Glue filling mechanism and glue filling system

Abstract

The utility model discloses a glue filling mechanism and a glue filling system. The glue filling mechanism comprises a carrier plate, a jig, a cover body, a glue filling valve and a metering valve; the jig is arranged on the carrier plate and provided with a forming cavity, a glue inlet and a glue outlet, wherein the glue inlet and the glue outlet are communicated with the forming cavity, and at least part of each of the glue inlet and the glue outlet is of a structure gradually shrinking from inside to outside. The cover body covers the carrier plate to form a closed cavity, the jig is located in the cavity, and the cover body is communicated with an external vacuum device to vacuumize the cavity; the glue filling valve is arranged on the cover body, and a glue filling needle of the glue filling valve is arranged in the cavity in a penetrating manner and is inserted into the glue inlet; the metering valve is arranged on the cover body, and a metering needle of the metering valve penetrates through the cavity and is inserted into the glue outlet in a suspended mode. According to the glue filling mechanism, glue overflowing from the glue outlet is sucked back through the metering valve, and the forming yield of products is increased; the glue inlet and the glue outlet are arranged to be of a structure gradually shrinking from inside to outside, glue overflowing is reduced, glue can be located at the position, gradually shrinking from inside to outside, of the glue outlet, and demolding of a product is facilitated.

Description

Technical Field

[0001] The present application relates to the technical field of glue filling, and in particular to a glue filling mechanism and a glue filling system. Background Art

[0002] In actual production and processing, in order to improve the sealing of the product or to stick two parts together, the product or two parts can be placed in a jig, and then glue can be poured into the jig to seal the air leakage of the product, or to stick the two parts together with glue. However, when pouring glue into the jig, due to the pressure of atmospheric pressure, the glue is easy to overflow from the glue outlet of the jig. After the glue overflows from the glue outlet and solidifies, it affects the demoulding, causing the product to deform or break, and affecting the molding yield of the product. Utility Model Content

[0003] In view of the above, it is necessary to propose a glue filling mechanism and a glue filling system to suck back the overflowed colloid and improve the molding yield of the product.

[0004] The present application embodiment provides a glue filling mechanism, including:

[0005] Carrier board;

[0006] A jig is arranged on the carrier plate, the jig is provided with a molding cavity and a glue inlet and a glue outlet communicated with the molding cavity, and the glue inlet and the glue outlet are at least partially configured as a structure that gradually contracts from the inside to the outside;

[0007] A cover body, which is disposed on the carrier plate to form a closed cavity, the fixture is located in the cavity, and the cover body is used to communicate with an external vacuum device, and the external vacuum device evacuates the cavity;

[0008] A glue filling valve is arranged on the cover body, and a glue filling needle of the glue filling valve is passed through the cavity and inserted into the glue inlet, and the glue filling valve is used to supply glue to the glue inlet;

[0009] A metering valve is arranged on the cover body and spaced apart from the glue filling valve. A metering needle of the metering valve is inserted into the cavity and suspended at the glue outlet. The metering valve is used to suck back the colloid at the glue outlet.

[0010] In some embodiments, the glue inlet and the glue outlet both include a tapered hole and a straight barrel hole connected to the tapered hole, the tapered hole is connected to the molding cavity, and the tapered hole gradually shrinks from the inside to the outside.

[0011] In some embodiments, the glue filling needle is inserted into the intersection of the straight barrel hole and the tapered hole of the glue inlet, and the metering needle is suspended and inserted into the intersection of the straight barrel hole and the tapered hole of the glue outlet.

[0012] In some embodiments, the diameter of the metering needle is smaller than the diameter of the straight barrel hole of the glue outlet.

[0013] In some embodiments, the cover body includes a top plate and a support member, both ends of the support member are openings, one end of the support member is connected to the top plate, and the other end of the support member is connected to the carrier plate, and the glue filling valve and the metering valve are both arranged on the top plate.

[0014] In some embodiments, the cover body further includes a sealing member disposed between the top plate and the support member.

[0015] In some embodiments, the glue filling mechanism further includes a connecting tube, one end of which is disposed on the cover body, and the other end of which is used to communicate with the external vacuum device.

[0016] In some embodiments, the glue filling valve also includes a connected screw assembly and a needle head, the screw assembly is used to rotate along a first direction to supply the colloid, and the screw assembly is used to rotate along a second direction opposite to the first direction to suck back the colloid; the glue filling needle is inserted into the needle head of the glue filling valve; the metering valve also includes a needle head, and the metering needle is inserted into the needle head of the metering valve; the glue inlet and the glue outlet both include matching holes, and the matching holes and the corresponding straight barrel holes form a stepped shape to adapt to the needle head of the glue filling valve and / or the needle head of the metering valve.

[0017] An embodiment of the present application also provides a glue filling system, comprising a glue filling mechanism as described in any of the above technical solutions.

[0018] In some embodiments, the glue pouring system further comprises:

[0019] A lifting mechanism, connected to the carrier plate of the glue filling mechanism, and used for driving the carrier plate to be lifted and lowered;

[0020] A vacuum device, connected to the cover of the glue filling mechanism, and used to evacuate the cavity formed by the cover and the carrier;

[0021] The controller is coupled to the lifting mechanism, the vacuum device, the glue filling valve and the metering valve of the glue filling mechanism respectively, and is used to control the lifting mechanism to drive the carrier plate to lift and lower, and is also used to control the vacuum device to evacuate and break the vacuum of the cavity, and is also used to control the glue filling valve to supply colloid to the glue inlet, and is used to control the metering valve to suck back the colloid at the glue outlet.

[0022] When the above-mentioned glue filling mechanism and glue filling system are in use, the cover body is connected to the carrier plate to form a closed cavity, and the glue filling needle of the glue filling valve is inserted into the glue inlet, and the metering needle of the metering valve is suspended and inserted into the glue outlet. The cavity is evacuated by a vacuum device. After the cavity is evacuated, glue is poured into the glue inlet through the glue filling valve to make the glue flow into the molding cavity. When the glue overflows to the metering needle at the glue outlet, the metering valve sucks back the glue at the glue outlet through the metering needle to prevent the glue from overflowing from the glue outlet. When the glue filling is completed, the metering valve is closed with a delay, and the vacuum device breaks the vacuum of the cavity, so that the cover body and the carrier plate are separated, and the glue in the fixture is solidified and formed, thereby realizing glue filling.

[0023] The glue filling mechanism and glue filling system of the embodiment of the present application, through the cooperation of the carrier plate, the fixture, the cover body, the glue filling valve and the metering valve, suck back the glue overflowing from the glue outlet, so as to avoid the glue overflowing from the glue outlet and causing the difficulty of demolding, and avoid the deformation or breakage of the product due to the difficulty of demolding, thereby improving the molding yield of the product; in addition, by setting the glue inlet and the glue outlet as a structure that gradually shrinks from the inside to the outside, the glue capacity of the glue inlet and the glue outlet on the side close to the molding cavity is increased, and the glue output of the glue from the glue inlet and the glue outlet is reduced. Moreover, through the structure that gradually shrinks from the inside to the outside, the glue overflow is reduced, which is conducive to the glue being in the glue outlet The gradually shrinking position from the inside to the outside facilitates the demolding of the product, and further improves the glue molding yield of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of the glue filling mechanism provided in the embodiment of the present application.

[0025] Figure 2 yes Figure 1 The exploded schematic diagram of the glue filling mechanism is shown.

[0026] Figure 3 yes Figure 2 The cross-sectional view of the fixture along III-III in the glue filling mechanism shown.

[0027] Figure 4 The present invention is a cross-sectional schematic diagram of a glue filling needle inserted into a glue inlet suitable for an embodiment of the present application.

[0028] Figure 5 The present invention is a cross-sectional schematic diagram of a metering needle suspended and inserted into a glue outlet suitable for an embodiment of the present application.

[0029] Figure 6 It is a module schematic diagram of the glue filling system provided in an embodiment of the present application.

[0030] Main component symbols

[0031] Glue filling system 1

[0032] Glue filling mechanism 100

[0033] Carrier board 10

[0034] Jig 20

[0035] Molding cavity 21

[0036] Glue inlet 22

[0037] Glue outlet 23

[0038] Conical hole 24

[0039] Straight barrel hole 25

[0040] Matching hole 26

[0041] Cover body 30

[0042] Top plate 31

[0043] Support member 32

[0044] Seal 33

[0045] Cavity 40

[0046] Glue filling valve 50

[0047] Glue filling needle 51

[0048] Screw assembly 52

[0049] Metering valve 60

[0050] Metering needle 61

[0051] Connecting pipe 70

[0052] Lifting mechanism 200

[0053] Vacuum device 300

[0054] Controller 400

[0055] Glue supply mechanism 500 DETAILED DESCRIPTION

[0056] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0057] In the description of the present application, it should be understood that the terms indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, it should be noted that the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0058] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0059] Some embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0060] See also Figures 1 to 5 The embodiment of the present application provides a glue pouring mechanism 100 . The glue pouring mechanism 100 includes a carrier plate 10 , a fixture 20 , a cover body 30 , a glue pouring valve 50 and a metering valve 60 .

[0061] The carrier 10 is roughly plate-shaped, and the carrier 10 can be connected to an external lifting mechanism (not shown), and the external lifting mechanism drives the carrier 10 to move up and down, wherein the external lifting mechanism can be a functional structure such as a linear cylinder. The fixture 20 is detachably arranged on the carrier 10, and the fixture 20 is provided with a glue inlet 22, a molding cavity 21 and a glue outlet 23 which are connected in sequence, and the glue inlet 22 and the glue outlet 23 are at least partially arranged as a structure that gradually shrinks from the inside to the outside, and the glue inlet 22 and the glue outlet 23 can be understood as a structure that is larger at the bottom and smaller at the top, wherein the side close to the molding cavity 21 can be understood as "inside", and the side away from the molding cavity 21 can be understood as "outside", and the molding cavity 21 of the fixture 20 can be clamped with a workpiece (not shown) so that the colloid poured into the molding cavity 21 is connected to the workpiece after solidification, and the molding cavity 21 of the fixture 20 can also be not clamped with a workpiece, so that the colloid poured into the molding cavity 21 is solidified and formed into a product.

[0062] The cover 30 is used to connect with the carrier 10 to form a closed cavity 40. After the cover 30 is connected with the carrier 10, the jig 20 is located in the cavity 40. The cover 30 is used to communicate with an external vacuum device (not shown), and the external vacuum device evacuates the cavity 40, which also includes evacuating the molding cavity 21 of the jig 20. It can be understood that the cover 30 can usually be located above the carrier 10. When the jig 20 is placed on the carrier 10 and the external lifting mechanism drives the carrier 10 to approach the cover 30 above it, the cover 30 covers the carrier 10 to form a closed cavity 40. After the glue filling is completed, the external lifting mechanism drives the carrier 10 away from the cover 30 above it to separate from the cover 30, so as to remove the jig 20 after the glue filling from the carrier 10.

[0063] The glue filling valve 50 is inserted on the cover body 30 and the glue filling needle 51 of the glue filling valve 50 is inserted into the cavity 40 and inserted into the glue inlet 22. The glue filling valve 50 is used to supply colloid to the glue inlet 22 so that the colloid flows into the molding cavity 21 through the glue inlet 22. It can be understood that after the glue filling valve 50 fills the colloid into the glue inlet 22, the colloid has pressure and can flow to various positions in the molding cavity 21. When the colloid flows in the molding cavity 21, it may overflow from the glue outlet 23. The metering valve 60 is set on the cover body 30 and is spaced from the glue filling valve 50. The metering needle 61 of the metering valve 60 is inserted into the cover body 30 and extends into the cavity 40 and is suspended and inserted into the glue outlet 23. The metering valve 60 is used to suck back the colloid that overflows from the glue outlet 23. The suspended insertion at the glue outlet 23 can be understood as the metering needle 61 being inserted into the glue outlet 23 but not contacting the hole wall of the glue outlet 23, and a gap is left between the metering needle 61 and the hole wall of the glue outlet 23, so that when the external vacuum device evacuates the cavity 40, the air in the molding cavity 21 can be drawn away from the gap between the metering needle 61 and the hole wall of the glue outlet 23, and when the colloid overflows to the gap between the metering needle 61 and the hole wall of the glue outlet 23, the metering valve 60 can sense the colloid and suck the colloid back through the metering needle 61. The glue injection needle 51 and the metering needle 61 can both be understood as needles.

[0064] When the above-mentioned glue filling mechanism 100 is in use, the fixture 20 is placed on the carrier 10, and the external lifting mechanism drives the carrier 10 to approach the cover body 30 above it and connects the carrier 10 with the cover body 30 to form a closed cavity 40. The external vacuum device evacuates the cavity 40, so that the cavity 40 and the molding cavity 21 of the fixture 20 are in a vacuum environment. The glue filling valve 50 fills the glue into the glue inlet 22, and the glue is poured into the molding cavity 21 through the glue inlet 22 and flows to various positions in the molding cavity 21. When the glue overflows from the glue outlet 23 to the surrounding side of the metering needle 61, the metering valve 60 sucks back the glue at the glue outlet 23 through the metering needle 61, so that the glue at the glue outlet 23 is retained on the side of the glue outlet 23 close to the molding cavity 21 (the end with a larger diameter of the glue outlet 23). When the glue filling of the fixture 20 is completed, the glue filling valve 50 stops filling, and the external vacuum device The vacuum of the cavity 40 is broken, so that the atmospheric pressure environment is restored in the cavity 40. Since the atmospheric pressure environment is restored in the cavity 40, the colloid in the molding cavity 21 overflows from the glue outlet 23 due to the pressure of the atmospheric pressure. When the colloid overflows from the glue outlet 23 to the surrounding side of the metering needle 61, the metering valve 60 sucks back the colloid at the glue outlet 23 through the metering needle 61. After the external vacuum device breaks the vacuum of the cavity 40 and the glue injection valve 50 stops injecting glue, the metering valve 60 is closed with a delay to ensure that the glue outlet 23 will not be affected by the atmospheric pressure and the colloid will not overflow. When the metering valve 60 is closed, the external lifting mechanism drives the carrier plate 10 to move away from the cover body 30 above it, so that the carrier plate 10 is separated from the cover body 30, so as to facilitate the removal of the jig 20 after the injection. After the jig 20 is removed, the jig 20 can be placed in a curing room, and the colloid in the jig 20 is photocured by ultraviolet light.

[0065] The glue filling mechanism 100 provided in the embodiment of the present application uses the metering valve 60 to suck back the colloid overflowing from the glue outlet 23, thereby preventing the colloid from overflowing from the glue outlet 23 and causing difficulty in demolding, preventing the product from being deformed or broken due to difficulty in demolding, and improving the molding yield of the product. In addition, by setting the glue inlet 22 and the glue outlet 23 to be structures that gradually shrink from the inside to the outside, the glue capacity of the glue inlet 22 and the glue outlet 23 on the side close to the molding cavity 21 is increased, and the glue output of the colloid from the glue inlet 22 and the glue outlet 23 is reduced. In addition, the structure that gradually shrinks from the inside to the outside reduces glue overflow, which is conducive to the glue being in the glue outlet 23. The gradually shrinking position from the inside to the outside also facilitates the demolding of the product, further improving the molding yield of the product.

[0066] In the embodiment of the present application, the number of the glue inlet 22 and the glue outlet 23 can be two, and the connection line of the two glue inlets 22 and the connection line of the two glue outlets 23 are cross-set, and accordingly, the number of the glue filling valve 50 and the metering valve 60 are both two. In this way, by setting two glue inlets 22 and two glue outlets 23 on the fixture 20, the colloid can flow evenly to various positions of the molding cavity 21 through the two glue inlets 22, ensuring that the colloid is full and not missing after solidification.

[0067] In the embodiment of the present application, the glue inlet 22 and the glue outlet 23 both include a tapered hole 24, a straight barrel hole 25 and a matching hole 26 which are connected in sequence, the tapered hole 24 is connected to the molding cavity 21, the tapered hole 24 gradually shrinks from the inside to the outside, the aperture of the straight barrel hole 25 remains unchanged, and the matching hole 26 forms a step with the straight barrel hole 25 to match the needle head of the glue filling valve 50 and the needle head of the metering valve 60. In this way, by setting the glue inlet 22 and the glue outlet 23 to include the tapered hole 24, the straight barrel hole 25 and the matching hole 26, the glue capacity of the glue inlet 22 and the glue outlet 23 on the side close to the molding cavity 21 is increased by the tapered hole 24, and the glue output at the glue inlet 22 and the glue outlet 23 is reduced. It can be understood that in other embodiments, the glue inlet 22 and the glue outlet 23 may also include two circular holes with different apertures, and the circular hole with a larger aperture is connected to the molding cavity 21, so that the glue volume on the side of the glue inlet 22 and the glue outlet 23 close to the molding cavity 21 is increased by the circular hole with a larger aperture. Alternatively, the glue inlet 22 and the glue outlet 23 may also include a trapezoidal circular hole, the aperture of which decreases from bottom to top, so that the glue volume on the side of the glue inlet 22 and the glue outlet 23 close to the molding cavity 21 is increased.

[0068] In the embodiment of the present application, the glue injection needle 51 of the glue injection valve 50 is inserted into the intersection of the straight barrel hole 25 and the tapered hole 24 of the glue inlet 22, and the glue injection needle 51 is adapted to be inserted into the straight barrel hole 25 and fits with the hole wall of the straight barrel hole 25. In this way, by limiting the insertion position of the glue injection needle 51, it is prevented that the glue overflows from the glue inlet 22 when the glue injection valve 50 is injecting glue, and the tapered hole 24 is used to reduce the pressure of the glue flowing out of the glue injection needle 51, so as to ensure that the glue can smoothly flow into the molding cavity 21.

[0069] In the embodiment of the present application, the glue filling valve 50 further includes a screw assembly 52 and a needle head. The screw assembly 52 is used to rotate in a first direction to supply colloid so that the colloid flows out from the glue filling needle 51. The screw assembly 52 is also used to rotate in a second direction opposite to the first direction to suck back the colloid. It can also be understood that the screw assembly 52 supplies colloid by forward rotation and sucks back the colloid by reverse rotation. The glue filling needle 51 is inserted into the needle head of the glue filling valve 50. In this way, by limiting the glue filling valve 50 to include the screw assembly 52, the glue filling valve 50 has the function of sucking back the colloid. When the glue filling of the fixture 20 is completed and the vacuum of the cavity 40 is broken, the glue filling valve 50 sucks back the colloid at the glue inlet 22 by reverse rotation, and sucks back the colloid at the glue outlet 23 by the metering valve 60, thereby ensuring that there is no colloid overflow at both the glue inlet 22 and the glue outlet 23.

[0070] In the embodiment of the present application, the metering needle 61 of the metering valve 60 is suspended and inserted at the intersection of the straight barrel hole 25 and the tapered hole 24 of the glue outlet 23, and the diameter of the metering needle 61 is smaller than the diameter of the straight barrel hole 25 of the glue outlet 23. The metering valve 60 further includes a needle head, and the metering needle 61 is inserted in the needle head of the metering valve 60. In this way, by limiting the insertion position of the metering needle 61, when the colloid at the glue outlet 23 overflows to the tapered hole 245, the metering valve 60 rotates to suck back the colloid in the tapered hole 24, so that the colloid at the straight barrel hole 25 drops, and then the overflow degree of the colloid is limited to the tapered hole 24; by limiting the diameter of the metering needle 61 to be smaller than the diameter of the straight barrel hole 25 of the glue outlet 23, a gap is formed between the metering needle 61 and the hole wall of the straight barrel hole 25, so that when the cavity 40 is evacuated, the air in the molding cavity 21 can be extracted through the gap between the metering needle 61 and the hole wall of the straight barrel hole 25.

[0071] In the embodiment of the present application, the cover body 30 may include a top plate 31 and a support member 32, both ends of the support member 32 are open, one end of the support member 32 is connected to the top plate 31, and the other end of the support member 32 is used to connect to the carrier 10, the glue filling valve 50 and the metering valve 60 are both arranged on the top plate 31, and the glue filling needle 51 and the metering needle 61 are both penetrated through the top plate 31 and extend into the support member 32. In this way, by setting the specific structure of the cover body 30, the cover body 30 is connected to the carrier 10 to form a closed cavity 40.

[0072] Furthermore, the cover body 30 further includes a sealing member 33, which is generally annular, embedded in the support member 32 and abutting against the top plate 31, and the sealing member 33 can be made of a rubber material. In this way, by arranging the above-mentioned sealing member 33 between the top plate 31 and the support member 32, the sealing ability between the top plate 31 and the support member 32 is improved to avoid air leakage in the cavity 40. It can be understood that the sealing member 33 can also be arranged on the side of the support member 32 facing the carrier 10 or the side of the carrier 10 facing the support member 32 to further improve the sealing ability of the cavity 40.

[0073] In the embodiment of the present application, the glue pouring mechanism 100 further includes a connecting pipe 70, one end of which is disposed on the top plate 31 of the cover body 30, and the other end of the connecting pipe 70 is used to communicate with an external vacuum device. Thus, by disposing the connecting pipe 70, the cover body 30 is connected with the external vacuum device. The connecting pipe 70 may be a hard pipe such as a steel pipe, or a soft pipe such as a corrugated pipe.

[0074] See also Figure 6 The embodiment of the present application further provides a glue pouring system 1. The glue pouring system 1 includes the glue pouring mechanism 100 described in the above technical solution. The glue pouring system 1 also includes a lifting mechanism 200, a vacuum device 300 and a controller 400.

[0075] The lifting mechanism 200 may be a linear cylinder, and the lifting mechanism 200 is connected to the carrier 10 of the glue injection mechanism 100, and the lifting mechanism 200 is used to drive the carrier 10 to move up and down to approach or move away from the cover 30 above the carrier 10. The vacuum device 300 may be a vacuum pump, and the vacuum device 300 is connected to the cover 30 of the glue injection mechanism 100 or to the connecting pipe 70 of the glue injection mechanism 100, and the vacuum device 300 is used to evacuate and break the vacuum of the cavity 40 formed by the connection between the cover 30 and the carrier 10. The controller 400 is coupled to the lifting mechanism 200, the vacuum device 300 and the glue filling valve 50 and the metering valve 60 of the glue filling mechanism 100 respectively. The controller 400 is used to control the lifting mechanism 200 to drive the carrier 10 to lift and lower. The controller 400 is also used to control the vacuum device 300 to evacuate and break the vacuum of the cavity 40. The controller 400 is also used to control the glue filling valve 50 to supply colloid to the glue inlet 22. Specifically, the controller 400 controls the screw assembly 52 of the glue filling valve 50 to rotate forward to supply colloid and reverse to suck back the colloid, and the controller 400 is used to control the metering valve 60 to suck back the colloid at the glue outlet 23.

[0076] When the above-mentioned glue filling system 1 is in use, the fixture 20 is placed on the carrier 10, and the controller 400 controls the lifting mechanism 200 to drive the carrier 10 to approach the cover 30 above it and connect the carrier 10 with the cover 30 to form a closed cavity 40. The controller 400 controls the vacuum device 300 to evacuate the cavity 40, so that the cavity 40 and the molding cavity 21 of the fixture 20 are in a vacuum environment. The controller 400 controls the glue filling valve 50 to rotate forward to supply glue to the glue inlet 22. The colloid is poured into the molding cavity 21 through the glue inlet 22 and flows to various positions in the molding cavity 21. When the colloid overflows from the glue outlet 23 to the surrounding side of the metering needle 61, the controller 400 controls the metering valve 60 to suck back the colloid at the glue outlet 23, so that the colloid at the glue outlet 23 is retained on the side of the glue outlet 23 close to the molding cavity 21 (the end with a larger diameter of the glue outlet 23). When the glue filling of the fixture 20 is completed, the controller 400 controls the vacuum device 3 00 breaks the vacuum in the cavity 40, so that the cavity 40 returns to the atmospheric pressure environment. Since the cavity 40 returns to the atmospheric pressure environment, the colloid in the molding cavity 21 overflows from the glue outlet 23 and the glue inlet 22 due to the atmospheric pressure. When the colloid overflows from the glue outlet 23 to the side of the metering needle 61, the controller 400 controls the metering valve 60 to suck back the colloid at the glue outlet 23 through the metering needle 61. After the vacuum device 300 breaks the vacuum in the cavity 40, the controller 400 The metering valve 60 is controlled to be closed with a delay, so that the metering valve 60 continuously sucks back the colloid overflowing from the glue outlet 23, ensuring that there is no colloid overflowing from the glue outlet 23, and the controller 400 controls the glue filling valve 50 to stop filling and reverse to suck back the colloid at the glue inlet 22, ensuring that there is no colloid overflowing from the glue inlet 22, wherein the controller 400 also controls the glue filling valve 50 to be closed with a delay after reversing, so that the glue filling valve 50 continuously sucks back the colloid overflowing from the glue inlet 22. After the controller 400 controls the glue filling valve 50 and the metering valve 60 to be closed, the controller 400 controls the lifting mechanism 200 to drive the carrier plate 10 to move away from the cover body 30 above it, so that the carrier plate 10 is separated from the cover body 30, so as to facilitate the removal of the fixture 20 after the filling. After the fixture 20 is removed, the fixture 20 can be placed in a curing room, and the colloid in the fixture 20 is photocured by ultraviolet light.

[0077] The glue filling system 1 provided in the embodiment of the present application, through the glue filling valve 50 and the metering valve 60, respectively sucks back the colloid overflowing from the glue inlet 22 and the glue outlet 23, so as to avoid the colloid overflowing from the glue inlet 22 and the glue outlet 23 and causing difficulty in demolding, and avoid the deformation or breakage of the product due to the difficulty in demolding, thereby improving the molding yield of the product. In addition, by setting the glue inlet 22 and the glue outlet 23 to be a structure that gradually shrinks from the inside to the outside, the glue capacity of the glue inlet 22 and the glue outlet 23 on the side close to the molding cavity 21 is increased, and the glue output of the colloid from the glue inlet 22 and the glue outlet 23 is reduced. Moreover, through the structure that gradually shrinks from the inside to the outside, the glue overflow is reduced, which is conducive to the glue being in the glue outlet 23 The gradually shrinking position from the inside to the outside is also convenient for demolding the product, and the molding yield of the product is further improved.

[0078] In the embodiment of the present application, the glue pouring system 1 may further include a glue supply mechanism 500, which is connected to the glue pouring valve 50 and coupled to the controller 400. The controller 400 is also used to control the glue supply mechanism 500 to supply glue to the glue pouring valve 50, so that the glue pouring valve 50 supplies glue to the glue inlet 22. In this way, by providing the above-mentioned glue supply mechanism 500, the glue pouring system 1 can realize continuous glue pouring operation, reduce material preparation time, and improve glue pouring efficiency.

[0079] It is obvious to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above, and that the present application can be implemented in other specific forms without departing from the spirit or essential features of the present application. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present application.

[0080] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present application and are not intended to limit it. Although the present application has been described in detail with reference to the preferred embodiments, a person of ordinary skill in the art should understand that the technical solution of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present application.

Claims

1. A glue filling mechanism, characterized in that: include: Carrier board; A jig is arranged on the carrier plate, the jig is provided with a molding cavity and a glue inlet and a glue outlet communicated with the molding cavity, and the glue inlet and the glue outlet are at least partially configured as a structure that gradually contracts from the inside to the outside; A cover body, which is disposed on the carrier plate to form a closed cavity, the fixture is located in the cavity, and the cover body is used to communicate with an external vacuum device, and the external vacuum device evacuates the cavity; A glue filling valve is arranged on the cover body, and a glue filling needle of the glue filling valve is passed through the cavity and inserted into the glue inlet, and the glue filling valve is used to supply glue to the glue inlet; A metering valve is arranged on the cover body and spaced apart from the glue filling valve. A metering needle of the metering valve is inserted into the cavity and suspended at the glue outlet. The metering valve is used to suck back the colloid at the glue outlet.

2. The glue filling mechanism according to claim 1, characterized in that: The glue inlet and the glue outlet both include a tapered hole and a straight barrel hole connected to the tapered hole, the tapered hole is connected to the molding cavity, and the tapered hole gradually shrinks from the inside to the outside.

3. The glue filling mechanism according to claim 2, characterized in that: The glue injection needle is inserted into the intersection of the straight barrel hole and the tapered hole of the glue inlet, and the metering needle is suspended and inserted into the intersection of the straight barrel hole and the tapered hole of the glue outlet.

4. The glue filling mechanism according to claim 2, characterized in that: The diameter of the metering needle is smaller than the diameter of the straight barrel hole of the glue outlet.

5. The glue filling mechanism according to claim 1, characterized in that: The cover body includes a top plate and a support member, both ends of the support member are openings, one end of the support member is connected to the top plate, and the other end of the support member is connected to the carrier plate, and the glue injection valve and the metering valve are both arranged on the top plate.

6. The glue filling mechanism according to claim 5, characterized in that: The cover body further includes a sealing member, and the sealing member is arranged between the top plate and the supporting member.

7. The glue filling mechanism according to claim 1, characterized in that: The glue pouring mechanism further comprises a connecting pipe, one end of which is arranged on the cover body, and the other end of which is used to communicate with the external vacuum device.

8. The glue filling mechanism according to claim 3, characterized in that: The glue dispensing valve further comprises a screw assembly and a needle head connected to each other, wherein the screw assembly is used to rotate in a first direction to supply the colloid, and the screw assembly is used to rotate in a second direction opposite to the first direction to suck back the colloid; the glue dispensing needle is inserted into the needle head of the glue dispensing valve; The metering valve further comprises a needle portion, wherein the metering needle is inserted into the needle portion of the metering valve; The glue inlet and the glue outlet both include matching holes, and the matching holes and the corresponding straight barrel holes form a stepped shape to match the needle head of the glue filling valve and / or the needle head of the metering valve.

9. A glue filling system, characterized in that: It comprises a glue filling mechanism as described in any one of claims 1 to 8.

10. The glue pouring system according to claim 9, characterized in that: The glue pouring system also includes: A lifting mechanism, connected to the carrier plate of the glue filling mechanism, and used for driving the carrier plate to be lifted and lowered; A vacuum device, connected to the cover of the glue filling mechanism, and used to evacuate the cavity formed by the cover and the carrier; The controller is coupled to the lifting mechanism, the vacuum device, the glue filling valve and the metering valve of the glue filling mechanism respectively, and is used to control the lifting mechanism to drive the carrier plate to lift and lower, and is also used to control the vacuum device to evacuate and break the vacuum of the cavity, and is also used to control the glue filling valve to supply colloid to the glue inlet, and is used to control the metering valve to suck back the colloid at the glue outlet.

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