Buffer structure

Abstract

The utility model discloses a buffer structure, which mainly comprises a body, which is provided with a groove body structure formed by recessing along the thickness direction, and the groove wall of the groove body structure extends along the direction deviating from the groove position to form a folding edge; the plurality of supporting structures are connected with the folded edges and are used for isolating the groove body structure from a bearing surface in contact with the supporting structures; wherein the buffer structure can support the use of the electronic equipment in different placement states, and in different placement states, the support structure provides different acting forces to the groove body structure.

Description

Technical Field

[0001] The present application relates to the technical field of hardware assistance of electronic equipment, and in particular to a buffer structure. Background Art

[0002] Currently, buffer pads are generally added to electronic devices when they are packaged to protect them during transportation and prevent them from being damaged by bumps and jolts.

[0003] In some embodiments, the packaging of electronic devices or the cushioning pads used in daily life are generally made of degradable materials and have a certain deformation ability to achieve a cushioning effect. However, due to the continuous increase in the output of electronic devices, degradable and recyclable materials are gradually unable to meet the current environmental protection goals, so further improving the utilization value of the cushioning pads has become a top priority. Utility Model Content

[0004] In order to solve the above technical problems, the following technical solutions are provided in the embodiments of the present application:

[0005] The present application provides a buffer structure, which mainly includes: a body, having a groove structure formed by being recessed along the thickness direction, the groove wall of the groove structure extending in a direction away from the groove position to form a folded edge; a plurality of support structures connected to the folded edge, used to isolate the groove structure from the bearing surface contacted by the support structure;

[0006] Among them, the buffer structure can support the use of electronic equipment in different placement states. In different placement states, the support structure provides different forces to the slot structure.

[0007] In some modified implementations of the present application, the buffer structure can support the use of the electronic device in the storage state and the use state; the support structure provides different forces to the slot structure in the storage state and the use state.

[0008] In some modified implementations of the present application, a notch is provided on the groove wall of the groove body structure, and a gap is provided on the support structure corresponding to the notch.

[0009] In some modified embodiments of the present application, the slot structure includes a first slot wall and a second slot wall disposed adjacent to each other, and the number of notches disposed on the first slot wall is greater than the number of notches disposed on the second slot wall;

[0010] and / or,

[0011] The groove body structure comprises two first groove walls which are arranged opposite to each other, and the arrangement positions of the notches on the two first groove walls are the same or different.

[0012] In some modified implementation modes of the present application, it also includes: a plurality of ventilation holes, which are opened at the bottom of the slot structure; the ventilation holes are connected with the gaps, so that when electronic equipment is arranged on the slot structure, the slot structure can be connected with the outside space through the ventilation holes and the gaps.

[0013] In some modified implementations of the present application, it also includes: a baffle that is easy to remove is set on the ventilation hole; when the buffer structure is used to store electronic equipment, the baffle can be used to cover the ventilation hole; when the buffer structure is used to support the electronic equipment, the corresponding baffle on the ventilation hole is removed, and a heat dissipation area is formed at the bottom of the groove to dissipate heat from the electronic equipment.

[0014] In some modified implementations of the present application, the blocking pieces are connected to the inner edges of the corresponding ventilation holes through the perforated line structures;

[0015] And / or, the ventilation holes are symmetrically arranged relative to the center line of the slot structure.

[0016] In some modified implementations of the present application, it also includes: an anti-slip structure, which is composed of a plurality of convex strips arranged at the bottom of the groove, and an anti-slip area is formed at the bottom of the groove outside the heat dissipation area, and the anti-slip area is close to the corners of the bottom of the groove, so that a resistance array can be formed at the corners of the bottom of the groove through the convex strips.

[0017] In some modified embodiments of the present application, the end of each support structure is formed with an outward-turned flange structure to increase the contact area of ​​the end of the support structure; and / or the plane where the tangent of the support structure lies is arranged at an acute angle to the plane where the groove wall of the groove body structure lies.

[0018] In some modified embodiments of the present application, the material thickness of each supporting structure is greater than the material thickness of the main body; and / or the thickness of the portion of the supporting structure where the notch is provided is smaller than the portion of the supporting structure that provides the force. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present application will become easy to understand. In the accompanying drawings, several embodiments of the present application are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0020] Figure 1 A schematic diagram of the three-dimensional structure of the buffer structure in the storage state in the embodiment of the present application is shown;

[0021] Figure 2 The three-dimensional structural diagram of the buffer structure in the use state in the embodiment of the present application is schematically shown.

[0022] Description of Figure Numbers:

[0023] 1. Main body; 11. Tank structure;

[0024] 2. Folded edge; 3. Support structure; 4. Notch; 5. Gap; 6. Ventilation hole; 7. Baffle; 8. Raised strip. DETAILED DESCRIPTION

[0025] The exemplary embodiments disclosed in the present application will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments disclosed in the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present application and to fully convey the scope of the present application to those skilled in the art.

[0026] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by technicians in the field to which this application belongs.

[0027] At present, judging from the development of the market situation, two types of computer host cushions are widely used in the field of electronic products. One is a temporary cushioning protection device specially used in the process of logistics transportation, which is usually designed as a detachable or disposable structure. Its main purpose is to reduce the damage caused by vibration and collision to the precision electronic components inside the computer host by absorbing impact energy during handling, loading and unloading, and transportation. The other is a cushioning base used in daily use scenarios of computer hosts. As a fixed support accessory of the host, it is designed to provide a stable placement platform as well as anti-slip and shock-absorbing functions to ensure that the host maintains good stability and working environment during long-term operation.

[0028] Application and advantages of degradable materials in the field of cushions. With the development of environmental protection concepts and technologies, the industry has begun to pay attention to and actively adopt degradable materials to manufacture the above two types of computer host cushions. Such materials can not only meet basic cushioning needs, but also naturally degrade after completing their protective mission, greatly improving the environmental attributes and resource recovery rate of the product. This innovation helps reduce the impact of electronic waste on the environment and conforms to the trend of the circular economy, so that cushioning equipment can not only ensure product safety, but also reduce pressure on the environment after the end of its life cycle.

[0029] The inventors of the present application have discovered that there are problems with the utilization rate of existing cushions and the need for improvement. Although cushions made of degradable materials have made certain progress in environmental protection, the utilization efficiency of these cushions on the market is not ideal. In actual operation, since logistics cushions are often designed as disposable consumables, even if degradable materials are used, the post-use treatment and reuse rate is still low; and for long-term use cushion bases, they may be idle or abandoned due to factors such as host replacement or changes in user preferences. In view of this, how to further improve the utilization efficiency of these two types of cushions throughout their life cycle becomes a problem that must be solved. The present invention proposes an innovative solution to this problem, aiming to optimize the design and functionality of the cushions so that they can be reused in more occasions or easily converted to other uses, thereby effectively improving the overall utilization value of the cushions.

[0030] Reference Figure 1 and Figure 2 As shown, the embodiment of the present application proposes a buffer structure, which mainly includes: a body 1, having a groove structure 11 formed by being recessed along the thickness direction, and the groove wall of the groove structure 11 is extended in the direction away from the groove position to form a folded edge 2; a plurality of support structures 3 connected to the folded edge 2, which are used to isolate the groove structure 11 from the bearing surface contacted by the support structure 3;

[0031] Among them, the buffer structure can support the use of the electronic device in different placement states. In different placement states, the support structure 3 provides different forces to the slot structure 11.

[0032] Specifically, in the technical solution adopted by the present application, the main body 1 of the buffer structure can adopt an integrally formed structure, and has a slot structure 11 on one side of the main body 1 in the thickness direction, which is used to place the electronic product in the slot structure 11. For example, if the electronic product is a computer host, the buffer structure is a buffer pad installed on the host shell, and the slot structure 11 on the main body 1 is adapted to the shell structure of the host. A support structure 3 is also formed on the main body 1 and is circumferentially arranged on the outside of the main body 1. Specifically, the groove wall of the slot structure 11 extends in a direction away from the groove position to form a folded edge 2, and each support structure 3 is connected to the folded edge 2 and extends downward along the depth direction of the slot structure 11 to below the slot structure 11. In other words, the height of the support structure 3 is greater than the depth of the slot structure 11, so that it can serve as a support portion for supporting the main body 1. Furthermore, when used as a buffer structure for packaging, since the groove wall of the groove structure 11 is connected to the support structure 3 through the folded edge 2 with a certain width, a spacing distance is formed between the support structure 3 and the groove structure 11, and when the support structure 3 is elastically deformed toward the groove body, it can also provide buffering force for the electronic device, that is, the circumferential outer side of the groove structure 11 can also form a buffering force through the integrally formed support structures 3. As a buffer structure during use, since the area supported by the buffer structure is significantly increased compared to the floor space occupied by the electronic device, the support effect of the buffer structure is more stable.

[0033] For further information, see Attachment Figure 1 In some embodiments, the buffer structure can support the use of the electronic device in the storage state and the use state; the support structure 3 provides different forces to the slot structure 11 in the storage state and the use state.

[0034] Specifically, in the technical solution adopted by the present application, when the buffer structure is used as packaging in the storage state, taking a computer host as an example, two buffer structures of the present application can be used and respectively mounted on opposite sides of the computer host. Since the support structure 3 connected to the slot structure 11 through the folded edge 2 forms a spacing distance between the slot structure 11 along the circumferential direction, if the impact force is squeezed toward the slot structure 11 along the outer side of the support structure 3, the spacing distance between the support structure 3 and the slot structure 11 can make enough space for the elastic deformation of the support structure 3, so that the buffer force of four circumferential surfaces can be formed on the computer host through the structure, among which, there are still two surfaces that need the buffer structure to form a buffer force, and the remaining two surfaces correspond to the extension direction of the support structure 3, that is, the two surfaces of the buffer structure mounted on the computer host. Since these two surfaces are isolated from the packaging box by the support structure 3, when the entire body 1 of the buffer structure has elastic deformation characteristics, a buffer force can be formed on the remaining two surfaces.

[0035] The use state is when the buffer structure is used as a buffer base. Taking a computer host as an example, a buffer structure of the present application can be used as the base of the computer host. Specifically, the bottom surface of the computer body is mounted in the slot structure 11, and the computer host can stand on the ground, a desktop or other platforms with a certain flatness through the buffer structure. Since the slot structure 11 can be integrally formed with the support structure 3 through the folding edge 2 and is made of a material with elastic properties, it can provide a stable placement platform for the computer host, with anti-slip and shock-absorbing functions as the main function, to ensure that the host maintains good stability and working environment during long-term operation.

[0036] Further, see Figure 1 and Figure 2 As shown, in some embodiments, a notch 4 is provided on the groove wall of the groove structure 11, and a notch 5 is provided on the support structure 3 corresponding to the notch 4.

[0037] Specifically, in the technical solution adopted by the present application, in one embodiment, a notch 4 is formed on the body 1. In this embodiment, each notch 4 is arranged on the groove wall of the groove structure 11. Each notch 4 is formed on the groove wall and the folded edge 2 of the groove structure 11 and the support structure 3 to reduce the rigidity of the body 1 structure, thereby effectively increasing the buffering force of the buffer structure. Notches 5 corresponding to the upper and lower portions of the notch 4 can also be formed on the support structure 3 to increase the rigidity reduction of the body 1 structure and further increase the buffering force of the body 1.

[0038] On the other hand, if the buffer structure is used as a buffer base, in the process of the buffer structure supporting the computer body, each notch 5 can connect the bottom space of the main body 1 enclosed by each supporting structure 3 with the external space. When the bottom space of the main body 1 is heat-exchanged with the external space through the assistance of each notch 5, the heat accumulated under the buffer body 1 can be dispersed, so that the heat dissipation function of the electronic device using the buffer structure as the base is not excessively affected.

[0039] Further, see Figure 1 and Figure 2 As shown, in some embodiments, the slot structure 11 includes a first slot wall and a second slot wall that are adjacently arranged, and the number of notches 4 arranged on the first slot wall is greater than the number of notches 4 arranged on the second slot wall;

[0040] and / or,

[0041] The slot structure 11 includes two first slot walls that are arranged opposite to each other. The notches 4 on the two first slot walls are arranged at the same or different positions.

[0042] Specifically, in the technical solution adopted by the present application, in one embodiment, the slot structure 11 is arranged in a rectangular parallelepiped structure, including adjacent first slot walls and second slot walls, and the length of the first slot wall is greater than the length of the second slot wall, so that the number of notches 4 arranged on the first slot wall can be greater than the number of notches 4 arranged on the second slot wall. In this embodiment, two notches 4 can be arranged on the first slot wall, and one notch 4 can be arranged on the second slot wall; it should be noted that the number of notches 4 on each slot wall and the size of each notch 4 can be freely adjusted according to the drop test. Since the buffering force required at different positions on the buffer structure is different in different situations, the notch 4 can be set according to the actual situation. In this embodiment, when the buffering force of the buffer structure is required to be relatively balanced, the notches 4 on the two opposite slot walls can be arranged corresponding to each other, and when the reduction of the material structure stiffness needs to be met at a specific position of the buffer structure, the positions can also be staggered, all within the protection scope of the present application.

[0043] Further, see Figure 2 As shown, in some embodiments, it also includes: a plurality of ventilation holes 6, which are opened at the bottom of the slot structure 11; the ventilation holes 6 are connected with the gaps 5, so that when electronic equipment is arranged on the slot structure 11, the slot structure 11 can be connected with the outside space through the ventilation holes 6 and the gaps 5.

[0044] Specifically, in the technical solution adopted by the present application, in one embodiment, a plurality of ventilation holes 6 may be provided at the bottom of the slot structure 11, and the ventilation holes 6 may be concentrated in the middle position close to the bottom of the slot to form a heat dissipation area for dissipating the heat of the slot structure 11, and the ventilation holes 6 are connected to the notch 5 through the bottom space below the main body 1, so that the electronic equipment in the slot structure 11 can be dissipated by heat exchange between the air. In this embodiment, the positions of the ventilation holes 6 arranged in the slot structure 11 may correspond to the heat dissipation ports of the electronic equipment one by one, so that in this embodiment, the buffer structure mainly assists the electronic equipment in discharging its heat to the external space through the cooperation of the ventilation holes 6 and the notch 5 in the use state, so as not to affect the heat dissipation effect when the electronic equipment uses the buffer structure as a base.

[0045] Further, see Figure 1 As shown, in some embodiments, it also includes: a blocking piece 7 set on each ventilation hole 6; when the buffer structure is used to accommodate electronic equipment, the blocking piece 7 is used to cover the ventilation hole 6; when the buffer structure is used to support electronic equipment, the corresponding blocking piece 7 on the ventilation hole 6 is removed, and a heat dissipation area is formed at the bottom of the groove to dissipate heat for the electronic equipment.

[0046] Specifically, in the technical solution adopted by the present application, according to the above-mentioned embodiment, since the buffer structure of the present application can continue to serve as a buffer base in the use state after completing the packaging buffer mission, the utilization rate of the buffer structure in the present application can be improved. However, referring to the above-mentioned embodiment, a vent 6 connected to the base space is provided in the slot structure 11 of the main body 1, and there is a probability that the buffer structure cannot complete the packaging mission more excellently. Therefore, in one embodiment, when the buffer structure is in the storage state, it also includes a baffle 7 configured on each vent 6, wherein the structure, shape and size of each baffle 7 are adapted to the corresponding vent 6, and are detachably mounted on the corresponding vent 6, so as to prevent foreign matter or other fine particles from damaging the precision structure of the electronic device through the vent 6 in the storage state. When in use, after the buffer structure completes the packaging mission, the baffle 7 on the vent 6 can be removed by manpower to expose the vent 6 corresponding to the heat dissipation port of the electronic device, and the slot structure 11 is connected to the bottom space below the main body 1.

[0047] Further, see Figure 1 As shown, in some embodiments, the baffles 7 are connected to the inner edges of the corresponding ventilation holes 6 through perforated line structures; and / or, the ventilation holes 6 are symmetrically arranged relative to the center line of the slot structure.

[0048] Specifically, in the technical solution adopted by the present application, in one embodiment, since the buffer structure can be reused as a buffer base of the electronic device after completing the packaging mission, the detachable structure between each baffle 7 and each vent 6 adopts a one-time removal method, that is, after the baffle 7 can be changed from the storage state to the use state according to the buffer structure, the baffle 7 can be disintegrated by manpower at one time with the connection structure between the main body 1 to expose each vent 6. In the embodiment of the present application, each baffle 7 is connected to the slot structure 11 through a perforated line structure. In this embodiment, each vent 6 can be symmetrically arranged based on the center line of the slot structure, so that it can fully fit with the heat dissipation hole of the electronic device. When in use, each baffle 7 can be pressed by manpower until the perforated line structure is broken, and the baffle 7 can be removed. In one embodiment, the vent 6 can be set to a long strip or an arrow tip shape and a circle, etc., which is specifically set according to the shape of the heat dissipation hole of the electronic device, and the shape of the vent 6 is no longer limited here.

[0049] Further, see Figure 1 and Figure 2 As shown, in some embodiments, it also includes: an anti-slip structure, which is composed of a plurality of convex strips 8 arranged at the bottom of the groove, and forms an anti-slip area located outside the heat dissipation area at the bottom of the groove, and the second area is close to each corner of the bottom of the groove, so that a resistance array can be formed at each corner position of the bottom of the groove through each convex strip 8.

[0050] Specifically, in the technical solution adopted in the present application, an anti-slip structure is also provided on the buffer structure, and the anti-slip structure includes a plurality of convex strips 8 formed in the groove body structure 11, and each convex strip 8 can be divided into four groups, which are respectively located at each corner position of the groove bottom, so as to form an anti-slip area around the heat dissipation area in the groove body structure 11. Each convex strip 8 can increase the friction between the groove body structure 11 and the electronic device, and is used to prevent the electronic device from sliding in the groove body structure 11, thereby effectively improving the user experience and preventing the discomfort caused by the device slipping in the groove body structure 11 or unnecessary risks during transportation.

[0051] Further, see Figure 1 and Figure 2 As shown, in some embodiments, the end of each support structure 3 is formed with an outward-turned flange structure to increase the contact area of ​​the end of the support structure 3; and / or the plane where the tangent of the support structure 3 is located is set at an acute angle to the plane where the groove wall of the groove structure 11 is located.

[0052] Specifically, in the technical solution adopted by the present application, the buffer structure of the present application may also include a flange structure, which is located at the supporting end of the supporting structure 3 and is formed in an outward-turning manner, which can not only increase the contact area between each supporting structure 3 and the ground or the packaging box, but also increase the supporting area formed by the combination of each supporting structure 3. It is also possible to form an acute angle between the extended tangent of the supporting structure and the groove wall of the groove structure, which can be understood as: the extension direction of the supporting structure is inclined toward the outside direction of the groove structure, so that the supporting function of the buffer structure is more stable and it is not easy to roll over due to the shift of the center of gravity of the electronic equipment.

[0053] Further, see Figure 1 and Figure 2 As shown, in some embodiments, the material thickness of each support structure 3 is higher than the material thickness of the main body 1; and / or the thickness of the portion of the support structure where the notch is provided is smaller than the portion of the support structure providing the force.

[0054] Specifically, in the technical solution adopted by the present application, in one embodiment, the support structure 3 on the buffer structure is thickened, which can be understood as the material of each support structure 3 is thicker than the material thickness of the main body 1, specifically, the material of the support part of the support structure 3 is thickened, while the part of the support structure used to open the notch 5 is not thickened. Since the buffer structure in the test storage state and the use state needs to pass the required buffering force of the drop test, the buffering force of the buffer structure is further improved through the notch 5 and the recess 4, and the support structure 3 will also undergo structural deformation under the action of the extrusion force. The buffering force generated by the structural deformation will also directly affect the parameters of the drop test. After the support structure is thickened, the material stiffness of the support structure 3 is significantly improved, reducing the influence of the extrusion force on the support structure 3, so that the buffering force of the buffer structure is mainly reflected in the part where the stiffness is reduced by the recess 4 and the notch 5, so that the desired buffering force can be obtained more easily during production, testing and use.

[0055] After adopting the buffer structure of the present application, the design and functionality of the buffer structure are optimized so that it can be reused in more occasions or easily converted into other uses, thereby effectively improving the overall utilization value of the buffer pad.

[0056] It should be noted that in the description of this specification, the terms "upper", "lower", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application; the terms "connect", "install", "fixed", etc. should be understood in a broad sense, for example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0057] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0058] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A buffer structure, characterized in that: include: The body has a groove structure formed by being recessed in the thickness direction, and the groove wall of the groove structure extends in a direction away from the groove position to form a folded edge; A plurality of support structures connected to the folded edges, used to isolate the trough structure from the bearing surface contacted by the support structures; The buffer structure can support the use of the electronic device in different placement states, and in different placement states, the support structure provides different forces to the slot structure.

2. The buffer structure according to claim 1, characterized in that: The buffer structure can support the use of the electronic device in the storage state and the use state; The supporting structure provides different forces to the trough structure in the storage state and in the use state.

3. The buffer structure according to claim 1 or 2, characterized in that: A notch is arranged on the groove wall of the groove body structure, and a gap is arranged on the support structure corresponding to the notch.

4. The buffer structure according to claim 3, characterized in that: The slot body structure comprises a first slot wall and a second slot wall arranged adjacent to each other, wherein the number of notches arranged on the first slot wall is greater than the number of notches arranged on the second slot wall; and / or, The slot body structure comprises two first slot walls arranged opposite to each other, and the notches on the two first slot walls are arranged at the same or different positions.

5. The buffer structure according to claim 3, characterized in that: Also includes: A plurality of ventilation holes are provided at the bottom of the tank structure; The ventilation hole is communicated with the notch, so that when electronic equipment is arranged on the slot structure, the slot structure can be communicated with the outside space through the ventilation hole and the notch.

6. The buffer structure according to claim 5, characterized in that: Also includes: A blocking piece that is easy to remove is provided on each of the ventilation holes; In the case where the buffer structure is used to store electronic equipment, the blocking sheet is used to cover the ventilation hole; When the buffer structure is used to support electronic equipment, the corresponding blocking sheet on the ventilation hole is removed, and a heat dissipation area is formed at the bottom of the groove to dissipate heat for the electronic equipment.

7. The buffer structure according to claim 6, characterized in that: The blocking pieces are respectively connected to the inner edges of the corresponding ventilation holes through perforated line structures; and / or, The ventilation holes are symmetrically arranged relative to the center line of the slot structure.

8. The buffer structure according to claim 5, characterized in that: Also includes: The anti-slip structure is composed of a plurality of convex strips arranged at the bottom of the groove, and an anti-slip area located outside the heat dissipation area is formed at the bottom of the groove. The anti-slip area is close to the corners of the bottom of the groove, so that a resistance array can be formed at the corners of the bottom of the groove through the convex strips.

9. The buffer structure according to claim 2, characterized in that: The end of each support structure is formed with an outward-turned flange structure to increase the contact area of ​​the end of the support structure; and / or, The plane where the tangent line of the support structure is located is arranged at an acute angle with the plane where the groove wall of the groove body structure is located.

10. The buffer structure according to claim 3, characterized in that: The material thickness of each of the supporting structures is greater than the material thickness of the body; and / or, The thickness of the portion of the support structure where the notch is provided is smaller than the thickness of the portion of the support structure where the force is provided.

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