Circuit board and electric equipment

Abstract

The embodiment of the utility model provides a circuit board and electric equipment, comprising a substrate, at least one side of the substrate is provided with a conductive layer and a solder mask layer, and the solder mask layer is arranged at one side of the conductive layer away from the substrate; a hole is formed in the substrate and penetrates through the conductive layer and the solder mask layer, a window is formed in the solder mask layer at the position corresponding to the hole, the conductive layer at the window is exposed to form a bonding pad part, the hole is used for arranging a fixing piece, and at least part of the fixing piece is in contact with the bonding pad part.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a circuit board and electrical equipment. Background Art

[0002] The circuit board is an important electronic component, which is the support of the electronic components and the carrier of the electrical connection of the electronic components. In order to connect the electronic components arranged on the circuit board or fix the circuit board, it is usually necessary to drill screw holes on the circuit board.

[0003] In the related art, when setting screw holes on a circuit board, it is generally necessary to set screw holes on the circuit board, set pads at the screw holes, and the screws pass through the screw holes. The screw caps can be put on the screws and contact the pads to achieve fixation. However, as the device layout and wiring density on the existing circuit boards are getting higher and higher, the space reserved on the circuit boards for setting pads is getting smaller and smaller, making it more difficult to set pads on the circuit boards. Utility Model Content

[0004] The embodiments of the utility model provide a circuit board and an electrical device to solve the problem that it is difficult to arrange a solder pad on a circuit board in the related art.

[0005] In order to solve the above technical problems, the utility model is achieved as follows:

[0006] In the first aspect, an embodiment of the utility model proposes a circuit board, comprising: a substrate, a conductive layer and a solder resist layer being provided on at least one side of the substrate, the solder resist layer being provided on the side of the conductive layer facing away from the substrate; an opening being provided in the substrate, the opening penetrating the conductive layer and the solder resist layer, the solder resist layer being provided with a window at a position corresponding to the opening, the conductive layer being exposed at the window to form a pad portion, the opening being used to set a fixing part, and the fixing part being at least partially in contact with the pad portion.

[0007] Optionally, the window is arranged around at least a portion of the opening.

[0008] Optionally, on a plane perpendicular to the axis of the opening, at least a portion of the outer contour line of the projection of the window is an arc line, and the center of the arc line coincides with the axis of the opening.

[0009] Optionally, on a plane perpendicular to the axis of the opening, at least a portion of an outer contour line of the projection of the window is an arc line, and the center of the arc line is offset from the axis of the opening.

[0010] Optionally, the conductive layer includes a first conductive region and a second conductive region that are spaced apart from each other, the opening is located on a side of the first conductive region close to the second conductive region, and the window is provided in the first conductive region.

[0011] Optionally, the first conductive region has a first edge facing the second conductive region, and when the window is provided in the first conductive region, a portion of the edge of the window close to the second conductive region is parallel to the first edge.

[0012] Optionally, a distance between a portion of an edge wall of the window close to the second conductive area and the first edge is D1, and D1 ≥ 0.25 mm.

[0013] Optionally, the conductive layer includes a first conductive region and a second conductive region which are spaced apart from each other, part of the openings are located in the first conductive region, and another part of the openings are located in the second conductive region.

[0014] Optionally, the circuit board further includes an inner pad, the inner pad is embedded in the substrate, and the opening passes through the inner pad, and the inner pad is used to fix the fixing member.

[0015] In a second aspect, an embodiment of the utility model further proposes an electrical device, wherein the electrical device comprises any circuit board described in the above-mentioned first aspect.

[0016] In an embodiment of the utility model, a circuit board includes a substrate, at least one side of the substrate is provided with a conductive layer and a solder resist layer, an opening is provided in the substrate, wherein the opening penetrates the conductive layer and the solder resist layer, and the opening can provide a setting space for a fixing part, so that the fixing part can be set in at least one of the substrate, the conductive layer and the solder resist layer. The solder resist layer is provided with a window at a position corresponding to the opening, and the setting of the window can make the conductive layer exposed to form a pad portion. That is, a window is provided at a position where the opening is provided on the solder resist layer, therefore, the window can provide a setting space for the fixing part exposed at the opening, so that the fixing part can contact both the opening and the pad portion, so that the fixing part can fix the circuit board.

[0017] That is, the present application replaces the pad setting in the related technology with the pad part, and can set a window on the solder resist layer according to actual needs, and directly use the conductive layer exposed at the window as the pad part, so that the setting of the pad part is more flexible, and the space occupied by the pad part can be reduced, which is convenient for fixing the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram showing a circuit board provided by an embodiment of the utility model;

[0019] Figure 2 A schematic diagram showing a fixing member provided by an embodiment of the utility model arranged on a circuit board;

[0020] Figure 3 One of the schematic diagrams showing the window opening provided by the embodiment of the utility model;

[0021] Figure 4 A second schematic diagram showing a window provided by an embodiment of the utility model;

[0022] Figure 5 A third schematic diagram showing a window provided by an embodiment of the utility model;

[0023] Figure 6 A fourth schematic diagram showing a window provided by an embodiment of the utility model;

[0024] Figure 7 A fifth schematic diagram showing the window provided in the embodiment of the utility model.

[0025] Reference numerals:

[0026] 100: circuit board; 10: substrate; 20: conductive layer; 30: solder resist layer; 40: opening; 31: window; 200: fixing member; 21: first conductive area; 22: second conductive area; 23: groove; 50: pad portion; 60: inner pad; 231: first edge; 232: second edge; X: first direction. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] It should be understood that the references to "one embodiment" or "an embodiment" throughout the specification mean that the specific features, structures, or characteristics associated with the embodiment are included in at least one embodiment of the present invention. Therefore, the references to "in one embodiment" or "in an embodiment" appearing throughout the specification do not necessarily refer to the same embodiment. In addition, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0029] like Figures 1 to 6 As shown, the circuit board 100 includes a substrate 10, and a conductive layer 20 and a solder resist layer 30 are provided on at least one side of the substrate 10, and the solder resist layer 30 is provided on the side of the conductive layer 20 facing away from the substrate 10; an opening 40 is provided in the substrate 10, and the opening 40 passes through the conductive layer 20 and the solder resist layer 30, and the solder resist layer 30 is provided with a window 31 at a position corresponding to the opening 40, and the conductive layer 20 at the window 31 is exposed to form a pad portion 50, and the opening 40 is used to set a fixing part 200, and the fixing part 200 is at least partially in contact with the pad portion 50.

[0030] In the embodiment of the utility model, the circuit board 100 includes a substrate 10, at least one side of the substrate 10 is provided with a conductive layer 20 and a solder resist layer 30, and an opening 40 is provided in the substrate 10, wherein the opening 40 penetrates the conductive layer 20 and the solder resist layer 30, and the opening 40 can provide a setting space for the fixing member 200, so that the fixing member 200 can be set in at least one of the substrate 10, the conductive layer 20 and the solder resist layer 30. The solder resist layer 30 is provided with a window 31 at a position corresponding to the opening 40, and the setting of the window 31 can make the conductive layer 20 exposed to form a pad portion 50. That is, the window 31 is provided at the position where the opening 40 is provided on the solder resist layer 30, therefore, the window 31 can provide a setting space for the fixing member 200 exposed at the opening 40, so that the fixing member 200 can contact both the opening 40 and the pad portion 50, so that the fixing member 200 can fix the circuit board 100.

[0031] That is, the present application replaces the setting of the pad in the related art with the pad part 50, and can set a window on the solder resist layer according to actual needs, and directly use the conductive layer exposed at the window as the pad part, so that the setting of the pad part is more flexible, and the space occupied by the pad part can be reduced, which is convenient for fixing the circuit board. In addition, when designing the pad part 50, the shape and size of the window 31 can be directly adjusted to obtain pad parts 50 of different shapes and sizes, which is convenient for rapid adjustment of the pad part 50.

[0032] It should be noted that at least one side of the substrate 10 is provided with a conductive layer 20 and a solder resist layer 30, and a window 31 can be provided on at least one of the solder resist layers 30 on both sides of the substrate 10. Specifically, the substrate 10 can have a first side and a second side opposite to each other, and the conductive layer 20 and the solder resist layer 30 can be provided on the first side, or the conductive layer 20 and the solder resist layer 30 can be provided on the second side, or the conductive layer 20 and the solder resist layer 30 can be provided on the first side and the second side. When the conductive layer 20 and the solder resist layer 30 are provided on the first side or the second side, the solder resist layer 30 and the conductive layer 20 are located on one side of the substrate 10, and at this time, a window 31 can be provided on the solder resist layer 30 so that the conductive layer 20 at the window 31 can form a pad portion 50, that is, a pad portion 50 can be formed on the first side or the second side of the substrate 10, so that the fixing member 200 can contact the pad portion 50. When the conductive layer 20 and the solder resist layer 30 are arranged on the first side and the second side, the solder resist layer 30 and the conductive layer 20 are arranged on both sides of the substrate 10, and the opening 31 can be arranged on the solder resist layer 30 on any side, or on the solder resist layers 30 on both sides, such as Figure 1 , Figure 2 As shown, the specific location of the window 31 is not specifically limited in the embodiment of the present invention.

[0033] It should also be noted that in the related art, due to the additional setting of the pad, the pad is relatively solidified, and the size, shape, etc. of the pad cannot be adjusted according to the demand. Specifically, when designing and drawing the circuit board 100, the pad is directly called from the package library. If the pad in the package library does not meet the use requirements, the pad needs to be adjusted. At this time, the pad cannot be directly modified in the design software, and it is more troublesome to modify the pad in the package library. The present application obtains the pad portion 50 by setting a window 31 on the solder mask layer 30. The position, size, etc. of the window 31 can be arbitrarily adjusted according to the use requirements during the design process, which can better meet the use requirements. And when making according to the design, the window 31 of corresponding shape and size can be set on the solder mask layer 30 according to the design, which can also facilitate the production of the circuit board 100.

[0034] In addition, the present application sets a window 31 on the solder resist layer 30, so that the conductive layer 20 at the window 31 can form a pad portion 50. In addition to being used for contacting at least part of the fixing member 200 to fix the circuit board 100 as mentioned above, the pad portion 50 can also be used for soldering electronic components. For example, for an electronic component to be plugged in, the pin of the electronic component can be placed in the opening 40, and at least part of the pin can be soldered to the pad portion 50 to achieve connection; for surface mounted electronic components, the opening 40 can be omitted, and the window 31 can be directly set at the position where the circuit board 100 is to be connected, and the electronic component can be soldered to the exposed conductive layer 20.

[0035] Additionally, in some embodiments, the window 31 may be disposed around at least a portion of the opening 40 .

[0036] The window 31 is arranged around at least part of the opening 40 , that is, the window 31 can be arranged along the circumferential direction of the opening 40 . Specifically, the window 31 can be arranged around the opening 40 in a circle, or the window 31 can be arranged around the opening 40 for a section.

[0037] When the window 31 is arranged around the opening 40, the conductive layer 20 is exposed all around the opening 40, that is, the conductive layer 20 can form a pad portion 50 around the opening 40. On the one hand, the arrangement of the pad portion 50 relative to the opening 40 can be more uniform, and a setting position can be provided all around the part of the fixing part 200 extending out of the opening 40, which is convenient for setting the fixing part 200 and avoiding the problem of poor contact between the fixing part 200 and the pad portion 50 due to the presence of part of the solder resist layer 30 between the fixing part 200 and the pad portion 50.

[0038] In the case where the window 31 is arranged around the opening 40 for a section, the conductive layer 20 is exposed at a part of the periphery of the opening 40, and this arrangement can adapt to the fixing of the circuit board 100 at certain specific positions. For example, when the substrate 10 is a rectangular plate, the opening 40 is arranged at the top corner of the substrate 10, and the opening 40 and the edge of the substrate 10 are at least partially inscribed, at this time, when the window 31 is arranged, the part inscribed between the opening 40 and the edge of the substrate 10 cannot be provided with the window 31, and the window 31 can surround the opening 40 at other positions to provide an installation position for the fixing member 200.

[0039] In addition, in some embodiments, on a plane perpendicular to the axis of the opening 40 , at least a portion of the outer contour line of the projection of the window 31 is an arc line, and the center of the arc line coincides with the axis of the opening.

[0040] At least part of the outer contour of the window 31 is an arc line. Since the center of the arc line coincides with the axis of the opening 40, the window 31 is coaxially arranged with the opening 40, so that the exposed part of the conductor layer can be more uniform. When the fixing member 200 is arranged and the fixing member 200 and the pad portion 50 are both abutted, the area of ​​the window 31 can be made smaller to prevent affecting the wiring space. Specifically, the window can be an annular groove, the inner side of the annular groove coincides with the outer side of the opening 40, and the outer side of the annular groove is in the shape of the above-mentioned arc line.

[0041] In the embodiment of the utility model, the opening 40 can be a threaded hole, and the fixing member 200 can be a threaded member. For example, the fixing member 200 can include a screw and a nut. The screw can be inserted into the threaded hole, and a part of the screw can extend from the threaded hole. The nut can be threadedly connected with the part of the screw extending from the threaded hole, and abuts against the pad portion 50 to fix the circuit board 100. In the case where the fixing member 200 is a screw and a nut, the window 31 can be an annular groove, and the outer side of the annular groove is circular, so that the shape consistency of the pad portion 50 and the nut is good, and the nut can be ensured to be in normal contact with the pad portion 50, and the size of the window 31 is small, reducing the setting area of ​​the pad portion 50 on the circuit board 100. Of course, the fixing member 200 can also be other structures, for example, it can include a pin and a fixing plate, the fixing plate is connected to the end of the pin, the pin can extend into the opening 40, and the fixing plate can contact the pad portion 50. The specific structure of the fixing member 200 is not specifically limited in the embodiment of the utility model.

[0042] In addition, the outer side of the annular groove may be elliptical, and the center of the outer contour of the ellipse may coincide with the axis of the opening.

[0043] It should be noted that the outer contour line of the window 31 may not be an arc line. For example, the window 31 may be a window 31 with a rectangular outer side. In this case, in order to allow the nut to contact the pad portion 50 well, the size of the inscribed circle of the rectangle outside the window 31 should be greater than or equal to the size of the nut, which can ensure that the nut can contact the pad portion 50 normally and make the size of the window 31 smaller, reducing the setting area of ​​the pad portion 50 on the circuit board 100 and avoiding affecting the wiring space. Of course, the window 31 may also be a window 31 with a pentagonal or hexagonal outer side, etc. The specific shape of the window 31 is not specifically limited in the embodiment of the utility model.

[0044] It should also be noted that, when the opening 40 is set at the edge of the circuit board 100, the nut may be partially located outside the circuit board 100 due to its larger size than the screw. If the window 31 is set according to the size of the nut, the window 31 will appear to be located outside the circuit board 100, for example. Figure 3 At this time, when designing and drawing the circuit board 100, there will be problems with abnormal engineering confirmation. In order to avoid such problems, the size of the window 31 can be adjusted during drawing, and the part of the window 31 located outside the circuit board 100 can be removed, for example Figure 4 , according to Figure 4 The position and size of the middle window 31 are used to manufacture the pad portion 50. In order to adapt to the tolerance in the manufacturing process and improve the yield of the circuit board, the edge of the window and the edge of the circuit board can be set to have a tolerance of less than or equal to 0.25 mm.

[0045] In the case where the fixing member 200 includes a screw and a nut, and the outer side of the arc-shaped groove is circular, the size of the outer circular side of the arc-shaped groove can be set according to the size of the nut. In order to make the nut contact the pad portion 50 better, the size of the outer circular side of the arc-shaped groove can be 0.4mm-1mm larger than the size of the nut. Specifically, it can be 0.5mm, 0.8mm, 0.6mm, 0.4mm, 1mm, 0.59mm, etc. Considering the existence of manufacturing tolerances, during manufacturing, the size of the outer circular side of the window 31 can be 0.1mm larger than the above-mentioned set size, so that even if there is a manufacturing tolerance, the area of ​​the window 31 can be sufficient.

[0046] In addition, in some embodiments, on a plane perpendicular to the axis of the opening 40 , at least a portion of the outer contour line of the projection of the window 31 is an arc line, and the center of the arc line is offset from the axis of the opening.

[0047] On a plane perpendicular to the axis of the opening 40, the outer contour line of the projection of the window 31 is an arc line, that is, the outer contour of the window 31 is an arc, which can be staggered with the projection of the axis of the opening 40, that is, the center of the window 31 is offset from the center of the opening 40. At this time, the window 31 is eccentric relative to the center of the opening 40. The eccentric structure of the window 31 makes the exposed conductive layer 20 also eccentric relative to the opening 40, forming an eccentric pad portion 50, which can adapt to the installation of eccentric components on the fixing part 200.

[0048] Specifically, the center of the arc line is staggered with the axis of the opening, and the spacing between the center of the arc line and the axis of the opening can be set according to the actual fixing part 200 used, for example, it can be 1mm, 2mm, 2.6mm, 3mm, 1.5mm, etc. The specific value of the spacing between the center of the arc line and the axis of the opening is not specifically limited in the embodiment of the utility model.

[0049] In addition, in some embodiments, Figure 5 , Figure 6 , Figure 7 As shown, the conductive layer 20 includes a first conductive region 21 and a second conductive region 22 which are spaced apart from each other. The opening 40 is located on one side of the first conductive region 21 close to the second conductive region 22 , and the window 31 is provided in the first conductive region 21 .

[0050] The conductive layer 20 includes a first conductive area 21 and a second conductive area 22. The first conductive area 21 and the second conductive area 22 can provide connection locations for different components on the circuit board. In the case where the space of the circuit board 100 is relatively cramped, the opening 40 is usually set on the side of the first conductive area 21 close to the second conductive area 22. When the window 31 is set, the window 31 can be set only on the first conductive area 21 to avoid the problem that the fixing part 200 conducts electricity between the first conductive area 21 and the second conductive area 22. Specifically, when the opening 40 is set close to the second conductive area 22, and the fixing part 200 is a screw and a nut, part of the nut will fall into the second conductive area 22. If the window 31 has a part extending to the second conductive area 22, such as Figure 5 As shown, when the nut is set, the nut will contact both the first conductive area 21 and the second conductive area 22, so that the first conductive area 21 and the second conductive area 22 are in contact, affecting the insulation setting of the two conductive areas. Since the window 31 of the present application is set in the first conductive area 21, even if part of the nut is located in the second conductive area 22, the nut can only be connected to the first conductive area 21 through the window 31. As for the second conductive area 22, due to the setting of the solder resist layer 30, it is not connected to the nut, thereby avoiding the problem of the nut conducting the two conductive areas.

[0051] In addition, in some embodiments, the first conductive region 21 has a first edge 231 facing the second conductive region 22 . When the window 31 is provided in the first conductive region 21 , a portion of the edge of the window 31 close to the second conductive region 22 is parallel to the first edge 231 .

[0052] When the window 31 is provided in the first conductive area 21, the edge of the window 31 close to the second conductive area 22 is parallel to the first edge 231, so that the edge of the window 31 close to the second conductive area 22 is consistent with the shape of the first edge 231, so that the area of ​​the window 31 can be larger, so that the conductive layer 20 exposed at the window 31 can be more, and the contact area between the fixing part 200 and the conductive layer 20 can be larger, so that the fixing part 200 and the conductive layer 20 can be in good contact, such as Figure 6 As shown, the shape of the edge of the window 31 close to the second conductive area 22 is inconsistent with the first edge 231, which may cause the window 31 to partially extend toward the opening 40, thereby reducing the area of ​​the window 31.

[0053] In addition, in some embodiments, Figure 6 As shown, the distance between the edge of the portion of the window 31 close to the second conductive region 22 and the first edge 231 is D1, and D1 ≥ 0.25 mm.

[0054] In the case where the window 31 is provided in the first conductive area 21, the distance between the edge of the portion of the window 31 close to the second conductive area 22 and the first edge 231 is D1, D1 ≥ 0.25 mm, that is, there is a gap between the edge of the window 31 and the first edge 231, and the setting of the gap can adapt to the tolerance in the production process. Specifically, in the design, if the distance between the edge of the portion of the window 31 close to the second conductive area 22 and the first edge 231 is small, the window 31 may extend to the second conductive area 22 due to the existence of the production tolerance during the production, resulting in the first conductive area 21 and the second conductive area 22 being conductive. Since D1 ≥ 0.25 mm is set in this embodiment, even if the window 31 is slightly larger due to the existence of the tolerance during the actual production, it can be avoided that the portion of the window 31 extending to the second conductive area 22 is large, and the window 31 is prevented from extending directly to the second conductive area 22, thereby preventing the second conductive area 22 and the first conductive area 21 from being conductive.

[0055] It should be noted that D1 ≥ 0.25 mm. Specifically, D1 may be greater than or equal to 0.25 mm. For example, it may be 0.25 mm, 0.28 mm, 0.26 mm, 0.29 mm, 0.3 mm, etc. The specific value of D1 is not specifically limited in the embodiments of the present invention.

[0056] In addition, in some embodiments, Figure 7As shown, the conductive layer 20 includes a first conductive area 21 and a second conductive area 22 which are spaced apart. A groove 23 is formed between the first conductive area 21 and the second conductive area 22. The groove 23 is filled with a solder resist layer 30. The opening 40 is located on a side of the first conductive area 21 close to the second conductive area 22. The window 31 is provided in the first conductive area 21 and extends into the groove 23.

[0057] That is, the conductive layer 20 may include a first conductive region 21 and a second conductive region 22 , and the groove 23 is located between the first conductive region 21 and the second conductive region 22 , and the first conductive region 21 and the second conductive region 22 may be isolated from each other, so that the first conductive region 21 and the second conductive region 22 are insulated.

[0058] In the case where the space of the circuit board 100 is relatively cramped, the opening 40 is usually set on the side of the first conductive area 21 close to the second conductive area 22. When setting the window 31, the window 31 can be set on the first conductive area 21 and the groove 23. That is, part of the window 31 is located inside the first conductive area 21, and part of it is located inside the groove 23. Since the setting of the groove 23 can insulate the first conductive area 21 and the second conductive area 22 from each other, even if part of the fixing part extends beyond the first conductive area 21 to the groove 23, the problem of the fixing part conducting the first conductive area 21 and the second conductive area 22 can be avoided.

[0059] It should be noted that the first conductive area 21 and the second conductive area 22 can be set according to actual conditions. For example, for a notebook, the circuit board 100 thereof usually has an audio interface and related circuit design, and an opening 40 is set next to the audio interface to fix the circuit board 100. However, due to the particularity of the design of the audio circuit chip, it has analog signals and digital signals. Therefore, an analog ground and a system ground are correspondingly set on the circuit board 100. The first conductive area 21 can be the system ground, and the second conductive area 22 can be the digital ground. The analog signal refers to the analog ground, and the digital signal refers to the system ground. The window 31 there can be set only on the system ground or in the system ground and the groove 23. Of course, for the position near other components for fixing the circuit board 100, the opening 40 may also be set at the digital ground, the first conductive area 21 is the digital ground, and the second conductive area 22 is the system ground. The specific settings of the first conductive area 21 and the second conductive area 22 are not specifically limited in the design example of the utility model.

[0060] In the case where the window 31 is provided in the first conductive area 21 and extends into the groove 23, the setting of the window 31 can be set with reference to the case where the window 31 is provided in the first conductive area 21, that is, the edge of the portion close to the second conductive area 22 can be parallel to the second edge 232, so that the window 31 can be located in the first conductive area 21 and the groove 23, and the area of ​​the window 31 can be larger, ensuring that the fixing member 200 can be in good contact with the conductive layer 20. The second edge 232 can be the edge of the second conductive area 22 facing the first conductive area, such as Figure 7 shown.

[0061] In addition, in some embodiments, the conductive layer 20 includes a first conductive region 21 and a second conductive region 22 that are spaced apart, a portion of the openings 31 is located in the first conductive region 21 , and another portion of the openings 31 is located in the second conductive region 22 .

[0062] In the embodiment of the utility model, part of the window 31 is located in the first conductive area 21, and the other part of the window 31 is located in the second conductive area 22, which can adapt to the arrangement of components that need to conduct the first conductive area 21 and the second conductive area 22. That is, in addition to the above-mentioned two situations where the window 31 is arranged in the first conductive area and the window 31 is arranged in the first conductive area 21 and extends into the groove 23, in actual use, there will also be a situation where some components need to conduct the first conductive area 21 and the second conductive area 22 during connection. In this case, the window 31 can be extended from the first conductive area 21 to the second conductive area 22, and a similar arrangement can be performed. Figure 5 design.

[0063] In an embodiment of the utility model, when a groove 23 is formed between the first conductive area 21 and the second conductive area 22, the window 31 can have three parts located in the first conductive area 21, the groove 23, and the second conductive area 22. At this time, the nut spans the first conductive area 21, the groove 23 and the second conductive area 22.

[0064] In addition, in some embodiments, Figure 1 , Figure 2 As shown, the circuit board 100 may further include an inner pad 60 , which is embedded in the substrate 10 , and the opening 40 passes through the inner pad 60 , and the inner pad 60 is used to fix the fixing member 200 .

[0065] The circuit board 100 also includes an inner layer pad 60, which is embedded in the substrate 10, and the opening 40 passes through the inner layer pad 60. When the fixing member 200 is set, the fixing member 200 can also be passed through the inner layer pad 60, so that the inner layer pad 60 can also fix the fixing member 200, further improving the connection effect between the fixing member 200 and the circuit board 100.

[0066] It should be noted that, when the circuit board 100 is a multi-layer board, the substrate 10 further has one or more conductive pattern layers inside, and an inner pad 60 may be provided in the substrate 10 to improve the connection effect between the fixing member 200 and the circuit board 100. When the circuit board 100 is a single-layer board or a double-layer board, the circuit board 100 is relatively thin, and the inner pad 60 may not be provided.

[0067] In addition, in some embodiments, the window 31 is arranged around the opening 40, the stacking direction of the conductive layer 20 and the solder resist layer 30 is the first direction X, and the projection of the inner pad 60 on the plane perpendicular to the first direction X can be located inside the projection of the window 31 on the plane perpendicular to the first direction X.

[0068] The stacking direction of the conductive layer 20 and the solder resist layer 30 is the first direction X, and the axial direction of the opening 40 can be parallel to the first direction X, so that the opening 40 can penetrate the conductive layer 20 and the solder resist layer 30. In the case where the opening 31 is arranged around the opening 40, the projection of the inner pad 60 on the plane perpendicular to the first direction X can be located inside the projection of the opening 31 on the plane perpendicular to the first direction X. At this time, the size of the inner pad 60 is less than or equal to the size of the outer pad, which, on the one hand, complies with the manufacturing process of the inner pad 60, and on the other hand, can make the size of the inner pad 60 smaller, preventing the inner pad 60 from affecting the wiring space inside the substrate 10.

[0069] In the embodiment of the utility model, the circuit board 100 includes a substrate 10, at least one side of the substrate 10 is provided with a conductive layer 20 and a solder resist layer 30, and an opening 40 is provided in the substrate 10, wherein the opening 40 penetrates the conductive layer 20 and the solder resist layer 30, and the opening 40 can provide a setting space for the fixing member 200, so that the fixing member 200 can be set in at least one of the substrate 10, the conductive layer 20 and the solder resist layer 30. The solder resist layer 30 is provided with a window 31 at a position corresponding to the opening 40, and the setting of the window 31 can make the conductive layer 20 exposed to form a pad portion 50. That is, the window 31 is provided at the position where the opening 40 is provided on the solder resist layer 30, therefore, the window 31 can provide a setting space for the fixing member 200 exposed at the opening 40, so that the fixing member 200 can contact both the opening 40 and the pad portion 50, so that the fixing member 200 can fix the circuit board 100.

[0070] That is, the present application replaces the pad arrangement in the related art with the pad portion 50, and can set a window on the solder resist layer according to actual needs, and directly use the conductive layer exposed at the window as the pad portion, so that the arrangement of the pad portion is more flexible, and the occupied space of the pad portion can be reduced, which is convenient for fixing the circuit board. In addition, when designing the pad portion 50, the shape and size of the window 31 can be directly adjusted to obtain pad portions 50 of different shapes and sizes, which is convenient for rapid adjustment of the pad portion 50.

[0071] In addition, an embodiment of the utility model further provides an electrical device, and the electrical device includes the circuit board 100 in any one of the above embodiments.

[0072] The electrical equipment includes the above-mentioned circuit board 100. Since the setting of the traditional solder pad is cancelled at the position where the circuit board 100 is fixed, a window 31 is set on the solder resist layer 30 so that the conductive layer 20 at the window 31 is exposed to form a solder pad portion 50. The fixing part 200 can be installed through the solder pad portion 50 and the opening 40, and the problem of additionally setting a solder pad to install the fixing part 200 can be avoided. Therefore, the solder pad portion 50 can be adjusted according to the position and size of the window 31, which is more flexible.

[0073] It should be noted that the electrical device can be any device having a circuit board 100 inside, such as a mobile phone, a tablet, a laptop computer, a vehicle, etc. The specific type of the electrical device is not specifically limited in the embodiment of the utility model.

[0074] It should also be noted that the circuit board 100 may be a printed circuit board 100 (Printed Circuit Board, PCB), or the circuit board 100 may also be a flexible circuit board 100 (Flexible Printed Circuit, FPC). The type of the circuit board 100 is not specifically limited in the embodiments of the present invention.

[0075] It should be noted that the various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0076] Although the optional embodiments of the utility model embodiments have been described, those skilled in the art, once knowing the basic creative concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including optional embodiments and all changes and modifications falling within the scope of the utility model embodiments.

[0077] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity from another entity, and do not necessarily require or imply any such actual relationship or order between these entities. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that an article or terminal device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such article or terminal device. In the absence of further restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the article or terminal device including the elements.

[0078] The technical solution provided by the present invention is introduced in detail above. Specific examples are used in this article to illustrate the principle and implementation method of the present invention. At the same time, for those skilled in the art, according to the principle and implementation method of the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A circuit board, characterized in that: include: A substrate, wherein at least one side of the substrate is provided with a conductive layer and a solder resist layer, the solder resist layer is provided on the side of the conductive layer facing away from the substrate; an opening is provided in the substrate, the opening passes through the conductive layer and the solder resist layer, the solder resist layer is provided with a window at a position corresponding to the opening, the conductive layer at the window is exposed to form a pad portion, the opening is used to set a fixing part, and the fixing part is at least partially in contact with the pad portion.

2. The circuit board according to claim 1, characterized in that: The window is arranged around at least a portion of the opening.

3. The circuit board according to claim 1, characterized in that: On a plane perpendicular to the axis of the opening, at least a portion of the outer contour line of the projection of the window is an arc line, and the center of the arc line coincides with the axis of the opening.

4. The circuit board according to claim 1, characterized in that: On a plane perpendicular to the axis of the opening, at least a portion of the outer contour line of the projection of the window is an arc line, and the center of the arc line is offset from the axis of the opening.

5. The circuit board according to claim 1, characterized in that: The conductive layer comprises a first conductive region and a second conductive region which are spaced apart from each other. The opening is located on a side of the first conductive region close to the second conductive region, and the window is located in the first conductive region.

6. The circuit board according to claim 5, characterized in that: The first conductive region has a first edge facing the second conductive region. When the window is provided in the first conductive region, a portion of the edge of the window close to the second conductive region is parallel to the first edge.

7. The circuit board according to claim 6, characterized in that: A distance between a portion of an edge of the window close to the second conductive region and the first edge is D1, and D1 ≥ 0.25 mm.

8. The circuit board according to claim 1, characterized in that: The conductive layer includes a first conductive region and a second conductive region which are spaced apart from each other. Part of the openings are located in the first conductive region, and another part of the openings are located in the second conductive region.

9. The circuit board according to claim 1, characterized in that: The circuit board also includes an inner pad, which is embedded in the substrate, and the opening passes through the inner pad, and the inner pad is used to fix the fixing member.

10. An electrical device, characterized in that: The electrical equipment comprises the circuit board described in any one of claims 1-9.

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