emit a laser beam, wherein the laser driver board is arranged on the laser adapter board, and wherein the laser adapter board is arranged around at least one circumference of the laser driver board; and a temperature detection unit, wherein the temperature detection unit includes a temperature sensor, wherein the temperature sensor is attached to the laser driver board, and wherein the temperature sensor is used to detect the temperature of the laser chip.

[0032] By attaching a temperature sensor, i.e., a chip NTC, on the laser driver board, compared to the existing screw-fixed lead NTC, the thermal resistance from the NTC to the laser driver board is affected by factors such as the fixing angle, screw torque, and contact flatness, and the thermal resistance consistency is poor, resulting in inaccurate temperature detection. The setting method of the chip NTC used in this application is closer to the laser chip, which can improve the accuracy of temperature detection and facilitate system design and expansion. In addition, there is no need for an external ambient temperature detection NTC and an external laser NTC, the connector of the temperature detection NTC is eliminated, the lead NTC or NTC components and connecting wires are eliminated, the operation of assembling the NTC is eliminated, the production assembly efficiency is improved, the whole machine line is simplified, and it is conducive to stacking design optimization. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0034] Figure 1 A schematic diagram of the structure of a light source assembly provided by the prior art;

[0035] Figure 2 A schematic diagram of assembling a temperature sensor in a light source assembly provided by the prior art;

[0036] Figure 3 A schematic diagram of the structure of a light source assembly provided in an embodiment of the present application;

[0037] Figure 4 A schematic diagram of the assembly of a laser and a temperature sensor in a light source assembly provided in an embodiment of the present application;

[0038] Figure 5 A schematic diagram of the assembly of the second laser and the temperature sensor in the light source assembly provided in an embodiment of the present application from a first viewing angle;

[0039] Figure 6 A schematic diagram of the assembly of the second laser and the temperature sensor in the light source assembly provided in an embodiment of the present application under a second viewing angle;

[0040] Figure 7 A schematic diagram of a first wiring assembly of a second type of laser and a temperature sensor in a light source assembly provided in an embodiment of the present application;

[0041] Figure 8 A schematic diagram of a second wiring assembly of a second laser and a temperature sensor in a light source assembly provided in an embodiment of the present application;

[0042] Fig. 9 A schematic diagram of a third wiring assembly of a second laser and a temperature sensor in a light source assembly provided in an embodiment of the present application;

[0043] Fig.10 A fourth wiring assembly schematic diagram of the second laser and the temperature sensor in the light source assembly provided in an embodiment of the present application;

[0044] Fig.11 A schematic diagram of assembling a third type of laser and a temperature sensor in a light source assembly provided in an embodiment of the present application;

[0045] Fig.12 A schematic diagram of a first wiring assembly of a third type of laser and a temperature sensor in a light source assembly provided in an embodiment of the present application;

[0046] Fig.13 A schematic diagram of a second wiring assembly of a third type of laser and a temperature sensor in a light source assembly provided in an embodiment of the present application;

[0047] Fig.14 A schematic diagram of a third wiring assembly of a third type of laser and a temperature sensor in a light source assembly provided in an embodiment of the present application;

[0048] Fig.15 This is a schematic diagram of assembling the fourth type of laser and temperature sensor in the light source assembly provided in an embodiment of the present application;

[0049] Fig.16 A schematic diagram of a first wiring assembly of a fourth type of laser and a temperature sensor in a light source assembly provided in an embodiment of the present application;

[0050] Fig.17 A schematic diagram of a second wiring assembly of a fourth type of laser and a temperature sensor in a light source assembly provided in an embodiment of the present application;

[0051] Fig.18 A schematic diagram of a third wiring assembly of a fourth type of laser and a temperature sensor in a light source assembly provided in an embodiment of the present application;

[0052] Fig.19 An exploded view of a projection device provided in an embodiment of the present application.

[0053] Description of reference numerals:

[0054] 100-light source assembly;

[0055] 110-Laser;

[0056] 111-Laser chip;

[0057] 1111-first laser chip;

[0058] 1112 - second laser chip;

[0059] 112-laser driver board;

[0060] 120-Laser adapter plate;

[0061] 130- temperature sensor;

[0062] 131- a first temperature sensor;

[0063] 132 - a second temperature sensor;

[0064] 133-connector;

[0065] 140-tube shell;

[0066] 141-first tube shell;

[0067] 142-second tube shell;

[0068] 150-first pad;

[0069] 160- second pad;

[0070] 170-main control circuit board;

[0071] 171-main control chip;

[0072] 180-power board;

[0073] 190-heat sink;

[0074] 191-Fan;

[0075] 192-Radiator. DETAILED DESCRIPTION

[0076] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application. All other embodiments obtained are within the scope of protection of the present application. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0077] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0078] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0079] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0080] Figure 1 A schematic diagram of the structure of a light source assembly provided by the prior art. Figure 2The schematic diagram of the assembly of the temperature sensor in the light source assembly provided by the prior art is as follows: Figure 1 and Figure 2 As shown, the light source assembly includes heating elements such as the laser unit 110 (light source) and the main control chip 171 on the main control circuit board 170. These devices require strict temperature control, and generally adopt heat dissipation solutions such as air cooling or water cooling. Heat dissipation control requires collecting device temperature, and the laser temperature is detected by fixing the temperature sensor 130 (lead NTC) on the laser unit. However, when using screw-fixed lead NTC, the thermal resistance from NTC to the laser is affected by factors such as the fixing angle, screw torque, and contact flatness. The thermal resistance consistency is poor, resulting in inaccurate temperature detection. In addition, the lead NTC includes connectors, connecting wires, and fixed metal sheets, which are more expensive. The production process requires separate assembly, which increases the operating procedures and reduces reliability.

[0081] In order to overcome the defects in the prior art, the light source assembly and projection device provided by the present application, by attaching a temperature sensor on the laser driver board, that is, a chip NTC, compared with the existing screw-fixed lead NTC, the thermal resistance from NTC to the laser driver board is affected by factors such as the fixing angle, screw torque, and contact flatness, and the thermal resistance consistency is poor, resulting in inaccurate temperature detection. The setting method of the chip NTC used in the present application is closer to the laser chip, which can improve the accuracy of temperature detection and facilitate system design and expansion. In addition, there is no need for an external ambient temperature detection NTC and an external laser NTC, eliminating the connector of the temperature detection NTC, eliminating the lead NTC or NTC assembly and connecting wires, eliminating the operation of assembling the NTC, improving the production and assembly efficiency, simplifying the entire machine line, and facilitating stacking design optimization.

[0082] The contents of the present application will be described in detail below in conjunction with the accompanying drawings so that those skilled in the art can understand the contents of the present application more clearly and in detail.

[0083] Figure 3 A schematic diagram of the structure of a light source assembly provided in an embodiment of the present application, Figure 4 This is a schematic diagram of the assembly of a laser and a temperature sensor in a light source assembly provided in an embodiment of the present application. Figure 5 This is a schematic diagram of the assembly of the second laser and the temperature sensor in the light source assembly provided in an embodiment of the present application from a first viewing angle, Figure 6 This is a schematic assembly diagram of a second laser and a temperature sensor in a light source assembly provided in an embodiment of the present application from a second viewing angle.

[0084] like Figures 3 to 6 As shown, the embodiment of the present application provides a light source assembly 100, including:

[0085] A laser 110 unit, the laser 110 unit includes a laser 110 and a laser adapter plate 120, the laser 110 is connected to the laser adapter plate 120, the laser 110 includes a laser chip 111 and a laser driving board 112, the laser chip 111 is used to receive a driving signal from the laser driving board 112 to emit a laser beam, the laser driving board 112 is arranged on the laser adapter plate 120, and the laser adapter plate 120 is arranged around at least one peripheral side of the laser driving board 112;

[0086] The temperature detection unit includes a temperature sensor 130 . The temperature sensor 130 is attached to the laser driving board 112 . The temperature sensor 130 is used to detect the temperature of the laser chip 111 .

[0087] Through the above-mentioned setting, that is, by attaching the temperature sensor 130, that is, the chip NTC, on the laser driver board 112, compared with the existing screw-fixed lead NTC, the thermal resistance from the NTC to the laser driver board 112 is affected by factors such as the fixing angle, the screw torque, and the contact flatness, and the thermal resistance consistency is poor, resulting in the problem of inaccurate temperature detection. The setting method of the chip NTC used in this application is closer to the laser chip 111, which can improve the accuracy of temperature detection and facilitate system design and expansion. In addition, there is no need for an external ambient temperature detection NTC and an external laser 110 NTC, the connector 133 of the temperature detection NTC is omitted, the lead NTC or NTC components and connecting wires are omitted, and the operation of assembling the NTC is omitted, thereby improving the production and assembly efficiency, simplifying the entire machine line, and facilitating stacking design optimization.

[0088] It should be noted that each structure is described in detail below.

[0089] It should be noted that the laser driver board 112 is used to carry the laser chip 111 and the lens module thereon, and is also used for heat dissipation and providing the laser chip 111 with an external connector 133. The laser adapter board 120 is used for an external power supply and is connected to the laser driver board 112 to provide a driving signal for the laser driver board 112.

[0090] In some embodiments, the laser 110 may be a monochromatic laser 110 , that is, the laser 110 may be a red laser 110 , a green laser 110 , a blue laser 110 , or the like.

[0091] The monochromatic laser 110 may be an MCL (multi-chip laser) type laser 110, so that the laser chips 111 included in the MCL type laser 110 all emit light beams of the same color. Of course, the structure of the monochromatic laser 110 may also be other structures, which will not be described in detail in the embodiment of the present invention.

[0092] It should be noted that when the light beam is emitted by the laser 110, a certain amount of heat will be generated. The heat will accumulate in the light source housing included in the light source assembly 100, thereby causing the temperature inside the light source housing to rise, that is, causing the ambient temperature of the laser 110 to rise. This can easily affect the performance of the laser 110 and further affect the projection effect of the projection device.

[0093] Therefore, it is necessary to detect the temperature of the laser 110 unit.

[0094] It should be noted that the temperature sensor 130 can be attached to the laser adapter board 120 or to the laser driving board 112 .

[0095] The temperature sensor 130 is attached in a manner such as soldering the temperature sensor 130 on the laser adapter board 120 or the laser driver board 112, and the temperature sensor 130 is welded to one side of the laser adapter board 120 or one side of the laser driver board 112. Different from the punching and threading installation, the punching and threading installation makes the thermal resistance from the temperature sensor 130 to the laser driver board 112 affected by factors such as the fixing angle, screw torque, and contact flatness, resulting in poor thermal resistance consistency and inaccurate temperature detection.

[0096] Of course, other methods may also be used to attach the temperature sensor 130 to the laser adapter board 120 or the laser driving board 112 .

[0097] The embodiment of the present application is mainly described by taking the example that the temperature sensor 130 can be attached to the laser driving board 112 .

[0098] In some embodiments, the temperature sensor 130 may be an NTC (Negative Temperature Coefficient) thermistor. Since the NTC thermistor has a long life, using the NTC thermistor as the temperature sensor 130 can increase the service life of the temperature sensor 130 and ensure the effectiveness of the temperature sensor 130 in detecting the laser 110 unit.

[0099] It should be noted that the NTC temperature sensor 130 is a thermistor with a negative temperature coefficient, whose resistance can decrease as the temperature increases. The measurement accuracy meets the temperature measurement requirements of the heat dissipation system and the cost is low.

[0100] It should be noted that the present application adopts the method of mounting NTC on the laser driving board 112, and can also adopt the temperature sensor 130 chip with integrated AD conversion to communicate with the SOC through the I2C interface.

[0101] like Figure 5 and Figure 6 As shown, in some optional embodiments, a tube shell 140 is further included, and the tube shell 140 is disposed on the laser driving board 112, and the laser chip 111 is located in the tube shell 140;

[0102] A first soldering pad 150 and a plurality of second soldering pads 160 are disposed on the laser driving board 112;

[0103] The temperature sensor 130 is electrically connected to the first pad 150 , and is located between the laser chip 111 and the first pad 150 , and is located on a side close to the laser chip 111 . The laser chip 111 is electrically connected to the second pad 160 .

[0104] It should be noted that the light source assembly 100 includes a tube shell 140 that forms an enclosed space, and the laser chip 111 is installed in the enclosed space. The sealing glass is used to seal the tube shell 140 so that the laser chip 111 is contained in a sealed environment. The laser chip 111 is installed on the laser driving board 112 to form the laser 110. The tube shell 140 can be made of ceramic material. An electrical conductive layer can be set inside the tube shell 140 to achieve conduction between the laser chip 111 and the laser driving board 112. The laser driving board 112 is provided with internal wiring, which is electrically connected to the laser adapter board 120 through the connecting pads on the laser driving board 112. The external power supply and driving signal can power the laser 110 through the laser adapter board 120 to light up the laser 110.

[0105] Specifically, the tube shell 140 may be annular, and the tube shell 140 and the laser driving board 112 may form an accommodation space. For each laser chip 111, the collimating lens and the reflecting component are sequentially arranged in the accommodation space and mounted on the laser driving board 112, and the laser chip 111 is mounted on the surface of the heat sink away from the laser 110 board. And for each light-emitting unit, the laser chip 111 is used to emit light to the collimating lens, the collimating lens is used to collimate the light emitted by the laser chip 111 and then emit it to the reflecting component, and the reflecting component is used to emit the light emitted by the collimating lens in a direction away from the laser driving board 112.

[0106] In some embodiments, the tube shell 140 can be formed using ceramic as a main material. In addition, the tube shell 140 is not limited to ceramics, and can also be formed by bonding a bottom member having a mounting surface formed using metal or a composite containing metal as a main material, and a frame member having a wiring pattern formed using ceramic as a main material. For example, among ceramics, aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide can be used as the main material of the tube shell 140. Among metals, copper, aluminum, iron, and composites, copper-molybdenum, copper-diamond composite materials, and copper-tungsten can be used as the main material of the tube shell 140.

[0107] It should be noted that, for the laser driving board 112 , an NTC may also be provided on the laser driving board 112 , and the NTC signal may be led out through the connector 133 of the laser 110 .

[0108] Of course, the temperature sensor 130 can also be connected to the main controller AD interface through the first pad 150, or a temperature sensor 130 with AD output can be used, which is connected to the I2C bus of the main controller through the connector 133 via a bus interface such as I2C.

[0109] like Figure 5 and Figure 6 As shown, in some optional embodiments, the laser chip 111 has a plurality of first electrical connection positions, and the plurality of first electrical connection positions are electrically connected to the same second pad 160; or,

[0110] The laser chip 111 has a plurality of second electrical connection sites, and the plurality of second electrical connection sites are electrically connected to the same second bonding pad 160 .

[0111] In some embodiments, the laser chip 111 leads out the signal through the second pad 160, and the laser 110 can be a red laser 110, a green laser 110 or a blue laser 110, which means that the laser chip 111 can include a red laser chip 111, a green laser chip 111 and a blue laser chip 111, the red laser chip 111 has a red anode terminal and a red cathode terminal, the green laser chip 111 has a green anode terminal and a green cathode terminal, and the blue laser chip 111 has a blue anode terminal and a blue cathode terminal. Therefore, if the power is independently supplied, the laser driving board 112 is provided with 6 second pads 160, and if the cathode or anode is shared, the laser driving board 112 is provided with 4 second pads 160.

[0112] In some embodiments, the temperature sensor 130 leads out the signal through the first soldering pad 150 , and thus the laser driving board 112 is provided with two first soldering pads 150 .

[0113] That is, when multiple first electrical connection positions are electrically connected to the same second pad 160, multiple anode terminals of the laser chip 111 are electrically connected to different second pads 160, that is, a common cathode, and the laser driving board 112 is provided with 4 second pads 160 and 2 first pads 150, a total of 6 pads, such as Figure 6 shown.

[0114] When multiple second electrical connection positions are electrically connected to the same second pad 160, multiple cathode terminals of the laser chip 111 are electrically connected to different second pads 160, that is, a common anode. The laser driving board 112 is provided with 4 second pads 160 and 2 first pads 150, a total of 6 pads. Figure 6 shown.

[0115] When all power is supplied independently, the laser driving board 112 is provided with 6 second pads 160 and 2 first pads 150 , for a total of 8 pads.

[0116] Figure 7 This is a schematic diagram of a first wiring assembly of a second type of laser and a temperature sensor in a light source assembly provided in an embodiment of the present application. Figure 8 This is a schematic diagram of a second wiring assembly of a second laser and a temperature sensor in a light source assembly provided in an embodiment of the present application. Fig. 9 This is a schematic diagram of a third wiring assembly of the second laser and the temperature sensor in the light source assembly provided in an embodiment of the present application. Fig.10 This is a schematic diagram of the fourth wiring assembly of the second laser and the temperature sensor in the light source assembly provided in an embodiment of the present application.

[0117] like Figures 5 to 10 As shown, in some optional embodiments, there is at least one laser chip 111, the at least one laser chip 111 includes a first laser chip 1111 and a second laser chip 1112, the tube shell 140 includes a first tube shell 141 and a second tube shell 142, the first laser chip 1111 is located in the first tube shell 141, and the second laser chip 1112 is located in the second tube shell 142;

[0118] The first laser chip 1111 and the second laser chip 1112 are arranged in a spaced relationship along the first direction, and the first laser chip 1111 and the second laser chip 1112 extend along the second direction;

[0119] There is an angle between the first direction and the second direction.

[0120] It should be noted that the present application takes the first laser chip 1111 and the second laser chip 1112 as an example for explanation. Of course, according to actual conditions, the number of laser chips 111 can be multiple, and the arrangement of the multiple laser chips 111 is not too limited here.

[0121] In some embodiments, the first direction may be the length direction of the laser driving board 112 , and the second direction may be the width direction of the laser driving board 112 . The first laser chip 1111 and the second laser chip 1112 are spaced apart along the length direction of the laser driving board 112 , and the first laser chip 1111 and the second laser chip 1112 extend along the width direction of the laser driving board 112 .

[0122] In other embodiments, the first direction may be the width direction of the laser driving board 112 , the second direction may be the length direction of the laser driving board 112 , the first laser chip 1111 and the second laser chip 1112 are spaced apart along the width direction of the laser driving board 112 , and the first laser chip 1111 and the second laser chip 1112 extend along the length direction of the laser driving board 112 .

[0123] Among them, Figure 5 As shown, X represents the first direction and Y represents the second direction.

[0124] like Figures 5 to 10 As shown, in some optional embodiments, the temperature sensor 130 is located between the first laser chip 1111 and the second laser chip 1112, so that the distance between the first laser chip 1111 and the temperature sensor 130 and the distance between the second laser chip 1112 and the temperature sensor 130 are the same;

[0125] When the first electrical connection positions of multiple laser chips 111 are electrically connected to the same second pad 160 , or the second electrical connection positions of multiple laser chips 111 are electrically connected to the same second pad 160 , the first pad 150 and the multiple second pads 160 are both located at one end of the laser driving board 112 .

[0126] It should be noted that such a setting method can not only meet the accuracy of the temperature sensor 130 in detecting the temperature of the first laser chip 1111 and the second laser chip 1112, but also can position the first solder pad 150 and the plurality of second solder pads 160 at one end of the laser driving board 112, thereby simplifying the wiring method by utilizing the effective position on the laser driving board 112.

[0127] Of course, the specific setting location can be adjusted according to actual conditions.

[0128] It should be noted that, since there are two laser chip 111 arrays on the laser 110, a single temperature sensor 130, that is, NTC, is placed at a position equidistant from the two laser chips 111 to ensure the consistency of heat flow from each light source to the NTC. For multiple laser chip 111 arrays, the center position is also selected to place the NTC. The distance between the NTC and the laser chip 111 is less than 1 / 2 of the size of the laser chip 111.

[0129] Fig.11 This is a schematic diagram of assembling the third type of laser and temperature sensor in the light source assembly provided in an embodiment of the present application. Fig.12 This is a schematic diagram of the first wiring assembly of the third laser and the temperature sensor in the light source assembly provided in the embodiment of the present application. Fig.13This is a schematic diagram of the second wiring assembly of the third laser and the temperature sensor in the light source assembly provided in the embodiment of the present application. Fig.14 This is a schematic diagram of a third wiring assembly of a third laser and a temperature sensor in a light source assembly provided in an embodiment of the present application.

[0130] like Figures 11 to 14 As shown, in some optional embodiments, the temperature sensor 130 is attached to the middle of the laser driving board 112 and is located between the side wall of the first laser chip 1111 and the side wall of the second laser chip 1112;

[0131] In the first direction, the distance between the sidewall of the first laser chip 1111 and the sidewall of the temperature sensor 130 facing the first laser chip 1111 and the distance between the sidewall of the second laser chip 1112 and the sidewall of the temperature sensor 130 facing the second laser chip 1112 are the same.

[0132] It should be noted that the temperature sensor 130 is located between the first tube shell 141 and the second tube shell 142 . Considering the installation space of the temperature sensor 130 , the position between the first tube shell 141 and the second tube shell 142 needs to match the shape of the temperature sensor 130 .

[0133] Therefore, in some embodiments, the temperature sensor 130 extends in the second direction, which means that the extension direction of the temperature sensor 130 is consistent with the extension direction of the first laser chip 1111 and the second laser chip 1112. On the one hand, it can ensure that the temperature sensor 130 can detect the temperatures of the first laser chip 1111 and the second laser chip 1112 at the same time, and the temperature sensor 130 is closer to the first laser chip 1111 and the second laser chip 1112, so that the accuracy of detecting the first laser chip 1111 and the second laser chip 1112 is higher; on the other hand, the size between the first tube shell 141 and the second tube shell 142 can be reduced to achieve miniaturization of the laser 110 unit.

[0134] Specifically, the distance range between the side wall of the first laser chip 1111 and the side wall of the temperature sensor 130 facing the first laser chip 1111, or the distance range between the side wall of the second laser chip 1112 and the side wall of the temperature sensor 130 facing the second laser chip 1112, can be adjusted according to actual conditions and are not excessively restricted here.

[0135] like Figures 5 to 10 As shown, in some optional embodiments, the temperature sensor 130 is attached to one end of the laser driving board 112 and is located between the end of the first laser chip 1111 and the end of the second laser chip 1112;

[0136] In the second direction, the distance between the end of the first laser chip 1111 and the side wall of the temperature sensor 130 facing the first laser chip 1111 and the distance between the end of the second laser chip 1112 and the side wall of the temperature sensor 130 facing the second laser chip 1112 are the same.

[0137] It should be noted that in order to further miniaturize the laser 110 unit, the temperature sensor 130 is attached to the end of the laser driving board 112, so that there is no need to occupy the space between the first tube shell 141 and the second tube shell 142. Setting the temperature sensor 130 at the end is also convenient for wiring.

[0138] Specifically, the second pad 160 and the first pad 150 are both disposed at one end close to the temperature sensor 130 , which reduces the wiring distance and is safer.

[0139] Fig.15 This is a schematic diagram of assembling the fourth type of laser and temperature sensor in the light source assembly provided in an embodiment of the present application. Fig.16 This is a schematic diagram of a first wiring assembly of a fourth type of laser and a temperature sensor in a light source assembly provided in an embodiment of the present application. Fig.17 This is a schematic diagram of the second wiring assembly of the fourth laser and the temperature sensor in the light source assembly provided in the embodiment of the present application. Fig.18 This is a schematic diagram of the third wiring assembly of the fourth type of laser and the temperature sensor in the light source assembly provided in the embodiment of the present application. Figures 15 to 18 As shown, in some optional embodiments, there is at least one temperature sensor 130, and the at least one temperature sensor 130 includes a first temperature sensor 131 and a second temperature sensor 132, the first temperature sensor 131 is located on a side of the first laser chip 1111 away from the second laser chip 1112, and the first temperature sensor 131 is used to detect the temperature of the first laser chip 1111;

[0140] The second temperature sensor 132 is located on a side of the second laser chip 1112 away from the first laser chip 1111 , and is used to detect the temperature of the second laser chip 1112 .

[0141] It should be noted that the number of temperature sensors 130 can match the number of laser chips 111. That is, when there are two laser chips 111, there are also two temperature sensors 130. When there are three laser chips 111, there are also three temperature sensors 130. Each temperature sensor 130 can detect one laser chip 111 separately, thereby ensuring the accuracy of the detection data.

[0142] The embodiment of the present application is described by taking two laser chips 111 and two temperature sensors 130 as an example, wherein the first temperature sensor 131 needs to be arranged close to the first laser chip 1111 and far from the second laser chip 1112. Correspondingly, the second temperature sensor 132 needs to be arranged close to the second laser chip 1112 and far from the first laser chip 1111, so as to achieve the purpose that the temperature signal mainly comes from the corresponding laser chip 111.

[0143] For the independent detection solution, the distance between the NTC and the corresponding detection laser chip 111 is less than 1 / 3 of the size of the laser chip 111 , and the distance between the NTC and other laser chips 111 is greater than 1 times the size of the laser chip 111 .

[0144] That is, the distance between the first temperature sensor 131 and the first laser chip 1111 is less than 1 / 3 of the size of the first laser chip 1111 , and the distance between the first temperature sensor 131 and the second laser chip 1112 is greater than 1 times the size of the laser chip 1111 .

[0145] Accordingly, the distance between the second temperature sensor 132 and the second laser chip 1112 is less than 1 / 3 of the size of the first laser chip 1111 , and the distance between the second temperature sensor 132 and the first laser chip 1111 is greater than 1 times the size of the laser chip 1111 .

[0146] Example of control logic: When the temperature of the laser 110 is greater than 70°C for more than 10 seconds, the speed of the fan 191 is increased. When the speed of the fan 191 is at the highest level, the current of the laser 110 is reduced by one level until it is reduced to the lowest current limit level.

[0147] When the temperature of the laser 110 is greater than 78° C. and lasts for more than 10 seconds, an alarm is issued and a shutdown action is performed.

[0148] The light source assembly provided in the embodiment of the present application includes a laser unit, the laser unit includes a laser and a laser adapter board, the laser is connected to the laser adapter board, the laser includes a laser chip and a laser driver board, the laser chip is used to receive the driving signal of the laser driver board to emit a laser beam, the laser driver board is arranged on the laser adapter board, and the laser adapter board is arranged around at least one side of the laser driver board; a temperature detection unit, the temperature detection unit includes a temperature sensor, the temperature sensor is attached to the laser driver board, and the temperature sensor is used to detect the temperature of the laser chip.

[0149] By attaching a temperature sensor, i.e., a chip NTC, on the laser driver board, compared to the existing screw-fixed lead NTC, the thermal resistance from the NTC to the laser driver board is affected by factors such as the fixing angle, screw torque, and contact flatness, and the thermal resistance consistency is poor, resulting in inaccurate temperature detection. The setting method of the chip NTC used in this application is closer to the laser chip, which can improve the accuracy of temperature detection and facilitate system design and expansion. In addition, there is no need for an external ambient temperature detection NTC and an external laser NTC, the connector of the temperature detection NTC is eliminated, the lead NTC or NTC components and connecting wires are eliminated, the operation of assembling the NTC is eliminated, the production assembly efficiency is improved, the whole machine line is simplified, and it is conducive to stacking design optimization.

[0150] In addition, the embodiment of the present application further provides a light source assembly 100, including:

[0151] A laser 110, wherein the laser 110 comprises a laser chip 111 and a laser driving board 112, wherein the laser chip 111 is used to receive a driving signal from the laser driving board 112 to emit a laser beam;

[0152] The temperature sensor 130 is attached to the laser driving board 112 to detect the temperature of the laser chip 111 .

[0153] By attaching a temperature sensor, i.e., a chip NTC, on the laser driver board, compared to the existing screw-fixed lead NTC, the thermal resistance from the NTC to the laser driver board is affected by factors such as the fixing angle, screw torque, and contact flatness, and the thermal resistance consistency is poor, resulting in inaccurate temperature detection. The setting method of the chip NTC used in this application is closer to the laser chip, which can improve the accuracy of temperature detection and facilitate system design and expansion. In addition, there is no need for an external ambient temperature detection NTC and an external laser NTC, the connector of the temperature detection NTC is eliminated, the lead NTC or NTC components and connecting wires are eliminated, the operation of assembling the NTC is eliminated, the production assembly efficiency is improved, the whole machine line is simplified, and it is conducive to stacking design optimization.

[0154] also, Fig.19 An exploded view of a projection device provided in an embodiment of the present application, such as Figures 3 to 19 As shown, an embodiment of the present application also provides a projection device, including an optical machine, a lens and the above-mentioned light source assembly 100, the optical machine is used to receive the light beam emitted by the light source assembly 100, the lens is arranged on the optical machine, and the lens will form an image based on the light beam processed by the optical machine.

[0155] The specific structure, working principle and function of the light source assembly 100 have been described in detail in the aforementioned first embodiment and will not be repeated here.

[0156] It should be noted that the projection device mainly includes a light source assembly 100, an optical machine and a lens, a DMD (Digital Micromirror Device) chip, a main control circuit board 170, an audio processing system, an audio system, and a heat sink 190. The light source assembly 100 is used to emit a light beam to the optical machine. The light source assembly 100 and the lens are fixedly connected to the optical machine. The DMD chip is arranged in the optical machine. The DMD chip, the audio processing system and the heat sink 190 are electrically connected to the main control circuit board 170 respectively, and the audio processing system is also electrically connected to the audio system.

[0157] The light source assembly 100 is mainly used to generate a light beam in the projection device. The optical machine processes the light beam generated by the light source assembly 100 and emits the processed light beam to the lens. The lens forms an image based on the light beam processed by the optical machine. Since the light beam emitted by the laser 110 has higher brightness and better color gamut, the laser 110 is usually used as the laser 110 unit included in the light source.

[0158] Specifically, the light beam emitted by the light source reaches the DMD chip in the optical machine system. The main control circuit board 170 controls the DMD chip to modulate the light beam emitted to the DMD chip, and the modulated light beam carries the image information output by the main control circuit board 170 and emits it to the lens, and then the light beam is emitted through the lens to the display film for display. The power board 180 supplies power to the laser adapter board 120. In addition, the main control circuit board 170 controls the audio processing system to process the audio information output by the main control circuit board 170, and plays the processed audio information out through the speakers. When displaying image information and playing audio information out, the main control circuit board 170 can control the heat dissipation system to drive the heat sink 190 to dissipate heat to prevent high temperature from affecting the functions of various components.

[0159] However, when the light beam is emitted by the laser 110, a certain amount of heat will be generated. The heat will accumulate in the light source housing included in the light source, thereby causing the temperature inside the light source housing to rise, that is, causing the ambient temperature of the laser 110 to rise. This can easily affect the performance of the laser 110 and further affect the projection effect of the light source assembly 100.

[0160] Therefore, it is necessary to detect the temperature of the laser 110 unit.

[0161] In some embodiments, the projection device may further include a heat sink 190 , and the heat sink 190 may cool down the laser 110 unit according to the real-time temperature detected by the temperature detection unit.

[0162] It should be noted that the heat sink 190 reduces the temperature of the laser 110 unit during use, avoiding the phenomenon that the laser 110 unit temperature is too high and cannot be discharged in time, and then gathers in the light source housing and affects the performance of the laser 110, thereby ensuring the light-emitting performance of the laser 110. Afterwards, the light beam emitted by the laser chip 111 can be emitted to the optical-mechanical system, and after being processed by the optical-mechanical system, it is emitted to the lens for projection, thereby ensuring the projection effect of the projection device.

[0163] In some embodiments, Figure 3 as well as Fig.19 As shown, the heat sink 190 may include a radiator 192 and a fan 191 , and the specific operation of the heat sink 190 will not be described in detail herein.

[0164] By attaching a temperature sensor, i.e., a chip NTC, on the laser driver board, compared to the existing screw-fixed lead NTC, the thermal resistance from the NTC to the laser driver board is affected by factors such as the fixing angle, screw torque, and contact flatness, and the thermal resistance consistency is poor, resulting in inaccurate temperature detection. The setting method of the chip NTC used in this application is closer to the laser chip, which can improve the accuracy of temperature detection and facilitate system design and expansion. In addition, there is no need for an external ambient temperature detection NTC and an external laser NTC, the connector of the temperature detection NTC is eliminated, the lead NTC or NTC components and connecting wires are eliminated, the operation of assembling the NTC is eliminated, the production assembly efficiency is improved, the whole machine line is simplified, and it is conducive to stacking design optimization.

[0165] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0166] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0167] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A light source assembly, characterized in that: include: A laser unit, wherein the laser unit comprises a laser and a laser adapter board, wherein the laser is connected to the laser adapter board, wherein the laser comprises a laser chip and a laser driving board, wherein the laser chip is used to receive a driving signal from the laser driving board to emit a laser beam, wherein the laser driving board is arranged on the laser adapter board, and wherein the laser adapter board is arranged around at least one peripheral side of the laser driving board; A temperature detection unit, wherein the temperature detection unit comprises a temperature sensor, wherein the temperature sensor is attached to the laser driving board, and the temperature sensor is used to detect the temperature of the laser chip.

2. The light source assembly according to claim 1, characterized in that: It also includes a tube shell, the tube shell is arranged on the laser driving board, and the laser chip is located in the tube shell; A first soldering pad and a plurality of second soldering pads are arranged on the laser driving board; The temperature sensor is electrically connected to the first pad, and the temperature sensor is located between the laser chip and the first pad and on a side close to the laser chip, and the laser chip is electrically connected to the second pad.

3. The light source assembly according to claim 2, characterized in that: The laser chip has a plurality of first electrical connection positions, and the plurality of first electrical connection positions are electrically connected to the same second pad; or, The laser chip has a plurality of second electrical connection sites, and the plurality of second electrical connection sites are electrically connected to the same second pad.

4. The light source assembly according to claim 2 or 3, characterized in that: There is at least one laser chip, and the at least one laser chip includes a first laser chip and a second laser chip. The tube shell includes a first tube shell and a second tube shell. The first laser chip is located in the first tube shell, and the second laser chip is located in the second tube shell. The first laser chip and the second laser chip are arranged at intervals along a first direction, and the first laser chip and the second laser chip extend along a second direction; Wherein, there is an angle between the first direction and the second direction.

5. The light source assembly according to claim 4, characterized in that: The temperature sensor is located between the first laser chip and the second laser chip, so that the distance between the first laser chip and the temperature sensor and the distance between the second laser chip and the temperature sensor are the same; When the first electrical connection points of multiple laser chips are electrically connected to the same second pad, or the second electrical connection points of multiple laser chips are electrically connected to the same second pad, the first pad and multiple second pads are all located at one end of the laser driving board.

6. The light source assembly according to claim 5, characterized in that: The temperature sensor is attached to the middle of the laser driving board and is located between the side wall of the first laser chip and the side wall of the second laser chip; In the first direction, a distance between a side wall of the first laser chip and a side wall of the temperature sensor facing the first laser chip and a distance between a side wall of the second laser chip and a side wall of the temperature sensor facing the second laser chip are the same.

7. The light source assembly according to claim 5, characterized in that: The temperature sensor is attached to one end of the laser driving board and is located between the end of the first laser chip and the end of the second laser chip; In the second direction, a distance between an end of the first laser chip and a side wall of the temperature sensor facing the first laser chip and a distance between an end of the second laser chip and a side wall of the temperature sensor facing the second laser chip are the same.

8. The light source assembly according to claim 4, characterized in that: There is at least one temperature sensor, and the at least one temperature sensor includes a first temperature sensor and a second temperature sensor. The first temperature sensor is located on a side of the first laser chip away from the second laser chip, and the first temperature sensor is used to detect the temperature of the first laser chip. The second temperature sensor is located on a side of the second laser chip away from the first laser chip, and is used to detect the temperature of the second laser chip.

9. A light source assembly, characterized in that: include: A laser, wherein the laser comprises a laser chip and a laser driving board, wherein the laser chip is used to receive a driving signal from the laser driving board to emit a laser beam; A temperature sensor is attached to the laser driving board to detect the temperature of the laser chip.

10. A projection device, characterized in that: It comprises an optical machine, a lens and the light source assembly according to any one of claims 1 to 9, wherein the optical machine is used to receive the light beam emitted by the light source assembly, the lens is arranged on the optical machine, and the lens will form an image based on the light beam processed by the optical machine.

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