Infrared heating device and organic plate forming equipment

Abstract

The utility model relates to an infrared heating device and organic plate forming equipment. The infrared heating device comprises a mounting shell which is provided with a containing space and an opening, and the containing space is communicated with the opening; the infrared heating pieces are arranged in the containing space at intervals in the width direction of the mounting shell and are opposite to the opening, the infrared heating pieces are made of metal foils, and after being heated, the infrared heating pieces radiate medium-wave infrared light and emit the medium-wave infrared light through the opening; and the insulating heat insulation piece is arranged in the accommodating space and is positioned on one side, far away from the opening, of the infrared heating piece. After the infrared heating piece is electrified, the infrared heating piece can directly heat and radiate the medium-wave infrared light, the medium-wave infrared light does not need to be radiated after convection heating, the heat transfer path is simplified, the heating efficiency is improved, the heating requirement in the organic plate forming process is met, the heat dissipation effect is guaranteed, and the forming requirement of the organic plate is met. Therefore, the forming efficiency of the organic plate is ensured.

Description

Technical Field

[0001] The present application relates to the technical field of organic board forming, and in particular to an infrared heating device and organic board forming equipment. Background Art

[0002] Organic board (continuous fiber reinforced thermoplastic composite board) is a composite board composed of continuous fiber and thermoplastic resin for reinforcement. The molding of organic board generally requires preheating and then molding. In order to save energy, the heater needs to be frequently turned on and off during the entire molding cycle of the organic board, so that the heater starts working when the organic board needs to be heated and stops working when it is not necessary to heat.

[0003] Usually, the heating of organic panels is generally carried out by infrared heating. The current infrared heaters generally adopt quartz tube infrared heaters. The principle is to heat the heating element in the quartz tube to a certain temperature by electricity, and then transfer the heat to the quartz tube through thermal convection to heat the quartz tube wall to a certain temperature, and then radiate infrared light outward through the quartz tube wall.

[0004] However, when using quartz tube heating, the heating element needs to heat and then radiate infrared light through the quartz tube, which has low heating efficiency and cannot meet the requirements of organic board molding, thereby affecting the molding efficiency of organic boards. When heat is dissipated, the heating element stops heating, but the quartz tube will still emit infrared light under the residual convection heat, affecting the heat dissipation effect. Summary of the invention

[0005] Based on this, it is necessary to provide an infrared heating device and an organic board forming equipment to address the problems of low heating efficiency and low heat dissipation efficiency when the organic board is currently heated by a quartz tube infrared heater. The infrared heating device and the organic board forming equipment can directly radiate medium-wave infrared light during heating, eliminating the convection heating process and improving the heating efficiency. When the heating is stopped, the medium-wave infrared light can be stopped in time to ensure the heat dissipation effect, thereby meeting the forming requirements of the organic board and improving the forming efficiency of the organic board.

[0006] An infrared heating device, comprising:

[0007] An installation shell, the installation shell having a receiving space and an opening, the receiving space being in communication with the opening;

[0008] A plurality of groups of infrared heating elements are arranged in the accommodation space at intervals along the width direction of the mounting housing and are arranged opposite to the opening, the infrared heating elements are made of metal foil, and the infrared heating elements radiate medium-wave infrared light after heating and emit it through the opening; and

[0009] The insulating and heat-isolating component is arranged in the accommodating space and is located on a side of the infrared heating component away from the opening.

[0010] In one embodiment of the present application, the infrared heating element includes a heating component and a supporting component, the heating component extends along the height dimension of the mounting shell, and the supporting component is arranged at both ends of the heating component and is arranged on the insulating and heat-insulating component;

[0011] The heating component and the supporting component are both made of metal foil.

[0012] In an embodiment of the present application, each of the infrared heating elements includes two heating components, the two heating components are arranged in parallel, and two ends of the two heating components are respectively connected to the supporting components.

[0013] In one embodiment of the present application, the heat generating component is arranged in a straight line bending shape, and / or the heat generating component is arranged in a curved line bending shape.

[0014] In one embodiment of the present application, the heat generating component is arranged in a wave shape.

[0015] In one embodiment of the present application, the thickness of the infrared heating element is less than or equal to 0.1 mm;

[0016] And / or, the width of the infrared heating element is 3 mm to 20 mm.

[0017] In one embodiment of the present application, the infrared heating element is subjected to oxidation treatment;

[0018] Alternatively, the outer side of the infrared heating element is coated with an infrared coating;

[0019] Alternatively, the surface of the infrared heating element is not subjected to surface treatment.

[0020] In one embodiment of the present application, the infrared heating element is made of an electrothermal alloy;

[0021] The infrared heating element is made of Cr20Ni80 material, Cr20Ni35 material, Cr20Ni30 material, 0Cr23A15 material, 0Cr21A16 material or 0Cr21A16Nb material;

[0022] The insulating and heat-insulating component is made of gypsum or aluminum silicate.

[0023] In one embodiment of the present application, the infrared heating device further comprises a shield, which is arranged in a mesh shape and is arranged at the opening;

[0024] The mounting shell has a plurality of heat dissipation grooves, which are distributed on the surface of the mounting shell away from the opening; and / or the mounting shell also has a fixing hole, which is arranged on the surface of the mounting shell away from the opening so as to be installed on the supporting frame of the infrared heating station; and / or the mounting shell also has a temperature measuring hole, which is arranged on the surface of the mounting shell away from the opening, and the temperature measuring hole is used to install a thermometer; and / or the infrared heating device also includes a terminal, which is arranged on the mounting shell and electrically connected to the infrared heating element, and the terminal is also electrically connected to an external power supply.

[0025] An organic board forming device comprises an injection molding machine and an infrared heating station, wherein the injection molding machine is used for forming and processing the organic board, and the infrared heating station comprises a supporting frame and a plurality of infrared heating devices as described in any of the above technical features, wherein the plurality of infrared heating devices are arranged in rows and / or columns on the supporting frame, and the plurality of infrared heating devices are used for heating the organic board.

[0026] After adopting the above technical solution, this application has at least the following technical effects:

[0027] The infrared heating device and organic board forming equipment of the present application, in the infrared heating device, the installation shell has a connected accommodating space and an opening, the insulating heat-insulating component is arranged in the accommodating space and installed on the side wall of the shell away from the opening, multiple groups of infrared heating components are arranged in the installation space at intervals and are located on the side of the insulating heat-insulating component facing the opening, the infrared heating component is made of metal foil, the infrared heating component can radiate medium-wave infrared light after being powered on and heated, and is arranged through the opening, and at the same time, the insulating heat-insulating component can play the role of insulation and heat insulation, avoid the installation shell from being electrified, and avoid the heat generated by the infrared heating component from being dissipated to the outside from the side of the installation shell opposite to the opening, so as to ensure that the heat generated by the infrared heating component can be dissipated from the opening, thereby ensuring the heating effect.

[0028] The infrared heating device uses metal foil to make an infrared heating element. After the infrared heating element is powered on, the infrared heating element can directly heat and radiate medium-wave infrared light, without the need to use convection heating to radiate medium-wave infrared light, thereby simplifying the heat transfer path and improving the heating efficiency to meet the heating requirements during the organic board forming process. Moreover, when the infrared heating element is powered off, the infrared heating element will immediately stop heating, and the ultra-thin metal foil can achieve rapid cooling and stop radiating medium-wave infrared light to ensure the heat dissipation effect. In this way, the medium-wave infrared light generated by the infrared heating element after heating can directly act on the organic board through the opening, and when the heating stops, the medium-wave infrared light can be stopped in time to meet the forming requirements of the organic board, thereby ensuring the forming efficiency of the organic board. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1This is a schematic diagram of an infrared heating device according to an embodiment of the present application viewed from a certain angle.

[0030] Figure 2 for Figure 1 A partial schematic diagram of the infrared heating device at AA is shown.

[0031] Figure 3 for Figure 1 The infrared heating device shown is a schematic diagram viewed from another angle.

[0032] Figure 4 for Figure 1 A partial enlarged view of the infrared heating device at point B is shown.

[0033] Among them: 100, infrared heating device; 110, mounting shell; 111, opening; 112, heat dissipation hole; 113, fixing hole; 114, temperature measuring hole; 120, infrared heating element; 121, heating component; 122, supporting component; 130, insulating and heat-insulating component; 140, protective cover; 150, terminal. DETAILED DESCRIPTION

[0034] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0035] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0036] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0037] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0038] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "on" or "below" a second feature, etc., or the like, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0039] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0040] See also Figure 1 , the present application provides an infrared heating device 100 . Figure 1This is a schematic diagram of an infrared heating device 100 of an embodiment of the present application viewed from one angle. The infrared heating device 100 is applied to the infrared heating station of the organic board forming equipment to heat the organic board during the forming process of the organic board to meet the forming requirements of the organic board. The organic board is a composite board formed by processing continuous fibers (such as glass fibers, carbon fibers, aramid fibers, etc.) and thermoplastic resins (such as PP, PA, PEEK, etc.) as raw materials. This application only takes the infrared heating device 100 heating the organic board as an example to illustrate its structure. Of course, in other embodiments of the present application, the infrared heating device 100 can also be applied to other equipment or devices that require infrared heating, which will not be repeated here.

[0041] It is understandable that the heating of organic boards is generally carried out using quartz tube infrared heaters. However, when using quartz tube heating, the heating element needs to be heated and then radiated infrared light through the quartz tube. The heating efficiency is low and cannot meet the requirements of organic board molding, thereby affecting the molding efficiency of the organic board. When dissipating heat, the heating element stops heating, but the quartz tube will still emit infrared light under the residual convection heat, affecting the heat dissipation effect. For this reason, the present application provides a new type of infrared heating device 100, which can directly radiate infrared light during heating, eliminating the convection heating process, improving the heating efficiency, and can stop radiating medium-wave infrared light in time when stopping heating, ensuring the heat dissipation effect, thereby meeting the molding requirements of the organic board and improving the molding efficiency of the organic board.

[0042] See also Figure 1 and Figure 2 In one embodiment, the infrared heating device 100 includes a mounting shell 110, an insulating heat-insulating member 130, and a plurality of infrared heating members 120. The mounting shell 110 has a storage space (not shown) and an opening 111, and the storage space is connected to the opening 111. The plurality of infrared heating members 120 are arranged in the storage space at intervals along the width direction of the mounting shell 110, and are arranged opposite to the opening 111. The infrared heating members 120 are made of metal foil. After heating, the infrared heating members 120 radiate medium-wave infrared light, which is emitted through the opening 111. The insulating heat-insulating member 130 is arranged in the storage space, and is located on the side of the infrared heating member 120 away from the opening 111. Figure 2 for Figure 1 The shown schematic diagram is a partial view of the infrared heating device 100 at AA.

[0043] The installation housing 110 is the overall outer shell of the infrared heating device 100. All components of the infrared heating device 100 are arranged in the installation housing 110. The installation housing 110 forms an integral infrared heating device 100, which facilitates the installation and use of the infrared heating device 100. At the same time, the installation housing 110 can also play a protective role, preventing external components from interfering with the components of the infrared heating device 100, thereby ensuring the performance of the infrared heating device 100.

[0044] Specifically, the mounting housing 110 is a hollow hexahedral structure, the internal cavity of the mounting housing 110 is a receiving space, one side of the mounting housing 110 has an opening 111, and the receiving space is connected to the opening 111. Figure 1 As shown, the installation housing 110 is a rectangular parallelepiped structure. The various components of the infrared heating device 100 are arranged in the accommodation space. In this way, while meeting the installation requirements of the various components of the infrared heating device 100, the volume of the installation housing 110 can also be reduced, thereby reducing the occupied space of the infrared heating device 100 applied to the organic board forming equipment. Figure 1 In the present application, the left-right direction is the width direction, the up-down direction is the height direction, and the front-back direction is the length direction. Figure 1 The orientation shown is a reference.

[0045] The infrared heating element 120 is the main component for realizing infrared heating. The infrared heating element 120 is arranged in the accommodation space and is arranged opposite to the opening 111. The infrared heating element 120 can heat after being energized, and can radiate medium-wave infrared light after being energized, and then the medium-wave infrared light can be emitted through the opening 111, so as to achieve the purpose of infrared heating, so as to heat the organic board. The number of infrared heating elements 120 is multiple groups, and multiple groups of infrared heating elements 120 are arranged in the accommodation space along the length direction of the mounting shell 110. In this way, multiple groups of infrared heating elements 120 can cover the opening 111 along the width direction of the mounting shell 110 to ensure the heating effect, thereby meeting the heating requirements of the organic board during the molding process.

[0046] Moreover, the infrared heating element 120 is made of metal foil, which is a thin metal sheet extended from metal. In this way, the infrared heating element 120 itself is made of conductive and heat-generating material and can self-heat, that is, the infrared heating element 120 can directly heat and radiate medium-wave infrared light outward after being powered on. Compared with the quartz tube heater, the infrared heating element 120 of the present application can directly heat after being powered on, eliminating the process of convection heating, so it can be heated to a specific temperature faster, greatly improving the heating efficiency. Optionally, the infrared heating element 120 extends in the height direction to ensure the heating area of ​​the infrared heating element 120.

[0047] The insulating heat-insulating member 130 is disposed in the accommodation space of the mounting housing 110 and is located on the side of the infrared heating member 120 away from the opening 111. When the infrared heating member 120 is powered on, the insulating heat-insulating member 130 can play a role in heat insulation, so that the heat generated by the infrared heating member 120 radiating the medium-wave infrared light will not be dissipated from other positions of the mounting housing 110, but can only be emitted through the opening 111, so as to ensure the heating effect on the organic board.

[0048] Moreover, the infrared heating element 120 is arranged on the insulating heat insulating element 130. After the infrared heating element 120 is powered on, the insulating heat insulating element 130 can also play an insulating role to prevent the infrared heating element 120 from being electrically connected to the mounting housing 110, to prevent the mounting housing 110 from being charged, to ensure the safety of the infrared heating device 100, and to avoid the short circuit of the organic board forming equipment. Optionally, the insulating heat insulating element 130 is attached to the inner wall of the mounting housing 110. Optionally, the insulating heat insulating element 130 is arranged in the mounting housing 110 in a plate shape and is connected to the top wall and the bottom wall of the mounting housing 110.

[0049] The infrared heating device 100 of the above embodiment uses a metal foil to make the infrared heating element 120. After the infrared heating element 120 is powered on, the infrared heating element 120 can directly heat and radiate medium-wave infrared light, without the need to use convection heating to radiate medium-wave infrared light, thereby simplifying the heat transfer path and improving the heating efficiency to meet the heating requirements during the organic board forming process. Moreover, when the infrared heating element 120 is powered off, the infrared heating element 120 will immediately stop heating and will not radiate medium-wave infrared light, thereby ensuring the heat dissipation effect. In this way, the medium-wave infrared light generated by the infrared heating element 120 after heating can directly act on the organic board through the opening 111, and when the heating stops, the medium-wave infrared light can be stopped in time to meet the forming requirements of the organic board, thereby ensuring the forming efficiency of the organic board.

[0050] See also Figure 1 In one embodiment, the infrared heating device 100 further includes a shield 140, which is arranged in a mesh shape and is arranged at the opening 111. When the infrared heating element 120 is powered on to radiate medium-wave infrared light, the medium-wave infrared light can be emitted through the mesh shield 140 to heat the organic board. The mesh shield 140 will not block the medium-wave infrared light to ensure the heating effect of the organic board. At the same time, the mesh shield 140 can also play a protective role to prevent the organic board or other components from entering the installation shell 110 and interfering with the infrared heating element 120, so as to avoid affecting the performance of the infrared heating element 120. Optionally, the shield 140 is a stainless steel part. That is, the shield 140 is made of stainless steel.

[0051] See also Figure 3In one embodiment, the mounting shell 110 has a plurality of heat dissipation slots, and the plurality of heat dissipation slots are distributed on a surface of the mounting shell 110 away from the opening 111 . Figure 3 for Figure 1 The infrared heating device 100 shown is a schematic diagram viewed from another angle. Figure 1 is the front side of the infrared heating device 100, Figure 3 It is the back side of the infrared heating device 100 , the opening 111 is arranged on the front side of the mounting shell 110 , the heat dissipation slot is located on the back side of the mounting shell 110 , and is arranged corresponding to the insulating and heat-insulating member 130 .

[0052] When the infrared heating element 120 stops heating, the heat dissipation holes 112 can accelerate the heat dissipation in the installation space to ensure the heat dissipation effect. Optionally, the heat dissipation slot is a circular hole, an oblong hole or a hole of other shapes, as long as the heat dissipation can be achieved and the processing is convenient. Optionally, the number of heat dissipation slots is multiple, and the multiple heat dissipation slots are arranged in rows and columns on the back of the installation shell 110. Of course, in other embodiments of the present application, the multiple heat dissipation slots can also be arranged on the back of the installation shell 110 in other regular or irregular arrangements.

[0053] See also Figure 3 In one embodiment, the mounting housing 110 further has a fixing hole 113, and the fixing hole 113 is provided on the surface of the mounting housing 110 away from the opening 111, so as to be mounted on the support frame of the infrared heating station. The fixing hole 113 realizes the hole position of fixing the mounting housing 110. It can be understood that the infrared heating device 100 needs to be fixed to the support frame of the infrared heating station of the organic board forming equipment, and the fastener can pass through the fixing hole 113 to fix the mounting housing 110 to the support frame, thereby realizing the fixing of the infrared heating device 100 to the support frame.

[0054] Optionally, the fastener is a bolt or the like. Optionally, there are multiple fasteners, and the multiple fasteners are evenly arranged on the back of the mounting housing 110 to ensure that the mounting housing 110 is reliably fixed to the support frame. It is worth noting that the shape of the fixing hole 113 is not limited in principle, as long as it can cooperate with the fastener to fix the mounting housing 110 to the support frame.

[0055] See also Figure 3 In one embodiment, the mounting housing 110 further has a temperature measuring hole 114, which is disposed on the surface of the mounting housing 110 away from the opening 111, and is used to install a thermometer. The thermometer extends into the mounting housing 110 through the temperature measuring hole 114, and the thermometer is generally a non-contact thermometer, which can measure the surface temperature of the organic board to be heated to ensure the heating effect of the organic board.

[0056] Optionally, the shape of the temperature measuring hole 114 is circular, polygonal or other shapes, as long as the thermometer can be placed. Optionally, there are multiple temperature measuring holes 114, and the multiple temperature measuring holes 114 are distributed on the back of the mounting shell 110 to achieve multi-point detection of the heating effect of the infrared heating element 120. Of course, the position of the temperature measuring hole 114 can also be determined according to the use requirements to ensure that the heating effect of the infrared heating element 120 can meet the molding requirements of the organic board.

[0057] See also Figure 3 In one embodiment, the infrared heating device 100 further includes a terminal 150, which is disposed on the mounting housing 110 and electrically connected to the infrared heating element 120. The terminal 150 is also electrically connected to an external power source. The terminal 150 is disposed on the back of the mounting housing 110, and the terminal 150 is disposed on the mounting housing 110 through an insulating seat.

[0058] Optionally, the terminal 150 is also electrically connected to the controller of the organic board forming equipment, and the controller controls the on and off of the terminal 150, thereby controlling the infrared heating element 120 to be powered on or off, thereby controlling the infrared heating element 120 to meet the forming requirements of the organic board.

[0059] See also Figure 1 , Figure 2 and Figure 4 In one embodiment, the infrared heating element 120 includes a heating component 121 and a supporting component 122. The heating component 121 extends along the height dimension of the mounting shell 110. The supporting component 122 is arranged at both ends of the heating component 121 and is arranged on the insulating and heat-insulating component 130. The heating component 121 and the supporting component 122 are both made of metal foil. Figure 4 for Figure 1 The infrared heating device 100 is shown as a partially enlarged view at B.

[0060] The heating component 121 is arranged in the accommodation space along the height direction, and the height dimension of the heating component 121 is adapted to the height dimension of the opening 111. The heating component 121 also has a certain dimension along the width direction. In this way, it can be ensured that the heating component 121 has a certain heating area, thereby ensuring the heating effect of the heating component 121. Moreover, the top of the heating component 121 is arranged on the insulating and heat-insulating member 130 through a supporting member 122, and the bottom of the heating component 121 is arranged on the insulating and heat-insulating member 130 through another supporting member 122, so that the heating component 121 can be fixed to the insulating and heat-insulating member 130.

[0061] The heating component 121 and the supporting component 122 are both made of metal foil. In this way, when the heating component 121 and the supporting component 122 are powered, the heating component 121 and the supporting component 122 can directly heat and radiate medium-wave infrared light. Optionally, the heating component 121 and the supporting component 122 are fixed to the insulating and heat-insulating member 130 by gluing or mechanical connection.

[0062] See also Figure 1 , Figure 2 and Figure 4 In one embodiment, each of the infrared heating elements 120 includes two heating components 121 , the two heating components 121 are arranged in parallel, and both ends of the two heating components 121 are respectively connected to the supporting component 122 .

[0063] Two adjacent infrared heating elements 120 are connected end to end to form a single loop, which is equivalent to connecting all heating components 121 and supporting components 122 in series. The two heating components 121 at the head and tail are electrically connected to the terminal 150 through high temperature resistant wires, so that the entire infrared heating device 100 can be powered on for heating.

[0064] Of course, in other embodiments of the present application, each infrared heating element 120 may also include other numbers of heating components 121 , and the heating components 121 may also be arranged in other layout forms as long as the heating requirements can be met.

[0065] See also Figure 1 , Figure 2 and Figure 4 In one embodiment, the heating component 121 is arranged in a straight bending shape, and / or the heating component 121 is arranged in a curved bending shape. That is to say, the heating component 121 can adopt a straight bending structure along the height direction, or a curved bending structure, or a combination of a straight bending shape and a curved bending structure. In this way, the surface area of ​​the heating component 121 can be increased, so that after the infrared heating element 120 is powered on, the infrared heating element 120 of this structural form can rise to a specific temperature faster to ensure the heating effect of the infrared heating element 120.

[0066] See also Figure 1 , Figure 2 and Figure 4 In one embodiment, the heating component 121 is arranged in a wave shape. That is, the heating component 121 is a wave-shaped structure with a certain width, so that the infrared heating element 120 can rise to a specific temperature faster after being powered on, thereby ensuring the heating effect.

[0067] See also Figure 1 , Figure 2 and Figure 4In one embodiment, the thickness of the infrared heating element 120 is less than or equal to 0.1 mm. In other words, the infrared heating element 120 is made of a metal foil less than or equal to 0.1 mm. In this way, the infrared heating element 120 can rise to a specific temperature more quickly after being powered on, thereby ensuring a heating effect. Furthermore, the thickness of the infrared heating element 120 is 0.04 mm to 0.05 mm.

[0068] See also Figure 1 , Figure 2 and Figure 4 In one embodiment, the width of the infrared heating element 120 is 3 mm to 20 mm. In this way, the infrared heating element 120 can have a certain width, which can ensure that the infrared heating element 120 has a certain surface area, so that it can rise to a specific temperature more quickly after power is turned on, ensuring the heating effect. Optionally, the width of the infrared heating element 120 is 7 mm to 8 mm.

[0069] See also Figure 1 , Figure 2 and Figure 4 In one embodiment, the infrared heating element 120 is oxidized, or the outer surface of the infrared heating element 120 is coated with an infrared coating. After the outer surface of the infrared heating element 120 is oxidized or coated with an infrared coating, the infrared emissivity of the metal foil can be increased to ensure the effect of radiating infrared light. Of course, in other embodiments of the present application, the surface of the infrared heating element 120 may not be treated.

[0070] In one embodiment, the infrared heating element 120 is made of an electric heating alloy. After the infrared heating element 120 is powered on, it can directly heat and radiate medium-wave infrared light outward, eliminating the process of convection heating, so it can heat to a specific temperature faster, greatly improving the heating efficiency. Optionally, the infrared heating element 120 is made of a nickel alloy. It can be understood that nickel alloy has a small specific volume, can heat and dissipate heat quickly, and can achieve uniform energy distribution and efficient heating, with an energy density of up to 60KW / m 2 .

[0071] In one embodiment, the infrared heating element 120 is made of Cr20Ni80, Cr20Ni35, Cr20Ni30, 0Cr23A15, 0Cr21A16 or 0Cr21A16Nb. In order to match the strongest absorption characteristics of the organic board to infrared rays in the medium wave range, the infrared heating element 120 can be made of an electric heating alloy that emits medium wave infrared, such as Cr20Ni80, Cr20Ni35, Cr20Ni30, 0Cr23A15, 0Cr21A16 or 0Cr21A16Nb.

[0072] In one embodiment, the insulating and heat-insulating member 130 is made of gypsum or aluminum silicate, so that the insulating and heat-insulating effect of the insulating and heat-insulating member 130 can be ensured.

[0073] The infrared heating device 100 of the present application uses a metal foil to make an infrared heating element 120. After the infrared heating element 120 is powered on, the infrared heating element 120 can directly heat and radiate medium-wave infrared light, without the need to use convection heating to radiate medium-wave infrared light, simplifying the heat transfer path and improving the heating efficiency to meet the heating requirements during the organic board forming process and the forming requirements of the organic board, thereby ensuring the forming efficiency of the organic board. In the infrared heating device 100, the infrared heating element 120 uses a metal foil of a special material, which can achieve rapid heating and heat dissipation, so that the infrared heating device 100 can achieve uniform energy distribution and efficient heating.

[0074] The present application also provides an organic board forming device, including an injection molding machine and an infrared heating station, wherein the injection molding machine is used to form and process the organic board, and the infrared heating station includes a support frame and a plurality of infrared heating devices 100 as described in any of the above embodiments, wherein the plurality of infrared heating devices 100 are arranged in rows and / or columns on the support frame, and the plurality of infrared heating devices 100 are used to heat the organic board. After the organic board forming device of the present application adopts the infrared heating device 100 of the above embodiment, the heating efficiency can be improved to meet the forming requirements of the organic board, thereby ensuring the forming efficiency of the organic board.

[0075] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0076] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. An infrared heating device, characterized in that: include: An installation shell, the installation shell having a receiving space and an opening, the receiving space being in communication with the opening; A plurality of groups of infrared heating elements are arranged in the accommodation space at intervals along the width direction of the mounting shell and are arranged opposite to the opening, the infrared heating elements are made of metal foil, and the infrared heating elements radiate medium-wave infrared light after heating and emit it through the opening; as well as The insulating and heat-isolating component is arranged in the accommodating space and is located on a side of the infrared heating component away from the opening.

2. The infrared heating device according to claim 1, characterized in that: The infrared heating element comprises a heating component and a supporting component, wherein the heating component extends along the height dimension of the mounting shell, and the supporting component is arranged at both ends of the heating component and is arranged on the insulating and heat-insulating component; The heating component and the supporting component are both made of metal foil.

3. The infrared heating device according to claim 2, characterized in that: Each of the infrared heating elements comprises two heating components, the two heating components are arranged in parallel, and two ends of the two heating components are respectively connected to the supporting components.

4. The infrared heating device according to claim 2, characterized in that: The heating component is arranged in a straight line bending shape, and / or the heating component is arranged in a curved line bending shape.

5. The infrared heating device according to claim 2, characterized in that: The heating component is arranged in a wave shape.

6. The infrared heating device according to any one of claims 1 to 5, characterized in that: The thickness of the infrared heating element is less than or equal to 0.1 mm; And / or, the width of the infrared heating element is 3 mm to 20 mm.

7. The infrared heating device according to any one of claims 1 to 5, characterized in that: The infrared heating element is subjected to oxidation treatment; Alternatively, the outer side of the infrared heating element is coated with an infrared coating; Alternatively, the surface of the infrared heating element is not subjected to surface treatment.

8. The infrared heating device according to any one of claims 1 to 5, characterized in that: The infrared heating element is made of electric heating alloy; The infrared heating element is made of Cr20Ni80 material, Cr20Ni35 material, Cr20Ni30 material, 0Cr23A15 material, 0Cr21A16 material or 0Cr21A16Nb material; The insulating and heat-insulating component is made of gypsum or aluminum silicate.

9. The infrared heating device according to any one of claims 1 to 5, characterized in that: The infrared heating device further comprises a protective cover, which is arranged in a mesh shape and is arranged at the opening; The mounting shell has a plurality of heat dissipation grooves, which are distributed on the surface of the mounting shell away from the opening; and / or the mounting shell also has a fixing hole, which is arranged on the surface of the mounting shell away from the opening so as to be installed on the supporting frame of the infrared heating station; and / or the mounting shell also has a temperature measuring hole, which is arranged on the surface of the mounting shell away from the opening, and the temperature measuring hole is used to install a thermometer; and / or the infrared heating device also includes a terminal, which is arranged on the mounting shell and electrically connected to the infrared heating element, and the terminal is also electrically connected to an external power supply.

10. An organic board forming device, characterized in that: It comprises an injection molding machine and an infrared heating station, wherein the injection molding machine is used for molding and processing an organic board, and the infrared heating station comprises a supporting frame and a plurality of infrared heating devices according to any one of claims 1 to 9, wherein the plurality of infrared heating devices are arranged in rows and / or columns on the supporting frame, and the plurality of infrared heating devices are used for heating the organic board.

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